Data Sheet

PCA9901
One wire single LED driver
Rev. 2 — 2 September 2010
Product data sheet
1. General description
The PCA9901 is a 20 mA current source for a single LED that allows stand-alone blinking
of a predefined pattern to off-load the microcontroller and save battery power.
Programming of the device is done through a training sequence: the host controller sends
the LED lighting sequence and the PCA9901 memorizes it. Once the sequence has been
memorized, the PCA9901 can be programmed to send it once or in a loop until the host
controller requests the sequence to be stopped.
Commands and blinking sequence are sent through a uni-directional one-wire interface.
Commands include: Training Start, Training End, Execute Sequence (once or in loop until
a Stop Command is requested) and Reset. A blinking sequence includes up to 3 different
blinking patterns, each defined by its ON and OFF timings.
A bypass mode allows the training sequence to be ignored and the LED output to follow
the one-wire interface Logic state to directly control the LED from the microcontroller.
An external resistor sets the maximum current that flows in the LED, which can be set
between 1 mA and 20 mA.
The PCA9901 operates from a 2.7 V to 5.5 V power supply.
2. Features and benefits
„
„
„
„
„
„
„
„
„
„
„
„
1 wire interface to control the device
Stand-alone blinking capability while training the sequence to blink
Sequence includes up to 3 blinking elements
12-bit (4096 steps) LED ON and OFF timings for each blinking element:
‹ ON timing is captured between 1 ms and 255 ms
‹ OFF timing is captured between 20 ms and 5.1 s
1.8 V compliant one-wire logic interface
Training Start, Training End, Run-Once, Run, Stop and Reset commands
High side current controlled LED driver with 1 mA to 20 mA max current in the LED set
by an external resistor. 5 mA drive capability when no external resistor is connected
110 mV max dropout voltage driver at 20 mA
Fully internal oscillator for sequence training, LED timing, Command and Sequencing
Controls
Short circuit and thermal protection
2.7 V to 5.5 V power supply
Very low quiescent current: < 0.75 μA
PCA9901
NXP Semiconductors
One wire single LED driver
„ ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
„ Latch-up testing is done to JEDEC Standard JESD78, which exceeds 100 mA
„ Temperature range: −40 °C to +85 °C
„ Packages offered: TSSOP8, WLCSP6
3. Applications
„ Cellular telephones
„ Stand-alone status indicator
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCA9901DP
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm
SOT505-1
PCA9901UK
WLCSP6
wafer level chip-size package; 6 bumps;
1.0 × 1.2 × 0.6 mm
-
4.1 Ordering options
Table 2.
PCA9901
Product data sheet
Ordering options
Type number
Topside mark
Temperature range
PCA9901DP
9901
−40 °C to +85 °C
PCA9901UK
9901
−40 °C to +85 °C
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Rev. 2 — 2 September 2010
© NXP B.V. 2010. All rights reserved.
2 of 27
PCA9901
NXP Semiconductors
One wire single LED driver
5. Block diagram
VDD
PCA9901
short/thermal disable
CTRL
INPUT
FILTER
DIGITAL INTERFACE
DECODER
control
signals
sequence
ON AND OFF
COUNTERS
enable
OSCILLATOR
clock
BAND GAP
REGISTERS
Vbg(int)
PATTERN
SEQUENCER
LED CURRENT
CONTROL
400 : 1 RATIO
GND
Fig 1.
PCA9901
Product data sheet
ISET
VDD
SHORT-CIRCUIT
AND
THERMAL
PROTECTION
LEDOUT
002aac602
Block diagram of PCA9901
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PCA9901
NXP Semiconductors
One wire single LED driver
6. Pinning information
6.1 Pinning
ball A1
index area
GND
1
8
VDD
LEDOUT
2
7
TEST1
n.c.
3
6
n.c.
ISET
4
5
CTRL
PCA9901DP
VDD
A1
A2
GND
TEST1
B1
B2
LEDOUT
CTRL
C1
C2
ISET
002aac604
Transparent top view
002aac855
Fig 2.
PCA9901UK
Pin configuration for TSSOP8
Fig 3.
Pin configuration for WLCSP6
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Type
Description
WLCSP6 TSSOP8
PCA9901
Product data sheet
VDD
A1
8
I
power supply
TEST1
B1
7
I
for test purposes only; must be connected to GND
CTRL
C1
5
I
digital interface
GND
A2
1
I
ground supply
LEDOUT B2
2
O
LED output (anode LED)
ISET
C2
4
I
current set resistor input; resistor to ground
n.c.
-
3, 6
-
not connected
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PCA9901
NXP Semiconductors
One wire single LED driver
7. Functional description
Refer to Figure 1 “Block diagram of PCA9901”.
7.1 Digital interface overview - CTRL pin
The digital interface is a simple one-wire uni-directional interface allowing the host
controller device to:
• send the lighting sequence to the LEDOUT pin and request the PCA9901 to capture
and memorize it at the same time
• send the specific commands to execute the captured and memorized sequence later
• reset the PCA9901 to a known state at any time.
