RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination material: gold, platinum silver, platinum palladium gold or solder coated Available non-magnetic terminations available • Multiple styles, termination materials and configurations, allow wide design flexibility • Epoxy bondable or wire bondable non-magnetic terminations available • Flow solderable • Custom sizes available • Burn-in data available • Automatic placement capability • Termination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available • Tape and reel packaging available • Internationally standardized sizes • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details. STANDARD ELECTRICAL SPECIFICATIONS GLOBAL MODEL CASE SIZE MAXIMUM WORKING VOLTAGE (1) V 40 50 70 100 100 100 125 200 200 POWER RATING P70 °C W RESISTANCE RANGE (2) TOLERANCE ±% RC0540 0504 0.100 10 to 500K RC0550 0505 0.100 10 to 500K RC0575 0705 (4) 0.200 10 to 1M RC5100 1005 0.250 10 to 1M RC1100 1010 0.450 10 to 1M RC1206 1206 0.300 10 to 1M RC5150 1505 0.325 10 to 1M RC7225 2208 0.525 10 to 1M RC2010 2010 0.575 10 to 1M Notes (1) Continuous working voltage shall be P x R or maximum working voltage, whichever is less. (2) Higher values available. Please consult factory. (3) ± 100 ppm/°C standard thru 1 M, ± 200 ppm/°C offered from 1.1 M to 10 M. (4) MIL case size 0705 and EIA case size 0805 are dimensionally the same. 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 1, 2, 5, 10, 20 TEMPERATURE COEFFICIENT (3) (-55 °C to +155 °C) ± ppm/°C 100 100 100 100 100 100 100 100 100 GLOBAL PART NUMBER INFORMATION New Global Part Numbering: RC0540AA1K00FKSB (preferred part number format) R GLOBAL MODEL RC C SIZE 0540 0550 0575 5100 1100 1206 5150 7225 2010 0 5 TERM STYLE A = 3-sided B = Top only C = 5-sided 4 0 TERM MATERIAL G = Non-magnetic A = Palladium silver B = Platinum gold C = Gold D = Platinum silver E = Platinum palladium gold A A 1 K 0 0 F RESISTANCE VALUE TOLERANCE TCR R= K = k M = M 100R = 100 1K00 = 1 k 1M00 = 1 M F=±1% G=±2% J=±5% K = ± 10 % M = ± 20 % K = 100 ppm L = 150 ppm N = 200 ppm W = 350 ppm K S B SOLDER TERMINATION PACKAGING E = Sn100 F = Sn95/Ag5, HSD S= Sn62/Pb36/Ag2, HSD T = Sn90/Pb10 N = No solder B = Bulk F = T/R (full reel) 1 = T/R (1000 pcs) 5 = T/R (500 pcs) T = T/R (250 pcs min.) W = Waffle tray Historical Part Numbering: CR1AA1001F100S2 (will continue to be accepted) CR 1 A A 1001 F 100 S2 HISTORICAL TERM TERM RESISTANCE SOLDER SIZE TOLERANCE TCR MODEL STYLE MATERIAL VALUE TERMINATION Note • For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543). Revision: 01-Oct-14 Document Number: 68013 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RC www.vishay.com Vishay Techno MECHANICAL SPECIFICATIONS ENVIRONMENTAL SPECIFICATIONS Resistive element Operating temperature Ruthenium oxide Encapsulation Glass Substrate 96 % alumina -55 °C to +155 °C Moisture resistance Termination Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold or solder coated non-magnetic terminations available. Solder finish Base metallization without a solder finish standard. Hot solder dipped tin/silver or tin/lead/silver solder alloys available. Less than 0.5 % change when tested per method 106 of MIL-STD-202 Less than 1 % change when tested per method 108D (+85 °C) of MIL-STD-202 Life Less than 0.5 % R Short time overload DIMENSIONS in inches (millimeters) Termination Style A Termination Style B (3-sided wraparound) (Top conductor only) Termination Style C (5-sided wraparound) W W W L L L T T T 0.025 [0.635] Max. 0.025 [0.635] Max. 0.025 [0.635] Max. MODEL LENGTH (L) (1) ± 0.006 (0.152) WIDTH (W) (1) THICKNESS (T) (1) ± 0.006 (0.152) ± 0.005 (0.127) RC0540 0.050 (1.27) 0.040 (1.02) 0.020 (0.508) RC0550 0.050 (1.27) 0.050 (1.27) 0.020 (0.508) RC0575 0.075 (1.90) 0.050 (1.27) 0.020 (0.508) RC5100 0.100 (2.54) 0.050 (1.27) 0.020 (0.508) RC1100 0.100 (2.54) 0.100 (2.54) 0.020 (0.508) RC1206 0.125 (3.18) 0.062 (1.57) 0.025 (0.635) RC5150 0.150 (3.81) 0.050 (1.27) 0.020 (0.508) RC7225 0.225 (5.72) 0.075 (1.90) 0.020 (0.508) RC2010 0.200 (5.08) 0.100 (2.54) 0.025 (0.635) Note (1) All dimensions are before solder coating. TYPE Solderable Epoxy bondable/ solderable Wire bondable/ Epoxy bondable TERMINATION MATERIAL Non-magnetic Platinum palladium gold Gold Palladium silver (4) Epoxy bondable Platinum gold Platinum silver TERMINATION STYLE TERMINATION STYLE/ MATERIAL CODE SOLDER TERMINATION CODE 3-sided (wraparound) AG Top only (flip chip) BG E or T (standard); F or S (optional) (2) 3-sided (wraparound) AE Top only (flip chip) BE 5-sided (wraparound) CE 3-sided (wraparound) AC Top only (flip chip) BC 5-sided (wraparound) CC 3-sided (wraparound) AA Top only (flip chip) BA 5-sided (wraparound) CA 3-sided (wraparound) AB Top only (flip chip) BB 5-sided (wraparound) CB 3-sided (wraparound) AD Top only (flip chip) BD 5-sided (wraparound) CD N (standard); F or S (optional) (3) N N Notes (2) Standard solder plating for the non-magnetic parts are solder terminations E or T. Hot solder dipped terminations F or S are also available. (3) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting. (4) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues. Revision: 01-Oct-14 Document Number: 68013 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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