Data Sheet

PCA9552
16-bit I2C-bus LED driver with programmable blink rates
Rev. 05 — 9 March 2006
Product data sheet
1. General description
The PCA9552 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is
necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set,
etc.) timer. The uniqueness of this device is the internal oscillator with two programmable
blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the
bus master must send repeated commands to turn the LED on and off. This greatly
increases the amount of traffic on the I2C-bus and uses up one of the master's timers. The
PCA9552 LED blinker instead requires only the initial setup command to program
BLINK RATE 1 and BLINK RATE 2 (that is, the frequency and duty cycle) for each
individual output. From then on, only one command from the bus master is required to
turn each individual open-drain output on, off, or to cycle at BLINK RATE 1 or
BLINK RATE 2. Maximum output sink current is 25 mA per bit and 200 mA per package.
Any bits not used for controlling the LEDs can be used for General Purpose Parallel
Input/Output (GPIO) expansion.
The active LOW hardware reset pin (RESET) and Power-On Reset (POR) initializes the
registers to their default state, all zeroes, causing the bits to be set HIGH (LED off).
Three hardware address pins on the PCA9552 allow eight devices to operate on the same
bus.
2. Features
■ 16 LED drivers (on, off, flashing at a programmable rate)
■ 2 selectable, fully programmable blink rates (frequency and duty cycle) between
0.172 Hz and 44 Hz (5.82 seconds and 0.023 seconds)
■ Input/outputs not used as LED drivers can be used as regular GPIOs
■ Internal oscillator requires no external components
■ I2C-bus interface logic compatible with SMBus
■ Internal power-on reset
■ Noise filter on SCL/SDA inputs
■ Active LOW reset input
■ 16 open-drain outputs directly drive LEDs to 25 mA
■ Edge rate control on outputs
■ No glitch on power-up
■ Supports hot insertion
■ Low standby current
■ Operating power supply voltage range of 2.3 V to 5.5 V
■ 0 Hz to 400 kHz clock frequency
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
■ ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
■ Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
■ Packages offered: SO24, TSSOP24, HVQFN24
3. Ordering information
Table 1:
Ordering information
Tamb = −40 °C to +85 °C
Type number
Topside mark Package
Name
Description
Version
PCA9552D
PCA9552D
SO24
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
PCA9552PW
PCA9552
TSSOP24
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
PCA9552BS
9552
HVQFN24
plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 × 4 × 0.85 mm
SOT616-1
4. Block diagram
A0
A1
A2
PCA9552
SCL
SDA
INPUT
REGISTER
INPUT
FILTERS
I2C-BUS
CONTROL
LED SELECT (LSn)
REGISTER
1
VDD
RESET
0
POWER-ON
RESET
OSCILLATOR
LEDn
PRESCALER 0
REGISTER
PWM0
REGISTER
BLINK0
PRESCALER 1
REGISTER
PWM1
REGISTER
BLINK1
VSS
002aac168
Remark: Only one I/O shown for clarity.
Fig 1. Block diagram of PCA9552
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
2 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
5. Pinning information
5.1 Pinning
A0
1
24 VDD
A0
1
A1
2
23 SDA
A1
2
24 VDD
23 SDA
A2
3
22 SCL
A2
3
22 SCL
LED0
4
21 RESET
LED0
4
21 RESET
LED1
5
20 LED15
LED1
5
20 LED15
LED2
6
19 LED14
LED2
6
LED3
7
18 LED13
LED3
7
LED4
8
17 LED12
LED4
8
17 LED12
LED5
9
16 LED11
LED5
9
16 LED11
LED6 10
15 LED10
LED6 10
15 LED10
LED7 11
14 LED9
LED7 11
14 LED9
VSS 12
13 LED8
VSS 12
13 LED8
PCA9552D
PCA9552PW
002aac165
19 LED14
18 LED13
002aac166
19 SCL
20 SDA
21 VDD
24 A2
terminal 1
index area
22 A0
Fig 3. Pin configuration for TSSOP24
23 A1
Fig 2. Pin configuration for SO24
LED0
1
18 RESET
LED1
2
17 LED15
LED2
3
LED3
4
LED4
5
14 LED12
LED5
6
13 LED11
16 LED14
15 LED13
LED10 12
9
VSS
LED9 11
8
LED7
LED8 10
7
LED6
PCA9552BS
002aac167
Transparent top view
Fig 4. Pin configuration for HVQFN24
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
