QFN Datasheet

QFN
www.vishay.com
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
FEATURES
• Wire bondable
• Chip size: 0.020 inches square
• Case: 0202
• Resistance range: 1  to 510 k
• Resistor material: Nichrome
• Quartz substrate: < 0.1 pF shunt capacitance
Product may not be to scale
• Power: 25 mW
The QFN series nichrome on quartz resistor chips offer a
combination of nichrome stability, excellent frequency
response and small size.
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
The QFNs are manufactured using Vishay Electro-Films (EFI)
sophisticated thin film equipment and manufacturing
technology. The QFNs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
APPLICATIONS
Vishay EFI QFN top-contact resistor chips are widely used
in hybrid packages where space is limited. Designed with
capacity to handle substantial power loads, they also have
the benefit of nichrome stability.
Recommended for hermetic environments where die is not
exposed to moisture.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
UNIT
1 to 510K

± 0.1, ± 0.5, ± 1
%
± 25, ± 50, ± 100, ± 250
ppm/°C
Tightest Standard Tolerance Available
1%
0.5 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
1Ω
10 Ω
30 Ω 100 Ω
200 kΩ 360 kΩ 510 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
VALUE
UNIT
Noise, MIL-STD-202, Method 308
100  to 250 k
< 100  or > 251 k
- 35 typ.
- 20 typ.
dB
Stability, 1000 h, + 125 °C, 50 mW
± 0.1 % max. R/R
%
- 55 to + 125
°C
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
± 0.25 max. R/R
%
High Temperature Exposure, + 150 °C, 100 h
± 0.5 max. R/R
%
Operating Temperature Range
Dielectric Voltage Breakdown
200
V
Insulation Resistance
1012 min.

Operating Voltage
100 max.
V
0.025
W
± 0.25 max. R/R
%
DC Power Rating at + 70 °C (Derated to zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 05-Apr-13
Document Number: 61079
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
QFN
www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.014
0.020
0.008
0.004
0.004
0.004
0.020
0.004
TYPICAL RANGE
7.5 kΩ to 510 kΩ
TYPICAL RANGE
56 Ω to 7.4 kΩ
TYPICAL RANGE
10 Ω to 55 Ω
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.020" x 0.020" ± 0.003" (0.51 mm x 0.51 mm ± 0.05 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Material
Quartz
Resistor Material
Nichrome (passivation optional)
Bonding Pad size
0.004" x 0.004" (0.10 mm x 0.10 mm)
Number of Pads
2
Pad Material
15 kÅ minimum gold (Al optional)
Backing
None, lapped quartz (Au optional)
GLOBAL PART NUMBER INFORMATION
Global Part Number: QFN50000FKANHWS
Global Part Number Description: QFN 5K 1 % 100 ppm/°C Al None H WS
Q
F
N
MODEL
RESISTANCE
QFN
First 4 digits
are significant
figures of
resistance
20 x 20
size
NiCr on
Quartz
Revision: 05-Apr-13
5
0
0
RESISTANCE
MULTIPLIER
CODE
TOLERANCE
CODE
(%)
C = 0.001
B = 0.01
A = 0.1
0=1
1 = 10
2 = 100
3 = 1000
B = 0.1
C = 0.25
D = 0.5
F = 1.0
G = 2.0
J = 5.0
K = 10.0
0
0
TCR
(ppm/°C)
E = ± 25
C = ± 50
K = ± 100
M = ± 250
F
K
A
N
H
W
S
TERMINATION
BACK
METAL
VISUAL
CLASS
PACKAGING
CODE
G = Gold
A = Aluminum
G = Gold
N = None
H = Class H
K = Class K
WS =
Waffle pack
100 min., 1 mult
Document Number: 61079
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000