Data Sheet

PCA9922
8-channel constant current LED driver with output error
detection
Rev. 2 — 6 April 2011
Product data sheet
1. General description
The PCA9922 is an 8-channel constant current LED driver designed for LED signage and
display applications. The output current is adjustable from 15 mA to 60 mA controlled by
an external series resistor. The outputs are controlled via a serial interface with a
maximum clock frequency of 25 MHz to allow for the system requirement of high volume
data transmission. Each of the 8 channel outputs has edge rate control to limit the change
in current when the outputs are enabled or disabled.
The device has built-in circuitry for detecting LED open-circuit and output short to ground.
After signaling the specified error detect sequence on the input control lines, error status
can be read out of the device via the serial data out.
The device is designed such that it may be cascaded with other similar devices. The SDO
pin contains the output of the shift register which may be used for cascading to the SDI pin
of the next device in the series. SDO changes state on the falling edge of CLK. SDI
captures data on the rising edge of CLK.
The PCA9922 is a pin-to-pin functionally equivalent 5 V alternative (exception: error data
is inverted; see Section 7.2.1, Section 7.2.2 and Section 7.2.7) for the ST2221A and
STP08CDC596.
The PCA9922 is available in DIP16, TSSOP16 and HVQFN20 packages and is specified
over the −40 °C to +85 °C industrial temperature range.
2. Features and benefits
„
„
„
„
„
„
„
„
„
„
„
„
25 MHz serial interface
3.3 V to 5.5 V operation
8 LED low side constant current outputs
Global control for the 8 LED outputs variable between 15 mA to 60 mA
15 mA to 60 mA maximum current for all 8 output channels set by an external resistor
Constant current matching at 25 °C, VDD = 5.0 V
Bit-to-bit: ±6 %
Chip-to-chip: ±10 %
Gradual turn-on/turn-off output to limit EMI
Error detection mode for line open, output short to ground, LED open and LED short
−40 °C to +85 °C operation
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
„ Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
„ Packages offered: DIP16, TSSOP16, HVQFN20
3. Applications
„
„
„
„
Full color, multi-color, monochrome LED signs
LED billboard displays
Traffic display signs
Transportation and commercial LED signs
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCA9922N
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
PCA9922PW
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
PCA9922BS
HVQFN20
plastic thermal enhanced very thin quad flat package; no leads; 20 terminals;
body 5 × 5 × 0.85 mm
SOT662-1
4.1 Ordering options
Table 2.
Ordering options
Type number
PCA9922
Product data sheet
Topside mark
Temperature range
PCA9922N
PCA9922N
Tamb = −40 °C to +85 °C
PCA9922PW
PCA9922
Tamb = −40 °C to +85 °C
PCA9922BS
P9922
Tamb = −40 °C to +85 °C
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Rev. 2 — 6 April 2011
© NXP B.V. 2011. All rights reserved.
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
5. Block diagram
LED0
LED1
LED7
VDD
ERROR
DETECT
CURRENT REGULATOR
R_EXT
VDD
PCA9922
OE
OUTPUT ENABLE
LE
8× DATA LATCH
VSS
SDI
8× SHIFT REGISTER
SDO
CLK
VSS
ERROR CONTROL
002aad311
Fig 1.
PCA9922
Product data sheet
Block diagram of PCA9922
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
6. Pinning information
6.1 Pinning
VSS
1
16 VDD
SDI
2
15 R_EXT
CLK
3
14 SDO
LE/DM1
4
13 OE/DM2
VSS
1
16 VDD
SDI
2
15 R_EXT
CLK
3
14 SDO
LE/DM1
4
LED0
5
LED1
6
11 LED6
LED2
7
10 LED5
LED3
8
PCA9922N
LED0
LED1
LED2
LED3
12 LED7
5
11 LED6
6
10 LED5
7
9
8
LED4
PCA9922PW
12 LED7
9
002aad161
LED4
002aad163
Pin configuration for TSSOP16
16 R_EXT
17 VDD
18 n.c.
terminal 1
index area
19 VSS
Fig 3.
20 SDI
Pin configuration for DIP16
CLK
1
15 SDO
LE/DM1
2
LED0
3
LED1
4
12 LED6
LED2
5
11 LED5
14 OE/DM2
7
8
9
n.c.
n.c.
n.c.
