D/CRCW-HR e3 Datasheet

D/CRCW-HR e3
www.vishay.com
Vishay
Lead (Pb)-Free Thick Film,
Rectangular High Value Chip Resistor
FEATURES
• High resistance values (up to 470M)
• Suitable for voltage dividers and hybrids
• Pure tin plating provides compatibility with lead
(Pb)-free and lead containing soldering
processing
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
MODEL
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P70
W
D11/CRCW0603-HR
0603
RR 1608M
0.10
75
± 500
±5
11M to 470M
E24
D12/CRCW0805-HR
0805
RR 2012M
0.125
150
± 500
±5
11M to 470M
E24
D25/CRCW1206-HR
1206
RR 3216M
0.25
200
± 500
±5
11M to 470M
E24
RESISTANCE
TEMPERATURE
TOLERANCE
RANGE
SERIES
COEFFICIENT
%

ppm/K
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage, and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time, generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020)
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
Rated Dissipation at P70 (1)
W
0.1
0.125
0.25
Operating Voltage Umax. ACRMS/DC
V
75
150
200
Voltage Coefficient
< 100M: < 0.1
> 100M: < 0.3
%/V
Insulation Voltage Uins (1 min)
V
Insulation Resistance

Operating Temperature Range
°C
Weight
mg
100
200
300
> 109
- 55 to + 155
2
5.5
10
Note
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
(1)
Revision: 12-Jun-12
Document Number: 20022
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW060316M0JPEAHR
C
R
C
W
MODEL/SIZE
CRCW0603
CRCW0805
CRCW1206
0
6
0
3
1
RESISTANCE
M = Million
6
M
TOLERANCE
J=±5%
0
J
P
E
A
H
R
TCR
P = ± 500 ppm/K
PACKAGING
EA
EB
EC
SPECIAL
Up to 2 digits
HR = High value
16M
5%
ET1
e3
Product Description: D11/CRCW0603-HR 500 16M 5 % ET1 e3
D11/CRCW0603-HR
500
MODEL
TCR
RESISTANCE
TOLERANCE
PACKAGING
LEAD (Pb)-FREE
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
± 500 ppm/K
68M = 68 M
227M = 227 M
±5%
ET1
ET5
ET6
e3 = Pure tin
termination finish
WIDTH
PITCH
REEL DIAMETER
8 mm
4 mm
285 mm/11.25"
PACKAGING
MODEL
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
CODE
QUANTITY
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
CARRIER TAPE
180 mm/7"
330 mm/13"
180 mm/7"
Paper tape acc. to
IEC 60068-3
Type I
8 mm
4 mm
285 mm/11.25"
330 mm/13"
180 mm/7"
8 mm
4 mm
285 mm/11.25"
330 mm/13"
DIMENSIONS
SOLDER PAD DIMENSIONS in millimeters
SIZE
DIMENSIONS in millimeters
REFLOW SOLDERING
INCH METRIC
0603
0805
1206
1608
L
W
H
T1
T2
a
b
l
a
b
l
0.85 ± 0.1
0.45 ± 0.05
0.3 ± 0.2
0.3 ± 0.2
0.5
0.9
1.0
0.9
0.9
1.0
0.3 ± 0.2
0.7
1.3
1.2
0.9
1.3
1.3
0.4 ± 0.2
0.9
1.7
2.0
1.1
1.7
2.3
1.55
+ 0.10
- 0.05
2.0
+ 0.20
- 0.10
1.25 ± 0.15
0.45 ± 0.05
0.3
3.2
+ 0.10
- 0.20
1.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.2
2012
3216
Revision: 12-Jun-12
WAVE SOLDERING
+ 0.10
- 0.20
Document Number: 20022
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR e3
www.vishay.com
Vishay
Fraction of Rated Dissipation P70
DERATING
100
%
50
0
- 50
0
50
100
°C
150
70
Ambient Temperature in amb
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
D/CRCW-HR e3
4.5
_
4.13
4.17.2
_
58 (Td)
11 M to 470 M
Resistance
-
±5%
Short time overload
U = 2.5 x √P70 x R  2 x Umax.;
Duration acc. to style
± (0.5 % R + 0.05 )
Solder bath method;
Sn60Pb40
Good tinning ( 95 % covered); no visible
damage
Solder bath method;
Sn96, 5Ag3Cu0.5 or
Sn99, 3Cu0.7
non-activated flux;
(245 ± 5) °C or (250 ± 5) °C
(3 ± 0.3) s
Good tinning ( 95 % covered); no visible
damage
Solderability
_
Temperature
coefficient
20 °C/- 55 °C/20 °C and
20 °C/125 °/20 °C
± 500 ppm/K
4.32
21 (Uu3)
Shear (adhesion)
RR 1608: 9 N
RR 2012 and RR 3216: 45N
No visible damage
4.33
21 (Uu1)
Substrate bending
Depth 2 mm;
3 times
No visible damage, no open circuit in bent
position
± (0.25 % R + 0.05 )
4.19
14 (Na)
Rapid change of
temperature
4.23
4.23.2
4.23.3
_
2 (Ba)
30 (Db)
4.23.4
4.23.5
4.23.6
1 (Aa)
13 (M)
30 (Db)
4.23.7
_
4.8.4.2
Revision: 12-Jun-12
Climatic sequence:
Dry Heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
D.C. Load
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
125 °C; 16 h
55 °C;  90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;  90 % RH
24 h; 5 cycle
U = √P70 x R
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
Document Number: 20022
3
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR e3
www.vishay.com
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
D/CRCW-HR e3
U = √P70 x R  Umax.
1.5 h on; 0,5 h off;
70 °C; 1000 h
70 °C; 8000 h
11 M to 470 M
4.25.1
_
Endurance at
70 °C
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (0.5 % R + 0.05 )
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH; 56 days
± (2 % R + 0.1 )
_
Endurance at upper
category temperature
155 °C; 1000 h
± (2 % R + 0.1 )
4.24
4.25.3
± (2 % R + 0.1 )
± (4 % R + 0.1 )
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 12-Jun-12
Document Number: 20022
4
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000