QFX Datasheet

QFX
www.vishay.com
Vishay Electro-Films
Thin Film, Top-Contact Megohm Resistor
FEATURES
• Wire bondable
• Chip size: 0.050 inches square
• Case: 0505
• Resistance range: 500 k to 10 M
• Quartz substrate: < 0.1 pF shunt capacitance
Product may not be to scale
The QFX series, tantulum nitride on quartz resistor chips
combine high resistance with low shunt capacitance. These
offer one of the best combinations of small size, frequency
response and high value available.
The QFXs are manufactured using Vishay Electro-Films (EFI)
sophisticated thin film equipment and manufacturing
technology. The QFXs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
• Resistor
material:
self-passivating
Tantalum
nitride,
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
The QFX series resistor chips are designed for circuits
requiring high values with lower shunt capacitance for
higher frequency of operation.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
VALUE
UNIT
500K to 10M

Standard Tolerances
TCR
± 0.1, ± 0.5
%
± 50, ± 100, ± 250, ± 350
ppm/°C
Tightest Standard Tolerance Available
0.5 %
0.1 %
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
± 350 ppm/°C
500 kΩ
1 MΩ 2.0 MΩ 4.2 MΩ
10 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
VALUE
UNIT
Noise, MIL-STD-202, Method 308
- 12 typ.
dB
Moisture Resistance, MIL-STD-202
Method 106
± 0.5 max. R/R
%
Stability, 1000 h, + 125 °C, 10 mW
± 0.5 max. R/R
%
Operating Temperature Range
- 55 to + 125
°C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
± 0.25 max. R/R
%
High Temperature Exposure, + 150 °C, 100 h
± 0.5 max. R/R
%
Dielectric Voltage Breakdown
400
V
Insulation Resistance
1012 min.

Operating Voltage
400 max.
V
0.020
W
± 0.25 max. R/R
%
DC Power Rating at + 70 °C (Derated to zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 05-Apr-13
Document Number: 61031
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
QFX
www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.050
0.045
0.050
0.005
0.005
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.050" x 0.050" ± 0.003" (1.25 mm x 1.25 mm ± 0.75 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Material
Quartz
Resistor Material
Tantalum nitride, self-passivating
Bonding Pad size
0.005" x 0.005" (0.127 mm x 0.127 mm)
Number of Pads
2
Pad Material
10 kÅ minimum aluminum (Au optional)
Backing
None, lapped quartz
GLOBAL PART NUMBER INFORMATION
Global Part Number: QFX25003KR4GGKWS
Global Part Number Description: QFX 2.5M 10 % 0/- 250 ppm/°C 40 Au Au K WS
Q
F
X
MODEL
RESISTANCE
QFX
First 4
digits are
significant
figures of
resistance
High value
TaN on
Quartz
Revision: 05-Apr-13
2
5
RESISTANCE
MULTILPLIER
CODE
2 = 100
3 = 1000
4 = 10 000
0
TOL.
CODE
(%)
0
3
TCR
(ppm/°C)
E = ± 25
B = 0.1
C = ± 50
C = 0.25
K = ± 100
D = 0.5
F = 1.0 M = ± 250
G = 2.0 W = ± 350
J = 5.0 R = 0/- 250
K = 10.0 P = 0/- 350
I = 0/- 200
K
R
4
G
G
K
W
S
SIZE
TERMINATION
BACK
METAL
VISUAL
CLASS
PACKAGING
CODE
3 = 30 x 30
4 = 40 x 40
5 = 55 x 55
G = Au
A = Al
G = Au
N = None
H=
Class H
K=
Class K
WS =
Waffle pack
100 min.,
1 mult
Document Number: 61031
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000