13 LED7
LED4 10
6
PCA9922BS
LED3
Fig 2.
13 OE/DM2
002aad349
Transparent top view
Fig 4.
PCA9922
Product data sheet
Pin configuration for HVQFN20
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
6.2 Pin description
Table 3.
Pin description
I = input; O = output.
Symbol
Pin
Type
Description
DIP16,
TSSOP16
HVQFN20
VSS
1
19[1]
power supply
supply ground
SDI
2
20
I
serial data in
CLK
3
1
I
serial data clock used to shift data on SDI
into the shift register
LE/DM1
4
2
I
latch enable with internal pull-down
resistor; active HIGH signal used to
capture data in the shift register to present
to the outputs
Detection Mode 1
LED0
5
3
O
constant current LED output driver 0
LED1
6
4
O
constant current LED output driver 1
LED2
7
5
O
constant current LED output driver 2
LED3
8
6
O
constant current LED output driver 3
LED4
9
10
O
constant current LED output driver 4
LED5
10
11
O
constant current LED output driver 5
LED6
11
12
O
constant current LED output driver 6
LED7
12
13
O
constant current LED output driver 7
OE/DM2
13
14
I
output enable with internal pull-up resistor;
active LOW signal used to allow data
captured in the latch to be presented to the
constant current outputs
SDO
14
15
O
serial data output
R_EXT
15
16
analog input
external resistor input
VDD
16
17
power supply
supply voltage
n.c.
-
7, 8, 9, 18
-
not connected
Detection Mode 2
[1]
PCA9922
Product data sheet
HVQFN20 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
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Rev. 2 — 6 April 2011
© NXP B.V. 2011. All rights reserved.
5 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
7. Functional description
The PCA9922 is an 8-channel constant current LED driver with built-in LED output error
detection. The PCA9922 contains an 8-bit shift register and data latches, which convert
serial input data into parallel output data.
At the output stage, 8 regulated current sinks are designed to provide constant and
uniform current through LEDs with different forward voltages (VF).
Refer to Figure 1 “Block diagram of PCA9922”.
7.1 System interface
During normal operation, serial data can be transferred into the PCA9922 through SDI,
shifted into the shift register, and out through the SDO. Data shifts from the SDI pin into
the next sequential bit in the shift register on each rising edge of the CLK input. The MSB
is the first bit to be clocked in. Data shifts out of the shift register and is presented on the
SDO pin on the falling edge of CLK. The exception to this is during the error detect
sequence, at which time the error status is loaded in a parallel fashion into the shift
register. The shift register is never disabled. It is either shifting or it is loading the error
status on every rising edge of CLK. Additionally, the device is designed such that it may
be cascaded with other similar devices. The SDO pin contains the output of the shift
register which may be used for cascading to the SDI pin of the next device in the series.
Data is parallel loaded from the serial shift register to an output control register when LE
(Latch Enable) is asserted HIGH (serial-to-parallel conversion). The output control register
will continue to reflect the shift register data, even if changes occur in the shift register
data, as long as LE is HIGH. When LE is LOW the latch is closed and changes in the shift
register data no longer effect the output control register. Applications where the latches
are bypassed (LE tied HIGH) will require that the OE input be HIGH during serial data
entry.
The data in the output control register is then used to drive the constant current output
drivers when the outputs are enabled. The outputs are globally enabled or disabled
through the OE. A LOW level on the OE will enable the output drivers, LED0 to LED7, to
reflect the data contained in the output control register.
An example timing diagram of expected normal operation of the device is shown in
Figure 5.
Remark: It is recommended that OE and LE pulse widths be at least two clocks wide
when CLK is running to avoid inadvertent entry into the error detect modes.
There is no synchronization logic in the design between CLK, LE and OE. It is the user’s
responsibility to meet the timing presented in Table 10 in order to guarantee proper
operation.
PCA9922
Product data sheet
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© NXP B.V. 2011. All rights reserved.
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
CLK
SDI
LE
OE
LED0
LED1
LED2
LED3
LED4
LED5
LED6
LED7
002aad203
For each LEDn 0 is on, 1 is off.
Fig 5.
Normal function timing diagram
7.2 LED output error detection
The PCA9922 has built-in circuitry for detecting LED open-circuit and output short
conditions. A predefined set of signal sequence on the input control lines must be initiated
to perform the output error detection. Once the error data is captured by this sequence,
error status can be read out of the device via the serial interface.
