Data Sheet

PCA9502
8-bit I/O expander with I2C-bus/SPI interface
Rev. 4 — 23 February 2016
Product data sheet
1. General description
The PCA9502 is an 8-bit I/O expander with I2C-bus/SPI host interface. The device comes
in a very small HVQFN24 package, which makes it ideally suitable for hand-held, battery
operated applications.
The device also supports software reset, which allows the host to reset the device at any
time, independent of the hardware reset signal.
2. Features and benefits
2.1 General features








Selectable I2C-bus or SPI interface
3.3 V or 2.5 V operation
Industrial temperature range: 40 C to +85 C
Eight programmable I/O pins
Software reset
Industrial and commercial temperature ranges
Available in HVQFN24 package
16 hardware-selectable slave addresses
2.2 I2C-bus features




Noise filter on SCL/SDA inputs
400 kbit/s (maximum)
Compliant with I2C-bus Fast-mode
Slave mode only
2.3 SPI features
 15 Mbit/s maximum speed
 Slave mode only
 SPI Mode 0
3. Applications
 Factory automation and process control
 Portable and battery operated devices
 Cellular data devices
PCA9502
NXP Semiconductors
8-bit I/O expander with I2C-bus/SPI interface
4. Ordering information
Table 1.
Ordering information
Type number
PCA9502BS
Package
Name
Description
Version
HVQFN24
plastic thermal enhanced very thin quad flat package; SOT616-3
no leads; 24 terminals; body 4  4  0.85 mm
5. Block diagram
VDD
PCA9502
RESET
SCL
GPIO
REGISTER
SDA
A0
8
GPIO[7:0]
I2C-BUS
A1
IRQ
1 kΩ (3.3 V)
1.5 kΩ (2.5 V)
VDD
VDD
I2C/SPI
002aab837
VSS
Fig 1.
Block diagram of PCA9502 I2C-bus interface
VDD
PCA9502
RESET
SCLK
GPIO
REGISTER
CS
SO
8
GPIO[7:0]
SPI
SI
IRQ
1 kΩ (3.3 V)
1.5 kΩ (2.5 V)
VDD
I2C/SPI
002aab838
VSS
Fig 2.
PCA9502
Product data sheet
Block diagram of PCA9502 SPI interface
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Rev. 4 — 23 February 2016
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PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
6. Pinning information
19 GPIO5
20 GPIO6
21 GPIO7
22 VDD
terminal 1
index area
23 VSS
24 VDD
19 GPIO5
20 GPIO6
21 GPIO7
22 VDD
terminal 1
index area
23 VSS
24 VDD
6.1 Pinning
RESET
1
18 GPIO4
RESET
1
18 GPIO4
VDD
2
17 VSS
VDD
2
17 VSS
VDD
3
16 GPIO3
VDD
3
VDD
4
15 GPIO2
VSS
4
A0
5
14 GPIO1
CS
5
14 GPIO1
A1
6
13 GPIO0
SI
6
13 GPIO0
Transparent top view
a. I2C-bus interface
Fig 3.
9
SCLK
VSS
15 GPIO2
IRQ 12
8
VSS 10
VDD 11
7
002aab839
16 GPIO3
PCA9502BS
SO
IRQ 12
9
SDA
VDD 11
8
VSS 10
7
n.c.
SCL
PCA9502BS
002aab840
Transparent top view
b. SPI interface
Pin configuration for HVQFN24
6.2 Pin description
Table 2.
PCA9502
Product data sheet
Pin description
Symbol
Pin
Type Description
RESET
1
I
VDD
2, 3, 11, 22, 24
power supply
I2C/SPI
4
I
I2C-bus or SPI interface select. I2C-bus interface is selected if this
pin is at logic HIGH. SPI interface is selected if this pin is at logic
LOW.
CS/A0
5
I
SPI chip select or I2C-bus device address select A0. If SPI
configuration is selected by I2C/SPI pin, this pin is the SPI chip
select pin (Schmitt trigger, active LOW). If I2C-bus configuration
is selected by I2C/SPI pin, this pin along with A1 pin allows user
to change the device’s base address.
SI/A1
6
I
SPI data input pin or I2C-bus device address select A1. If SPI
configuration is selected by I2C/SPI pin, this is the SPI data input
pin. If I2C-bus configuration is selected by I2C/SPI pin, this pin
along with A0 pin allows user to change the device’s base
address. To select the device address, please refer to Table 11.
