RN2483 Low-Power Long Range LoRa® Technology Transceiver Module General Features • • • • On-board LoRaWAN™ protocol stack ASCII command interface over UART Compact form factor: 17.8 x 26.7 x 3.34 mm Castellated SMT pads for easy and reliable PCB mounting • Environmentally friendly, RoHS compliant • European R&TTE Directive Assessed Radio Module • Device Firmware Upgrade (DFU) over UART, see “RN2483 LoRa® Technology Module Command Reference User’s Guide” (DS40001784) Operational • Single operating voltage: 2.1V to 3.6V (3.3V typical) • Temperature range: -40°C to +85°C • Low-power consumption • Programmable RF Communication Bit Rate up to 300 kbps with FSK modulation, 10937 bps with LoRa® Technology modulation • Integrated MCU, Crystal, EUI-64 Node Identity Serial EEPROM, Radio Transceiver with Analog Front End, Matching Circuitry • 14 GPIOs for control and status RF/Analog Features • Low-Power Long Range Transceiver operating in the 433 MHz and 868 MHz frequency bands • High Receiver Sensitivity: down to -146 dBm • TX Power: adjustable up to +14 dBm high efficiency PA • FSK, GFSK, and LoRa Technology modulation • IIP3 = -11 dBm • Up to 15 km coverage at suburban and up to 5 km coverage at urban area 2015 Microchip Technology Inc. Description Microchip’s RN2483 Low-Power Long Range LoRa Technology Transceiver module provides an easy to use, low-power solution for long range wireless data transmission. The advanced command interface offers rapid time to market. The RN2483 module complies with the LoRaWAN Class A protocol specifications. It integrates RF, a baseband controller, command Application Programming Interface (API) processor, making it a complete long range Solution. The RN2483 module is suitable for simple long range sensor applications with external host MCU. Applications • • • • • • Automated Meter Reading Home and Building Automation Wireless Alarm and Security Systems Industrial Monitoring and Control Machine to Machine (M2M) Internet of Things (IoT) DS50002346B-page 1 RN2483 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 3 2.0 General Specifications ................................................................................................................................................................. 6 3.0 Typical Hardware Connections..................................................................................................................................................... 8 4.0 Physical Dimensions .................................................................................................................................................................... 9 5.0 Application Information............................................................................................................................................................... 10 6.0 Regulatory Approval ................................................................................................................................................................... 12 Appendix A: Revision History ............................................................................................................................................................... 13 The Microchip Web Site ....................................................................................................................................................................... 15 Customer Change Notification Service ................................................................................................................................................ 15 Customer Support ................................................................................................................................................................................ 15 Product Identification System............................................................................................................................................................... 