The error detection mode is entered by the user via specific timing sequences presented
on the CLK, OE and LE pins. There are three key sequences to be generated by the user:
enter error detect, capture faults, and exit error detect. It is the responsibility of the user to
enable all outputs that the user wants to test during the error detect sequence.
Performing an error mode detection sequence consists of several operations:
1. Entering error detect mode.
2. Setting all bits that you want to test by enabling all outputs to logical 1s in the output
latch.
3. Capture fault data.
4. Exit error detect.
7.2.1 Open-circuit detection principle
The LED open-circuit detection compares the effective current level IO with the open load
detection threshold current Ith(det). If IO is below Ith(det), the PCA9922 detects an open-load
condition. This error status can be read as an error status code in the error detect mode.
For open-circuit error detection, a channel must be on.
PCA9922
Product data sheet
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Rev. 2 — 6 April 2011
© NXP B.V. 2011. All rights reserved.
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
Table 4.
Open-circuit detection
State of
output port
Condition of
output current
Error status code
Meaning
off
IO = 0 mA
0
detection not possible
on
IO < Ith(det)[1]
1
open circuit
IO ≥ Ith(det)[1]
channel n error status bit 0
normal
[1]
Ith(det) = 0.5 × IO (target) (typical).
7.2.2 Short-circuit detection principle
The LED short-circuit detection compares the effective voltage level (VO) with the
shorted-load detection threshold voltages Vth(det)sc and Vth(norm). If VO is above the
Vth(det)sc threshold, the PCA9922 detects a shorted-load condition. If VO is below the
Vth(norm) threshold, no error is detected or error bit is reset. This error status can be read
as an error status code in the Special mode. For short-circuit error detection, a channel
must be on.
Table 5.
Shorted-load detection
State of
output port
Condition of
output voltage
Error status code
Meaning
off
IO = 0 mA
0
detection not possible
on
VO ≥ Vth(det)sc
1
short circuit
VO < Vth(norm)
channel n error status bit 0
normal
7.2.3 Entering error detect mode
Entering the error detect mode consists of a 5-clock sequence involving CLK, OE and LE
as shown in Figure 6. The user must meet the set-up and hold times for OE and LE as
detailed inTable 10 to guarantee proper operation of the error detect circuitry. It should be
noted that the act of driving LE HIGH around the rising edge of clock 4 opens the latch in
the current control register block and data captured in the shift register at that point in time
is moved into the output control register. It should also be noted that the output logic was
enabled for a brief period of time while OE is LOW around the rising edge of clock 2. The
outputs LED[7:0] will glitch during this period.
CLK
LE
OE
002aad204
Fig 6.
PCA9922
Product data sheet
Timing for ‘Enter Error Detect Mode’ command
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
7.2.4 Setting the outputs to test
Before the Capture Fault sequence may be performed, the outputs must be set up. A logic
HIGH must be sent to the output control register for all eight bits. This is done after the
Enter Error Detect sequence is performed as a normal data load sequence as seen in
Figure 5. Please note that this process is completely destructive to the data that is stored
in the output control register (and the LED[7:0] pins). The output control register will have
to be restored to its proper values by the user after the error detect sequence has been
completed.
7.2.5 Capturing the fault/output error data
The Capture Fault/Error Data sequence can only follow the Enter Error Detect sequence.
If the Error Detect sequence has not occurred, this sequence will be treated as a normal
operational sequence. Once the Capture Fault sequence has occurred, an Exit Error
Detect sequence should be performed. There can be no more Capture Sequences until
another Enter Error Detect sequence has occurred.
The Capture Fault Sequence consists of holding OE LOW for no less than 3 clocks (CLK)
and for a minimum of 2 μs, whichever is longer. During this period of time, the shift register
is being loaded with the fault status. As such, data presented to the device via SDI will not
be captured. Bit 7 of the fault data will be present on SDO by the first falling edge CLK
after the user de-asserts OE for this cycle. An error condition is output as a 1 (HIGH bit),
and a 0 (LOW bit) designates a normal status. Timing for this sequence is shown in
Figure 7.
CLK
LE
OE
OE = 1'b0 for minimum of 3 clocks
or 2 μs, whichever is longer
SDO
previous serial data
fault data MSB
resume shift
with fault data
Fig 7.