SO
7
O
SPI data output pin. If SPI configuration is selected by I2C/SPI
pin, this is a 3-stateable output pin. If I2C-bus configuration is
selected by I2C/SPI pin, this pin function is undefined and must
be left as n.c. (not connected).
SCL/SCLK
8
I
I2C-bus or SPI input clock.
SDA
9
I/O
I2C-bus data input/output, open-drain if I2C-bus configuration is
selected by I2C/SPI pin. If SPI configuration is selected then this
pin is an undefined pin and must be connected to VSS.
device hardware reset (active LOW)[1]
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Rev. 4 — 23 February 2016
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PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
Table 2.
Pin description …continued
Symbol
Pin
Type Description
IRQ
12
O
Interrupt (open-drain, active LOW). Interrupt is enabled when
interrupt sources are enabled in the I/O Interrupt Enable register
(IOIntEna). The interrupt condition is the change of state of the
input pins. An external resistor (1 k for 3.3 V, 1.5 k for 2.5 V)
must be connected between this pin and VDD.
GPIO0
13
I/O
programmable I/O pin
GPIO1
14
I/O
programmable I/O pin
GPIO2
15
I/O
programmable I/O pin
GPIO3
16
I/O
programmable I/O pin
GPIO4
18
I/O
programmable I/O pin
GPIO5
19
I/O
programmable I/O pin
GPIO6
20
I/O
programmable I/O pin
GPIO7
21
I/O
programmable I/O pin
VSS
10, 17,
23
-
ground
VSS
center
pad
-
The center pad on the back side of the HVQFN24 package is
metallic and should be connected to ground on the printed-circuit
board.
[1]
See Section 7.1 “Hardware reset, Power-On Reset (POR) and software reset”
7. Functional description
The device interfaces to a host through either I2C-bus or SPI interface (selectable through
I2C/SPI pin), and provides the host with eight programmable GPIO pins.
7.1 Hardware reset, Power-On Reset (POR) and software reset
These three reset methods are identical and will reset the internal registers as indicated in
Table 3.
Table 3 summarizes the state of registers after reset.
Table 3.
Registers after reset
Register
Reset state
I/O direction
all bits cleared
I/O interrupt enable
all bits cleared
I/O control
all bits cleared
Table 4 summarizes the state of hardware pins after reset.
Table 4.
PCA9502
Product data sheet
Signals after reset
Signal
Reset state
I/Os
inputs
IRQ
HIGH by external pull-up
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Rev. 4 — 23 February 2016
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PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
7.2 Interrupts
The PCA9502 has interrupt generation capability. The interrupt enable register (IOIntEna)
enables interrupts due to I/O pin change of state, and the IRQ signal in response to an
interrupt generation.
8. Register descriptions
The programming combinations for register selection are shown in Table 5.
Table 5.
Table 6.
Register map - read/write properties
Register name
Read mode
Write mode
IODir
I/O pin direction
I/O pin direction
IOState
I/O pin states
n/a
IOIntEna
I/O interrupt enable register
I/O interrupt enable register
IOControl
I/O pins control
I/O pins control
PCA9502 internal registers
Register
Register
address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R/W
bit 0
R/W
General Register Set
0x0A[1]
IODir
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
0x0B[1]
IOState
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
R/W
0x0C[1]
IOIntEna
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
R/W
0x0D[1]
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
IOControl
reserved
reserved
reserved
reserved
SReset
reserved
reserved
IOLatch
[2]
[2]
[2]
[2]
[2]
[2]
0x0E[1]
[1]
Other addresses 0x00 through 0x09, 0x0F are reserved and should not be accessed (read or write).
[2]
These bits are reserved and should be set to 0.
R/W
8.1 Programmable I/O pins Direction register (IODir)
This register is used to program the I/O pins direction. Bit 0 to bit 7 control GPIO0 to
GPIO7.
Table 7.
IODir register (address 0x0A) bit description
Bit
Symbol
Description
7:0
IODir
set GPIO pins 7:0 to input or output
0 = input
1 = output
Remark: If there is a pending input (GPIO) interrupt and IODir is written, this pending
interrupt will be cleared, that is, the interrupt signal will be negated.
PCA9502
Product data sheet
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PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
8.2 Programmable I/O pins State register (IOState)
When ‘read’, this register returns the actual state of all I/O pins. When ‘write’, each
register bit will be transferred to the corresponding IO pin programmed as output.