3 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
5.2 Pin description
Table 2:
Symbol
Pin description
Pin
Description
SO24, TSSOP24
HVQFN24
A0
1
22
address input 0
A1
2
23
address input 1
A2
3
24
address input 2
LED0
4
1
LED driver 0
LED1
5
2
LED driver 1
LED2
6
3
LED driver 2
LED3
7
4
LED driver 3
LED4
8
5
LED driver 4
LED5
9
6
LED driver 5
LED6
10
7
LED driver 6
LED7
11
8
LED driver 7
VSS
12
9 [1]
ground supply
LED8
13
10
LED driver 8
LED9
14
11
LED driver 9
LED10
15
12
LED driver 10
LED11
16
13
LED driver 11
LED12
17
14
LED driver 12
LED13
18
15
LED driver 13
LED14
19
16
LED driver 14
LED15
20
17
LED driver 15
RESET
21
18
active LOW reset input
SCL
22
19
serial clock line
SDA
23
20
serial data line
VDD
24
21
supply voltage
[1]
HVQFN package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be
connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level
performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the
board and for proper heat conduction through the board, thermal vias need to be incorporated in the
printed-circuit board in the thermal pad region.
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
4 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
6. Functional description
Refer to Figure 1 “Block diagram of PCA9552”.
6.1 Device address
Following a START condition, the bus master must output the address of the slave it is
accessing. The address of the PCA9552 is shown in Figure 5. To conserve power, no
internal pull-up resistors are incorporated on the hardware selectable address pins and
they must be pulled HIGH or LOW.
slave address
1
1
0
0
fixed
A2
A1
A0 R/W
programmable
002aac169
Fig 5. PCA9552 address
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
6.2 Control Register
Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9552, which will be stored in the Control Register. This register can be
read and written via the I2C-bus.
0
0
0
AI
Auto-Increment flag
B3
B2
B1
B0
register address
002aac170
Reset state: 00h
Fig 6. Control Register
The lowest 3 bits are used as a pointer to determine which register will be accessed.
If the Auto-Increment flag (AI) is set, the four low order bits of the Control Register are
automatically incremented after a read or write. This allows the user to program the
registers sequentially. The contents of these bits will rollover to ‘0000’ after the last
register is accessed.
When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the
sequence must start by reading a register different from ‘0' (B3 B2 B1 B0 ≠ 0000).
Only the 4 least significant bits are affected by the AI flag. Unused bits must be
programmed with zeroes.
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
5 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
6.2.1 Control Register definition
Table 3:
Register summary
B3
B2
B1
B0
Symbol
Access
Description
0
0
0
0
INPUT0
read only
input register 0
0
0
0
1
INPUT1
read only
input register 1
0
0
1
0
PSC0
read/write
frequency prescaler 0
0
0
1
1
PWM0
read/write
PWM register 0
0
1
0
0
PSC1
read/write
frequency prescaler 1
0
1
0
1
PWM1
read/write
PWM register 1
0
1
1
0
LS0
read/write
LED0 to LED3 selector
0
1
1
1
LS1
read/write
LED4 to LED7 selector
1
0
0
0
LS2
read/write
LED8 to LED11 selector
1
0
0
1
LS3
read/write
LED12 to LED15 selector
6.3 Register descriptions
6.3.1 INPUT0 - Input register 0
The Input register 0 reflects the state of the device pins (inputs LED0 to LED7). Writes to
this register will be acknowledged but will have no effect.
Table 4:
Bit
INPUT0 - input register 0 description
7
6
5
4
3
2
1
0
Symbol
LED7
LED6
LED5
LED4
LED3
LED2
LED1
LED0
Default
X
X
X
X
X
X
X
X
Remark: The default value ‘X’ is determined by the externally applied logic level (normally
logic 1) when used for directly driving LED with pull-up to VDD.
6.3.2 INPUT1 - Input register 1
The Input register 1 reflects the state of the device pins (inputs LED8 to LED15). Writes to
this register will be acknowledged but will have no effect.
