PHP www.vishay.com Vishay Dale Thin Film High Power Thin Film Wraparound Chip Resistor FEATURES • • • • • • High purity ceramic substrate Power rating to 2.5 W Resistance range 10 to 30.1 k Resistor tolerance to ± 0.1 % TCR to ± 25 ppm/°C Flame resistant UL 94 V-0 APPLICATIONS PHP series chip resistors are designed with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users circuit board. Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the generated heat is critical to the overall performance of the device. • • • • • Power supplies Power switching Braking system Test and measurement equipment Motor deflection circuits TYPICAL PERFORMANCE ABSOLUTE TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST Material Resistance Range TCR: Absolute Tolerance: Absolute Power Rating: Resistor Stability: Absolute Stability: Ratio Voltage Coefficient Working Voltage Operating Temperature Range Storage Temperature Range Noise Shelf Life Stability: Absolute SPECIFICATIONS Nichrome 10 to 30.1 k 25 ppm/°C, 50 ppm/°C (standard) and, 100 ppm/°C 0.1 %, 0.5 %, 1.0 % and, 5.0 % 0.375 W - 2.5 W (1) R 0.1 % Not applicable < 0.1 ppm/V 75 V to 200 V -55 °C to +155 °C -55 °C to +155 °C < -30 dB ± 0.01 % CONDITIONS -55 °C to +125 °C +25 °C Maximum at +70 °C 2000 h at +70 °C 1 year at +25 °C COMPONENT RATINGS CASE SIZE POWER RATING (mW) 0603 375 (1) 0805 625 (1) 1206 1000 (1) 2512 2500 (1) Note (1) Dependent on component mounting by user WORKING VOLTAGE (V) 75 100 200 200 RESISTANCE RANGE () 10 to 30.1K 10 to 30.1K 10 to 30.1K 10 to 30.1K ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements) ENVIRONMENTAL TEST Resistance Temperature Characteristic Maximum Ambient Temperature at Rated Wattage Maximum Ambient Temperature at Power Derating Thermal Shock Low Temperature Operation Short Time Overload High Temperature Exposure Resistance to Soldering Heat Moisture Resistance Life at +70 °C for 2000 h Revision: 07-Aug-14 LIMITS MIL-PRF-55342 CHARACTERISTIC “E” ± 25 ppm/°C +70 °C +150 °C ± 0.1 % ± 0.1 % ± 0.1 % ± 0.1 % ± 0.2 % ± 0.2 % ± 0.5 % TYPICAL VISHAY PERFORMANCE ± 15 ppm/°C +70 °C +150 °C ± 0.04 % ± 0.001 % ± 0.003 % ± 0.030 % ± 0.007 % ± 0.002 % ± 0.100 % Document Number: 60076 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches D W T E L LENGTH WIDTH W (± 0.005) 0603 0.064 ± 0.006 0805 0.080 ± 0.006 CASE SIZE THICKNESS MIN./MAX. TOP PAD D (± 0.005) BOTTOM PAD E (± 0.005) 0.032 0.020 max. 0.012 0.021 0.050 0.015/0.033 0.016 0.025 1206 0.126 ± 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040 2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050 LAND PATTERN DIMENSIONS in inches 0603 Land Pattern 1206 Land Pattern 0.0920 0.1730 0.0340 0.0710 0.0140 0.0390 0.0220 0.0755 0805 Land Pattern 2512 Land Pattern 0.2910 0.1050 0.0520 0.1260 0.0200 0.0425 0.1090 0.0910 STANDARD MATERIAL SPECIFICATIONS Resistive Element Nichrome Substrate Material Alumina (Al2O3) Terminations (Tin/Lead) Terminations (Lead (Pb)-free) Revision: 07-Aug-14 Tin/lead solder over nickel barrier Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier Document Number: 60076 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP www.vishay.com Vishay Dale Thin Film 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 0603 - 100 Ω 0603 - 5 kΩ 0603 - 18.8 kΩ 70 PHP CHIP TEMP. VS. APPLIED POWER Applied Power (W) Applied Power (W) PHP CHIP TEMP. VS. APPLIED POWER 150 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 200 70 Chip Surface Temperature (°C) Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C. 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 1206 - 100 Ω 1206 - 5 kΩ 1206 - 10 kΩ 70 150 Revision: 07-Aug-14 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C. PHP CHIP TEMP. VS. APPLIED POWER 10.00 9.00 8.00 7.00 6.00 5.00 4.00 3.00 2.00 1.00 0.00 2512 - 10 Ω 2512 - 10 kΩ 2512 - 30 kΩ 70 200 200 150 Chip Surface Temperature (°C) Chip Surface Temperature (°C) Notes • Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface temperature of 25 °C. • Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full range of power levels. • Thermal imaging and load life testing was conducted mounting one device to 2" x 3" test cards with 2.5 mil copper plating on both surfaces. Thermal vias on 120 mil centers were utilized for heat transfer between surfaces of the test card. 150 Chip Surface Temperature (°C) Applied Power (W) Applied Power (W) PHP CHIP TEMP. VS. APPLIED POWER 0805 - 100 Ω 0805 - 5 kΩ 0805 - 20 kΩ Notes • Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface temperature of 25 °C. Case Size Resistance Value Temperature 2512 2512 2512 Up to 10 Up to 10 k Up to 30 k 70 2.44 1.81 1.87 150 6.82 4.89 5.19 200 9.33 6.63 7.09 Power (W) Document Number: 60076 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP www.vishay.com Vishay Dale Thin Film DERATING CURVE Percent of Rated Power 100 80 60 40 20 0 0 70 125 155 Ambient Temperature °C GLOBAL PART NUMBER INFORMATION P H P GLOBAL MODEL SUBSTRATE PHP 0 = Alumina 0 CASE SIZE 0603 0805 1206 2512 1 2 0 6 TCR RESISTANCE E= ± 25 ppm/°C H= ± 50 ppm/°C K= ± 100 ppm/°C The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. “R” designates the decimal point. Example: 10R0 = 10 1000 = 100 1001 = 1 k Revision: 07-Aug-14 E 1 TOLERANCE 0 0 2 B TERMINATION B = ± 0.1 % B = Wraparound Sn/Pb solder D = ± 0.5 % w/nickel barrier F = ± 1.0 % G = ± 2.0 % J = ± 5.0 % S = Wraparound lead (Pb)-free solder SAC-305 RoHS-compliant - e1 B T 1 PACKAGING BS = BULK 100 min., 1 mult WS = WAFFLE 100 min., 1 mult WI = WAFFLE (item single lot day code) 100 min., 1 mult TAPE AND REEL T1 = 1000 min., 1000 mult T3 = 300 min., 300 mult T5 = 500 min., 500 mult TF = Full reel TS = 100 min., 1 mult TI = 100 min., 1 mult (item single lot date code) TP = 100 min., 1 mult (package unit single lot date) Document Number: 60076 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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