Table 8.
IOState register (address 0x0B) bit description
Bit
Symbol
Description
7:0
IOState
Write this register: set the logic level on the output pins
0 = set output pin to zero
1 = set output pin to one
Read this register: return states of all pins
8.3 I/O Interrupt Enable register (IOIntEna)
This register enables the interrupt due to a change in the I/O configured as inputs.
Table 9.
IOIntEna register (address 0x0C) bit description
Bit
Symbol
Description
7:0
IOIntEna
input interrupt enable
0 = a change in the input pin will not generate an interrupt
1 = a change in the input will generate an interrupt
8.4 I/O Control register (IOControl)
Table 10.
IOControl register (address 0x0E) bit description
Bit
Symbol
Description
7:4
-
reserved for future use
3
SReset
software reset
A write to this bit will reset the device. Once the device is reset this
bit is automatically set to 0.
2:1
-
reserved for future use
0
IOLatch
enable/disable inputs latching
0 = input values are not latched. A change in any input generates an
interrupt. A read of the input register clears the interrupt. If the input
goes back to its initial logic state before the input register is read,
then the interrupt is cleared.
1 = input values are latched. A change in the input generates an
interrupt and the input logic value is loaded in the bit of the
corresponding input state register (IOState). A read of the IOState
register clears the interrupt. If the input pin goes back to its initial
logic state before the interrupt register is read, then the interrupt is
not cleared and the corresponding bit of the IOState register keeps
the logic value that initiates the interrupt.
Example: If GPIO4 input was as logic 0 and the input goes to logic 1
then back to logic 0, the IOState register will capture this change and
an interrupt is generated (if enabled). When the read is performed on
the IOState register, the interrupt is de-asserted, assuming there were
no additional input(s) that changed, and bit 4 of the IOState register
will read ‘1’. The next read of the IOState register should now read ‘0’.
PCA9502
Product data sheet
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8-bit I/O expander with I2C-bus/SPI interface
9. I2C-bus operation
The two lines of the I2C-bus are a serial data line (SDA) and a serial clock line (SCL). Both
lines are connected to a positive supply via a pull-up resistor, and remain HIGH when the
bus is not busy. Each device is recognized by a unique address whether it is a
microcomputer, LCD driver, memory or keyboard interface and can operate as either a
transmitter or receiver, depending on the function of the device. A device generating a
message or data is a transmitter, and a device receiving the message or data is a
receiver. Obviously, a passive function like an LCD driver could only be a receiver, while a
microcontroller or a memory can both transmit and receive data.
9.1 Data transfers
One data bit is transferred during each clock pulse (see Figure 4). The data on the SDA
line must remain stable during the HIGH period of the clock pulse in order to be valid.
Changes in the data line at this time will be interpreted as control signals. A HIGH-to-LOW
transition of the data line (SDA) while the clock signal (SCL) is HIGH indicates a START
condition, and a LOW-to-HIGH transition of the SDA while SCL is HIGH defines a STOP
condition (see Figure 5). The bus is considered to be busy after the START condition and
free again at a certain time interval after the STOP condition. The START and STOP
conditions are always generated by the master.
SDA
SCL
data line
stable;
data valid
Fig 4.
change
of data
allowed
mba607
Bit transfer on the I2C-bus
SDA
SCL
S
P
START condition
STOP condition
mba608
Fig 5.
START and STOP conditions
The number of data bytes transferred between the START and STOP condition from
transmitter to receiver is not limited. Each byte, which must be eight bits long, is
transferred serially with the most significant bit first, and is followed by an acknowledge
bit. (see Figure 6). The clock pulse related to the acknowledge bit is generated by the
master. The device that acknowledges has to pull down the SDA line during the
acknowledge clock pulse, while the transmitting device releases this pulse (see Figure 7).
PCA9502
Product data sheet
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PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
acknowledgement signal
from receiver
SDA
MSB
SCL
0
S
1
6
7
8
0
1
2 to 7
ACK
START
condition
8
ACK
byte complete,
interrupt within receiver
clock line held LOW
while interrupt is serviced
P
STOP
condition
002aab012
Fig 6.
Data transfer on the I2C-bus
data output
by transmitter
transmitter stays off of the bus
during the acknowledge clock
data output
by receiver
SCL from master
acknowledgement signal
from receiver
S
0
1
6
7
002aab013
START
condition
Fig 7.