Table 5:
Bit
INPUT1 - input register 1 description
7
6
5
4
3
2
1
0
Symbol
LED15
LED14
LED13
LED12
LED11
LED10
LED9
LED8
Default
X
X
X
X
X
X
X
X
Remark: The default value ‘X’ is determined by the externally applied logic level (normally
logic 1) when used for directly driving LED with pull-up to VDD.
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
6 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
6.3.3 PCS0 - Frequency Prescaler 0
PSC0 is used to program the period of the PWM output.
The period of BLINK0 = (PSC0 + 1) / 44.
Table 6:
Bit
PSC0 - Frequency Prescaler 0 register description
7
6
5
4
3
2
1
0
Symbol
PSC0[7]
PSC0[6]
PSC0[5]
PSC0[4]
PSC0[3]
PSC0[2]
PSC0[1]
PSC0[0]
Default
1
1
1
1
1
1
1
1
6.3.4 PWM0 - Pulse Width Modulation 0
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off)
when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is
programmed with 00h, then the PWM0 output is always LOW.
The duty cycle of BLINK0 = (256 − PWM0) / 256.
Table 7:
Bit
PWM0 - Pulse Width Modulation 0 register description
7
6
5
4
3
2
1
0
Symbol
PWM0
[7]
PWM0
[6]
PWM0
[5]
PWM0
[4]
PWM0
[3]
PWM0
[2]
PWM0
[1]
PWM0
[0]
Default
1
0
0
0
0
0
0
0
6.3.5 PCS1 - Frequency Prescaler 1
PSC1 is used to program the period of the PWM output.
The period of BLINK1 = (PSC1 + 1) / 44.
Table 8:
Bit
PSC1 - Frequency Prescaler 1 register description
7
6
5
4
3
2
1
0
Symbol
PSC1[7]
PSC1[6]
PSC1[5]
PSC1[4]
PSC1[3]
PSC1[2]
PSC1[1]
PSC1[0]
Default
1
1
1
1
1
1
1
1
6.3.6 PWM1 - Pulse Width Modulation 1
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off)
when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is
programmed with 00h, then the PWM1 output is always LOW.
The duty cycle of BLINK1 = (256 − PWM1) / 256.
Table 9:
Bit
PWM1 - Pulse Width Modulation 1 register description
7
6
5
4
3
2
1
0
Symbol
PWM1
[7]
PWM1
[6]
PWM1
[5]
PWM1
[4]
PWM1
[3]
PWM1
[2]
PWM1
[1]
PWM1
[0]
Default
1
0
0
0
0
0
0
0
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
7 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
6.3.7 LS0 to LS3 - LED selector registers
The LSn LED select registers determine the source of the LED data.
00 = output is set LOW (LED on)
01 = output is set high-impedance (LED off; default)
10 = output blinks at PWM0 rate
11 = output blinks at PWM1 rate
Table 10: LS0 to LS3 - LED selector registers bit description
Legend: * default value
Register
Bit
Value
Description
LS0 - LED0 to LED3 selector
LS0
7:6
01*
LED3 selected
5:4
01*
LED2 selected
3:2
01*
LED1 selected
1:0
01*
LED0 selected
LS1 - LED4 to LED7 selector
LS1
7:6
01*
LED7 selected
5:4
01*
LED6 selected
3:2
01*
LED5 selected
1:0
01*
LED4 selected
LS2 - LED8 to LED11 selector
LS2
7:6
01*
LED11 selected
5:4
01*
LED10 selected
3:2
01*
LED9 selected
1:0
01*
LED8 selected
LS3 - LED12 to LED15 selector
LS3
7:6
01*
LED15 selected
5:4
01*
LED14 selected
3:2
01*
LED13 selected
1:0
01*
LED12 selected
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
8 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
6.4 Pins used as GPIOs
LED pins not used to control LEDs can be used as general purpose I/Os (GPIOs).
For use as input, set LEDn to high-impedance (01) and then read the pin state via the
input register.
For use as output, connect external pull-up resistor to the pin and size it according to the
DC recommended operating characteristics. LED output pin is HIGH when the output is
programmed as high-impedance, and LOW when the output is programmed LOW through
the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or
PWM1 are used.
6.5 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9552 in
a reset condition until VDD has reached VPOR. At that point, the reset condition is released
and the PCA9552 registers are initialized to their default states. Thereafter, VDD must be
lowered below 0.2 V to reset the device.
