SC3- Datasheet

SC3www.vishay.com
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
FEATURES
•
•
•
•
•
•
Wire bondable
Small single chip size: 0.050 inches square
Case: 0505
Resistance range: 100  to 50 k
Resistor material: Nichrome
Oxidized silicon substrate for good power
dissipation
• 400 mW capability
• User trimmable
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Product may not be to scale
The SC3- series resistor chips on silicon offer a combination
of nichrome stability, wide resistance range and higher
power rating than is available on the same sized ceramic
substrate.
APPLICATIONS
The SC3- resistors are manufactured using Vishay
Electro-Films (EFI) sophisticated thin film equipment and
manufacturing technology. The SC3- resistors are 100 %
electrically tested and visually inspected to MIL-STD-883.
Vishay EFI SC3- chip resistors have excellent power
dissipation capability and are ideally suited for prototyping.
Typical application areas are:
• Amplifiers
• Oscillators
• Attenuators
• Couplers
• Filters
Recommended for hermetic environments where die is not
exposed to moisture.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
100 to 50K
± 0.1
± 25, ± 50, ± 100
UNIT

%
ppm/°C
Tightest Standard Tolerance Available
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
100 Ω
50 k Ω
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
Stability, 1000 h, + 125 °C
Operating Temperature Range
ThermalShock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to zero at + 150 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 05-Apr-13
VALUE
- 20 typ.
± 0.1 max. R/R
- 55 to + 125
± 0.25 max. R/R
± 0.25 max. R/R
200
1012 min.
100 max.
0.400
± 0.25 max. R/R
UNIT
dB
%
°C
%
%
V

V
W
%
Document Number: 61014
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SC3www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.050
0.050
0.045
0.0075
0.0075
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.050" x 0.050" ± 0.003" (1.27 mm x 1.27 mm ± 0.076 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Material
Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material
Nichrome
Bonding Pad Size
0.0075" x 0.045" (0.190 mm x 1.143 mm) minimum
Number of Pads
2
Pad Material
15 kÅ minimum gold standard (Al optional)
Backing
None, lapped semiconductor silicon (Au optional)
GLOBAL PART NUMBER INFORMATION
Global Part Number: SC3-12500KKSGNHWS
Global Part Number Description: SC3- 1.25K 10 % 100 ppm/°C Std Au None H WS
S
C
3
MODEL
RESISTANCE
SC3-
First 4
digits are
significant
figures of
resistance
Revision: 05-Apr-13
-
1
2
5
RESISTANCE
MULTILPLIER
CODE
TOL.
CODE
(%)
B = 0.01
A = 0.1
0=1
1 = 10
B = 0.1
C = 0.25
D = 0.5
F = 1.0
G = 2.0
J = 5.0
K = 10.0
0
0
K
TCR
(ppm/°C)
TRIM
STYLE
E = ± 25
C = ± 50
K = ± 100
E = Edg
S = Std
U = Usr
K
S
G
N
H
W
S
TERMINATION
BACK
METAL
VISUAL
CLASS
PACKAGING
CODE
G = Au
A = Al
G = Au
N = None
H=
Class H
K=
Class K
WS =
Waffle pack
100 min.,
1 mult
Document Number: 61014
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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Revision: 02-Oct-12
1
Document Number: 91000