8
Acknowledge on the I2C-bus
A slave receiver must generate an acknowledge after the reception of each byte, and a
master must generate one after the reception of each byte clocked out of the slave
transmitter.
There is an exception to the ‘acknowledge after every byte’ rule. It occurs when a master
is a receiver: it must signal an end of data to the transmitter by not signalling an
acknowledge on the last byte that has been clocked out of the slave. The acknowledge
related clock, generated by the master should still take place, but the SDA line will not be
pulled down. In order to indicate that this is an active and intentional lack of
acknowledgement, we shall term this special condition as a ‘negative acknowledge’.
9.2 Addressing and transfer formats
Each device on the bus has its own unique address. Before any data is transmitted on the
bus, the master transmits on the bus the address of the slave to be accessed for this
transaction. A well-behaved slave with a matching address, if it exists on the network,
should of course acknowledge the master's addressing. The addressing is done by the
first byte transmitted by the master after the START condition.
An address on the network is seven bits long, appearing as the most significant bits of the
address byte. The last bit is a direction (R/W) bit. A ‘0’ indicates that the master is
transmitting (write) and a ‘1’ indicates that the master requests data (read). A complete
data transfer, comprised of an address byte indicating a ‘write’ and two data bytes is
shown in Figure 8.
PCA9502
Product data sheet
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Rev. 4 — 23 February 2016
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PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
SDA
SCL
S
START
condition
0 to 6
address
7
8
0 to 6
R/W
ACK
data
7
8
0 to 6
ACK
data
7
8
P
ACK
STOP
condition
002aab046
Fig 8.
A complete data transfer
When an address is sent, each device in the system compares the first seven bits after
the START with its own address. If there is a match, the device will consider itself
addressed by the master, and will send an acknowledge. The device could also determine
if in this transaction it is assigned the role of a slave receiver or slave transmitter,
depending on the R/W bit.
Each node of the I2C-bus network has a unique seven-bit address. The address of a
microcontroller is of course fully programmable, while peripheral devices usually have
fixed and programmable address portions.
When the master is communicating with one device only, data transfers follow the format
of Figure 8, where the R/W bit could indicate either direction. After completing the transfer
and issuing a STOP condition, if a master would like to address some other device on the
network, it could start another transaction by issuing a new START.
Another way for a master to communicate with several different devices would be by using
a ‘repeated START’. After the last byte of the transaction was transferred, including its
acknowledge (or negative acknowledge), the master issues another START, followed by
address byte and data, without effecting a STOP. The master may communicate with a
number of different devices, combining ‘reads’ and ‘writes’. After the last transfer takes
place, the master issues a STOP and releases the bus. Possible data formats are
demonstrated in Figure 9. Note that the repeated START allows for both change of a
slave and a change of direction, without releasing the bus. We shall see later on that the
change of direction feature can come in handy even when dealing with a single device.
In a single master system, the repeated START mechanism may be more efficient than
terminating each transfer with a STOP and starting again. In a multimaster environment,
the determination of which format is more efficient could be more complicated, as when a
master is using repeated STARTs it occupies the bus for a long time and thus preventing
other devices from initiating transfers.
PCA9502
Product data sheet
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Rev. 4 — 23 February 2016
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8-bit I/O expander with I2C-bus/SPI interface
data transferred
(n bytes + acknowledge)
master write:
S
SLAVE ADDRESS
START condition
W
write
A
DATA
acknowledge
A
DATA
acknowledge
A
P
acknowledge
STOP condition
data transferred
(n bytes + acknowledge)
master read:
S
SLAVE ADDRESS
START condition
R
read
A
DATA
acknowledge
A
DATA
acknowledge
NA
P
not
acknowledge
STOP condition
data transferred
(n bytes + acknowledge)
combined
formats:
S
SLAVE ADDRESS R/W
START condition
read or
write
A
DATA
acknowledge
A
acknowledge
data transferred
(n bytes + acknowledge)
Sr
SLAVE ADDRESS R/W
repeated
START condition
read or
write
A
DATA
acknowledge
direction of transfer
may change at this point
A
P
acknowledge
STOP condition
002aab458
Fig 9.