PCA9922
Product data sheet
002aad205
Timing for ‘Capture Fault Mode’ command
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
7.2.6 Exit error detect mode
The ‘Exit error detect mode’ sequence is used to exit the error detect mode of operation
and resume normal mode. This is a 5-clock timing sequence using CLK, OE and LE. This
sequence consists of LE being held inactive for all five clocks. OE is active in the second
clock for one and only one clock. Figure 8 shows the timing for this sequence.
CLK
LE
OE
002aad206
Fig 8.
Timing for ‘Exit Error Detect Mode’ command
7.2.7 Error detection data
The PCA9922 will return a logical 1 for each output pin that has an error condition
detected as described in Table 4 and Table 5. An error condition may be either an
open circuit or short-circuit at the output pin. Once the Capture Fault sequence has
completed, the resultant fault/output error data may be shifted out of the device by issuing
8 clocks and reading the data at the SDO pin. If more than one device is connected in
series, then more than 8 clocks will be needed to shift all of the data from all of the devices
through to the last SDO pin in the chain.
Figure 9 shows a complete error detection sequence.
PCA9922
Product data sheet
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Rev. 2 — 6 April 2011
© NXP B.V. 2011. All rights reserved.
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some number of
optional clocks to
clock in 1s for testing
NXP Semiconductors
PCA9922
Product data sheet
enter error detect
command
at least 8 clocks
shift halted
load fault
command
shift
resumed
exit error detect
command
CLK
shift_reg[n-1:0]
SDO
fault data
fault data MSB
previous serial data shifting out
this must be min. 2 μs wide
and 3 clocks minimum with
output enable LOW
OE
LE
fault_load
fault_data[n-1:0]
fault_load goes LOW
on this edge of OE
fault data 8 bits
error_detect_mode
002aad208
Timing for a complete error detection sequence
PCA9922
11 of 27
© NXP B.V. 2011. All rights reserved.
Lower-case signal names are internal signals shown to aid understanding of timing.
Fig 9.
8-channel constant current LED driver with output error detection
Rev. 2 — 6 April 2011
All information provided in this document is subject to legal disclaimers.
SDI
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
8. Application design-in information
5V
C
10 μF
3.3 V to 5.5 V
LED0
LED1
LED2
LED3
LED7
PCA9922
R_EXT
CLK
SDI
LE
VSS
VDD
to next stage
SDO
OE
PWM
OR
BLANKING
INPUT
MICROCONTROLLER
SDO from last stage
002aad312
Fig 10. Typical application
VLED = 3 V ∼ 4 V
+
VCE
−
VDD
scan
R
OE
CPU
CLK
LE
LED0
PCA9922
VO
VI
VO
VI
LED7
SDI
R_EXT
VSS
SDO
OE
CLK
LE
LED0
PCA9922
LED7
SDI
R_EXT
VSS
SDO
002aad504
Fig 11. The PCA9922 in a typical multi-device architecture
PCA9922
Product data sheet
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
9. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
−0.5
+6.0
V
VO(LED)
LED output voltage
VO(SDO)
output voltage on pin SDO
−0.5
+6.0
V
−0.5
+6.0
V
VI
input voltage
−0.4
VDD + 0.4
V
ISS
ground supply current
-
485
mA
IO(LEDn)
output current on pin LEDn
fclk
clock frequency
Tstg
pins LED0 to LED7
-
60
mA
-
25
MHz
storage temperature
−65
+150
°C
Tj
junction temperature
−40
+125
°C
Ptot
total power dissipation
DIP16
-
1.12
W
TSSOP16
-
0.625
W
HVQFN20
-
3.125
W
operating
Tamb = 25 °C
10. Recommended operating conditions
Table 7.
Operating conditions
Symbol
Parameter
VDD
supply voltage
Conditions
VO(LED)
LED output voltage
Min
Max
Unit
3.3
5.5
V
-
5.5
V
pins LED0 to LED7
inactive
-
2.2
V
IO(LEDn)
output current on pin LEDn
output active
15
60
mA
VO(SDO)
output voltage on pin SDO
-
5.5
V
Ptot
total power dissipation
DIP16
-
0.44
W
TSSOP16
-
0.25
W
HVQFN20
-
1.25
W
−40
+85
°C
Toper
Tamb = 85 °C
operating temperature
11. Thermal characteristics
Table 8.