6.6 External RESET
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The
PCA9552 registers and I2C-bus state machine will be held in their default states until the
RESET input is once again HIGH.
This input requires a pull-up resistor to VDD if no active connection is used.
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
9 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 7).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 7. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 8.)
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mba608
Fig 8. Definition of START and STOP conditions
7.2 System configuration
A device generating a message is a ‘transmitter'; a device receiving is the ‘receiver'. The
device that controls the message is the ‘master' and the devices which are controlled by
the master are the ‘slaves' (see Figure 9).
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
10 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 9. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
S
START
condition
2
8
9
clock pulse for
acknowledgement
002aaa987
Fig 10. Acknowledgement on the I2C-bus
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
11 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
7.4 Bus transactions
SCL
1
2
3
4
5
6
7
8
9
slave address
SDA S
1
1
0
data to register
command byte
0 A2 A1 A0 0
START condition
A
R/W
0
0
0
AI B3 B2 B1 B0 A
DATA 1
A
acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
write to register
tv(Q)
data out from port
DATA 1 VALID
002aac185
Fig 11. Write to register
slave address
SDA S
1
1
0
command byte
0 A2 A1 A0 0
START condition
0
A
0
1
1
0
0 A2 A1 A0 1
(repeated)
START condition
(cont.)
AI B3 B2 B1 B0 A
acknowledge
from slave
R/W
acknowledge
from slave
slave address
(cont.) S
0
data from register
DATA (first byte)
A
Auto-Increment
register address
if AI = 1
R/W
acknowledge
from slave
data from register
DATA (last byte)
A
acknowledge
from master
NA P
STOP
condition
no acknowledge
from master
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
002aac186
Fig 12. Read from register
no acknowledge
from master
slave address
SDA S
1
1
0
0 A2 A1 A0 1
START condition
data from port
data from port
R/W
A
A
DATA 1
DATA 4
acknowledge
from master
acknowledge
from slave
NA P
STOP
condition
read from
port
th(D)
data into
port
tsu(D)
DATA 2
DATA 3
DATA 4
002aac187
Remark: This figure assumes the command byte has previously been programmed with 00h.
Fig 13. Read Input Port register
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
12 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
8. Application design-in information
5V
5V
I2C-BUS/SMBus
MASTER
SDA
10 kΩ
(3×)
SCL
VDD
SDA
LED0
SCL
LED1
LED2
LED3
RESET
LED4
LED5
LED6
PCA9552 LED7
LED8
LED9
LED10
A2
LED11
A1
LED12
A0
LED13
VSS
LED14
GPIOs
LED15
002aac188
LED0 to LED12 are used as LED drivers.
LED13 to LED15 are used as regular GPIOs.
Fig 14. Typical application
8.1 Minimizing IDD when the I/O is used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 15. Since the LED acts as a diode, when the LED is off the I/O
VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower
than VDD and is specified as ∆Istb in Table 13 “Static characteristics”.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.
Figure 15 shows a high value resistor in parallel with the LED. Figure 16 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the
input/output VI at or above VDD and prevents additional supply current consumption when
the LED is off.
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
13 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
3.3 V
VDD
VDD
LED
VDD
100 kΩ
LEDn
5V
LED
LEDn
002aac189
Fig 15. High value resistor in parallel with
the LED
002aac190
Fig 16. Device supplied by a lower voltage
8.2 Programming example
The following example will show how to set LED0 to LED3 on. It will then set LED4 and
LED5 to blink at 1 Hz at a 50 % duty cycle. LED6 and LED7 will be set to blink at 4 Hz and
at a 25 % duty cycle. LED8 to LED15 will be set to off.