I2C-bus data formats
PCA9502
Product data sheet
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8-bit I/O expander with I2C-bus/SPI interface
9.3 Addressing
Before any data is transmitted or received, the master must send the address of the
receiver via the SDA line. The first byte after the START condition carries the address of
the slave device and the read/write bit. Table 11 shows how the PCA9502’s address can
be selected by using A1 and A0 pins. For example, if these 2 pins are connected to VDD,
then the PCA9502’s address is set to 0x90, and the master communicates with it through
this address.
Table 11.
PCA9502 address map
A1
A0
PCA9502 I2C-bus addresses (hex)[1]
VDD
VDD
0x90 (1001 000X)
VDD
VSS
0x92 (1001 001X)
VDD
SCL
0x94 (1001 010X)
VDD
SDA
0x96 (1001 011X)
VSS
VDD
0x98 (1001 100X)
VSS
VSS
0x9A (1001 101X)
VSS
SCL
0x9C (1001 110X)
VSS
SDA
0x9E (1001 111X)
SCL
VDD
0xA0 (1010 000X)
SCL
VSS
0xA2 (1010 001X)
SCL
SCL
0xA4 (1010 010X)
SCL
SDA
0xA6 (1010 011X)
SDA
VDD
0xA8 (1010 100X)
SDA
VSS
0xAA (1010 101X)
SDA
SCL
0xAC (1010 110X)
SDA
SDA
0xAE (1010 111X)
[1]
X = logic 0 for write cycle; X = logic 1 for read cycle.
9.4 Use of sub-addresses
When a master communicates with the PCA9502 it must send a sub-address in the byte
following the slave address byte. This sub-address is the internal address of the word the
master wants to access for a single byte transfer, or the beginning of a sequence of
locations for a multi-byte transfer. A sub-address is an 8-bit byte. Unlike the device
address, it does not contain a direction (R/W) bit, and like any byte transferred on the bus
it must be followed by an acknowledge.
A register write cycle is shown in Figure 10. The START is followed by a slave address
byte with the direction bit set to ‘write’, a sub-address byte, a number of data bytes, and a
STOP signal. The sub-address indicates which register the master wants to access. and
the data bytes which follow will be written one after the other to the sub-address location.
PCA9502
Product data sheet
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8-bit I/O expander with I2C-bus/SPI interface
S
SLAVE ADDRESS
W
A
REGISTER ADDRESS(1)
A
nDATA
A
P
002aab047
White block: host to PCA9502
Grey block: PCA9502 to host
Fig 10. Master writes to slave
The register read cycle (see Figure 11) commences in a similar manner, with the master
sending a slave address with the direction bit set to ‘write’ with a following sub-address.
Then, in order to reverse the direction of the transfer, the master issues a repeated
START followed again by the device address, but this time with the direction bit set to
‘read’. The data bytes starting at the internal sub-address will be clocked out of the device,
each followed by a master-generated acknowledge. The last byte of the read cycle will be
followed by a negative acknowledge, signalling the end of transfer. The cycle is
terminated by a STOP signal.
S
SLAVE ADDRESS
W
REGISTER ADDRESS(1)
A
A
S
nDATA
SLAVE ADDRESS
A
LAST DATA
R
A
NA
P
002aab048
White block: host to PCA9502
Grey block: PCA9502 to host
Fig 11. Master read from Slave
Table 12.
Bit
PCA9502
Product data sheet
Register address byte (I2C-bus)
Name
Function
7
-
not used
6:3
A[3:0]
internal register select
2:1
-
not used, set to 0
0
-
not used
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8-bit I/O expander with I2C-bus/SPI interface
10. SPI operation
SCLK
SI
R/W
A3
A2
A1
A0
0
0
X
D7
D6
D5
D4
D3
D2
D1
D0
002aab925
R/W = 0; A[3:0] = register address
a. Register write
SCLK
SI
R/W
A3
A2
A1
A0
0
0
X
D7
SO
D6
D5
D4
D3
D2
D1
D0
002aab926
R/W = 1; A[3:0] = register address
b. Register read
Fig 12. SPI operation
Table 13.