17 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS50002346B-page 2 2015 Microchip Technology Inc. RN2483 DEVICE OVERVIEW LoRa Technology modulation also provides significant advantages in both blocking and selectivity compared to the conventional modulation techniques, solving the traditional design compromise between extended range, interference immunity, and low-power consumption. The RN2483 transceiver module features LoRa Technology RF modulation, which provides long range spread spectrum communication with high interference immunity. The RN2483 module delivers exceptional phase noise, selectivity, receiver linearity, and IIP3 for significantly lower power consumption. Figure 1-1, Figure 1-2, and Figure 1-3 show the top view, the pinout, and the block diagram of the module. RN2483 PIN DIAGRAM RN2483 TOP VIEW RFL 25 GND 24 RFH 23 FIGURE 1-1: FIGURE 1-2: 28 GND 29 NC 30 TEST0 31 TEST1 GND 20 NC 19 NC 18 NC 17 32 RESET 33 GND NC 16 NC 15 34 VDD 35 GPIO0 GPIO10 14 GPIO11 13 38 GPIO3 39 GPIO4 GPIO12 10 GPIO13 9 36 GPIO1 37 GPIO2 VDD 12 GND 11 40 GPIO5 41 GND GND 8 UART_RX 7 UART_TX 6 42 NC 43 GPIO6 RESERVED 5 RESERVED 4 44 GPIO7 45 GPIO8 UART_CTS 3 UART_RTS 2 GND 1 46 GPIO9 47 GND FIGURE 1-3: GND 22 GND 21 Using LoRa Technology modulation technique, RN2483 can achieve a receiver sensitivity of -146 dBm. The high sensitivity combined with the integrated +14 dBm power amplifier yields industry leading link budget, which makes it optimal for applications requiring extended range and robustness. GND 27 GND 26 1.0 RN2483 BLOCK DIAGRAM Host MCU RN2483 Module MCU UART Command Processor LoRaWAN™ Protocol Stack 14 GPIO Pins I2C Real-Time Clock EUI-64 EEPROM 32768 Hz Crystal User Hardware: Status LEDs, Switches, Logic IOs, etc. 2015 Microchip Technology Inc. SPI LoRa® Technology Radio Antenna 433 MHz Antenna 868 MHz DS50002346B-page 3 RN2483 Table 1-1 describes the module’s pins. TABLE 1-1: Pin PIN DESCRIPTION Name Type Description 1 GND Power Ground supply terminal 2 UART_RTS Output Communication UART RTS signal(1) 3 UART_CTS Input Communication UART CTS signal(1) 4 RESERVED — Do not connect 5 RESERVED — Do not connect 6 UART_TX Output Communication UART Transmit (TX) 7 UART_RX Input Communication UART Receive (RX) 8 GND Power Ground supply terminal 9 GPIO13 Input/Output General purpose I/O pin 10 GPIO12 Input/Output General purpose I/O pin 11 GND Power Ground supply terminal 12 VDD Power Positive supply terminal 13 GPIO11 Input/Output General purpose I/O pin 14 GPIO10 Input/Output General purpose I/O pin 15 NC — Not connected 16 NC — Not connected 17 NC — Not connected 18 NC — Not connected 19 NC — Not connected 20 GND Power Ground supply terminal 21 GND Power Ground supply terminal 22 GND Power Ground supply terminal 23 RFH RF analog RF signal pin for high band 24 GND Power Ground supply terminal 25 RFL RF analog RF signal pin for low band 26 GND Power Ground supply terminal 27 GND Power Ground supply terminal 28 GND Power Ground supply terminal 29 NC — Not connected 30 TEST0 — Do not connect 31 TEST1 — Do not connect 32 RESET Input Active-low device Reset input 33 GND Power Ground supply terminal 34 VDD Power Positive supply terminal 35 GPIO0 Input/Output General purpose I/O pin 36 GPIO1 Input/Output General purpose I/O pin 37 GPIO2 Input/Output General purpose I/O pin 38 GPIO3 Input/Output General purpose I/O pin 39 GPIO4 Input/Output General purpose I/O pin 40 GPIO5 Input/Output General purpose I/O pin 41 GND Power Ground supply terminal 42 NC — Not connected 43 GPIO6 Input/Output General purpose I/O pin DS50002346B-page 4 2015 Microchip Technology Inc. RN2483 TABLE 1-1: Pin PIN DESCRIPTION (CONTINUED) Name Type Description 44 GPIO7 Input/Output General purpose I/O pin 45 GPIO8 Input/Output General purpose I/O pin 46 GPIO9 Input/Output General purpose I/O pin 47 GND Power Ground supply terminal Note 1: Optional handshake lines are supported in future firmware releases. 2015 Microchip Technology Inc. DS50002346B-page 5 RN2483 2.0 GENERAL SPECIFICATIONS Table 2-1 provides the general specifications for the module. Table 2-2, Table 2-3, and Table 2-4 provide the electrical characteristics, current consumption, and dimensions of the module. Table 2-5 shows the RF output power calibration data. TABLE 2-1: GENERAL SPECIFICATIONS Specification Description Frequency Band 863.000 MHz to 870.000 MHz; 433.050 MHz to 434.790 MHz Modulation Method FSK, GFSK, and LoRa® Technology modulation Maximum Over-the-Air Data Rate 300 kbps with FSK modulation; 10937 bps with LoRa Technology modulation RF connection Board edge connection Interface UART Operation Range up to 15 km coverage at suburban; up to 5 km coverage at urban area Sensitivity at 0.1% BER -146 dBm(1) RF TX Power Adjustable up to max. 10 dBm on 433 MHz band (limited to meet regulations); max. 14 dBm on the 868 MHz band(2) Temperature (operating) -40°C to +85°C Temperature (storage) -40°C to +115°C Humidity 10% ~ 90% non-condensing Note 1: Depends on modulation. Expand Spreading Factor (SF). 