Table 11:
Programming PCA9552
Program sequence
I2C-bus
START
S
PCA9552 address with A0 to A2 = LOW
C0h
PSC0 subaddress + Auto-Increment
12h
Set prescaler PSC0 to achieve a period of 1 second:
2Bh
PSC0 + 1
Blink period = 1 = ----------------------44
PSC0 = 43
Set PWM0 duty cycle to 50 %:
80h
256 – PWM0
-------------------------------- = 0.5
256
PWM0 = 128
Set prescaler PCS1 to achieve a period of 0.25 seconds:
0Ah
PSC1 + 1
Blink period = 0.25 = ----------------------44
PSC1 = 10
Set PWM1 output duty cycle to 25 %:
C0h
256 – PWM1
-------------------------------- = 0.25
256
PWM1 = 192
Set LED0 to LED3 on
00h
Set LED4 and LED5 to PWM0, and LED6 or LED7 to PWM1
FAh
Set LED8 to LED11 off
55h
Set LED12 to LED15 off
55h
STOP
P
PCA9552_5
Product data sheet
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14 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
9. Limiting values
Table 12: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
−0.5
+6.0
V
VI/O
voltage on an input/output pin
IO(LEDn)
output current on pin LEDn
LEDn used as an I/O
VSS − 0.5
5.5
V
LEDn used as an I/O
-
±25
mA
ISS
ground supply current
-
200
mA
Ptot
total power dissipation
-
400
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
operating
10. Static characteristics
Table 13: Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ [1]
Max
Unit
Supply
VDD
supply voltage
2.3
-
5.5
V
IDD
supply current
Operating mode; VDD = 5.5 V; no load;
VI = VDD or VSS; fSCL = 100 kHz
-
350
550
µA
Istb
standby current
Standby mode; VDD = 5.5 V; no load;
VI = VDD or VSS; fSCL = 0 kHz
-
2.1
5.0
µA
∆Istb
additional standby current
Standby mode; VDD = 5.5 V;
every LED I/O at VI = 4.3 V;
fSCL = 0 kHz
-
-
2
mA
VPOR
power-on reset voltage [2]
VDD = 3.3 V; no load; VI = VDD or VSS
-
1.7
2.2
V
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
3
6.5
-
mA
IL
leakage current
VI = VDD = VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
4.4
5
pF
I/Os
VIL
LOW-level input voltage
−0.5
-
0.8
V
VIH
HIGH-level input voltage
2.0
-
5.5
V
IOL
LOW-level output current
ILI
input leakage current
Cio
input/output capacitance
VOL = 0.4 V; VDD = 2.3 V
[3]
9
-
-
mA
VOL = 0.4 V; VDD = 3.0 V
[3]
12
-
-
mA
VOL = 0.4 V; VDD = 5.0 V
[3]
15
-
-
mA
VOL = 0.7 V; VDD = 2.3 V
[3]
15
-
-
mA
VOL = 0.7 V; VDD = 3.0 V
[3]
20
-
-
mA
VOL = 0.7 V; VDD = 5.0 V
[3]
25
-
-
mA
VDD = 3.6 V; VI = 0 V or VDD
PCA9552_5
Product data sheet
−1
-
+1
µA
-
2.6
5
pF
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
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PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
Table 13: Static characteristics …continued
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ [1]
Max
Unit
Select inputs A0, A1, A2; RESET
VIL
LOW-level input voltage
−0.5
-
0.8
V
VIH
HIGH-level input voltage
2.0
-
5.5
V
ILI
input leakage current
−1
-
+1
µA
Ci
input capacitance
-
2.3
5
pF
[1]
All typical values at 3.3 V and 25 °C.
[2]
VDD must be lowered to 0.2 V in order to reset part.
[3]
Each I/O must be externally limited to a maximum of 25 mA and each octal ([LED0 to LED7] and [LED8 to LED15]) must be limited to a
maximum current of 100 mA for a device total of 200 mA.