Register address byte (SPI)
Bit
Name
Function
7
R/W
1: read from PCA9502
0: write to PCA9502
PCA9502
Product data sheet
6:3
A[3:0]
internal register select
2:1
-
not used, set to 0
0
-
not used
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8-bit I/O expander with I2C-bus/SPI interface
11. Limiting values
Table 14. Limiting values [1]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDD
supply voltage
Min
Max
Unit
0.3
+4.6
V
VI
input voltage
any input
0.3
+5.5
V
II
input current
any input
10
+10
mA
IO
output current
any output
10
+10
mA
Ptot
total power dissipation
-
300
mW
[2]
P/out
power dissipation per output
-
50
mW
Tamb
ambient temperature
40
+85
C
Tstg
storage temperature
VESD
[1]
electrostatic discharge
65
+150
C
HBM
[3]
-
5000
V
CDM
[4]
-
750
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any conditions
beyond those indicated under recommended operating conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
[2]
[3]
5.5 V steady state voltage tolerance on inputs and outputs is valid only when the supply voltage is present.
4.6 V steady state voltage tolerance on inputs and outputs when no supply voltage is present.
Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model Component level; Electrostatic Discharge Association, Rome, NY, USA.
[4]
Charged Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing, Charged Device
Model - Component level; Electrostatic Discharge Association, Rome, NY, USA.
PCA9502
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12. Static characteristics
Table 15. Static characteristics
VDD = (2.5 V  0.2 V) or (3.3 V  0.3 V); Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
VDD = 2.5 V
VDD = 3.3 V
Unit
Min
Max
Min
Max
2.3
2.7
3.0
3.6
V
operating; no load
-
750
-
750
A
static; no load
-
600
-
600
A
1.6
5.5[1]
2.0
5.5[1]
V
-
0.6
-
0.8
V
-
1
-
1
A
-
3
-
3
pF
1.85
-
-
-
V
IOH = 4 mA
-
-
2.4
-
V
IOL = 1.6 mA
-
0.4
-
-
V
IOL = 4 mA
-
-
-
0.4
V
-
4
-
4
pF
Supplies
VDD
supply voltage
IDD
supply current
Inputs I2C/SPI
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IL
leakage current
Ci
input capacitance
input; VI = 0 V or 5.5
V[1]
Output SO
VOH
VOL
Co
HIGH-level output voltage
LOW-level output voltage
IOH = 400 A
output capacitance
Inputs/outputs GPIO0 to GPIO7
VIH
HIGH-level input voltage
1.6
5.5[1]
2.0
5.5[1]
V
VIL
LOW-level input voltage
-
0.6
-
0.8
V
VOH
HIGH-level output voltage
1.85
-
-
-
V
IOH = 4 mA
-
-
2.4
-
V
VOL
LOW-level output voltage
IL
leakage current
Co
output capacitance
IOH = 400 A
IOL = 1.6 mA
-
0.4
-
-
V
IOL = 4 mA
-
-
-
0.4
V
input; VI = 0 V or 5.5 V[1]
-
1
-
1
A
-
4
-
4
pF
IOL = 1.6 mA
-
0.4
-
-
V
IOL = 4 mA
-
-
-
0.4
V
-
4
-
4
pF
Output IRQ
VOL
Co
I2C-bus
LOW-level output voltage
output capacitance
input/output SDA
VIH
HIGH-level input voltage
1.6
5.5[1]
2.0
5.5[1]
V
VIL
LOW-level input voltage
-
0.6
-
0.8
V
VOL
LOW-level output voltage
IOL = 1.6 mA
-
0.4
-
-
V
IOL = 4 mA
-
-
-
0.4
V
IL
leakage current
input; VI = 0 V or 5.5 V[1]
-
10
-
10
A
Co
output capacitance
-
7
-
7
pF
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Table 15. Static characteristics …continued
VDD = (2.5 V  0.2 V) or (3.3 V  0.3 V); Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
I2C-bus
Parameter
Conditions
VDD = 2.5 V
VDD = 3.3 V
Min
Max
Min
Max
Unit
inputs SCL, CS/A0, SI/A1
VIH
HIGH-level input voltage
1.6
5.5[1]
2.0
5.5[1]
V
VIL
LOW-level input voltage
-
0.6
-
0.8
V
IL
leakage current
-
10
-
10
A
Ci
input capacitance
-
7
-
7
pF
[1]
input; VI = 0 V or 5.5 V[1]
5.5 V steady state voltage tolerance on inputs and outputs is valid only when the supply voltage is present. 3.8 V steady state voltage
tolerance on inputs and outputs when no supply voltage is present.
13. Dynamic characteristics
Table 16. I2C-bus timing specifications
All the timing limits are valid within the operating supply voltage, ambient temperature range and output load;
VDD = (2.5 V  0.2 V) or (3.3 V  0.3 V); Tamb = 40 C to +85 C; refer to VIL and VIH with an input voltage of VSS to VDD.