PCA9922
Product data sheet
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
DIP16
89
°C/W
TSSOP16
160
°C/W
HVQFN20
32
°C/W
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
12. Static characteristics
Table 9.
Static characteristics
VDD = 5.0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vth(det)sc
short-circuit detection threshold
voltage
for short-error detection;
IO (target) = 5 mA to 120 mA
2.4
2.5
2.6
V
Vth(norm)
normal mode threshold voltage
for short-error detection;
IO (target) = 5 mA to 120 mA
2.3
-
-
V
Control interface (OE, LE, CLK, SDI, SDO)
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VOL
LOW-level output voltage
VOH
[1]
0.7VDD
-
VDD + 0.3
V
−0.3
-
0.3VDD
V
IOL = 1 mA
-
-
0.4
V
HIGH-level output voltage
IOL = −1 mA
VDD − 0.4
-
-
V
ILI
input leakage current
VI = VDD or VSS (CLK, SDI)
−1
-
+1
μA
Ci
input capacitance
VI = VDD or 0 V
-
1.5
5
pF
RPU
pull-up resistance
OE pin
150
300
600
kΩ
Rpd
pull-down resistance
LE pin
100
200
400
kΩ
VO = 0.7 V; Rext = 910 Ω
17.5
19.5
21.7
mA
VO = 0.7 V; Rext = 470 Ω
35.4
38.1
40.8
mA
Current controlled outputs (LED[7:0])
LOW-level output current
IOL
ΔIOL
supply current
IDD
[1]
LOW-level output current variation between bits
VO = 0.7 V; Rext = 910 Ω
-
±3.0
±7
%
VO = 0.7 V; Rext = 470 Ω
-
±1.5
±4
%
Rext = open; LED[7:0] = off
-
0.7
1.05
mA
Rext = 910 Ω; LED[7:0] = off
-
3.6
6.0
mA
Rext = 470 Ω; LED[7:0] = off
-
6.2
9.0
mA
Rext = 910 Ω; LED[7:0] = on
-
3.6
6.0
mA
Rext = 470 Ω; LED[7:0] = on
-
6.2
9.0
mA
OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to
active LOW times for executing error detect sequences.
PCA9922
Product data sheet
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PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
13. Dynamic characteristics
Table 10.
Dynamic characteristics
Symbol
tw(LE)
Parameter
Conditions
LE pulse width
tw(OE)
OE pulse width
VDD = 3.3 V
Min
Typ
Max
Unit
[1]
10
-
-
ns
[2]
200
-
-
ns
tsu(SDI)
SDI set-up time
from SDI to CLK
5
-
-
ns
th(SDI)
SDI hold time
from CLK to SDI
5
-
-
ns
fCLK
frequency on pin CLK
0
-
25
MHz
δ
clock duty cycle
-
50 to 50 60 to 40 %
tw(CLKH)
CLK HIGH pulse width
16
-
-
ns
tw(CLKL)
CLK LOW pulse width
16
-
-
ns
tPD(CLK-SDO)
propagation delay
from CLK to SDO
-
-
10
ns
tsu(LE)
LE set-up time
from LE to CLK
[3]
20
-
-
ns
tsu(OE)
OE set-up time
from OE to CLK
[3]
20
-
-
ns
from CLK to LE
[3]
5
-
-
ns
[3]
5
-
-
ns
th(LE)
LE hold time
th(OE)
OE hold time
from CLK to OE
tPD(OE-LEDH)
propagation delay
from OE to LED HIGH
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω
-
210
-
ns
tPD(OE-LEDL)
propagation delay
from OE to LED LOW
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω
-
210
-
ns
tPD(LEH-LEDH)
propagation delay
from LE HIGH to LED HIGH
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0
-
210
-
ns
tPD(LEH-LEDL)
propagation delay
from LE HIGH to LED LOW
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0
-
210
-
ns
tPD(CLKH-LEDH)
propagation delay
pins LED0 to LED7; VDD = 5.0 V;
from CLK HIGH to LED HIGH CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0; LE = logic 1
-
210
-
ns
tPD(CLKH-LEDL)
propagation delay
pins LED0 to LED7; VDD = 5.0 V;
from CLK HIGH to LED LOW CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0; LE = logic 1
-
210
-
ns
tr
rise time
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω
-
175
-
ns
tf
fall time
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0
-
190
-
ns
[1]
Applies to normal device operation. This pulse width does not apply to active HIGH times for executing error detect sequences.