20 %
VI = VSS
002aac191
(1)
percent
variation
20 %
002aac192
(1)
percent
variation
0%
0%
(2)
−20 %
(3)
(2)
−20 %
(3)
−40 %
−40
−20
0
20
40
60
100
Tamb (°C)
80
−40 %
−40
−20
(1) maximum
(1) maximum
(2) average
(2) average
(3) minimum
(3) minimum
Fig 17. Typical frequency variation over process at
VDD = 2.3 V to 3.0 V
20
40
60
100
80
Tamb (°C)
Fig 18. Typical frequency variation over process at
VDD = 3.0 V to 5.5 V
PCA9552_5
Product data sheet
0
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PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
11. Dynamic characteristics
Table 14:
Dynamic characteristics
Symbol
Parameter
Conditions
Standard mode
I2C-bus
Min
Max
Fast mode I2C-bus
Min
Max
Unit
fSCL
SCL clock frequency
0
100
0
400
tBUF
bus free time between a STOP and
START condition
4.7
-
1.3
-
µs
tHD;STA
hold time (repeated) START condition
4.0
-
0.6
-
µs
tSU;STA
set-up time for a repeated START
condition
4.7
-
0.6
-
µs
tSU;STO
set-up time for STOP condition
4.0
-
0.6
-
µs
tHD;DAT
data hold time
tVD;ACK
data valid acknowledge time
tVD;DAT
data valid time
kHz
0
-
0
-
ns
[1]
-
600
-
600
ns
LOW-level
[2]
-
600
-
600
ns
HIGH-level
[2]
-
1500
-
600
ns
tSU;DAT
data set-up time
250
-
100
-
ns
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
µs
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
µs
20 + 0.1Cb
[3]
300
ns
20 + 0.1Cb
[3]
300
ns
fall time of both SDA and SCL signals
tf
-
300
tr
rise time of both SDA and SCL signals
-
1000
tSP
pulse width of spikes that must be
suppressed by the input filter
-
50
-
50
ns
250
-
250
ns
Port timing
tv(Q)
data output valid time
-
tsu(D)
data input setup time
100
-
100
-
ns
th(D)
data input hold time
1
-
1
-
µs
tw(rst)
reset pulse width
10
-
10
-
ns
trec(rst)
reset recovery time
trst
reset time
Reset
[4] [5]
0
-
0
-
ns
400
-
400
-
ns
[1]
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2]
tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3]
Cb = total capacitance of one bus line in pF.
[4]
Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions.
[5]
Upon reset, the full delay will be the sum of trst and the RC time constant of the SDA bus.
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
17 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
tSU;STA
tHD;DAT
S
tHIGH
tSU;DAT
tSU;STO
Sr
P
002aaa986
Fig 19. Definition of timing on the I2C-bus
protocol
START
condition
(S)
tSU;STA
bit 7
MSB
(A7)
tLOW
bit 6
(A6)
tHIGH
bit 0
(R/W)
STOP
condition
(P)
acknowledge
(A)
1/f
SCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 20. I2C-bus timing diagram
ACK or read cycle
START
SCL
SDA
30 %
trst
RESET
50 %
50 %
trec(rst)
50 %
tw(rst)
trst
LEDn
50 %
LED off
002aac193
Fig 21. Reset timing
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
18 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
12. Test information
VDD
PULSE
GENERATOR
VI
VO
RL
500 Ω
VDD
open
GND
D.U.T.
RT
CL
50 pF
002aab284
RL = load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current)
CL = load capacitance includes jig and probe capacitance
RT = termination resistance should be equal to the output impedance Zo of the pulse
generators.
Fig 22. Test circuitry for switching times
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
19 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 23. Package outline SOT137-1 (SO24)
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
20 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
D
SOT355-1
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT355-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-153
Fig 24. Package outline SOT355-1 (TSSOP24)
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
21 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT616-1
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2 e
e
12
y
y1 C
v M C A B
w M C
b
7
L
13
6
e
e2
Eh
1/2 e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT616-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 25. Package outline SOT616-1 (HVQFN24)
PCA9552_5
Product data sheet
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Rev. 05 — 9 March 2006
22 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
PCA9552_5
Product data sheet
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23 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
15.5 Package related soldering information
Table 15:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow [2]
BGA,
LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
suitable
HTSSON..T [3],
suitable
LQFP, QFP, TQFP
not
SSOP, TSSOP, VSO, VSSOP
not recommended [7]
suitable
CWQCCN..L [8],
not suitable
not suitable
[1]
PMFP [9],
WQCCN..L [8]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
PCA9552_5
Product data sheet
recommended [5] [6]
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
24 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
Table 16:
Abbreviations
Acronym
Description
CDM
Charged Device Model
DSP
Digital Signal Processor
ESD
ElectroStatic Discharge
HBM
Human Body Model
GPIO
General Purpose Input/Output
IC
Integrated Circuit