All output load = 25 pF, except SDA output load = 400 pF.[1]
Symbol Parameter
Conditions
Standard-mode
I2C-bus
[2]
Fast-mode
I2C-bus
Min
Max
Min
Max
0
100
0
400
Unit
fSCL
SCL clock frequency
tBUF
bus free time between a STOP and
START condition
4.7
-
1.3
-
s
tHD;STA
hold time (repeated) START condition
4.0
-
0.6
-
s
tSU;STA
set-up time for a repeated START
condition
4.7
-
0.6
-
s
tSU;STO
set-up time for STOP condition
4.7
-
0.6
-
s
tHD;DAT
data hold time
0
-
0
-
ns
tVD;ACK
data valid acknowledge time
-
0.6
-
0.6
s
tVD;DAT
data valid time
-
0.6
-
0.6
ns
tSU;DAT
data set-up time
250
-
150
-
ns
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
s
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
s
SCL LOW to data out valid
kHz
tf
fall time of both SDA and SCL signals
-
300
-
300
ns
tr
rise time of both SDA and SCL signals
-
1000
-
300
ns
tSP
pulse width of spikes that must be
suppressed by the input filter
-
50
-
50
ns
td1
I2C-bus GPIO output valid time
0.5
-
0.5
-
s
td4
I2C input pin interrupt valid time
0.2
-
0.2
-
s
td5
I2C input pin interrupt clear time
0.2
-
0.2
-
s
[1]
A detailed description of the I2C-bus specification, with applications, is given in brochure “The I2C-bus and how to use it”. This brochure
may be ordered using the code 9398 393 40011.
[2]
Minimum SCL clock frequency is limited by the bus time-out feature, which resets the serial bus interface if SDA is held LOW for a
minimum of 25 ms.
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bit 7
MSB
(A7)
START
condition
(S)
protocol
tSU;STA
tLOW
bit 0
LSB
(R/W)
bit 6
(A6)
tHIGH
1/f
STOP
condition
(P)
acknowledge
(A)
SCL
SCL
tBUF
tf
tr
tSP
SDA
tSU;DAT
tHD;STA
tVD;ACK
tVD;DAT
tHD;DAT
tSU;STO
002aab489
Rise and fall times refer to VIL and VIH.
Fig 13. I2C-bus timing diagram
SDA
SLAVE ADDRESS
W
A
A IOSTATE REG.
A
A
DATA
td1
GPIOn
002aab255
Fig 14. Write to output
ACK from slave
SDA
SLAVE ADDRESS
W
A
A IOSTATE REG.
A
ACK from slave
S
SLAVE ADDRESS
R
A
ACK from master
DATA
A
P
IRQ
td4
GPIOn
td5
002aab877
Fig 15. GPIO pin interrupt
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Table 17. SPI-bus timing specifications
All the timing limits are valid within the operating supply voltage, ambient temperature range and output load;
VDD = (2.5 V  0.2 V) or (3.3 V  0.3 V); Tamb = 40 C to +85 C; and refer to VIL and VIH with an input voltage of VSS to VDD.
All output load = 25 pF, unless otherwise specified.