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8-channel constant current LED driver with output error detection
[2]
OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to
active LOW times for executing error detect sequences.
[3]
Timing required for signaling of error detection sequences. Not necessary for ‘normal’ operation.
fCLK
tw(CLKH)
CLK
50 %
tsu(SDI)
SDI
th(SDI)
50 %
tsu(OE)
OE
50 %
th(OE)
50 %
tsu(LE)
LE
tw(CLKL)
50 %
th(LE)
50 %
50 %
tPD(CLK-SDO)
SDO
50 %
002aad209
Fig 12. Timing 1
90 %
LEDn
10 %
90 %
10 %
tf
tr
002aad210
Fig 13. LED[7:0] rise/fall timing
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8-channel constant current LED driver with output error detection
tw(OE)
OE
50 %
50 %
tPD(OE-LEDH)
tPD(OE-LEDL)
LEDn
tPD(OE-LEDH)
tPD(OE-LEDL)
50 %
50 %
tw(LE)
LE
50 %
50 %
tPD(LEH-LEDH)
tPD(LEH-LEDL)
LEDn
CLK
50 %
50 %
50 %
tPD(CLKH-LEDH)
tPD(CLKH-LEDL)
LEDn
50 %
002aad211
Fig 14. Timing 2
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8-channel constant current LED driver with output error detection
14. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
SOT38-4
Fig 15. Package outline SOT38-4 (DIP16)
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8-channel constant current LED driver with output error detection
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 16. Package outline SOT403-1 (TSSOP16)
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8-channel constant current LED driver with output error detection
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
A
B
D
SOT662-1
terminal 1
index area
A
A1
E
c
detail X
C
e1
e
b
6
y
y1 C
v M C A B
w M C
10
L
11
5
e
e2
Eh
1
15
terminal 1
index area
20
16
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D(1)
Dh
E(1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.38
0.23
0.2
5.1
4.9
3.25
2.95
5.1
4.9
3.25
2.95
0.65
2.6
2.6
0.75
0.50
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT662-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 17. Package outline SOT662-1 (HVQFN20)
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15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
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8-channel constant current LED driver with output error detection
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 11 and 12
Table 11.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 12.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 18.
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8-channel constant current LED driver with output error detection
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of through-hole mount packages
17.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
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17.4 Package related soldering information
Table 13.
Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable[1]
PMFP[2]
-
not suitable
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
18. Abbreviations
Table 14.
Abbreviations
Acronym
Description
CDM
Charged-Device Model
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
HBM
Human Body Model
LED
Light Emitting Diode
MM
Machine Model
MSB
Most Significant Bit
PCB
Printed-Circuit Board
PWM
Pulse Width Modulator
19. Revision history
Table 15.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9922 v.2
20110406
Product data sheet
-
PCA9922 v.1
Modifications:
PCA9922 v.1
PCA9922
Product data sheet
•
Figure 1 “Block diagram of PCA9922”: removed block “auto shutdown and auto power-up”
20090115
Product data sheet
-
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Rev. 2 — 6 April 2011
-
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20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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8-channel constant current LED driver with output error detection
22. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
17.1
17.2
17.3
17.4
18
19
20
20.1
20.2
20.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
System interface . . . . . . . . . . . . . . . . . . . . . . . . 6
LED output error detection . . . . . . . . . . . . . . . . 7
Open-circuit detection principle . . . . . . . . . . . . 7
Short-circuit detection principle. . . . . . . . . . . . . 8
Entering error detect mode . . . . . . . . . . . . . . . . 8
Setting the outputs to test . . . . . . . . . . . . . . . . . 9
Capturing the fault/output error data. . . . . . . . . 9
Exit error detect mode . . . . . . . . . . . . . . . . . . 10
Error detection data . . . . . . . . . . . . . . . . . . . . 10
Application design-in information . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Recommended operating conditions. . . . . . . 13
Thermal characteristics . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Handling information. . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Soldering of through-hole mount packages . 23
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering by dipping or by solder wave . . . . . 23
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information . . . . . . 24
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
20.4
21
22
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 April 2011
Document identifier: PCA9922