I2C-bus
Inter IC bus
LED
Light Emitting Diode
MCU
Microcontroller
MM
Machine Model
MPU
Microprocessor
POR
Power-On Reset
PWM
Pulse Width Modulation
SMBus
System Management Bus
PCA9552_5
Product data sheet
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25 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
17. Revision history
Table 17:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PCA9552_5
20060309
Product data sheet
-
-
PCA9552_4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
Table 1 “Ordering information”: changed Topside mark of TSSOP24 package from
‘PCA9552PW’ to ‘PCA9552’
•
•
•
•
•
Table 2 “Pin description”: added Table note 1 regarding VSS pin on HVQFN24 package
Section 6.6 “External RESET”: changed symbol “tW” to “tw(rst)”
Figure 11: changed symbol “tpv” to “tv(Q)”
Figure 13: changed symbol “tph” to “th(D)”; changed symbol “tps” to “tsu(D)”
Section 8.1 “Minimizing IDD when the I/O is used to control LEDs”:
– 1st paragraph, 3rd sentence: changed symbol “∆IDD” to “∆Istb”
– 2nd paragraph, 4th sentence: changed symbol “VIN” to “VI”
•
Table 12 “Limiting values”:
– changed parameter description of VI/O from “DC voltage on an I/O” to “voltage on an
input/output pin”
– changed symbol “II/O (DC output current on an I/O)” to ‘IO(LEDn) (output current on pin LEDn)
•
Table 13 “Static characteristics”:
– moved second sentence of description below title to (new)Table note 1 and added its
reference at column “Typ”
– changed symbol “∆IDD” to “∆Istb”
– under subsection “I/Os”, changed symbol “IL” to “ILI”
•
Table 14 “Dynamic characteristics”:
– updated parameter descriptions
– under subsection “Port timing”: changed symbol “tPV” to “tv(Q)”; changed symbol “tPS” to
“tsu(D)”; changed symbol “tPH” to “th(D)”
– under subsection “Reset”: changed symbol “tW” to “tw(rst)”; changed symbol “tREC” to “trec(rst)”;
changed symbol “tRESET” to “trst” (also in Table note 5)
•
Figure 21 “Reset timing” modified to harmonize letter symbols
PCA9552_4
20041001
Product data sheet
-
9397 750 13727
PCA9552_3
PCA9552_3
20030502
Product data
853-2374 29857
of 2003 Apr 24
9397 750 11463
PCA9552_2
PCA9552_2
20030224
Product data
853-2374 29331
of 2002 Dec 20
9397 750 11156
PCA9552_1
PCA9552_1
20020927
Product data
853-2374 28878
of 2002 Sep 09
9397 750 10329
-
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
26 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
18. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
21. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
I2C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
20. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
22. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
PCA9552_5
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 05 — 9 March 2006
27 of 28
PCA9552
Philips Semiconductors
16-bit I2C-bus LED driver with programmable blink rates
23. Contents
1
2
3
4
5
5.1
5.2
6
6.1
6.2
6.2.1
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
6.4
6.5
6.6
7
7.1
7.1.1
7.2
7.3
7.4
8
8.1
8.2
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
15.5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5
Control Register . . . . . . . . . . . . . . . . . . . . . . . . 5
Control Register definition . . . . . . . . . . . . . . . . 6
Register descriptions . . . . . . . . . . . . . . . . . . . . 6
INPUT0 - Input register 0 . . . . . . . . . . . . . . . . . 6
INPUT1 - Input register 1 . . . . . . . . . . . . . . . . . 6
PCS0 - Frequency Prescaler 0 . . . . . . . . . . . . . 7
PWM0 - Pulse Width Modulation 0 . . . . . . . . . . 7
PCS1 - Frequency Prescaler 1 . . . . . . . . . . . . . 7
PWM1 - Pulse Width Modulation 1 . . . . . . . . . . 7
LS0 to LS3 - LED selector registers . . . . . . . . . 8
Pins used as GPIOs . . . . . . . . . . . . . . . . . . . . . 9
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9
External RESET . . . . . . . . . . . . . . . . . . . . . . . . 9
Characteristics of the I2C-bus. . . . . . . . . . . . . 10
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
START and STOP conditions . . . . . . . . . . . . . 10
System configuration . . . . . . . . . . . . . . . . . . . 10
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 11
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 12
Application design-in information . . . . . . . . . 13
Minimizing IDD when the I/O is used to control
LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Programming example . . . . . . . . . . . . . . . . . . 14
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Handling information. . . . . . . . . . . . . . . . . . . . 23
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24
Package related soldering information . . . . . . 24
16
17
18
19
20
21
22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status. . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
25
26
27
27
27
27
27
© Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 9 March 2006
Document number: PCA9552_5
Published in The Netherlands
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