CRMV Datasheet

CRMV
www.vishay.com
Vishay Techno
Thick Film Chip Resistors, Medium Voltage
FEATURES
• Voltages up to 1415 V
Available
• Automatic placement capability
• Termination style: 3-sided wraparound
Available
termination or single termination flip chip
available
• Tape and reel packaging available
• Suitable for solderable, epoxy bondable, or wire bondable
applications
• Internationally standardized sizes, custom sizes available
• Termination material: solder-coated nickel barrier or
solder coated non-magnetic terminations standard; gold,
palladium silver, platinum gold, platinum silver or platinum
palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic
terminations available
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
* This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details.
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL MODEL
CASE
SIZE
POWER RATING
P70 °C
W
MAX. WORKING
VOLTAGE (2)
V
RESISTANCE
RANGE (1)

TOLERANCE
±%
TEMPERATURE
COEFFICIENT (3)
± ppm/°C
CRMV1206
1206
0.30
550
150 to 15M
0.5, 1, 2, 5, 10, 20
100
CRMV1210
1210
0.35
650
300 to 20M
0.5, 1, 2, 5, 10, 20
100
CRMV2010
2010
0.50
895
500 to 40M
0.5, 1, 2, 5, 10, 20
100
CRMV2510
2510
0.80
1265
1K to 60M
0.5, 1, 2, 5, 10, 20
100
CRMV2512
2512
1.0
1415
1K to 75M
0.5, 1, 2, 5, 10, 20
100
Notes
• For non-standard sizes, lower values or higher power rating requirement, contact factory.
(1) Resistance values calibrated at 10 V . Calibration at other voltages available upon request.
DC
(2) Continuous working voltage shall be P x R or Maximum Working Voltage, whichever is less.
(3) Reference only: Not for all values specified. Consult factory for your size and value.
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
CRMV1206
CRMV1210
CRMV2010
CRMV2510
CRMV2512
Rated dissipation at 70 °C
W
0.30
0.35
0.50
0.80
1.0
Limiting element voltage
V
550
650
895
1265
1415
Insulation resistance

 1011
 1011
 1011
 1011
 1011
Category temperature range
°C
-55 to +155
-55 to +155
-55 to +155
-55 to +155
-55 to +155
Weight/1000 (typical)
g
12.2
19.6
32.2
39.8
49.7
VOLTAGE COEFFICIENT OF RESISTANCE
MODEL
VALUE ()
CRMV1206
150 to 15M
Consult factory
CRMV1210
300 to 20M
Consult factory
CRMV2010
500 to 40M
Consult factory
CRMV2510
1K to 60M
Consult factory
CRMV2512
1K to 75M
Consult factory
Revision: 29-Jun-15
VCR (ppm/V)
FURTHER INSTRUCTIONS
Document Number: 68037
1
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRMV
www.vishay.com
Vishay Techno
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: CRMV1210AF1K00FLET (preferred part number format)
C
R
GLOBAL
MODEL
SIZE
CRMV
1206
1210
2010
2510
2512
M
V
TERMINAL
STYLE
1
2
TERMINAL
MATERIAL
A = 3-sided F = Nickel barrier
B = Top only G = Non-magnetic
A = Palladium
silver
B = Palladium
gold
C = Gold
D = Platinum silver
E = Platinum
palladium gold
1
0
A
F
1
K
0
0
F
L
E
T
RESISTANCE
VALUE
TOLERANCE
TCR
SOLDER
TERMINATION
PACKAGING
R=
K = k
M = M
110R = 110 
49K9 = 49.9 k
10M0 = 10 M
D = ± 0.5 %
F=±1%
G=±2%
J=±5%
K = ± 10 %
M = ± 20 %
K = 100 ppm
L = 150 ppm
E = Sn100
N = No solder
T = Sn90 / Pb10
B = Bulk
F=T/R
(full reel)
1=T/R
(1000 pcs)
5=T/R
(500 pcs)
T=T/R
(250 pcs min.)
W = Waffle tray
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
DIMENSIONS in inches (millimeters)
TERMINATION STYLE A
(3-SIDED WRAPAROUND)
TERMINATION STYLE B
(TOP CONDUCTOR ONLY)
W
W
L
MODEL
LENGTH (1)
(L)
WIDTH (1)
(W)
THICKNESS (1)
(T)
CRMV1206
0.125 ± 0.006
(3.18 ± 0.15)
0.063 ± 0.006
(1.60 ± 0.15)
0.025 ± 0.002
(0.64 ± 0.05)
CRMV1210
0.125 ± 0.006
(3.18 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.025 ± 0.002
(0.64 ± 0.05)
CRMV2010
0.200 ± 0.006
(5.08 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.025 ± 0.002
(0.64 ± 0.05)
CRMV2510
0.250 ± 0.006
(6.35 ± 0.15)
0.100 ± 0.006
(2.54 ± 0.15)
0.025 ± 0.002
(0.64 ± 0.05)
CRMV2512
0.250 ± 0.006
(6.35 ± 0.15)
0.126 ± 0.006
(3.20 ± 0.15)
0.025 ± 0.002
(0.64 ± 0.05)
L
T
T
0.025 (0.635)
Max.
0.025 (0.635)
Max.
Note
(1) All dimensions are before solder coating.
TYPE
TERMINATION
MATERIAL
Solderable
Nickel barrier
Solderable
Non-magnetic
TERMINATION
STYLE
TERMINATION STYLE /
MATERIAL CODE
3-sided (wraparound)
AF
Top only (flip chip)
BF
3-sided (wraparound)
AG
Top only (flip chip)
BG
SOLDER TERMINATION
CODE
E or T
E or T
Epoxy bondable /
solderable
Platinum palladium gold
Top only (flip chip)
BE
N
Wire bondable / 
epoxy bondable
Gold
Top only (flip chip)
BC
N
Palladium silver
Epoxy bondable
Platinum gold
Platinum silver
Revision: 29-Jun-15
BA
Top only (flip chip)
BB
N
BD
Document Number: 68037
2
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRMV
www.vishay.com
Vishay Techno
Rated Power in %
DERATING CURVE
MATERIAL SPECIFICATIONS
120
Resistive element
Ruthenium oxide
100
Encapsulation
80
Substrate
60
40
20
0
- 55
- 25
0
25
50
75 100 125 155 175
70
Ambient Temperature in °C
Epoxy
96 % alumina
Termination
Solder-coated nickel barrier or solder
coated non-magnetic terminations
standard. Gold, platinum silver, platinum
palladium gold terminations available.
Solder finish
Pure tin or tin / lead solder alloys standard.
PERFORMANCE
TEST
CONDITIONS OF TEST
TEST RESULTS (TYPICAL TEST LOTS)
MIL-STD-202, method 108
1000 h rated power at +70 °C
 ± 0.50 %
MIL-PRF-55342, paragraph 4.8.6
 ± 0.02 %
MIL-STD-202, method 107
-55 °C to +150 °C
 ± 0.50 %
MIL-PRF-55342, paragraph 4.8.5
 ± 0.02 %
MIL-STD-202, methods 210
 ± 0.05 %
Moisture resistance
MIL-PRF-55342, paragraph 4.8.9
 ± 0.06 %
Solder mounting integrity
MIL-PRF-55342, paragraph 4.8.13
2 kg for 30 s
No evidence of mechanical damage
MIL-STD-202, method 208
95 % coverage
Life
Short time overload
Thermal shock
Low temperature operation
Resistance to bonding exposure
Solderability
Revision: 29-Jun-15
Document Number: 68037
3
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000