2: TX power is adjustable. For more information, refer to the “RN2483 LoRa® Technology Module Command Reference User’s Guide” (DS40001784). TABLE 2-2: ELECTRICAL CHARACTERISTICS Parameter Min. Typ. Max. Units Supply Voltage 2.1 — 3.6 V Voltage on any pin with respect to VSS (except VDD) -0.3 — VDD + 0.3 V Voltage on VDD with respect to VSS -0.3 — 3.9 V Input Clamp Current (IIK) (VI < 0 or VI > VDD) — — +/-20 mA Output Camp Current (IOK) (VO < 0 or VO > VDD) — — +/-20 mA GPIO sink/source current each — — 25/25 mA Total GPIO sink/source current — — 200/185 mA RAM Data Retention Voltage (in Sleep mode or Reset state) 1.5 — — V VDD Start Voltage to ensure internal Power-on Reset signal — — 0.7 V VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms Brown-out Reset Voltage 1.75 1.9 2.05 V Logic Input Low Voltage — — 0.15 x VDD V Logic Input High Voltage 0.8 x VDD — — V Input Leakage at <25°C (VSS<VPIN<VDD, Pin at high-impedance) — 0.1 50 nA Input Leakage at +60°C (VSS<VPIN<VDD, Pin at high-impedance) — 0.7 100 nA Input Leakage at +85°C (VSS<VPIN<VDD, Pin at high-impedance) — 4 200 nA RF Input Level — — +10 dBm DS50002346B-page 6 2015 Microchip Technology Inc. RN2483 TABLE 2-3: CURRENT CONSUMPTION Mode Typical Current at 3V (mA) Idle 2.8 RX 14.2 Deep Sleep TABLE 2-4: TABLE 2-5: Band OUTPUT POWER OF TX POWER SETTING TX Power Setting Output Power (dBm) Typical Supply Current at 3V (mA) -3 -4.0 17.3 -2 -2.9 18.0 -1 -1.9 18.7 -1.7 20.2 0.0018 MODULE DIMENSIONS Parameter Value Dimensions 17.8 x 26.7 x 3.34 mm 0 Weight 2.05g 1 -0.6 21.2 2 0.4 22.3 3 1.4 23.5 4 2.5 24.7 5 3.6 26.1 6 4.7 27.5 7 5.8 28.8 8 6.9 30.0 9 8.1 31.2 868 MHz 433 MHz 2015 Microchip Technology Inc. 10 9.3 32.4 11 10.4 33.7 12 11.6 35.1 13 12.5 36.5 14 13.5 38.0 15 14.1 38.9 -3 -3.5 14.7 -2 -2.3 15.1 -1 -1.3 15.6 0 -2.3 15.8 1 -1.2 16.4 2 -0.1 17.0 3 1.0 17.7 4 2.1 18.5 5 3.2 19.4 6 4.3 20.3 7 5.4 21.4 8 6.5 22.3 9 7.6 23.3 10 8.8 24.5 11 9.9 25.8 12 10.9 27.3 13 11.9 28.8 14 12.9 30.7 15 13.6 32.9 DS50002346B-page 7 RN2483 3.0 TYPICAL HARDWARE CONNECTIONS Figure 3-1 shows the typical hardware connections. FIGURE 3-1: HARDWARE CONNECTIONS 0+]EDQG 0+]EDQG 5)/ 5)+ 51 +RVW0&8 7; 5; 5; 7; &76 576 576 &76 8$57 *3,2V 6WDWXV/('V 6ZLWFKHV /RJLF,2V HWF Note 1: Optional handshake lines are supported in future firmware releases. 3.1 INTERFACE TO HOST MCU The RN2483 module has a dedicated UART interface to communicate with a host controller. Optional handshake lines are supported in future firmware releases. The “RN2483 LoRa® Technology Module Command Reference User’s Guide” (DS40001784) provides a detailed UART command description. Table 3-1 shows the default settings for the UART communication. TABLE 3-1: DEFAULT UART SETTINGS Specification Description Baud Rate 57600 bps Packet Length 8 bit Parity Bit No Stop Bits 1 bit Hardware Flow Control No 3.2 3.3 RF CONNECTIONS (RFL, RFH) RFL is the RF analog port for the lower frequency band (433 MHz) while RFH is for the higher frequency band (868 MHz). When routing RF paths, use proper strip lines with an impedance of 50 Ohm. 3.4 RESET PIN The Reset pin of the module is an active-low logic input. 3.5 POWER PINS It is recommended to connect power pins (Pin 12 and 34) to a stable supply voltage with sufficient source current. Table 2-3 shows the current consumption. Additional filtering capacitors are not required but used to ensure stable supply voltage in a noisy environment. GPIO PINS (GPIO0-GPIO13) The module has 14 GPIO pins. These lines can be connected to switches, LEDs, and relay outputs. The pins can be either logic inputs or outputs, and some pins have analog input capability that can be accessed via the module firmware. These pins have limited sink and source capabilities. Electrical characteristics are described in Table 2-2. For more information, see “RN2483 LoRa® Technology Module Command Reference User’s Guide” (DS40001784). DS50002346B-page 8 2015 Microchip Technology Inc. RN2483 4.0 PHYSICAL DIMENSIONS Figure 4-1 and Figure 4-2 illustrate the physical dimensions and the recommended PCB layout for the RN2483 module. FIGURE 4-1: RN2483 PHYSICAL DIMENSIONS FIGURE 4-2: RECOMMENDED PCB FOOTPRINT Note: Host PCB top layer copper traces must have solder mask to avoid shorting test pins on the bottom of the module. 