Symbol
Parameter
Conditions
VDD = 2.5 V
VDD = 3.3 V
Unit
Min
Max
Min
Max
-
100
-
100
ns
td(CS_NH-SOZ)
CS HIGH to SO 3-state delay time
tsu(CS_N-SCLK)
CS to SCLK setup time
100
-
100
-
ns
th(CS_N-SCLK)
CS to SCLK hold time
20
-
20
-
ns
td(SCLK-SO)
SCLK fall to SO valid delay time
-
25
-
20
ns
tsu(SI-SCLK)
SI to SCLK setup time
10
-
20
-
ns
th(SI-SCLK)
SI to SCLK hold time
TSCLK
SCLK period
tSCLKH
CL = 100 pF
CL = 100 pF
10
-
10
-
ns
83
-
67
-
ns
SCLK HIGH time
30
-
25
-
ns
tSCLKL
SCLK LOW time
30
-
25
-
ns
tw(CS_NH)
CS HIGH pulse width
200
-
200
-
ns
td9
SPI output data valid time
200
-
200
-
ns
td13
SPI interrupt clear time
200
-
200
-
ns
tSCLKL + tSCLKL
CS
th(CS_N-SCLK) tsu(CS_N-SCLK)
tSCLKL
tSCLKH
th(CS_N-SCLK)
tw(CS_NH)
SCLK
th(SI-SCLK)
tsu(SI-SCLK)
SI
td(SCLK-SO)
td(CS_N-SOZ)
SO
002aac429
Fig 16. Detailed SPI-bus timing
CS
SCLK
SI
R/W
A3
A2
A1
A0
0
0
X
D7
D6
D5
D4
D3
D2
D1
D0
td9
GPIOn
002aab878
R/W = 0; A[3:0] = IOState (0x0B)
Fig 17. SPI write IOState to GPIO switch
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8-bit I/O expander with I2C-bus/SPI interface
CS
SCLK
SI
R/W
A3
A2
A1
A0
0
0
X
D7
SO
D6
D5
D4
D3
D2
D1
D0
td13
IRQ
002aab879
R/W = 1; A[3:0] = IOState (0x0B)
Fig 18. Read IOState to clear GPIO INT
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14. Package outline
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT616-3A
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2 e
b
e
7
v
w
12
y
y1 C
C A B
C
L
13
6
e
e2
Eh
1/2 e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
scale
Dimensions (mm are the original dimensions)
Unit(1)
mm
A(1)
max
nom
min
1
A1
b
c
0.05 0.30
D(1)
Dh
E(1)
Eh
4.1
2.75
4.1
2.75
0.2
0.00 0.18
3.9
5 mm
2.45
3.9
e
e1
e2
0.5
2.5
2.5
L
v
w
y
y1
0.5
2.45
0.1
0.05 0.05
0.1
0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
SOT616-3A
References
IEC
JEDEC
JEITA
sot616-3a_po
European
projection
Issue date
16-02-16
16-02-17
MO-220
Fig 19. Package outline SOT616-3 (HVQFN24)
PCA9502
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15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
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• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 20) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18 and 19
Table 18.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 19.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 20.
PCA9502
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8-bit I/O expander with I2C-bus/SPI interface
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 20. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
Table 20.
PCA9502
Product data sheet
Abbreviations
Acronym
Description
GPIO
General Purpose Input/Output
I2C-bus
Inter Integrated Circuit bus
I/O
Input/Output
LCD
Liquid Crystal Display
POR
Power-On Reset
SPI
Serial Peripheral Interface
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18. Revision history
Table 21.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9502 v.4
20160223
Product data sheet
-
PCA9502 v.3
Modifications:
PCA9502 v.3
Modifications:
•
Table 14 “Limiting values
20061013
[1]”,
added ESD information
Product data sheet
-
PCA9502 v.2
•
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Table 15 “Static characteristics”, sub-section “Supplies”:
– IDD, supply current, operating; no load: changed maximum limit from 6.0 mA to 750 A for both
2.5 V and 3.3 V supply voltage ranges
– IDD, supply current: added “static; no load” Conditions (max 600 A)
PCA9502 v.2
20060803
Product data sheet
-
PCA9502 v.1
PCA9502 v.1
20060707
Product data sheet
-
-
PCA9502
Product data sheet
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19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCA9502
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 23 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
25 of 27
PCA9502
NXP Semiconductors
8-bit I/O expander with I2C-bus/SPI interface
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9502
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 23 February 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
26 of 27
PCA9502
NXP Semiconductors
8-bit I/O expander with I2C-bus/SPI interface
21. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.2
8
8.1
8.2
8.3
8.4
9
9.1
9.2
9.3
9.4
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
19
19.1
19.2
19.3
19.4
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General features . . . . . . . . . . . . . . . . . . . . . . . . 1
I2C-bus features . . . . . . . . . . . . . . . . . . . . . . . . 1
SPI features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Hardware reset, Power-On Reset (POR) and
software reset . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . . 5
Programmable I/O pins Direction register
(IODir) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Programmable I/O pins State register (IOState) 6
I/O Interrupt Enable register (IOIntEna) . . . . . . 6
I/O Control register (IOControl). . . . . . . . . . . . . 6
I2C-bus operation. . . . . . . . . . . . . . . . . . . . . . . . 7
Data transfers . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Addressing and transfer formats. . . . . . . . . . . . 8
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Use of sub-addresses. . . . . . . . . . . . . . . . . . . 11
SPI operation . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Handling information. . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
20
21
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 February 2016
Document identifier: PCA9502
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