2015 Microchip Technology Inc. DS50002346B-page 9 RN2483 5.0 APPLICATION INFORMATION 5.1 RF Trace Layout Design The RN2483 modular transmitter is certified with a PCB edge SMA connector and micro-strip trace layout as shown in Figure 5-1 and Figure 5-2. The two RF paths are axisymmetric with the same linear dimensions. The host PCB can follow these trace design to maintain compliance under the modular grant (FCC) and certificate (IC). Gerber files are available on the RN2483 product web page at www.microchip.com/RN2483. FIGURE 5-1: RF TRACE ROUTING (TOP LAYER) PCB Details: Two layer, plated through hole FR4 Thickness: 1.55 mm Via stitching with 0.25 mm plated Trace Dimensions: Trace width: 0.75 Trace gap: 0.15 Finished Copper Weight: 1 ounce Dimensions are in millimeters FIGURE 5-2: DS50002346B-page 10 RF TRACE ROUTING (BOTTOM LAYER) 2015 Microchip Technology Inc. APPLICATION SCHEMATIC Figure 5-3 shows the schematic for the RN2483 PICtail™/PICtail Plus Daughter Board. FIGURE 5-3: PICtail™/PICtail PLUS DAUGHTER BOARD SCHEMATIC 2015 Microchip Technology Inc. Note: Shaded components are not populated by default. RN2483 DS50002346B-page 11 5.2 RN2483 6.0 REGULATORY APPROVAL 6.1.2 This section outlines the regulatory information for the RN2483 module for Europe. 6.1 From R&TTE Compliance Association document Technical Guidance Note 01: Europe Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer's installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product (Section 2.2.4). The RN2483 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The RN2483 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article 3.1a), Electromagnetic Compatibility (EMC) (Article 3.1b), and Radio (Article 3.2) and are summarized in Table 6-1: European Compliance Testing. A Notified Body Opinion has also been issued. All test reports are available on the product web page at http://www.microchip.com. 6.1.3 6.1.1 HELPFUL WEB SITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: EXTERNAL ANTENNA REQUIREMENTS Additional helpful web sites are: • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/sectors/rtte/ regulatory-framework/index_en.htm • European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org • European Telecommunications Standards Institute (ETSI): http://www.etsi.org • European Radio Communications Office (ERO): http://www.ero.dk/ • The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ To maintain conformance to the testing listed in Table 6-1: European Compliance Testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the RN2483 module must follow CE marking requirements. The “R&TTE Compliance Association Technical Guidance Note 01” provides guidance on final product CE marking. TABLE 6-1: EUROPEAN COMPLIANCE TESTING Certification Standards Safety IEC 60950-1:2005 (2nd Ed: A1:2009) Health EN 62479 Article Laboratory Report Number Date (3.1a) TRaC Global Ltd. TRA-025134-43-00A 2/12/2015 — TRaC Global Ltd. TRA-025134-01-47-03A 2/12/2015 EMC EN 301 489-3 v1.6.1 (3.1b) TRaC Global Ltd. TRA-025134-43-00A 2/12/2015 Radio EN 300 220-2 v2.4.1 (3.2) TRaC Global Ltd. TRA-025134-01-47-00A (433 MHz) TRA-02513401-47-01A(868MHz) 2/12/2015 DS50002346B-page 12 2015 Microchip Technology Inc. RN2483 APPENDIX A: REVISION HISTORY Revision A (March 2015) This is the initial release of this document. Revision B (December 2015) This revision includes the following updates: • Updated Deep Sleep value in Table 2-3 "Current Consumption". • Updated Dimensions value in Table 2-4 "Module Dimensions". • Updated Figure 4-1. • Updated Figure 4-2. • Added Figure 5-2. • Updated information for Section 5.1 “RF Trace Layout Design”. 2015 Microchip Technology Inc. DS50002346B-page 13 RN2483 NOTES: DS50002346B-page 14 2015 Microchip Technology Inc. RN2483 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2015 Microchip Technology Inc. DS50002346B-page 15 RN2483 NOTES: DS50002346B-page 16 2015 Microchip Technology Inc. RN2483 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. I RM Device Temperature Range Package XXX Firmware Revision Number Device: RN2483: Low-Power Long Range LoRa® Technology Transceiver module Temperature Range: I = -40C to +85C (Industrial) Package: RM = Radio Module 2015 Microchip Technology Inc. Examples: RN2483-I/RM: Industrial temperature DS50002346B-page 17 RN2483 NOTES: DS50002346B-page 18 2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0101-8 QUALITYMANAGEMENTSYSTEM CERTIFIEDBYDNV == ISO/TS16949== 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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