The lighting sequence to be captured by the PCA9901 contains the actual LED ON
(CTRL = 1) and LED OFF (CTRL = 0) timings. A sequence includes up to 3 different
patterns, each one containing one ON and one OFF value. Up to 3 LED ON and
3 LED OFF times can then be memorized by the PCA9901.
Commands are specific events that tell the PCA9901 what action needs to be performed.
The different commands are:
TRAINING START: Beginning of the training sequence. Upon reception of this
command, the PCA9901 starts capturing the lighting sequence.
TRAINING END: End of the training sequence. Upon reception of this command, the
capture stops, and the sequence is stored in the corresponding registers. The PCA9901
goes to Shutdown mode.
RUN ONCE: The sequence that has been memorized is executed once and then the
PCA9901 goes to Shutdown mode. If no sequence has been previously captured, the
PCA9901 goes to Shutdown mode.
RUN: The sequence that has been memorized is executed until a STOP Command
occurs.
STOP: The LED output is switched off at the end of the current LED ON time and the
PCA9901 goes to Shutdown mode.
RESET: The PCA9901 is reset and all the internal registers default to zeroes. The
PCA9901 goes to Shutdown mode.
The PCA9901 decodes the commands using a 1.5 ms window from the first LOW to HIGH
transition that occurs on the CTRL pin. The following command or the data following a
command must then be issued at least 1.5 ms after.
At the end of the 1.5 ms window:
• The PCA9901 is fully operational (in the case the command is issued while the
PCA9901 was in Shutdown mode)
• The command has been successfully decoded and the PCA9901 is ready for the next
message from the host controller (which will start at the next LOW to HIGH transition
on the CTRL pin), or is ready to execute the required command.
PCA9901
Product data sheet
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Rev. 2 — 2 September 2010
© NXP B.V. 2010. All rights reserved.
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PCA9901
NXP Semiconductors
One wire single LED driver
7.2 Command descriptions
7.2.1 TRAINING START command
2 pulses sent to the PCA9901 in less than 1.5 ms causes the PCA9901 to enter the
Training mode.
The PCA9901 leaves the Shutdown mode as soon as the first rising edge is detected,
resets its registers to zeroes and is ready for sequence capture within the 1.5 ms.
The next assertion of the CTRL pin (LOW to HIGH transition) starts the first LED ON
period capture. CTRL cannot be asserted in less than 1.5 ms after the TRAINING START
command has been issued.
7.2.2 TRAINING END command
3 pulses sent to the PCA9901 in less than 1.5 ms causes the PCA9901 to leave the
Training mode.
The PCA9901 ends the last LED OFF period capture when the TRAINING END command
occurs.
The PCA9901 goes to Shutdown mode.
7.2.3 RUN ONCE command
4 pulses sent to the PCA9901 in less than 1.5 ms causes the device to enter the
RUN ONCE mode and wait for a ‘synchronization’ rising edge on CTRL.
When a rising edge on CTRL is detected, the sequence that has been previously captured
is run once. If no sequence has been captured it will go into Shutdown mode.
Once the sequence has been run, the PCA9901 goes to Shutdown mode.
Remark: CTRL line may stay either HIGH or LOW after the ‘synchronization’ edge.
7.2.4 RUN command
A LOW to HIGH transition followed by a HIGH state longer than 1.5 ms causes the
sequence that has been previously captured to be executed in loop. The CTRL pin stays
HIGH as long as the sequence is executed. If no sequence has been captured it will go
into Shutdown mode.
7.2.5 STOP command
A HIGH to LOW transition when the PCA9901 is in the RUN mode causes the sequence
that is running to stop:
• Immediately, if the transition occurred during the LED OFF time
• After finishing the execution of the current LED ON cycle if the transition occurred
during the LED ON time.
Once the sequence has been stopped, the PCA9901 goes to Shutdown mode.
PCA9901
Product data sheet
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Rev. 2 — 2 September 2010
© NXP B.V. 2010. All rights reserved.
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PCA9901
NXP Semiconductors
One wire single LED driver
7.2.6 RESET command
A single pulse sent to the PCA9901 in less than 1.5 ms causes the PCA9901 to go to
Shutdown mode and to reset its registers to zeroes.
7.3 State machine
power-up;
registers reset to zeroes
no patterns memorized
RUN or RUN ONCE
Shutdown mode
RESET
RUN ONCE
TRAINING START
PCA9901 up and running;
registers reset to zeroes
PCA9901 up
and running
time-out detected during
training sequence
training sequence;
LEDOUT follows CTRL state
TRAINING END
sequence
sent by
host
controller
TRAINING END
PCA9901 up
and running
sequence memorized;
LEDOUT off
sequence is sent once
to LEDOUT(1)
LEDOUT follows
CTRL state:
LEDOUT = ON
when CRTL = HIGH;
LEDOUT = OFF
when CTRL = LOW
RUN
PCA9901 up
and running
sequence is sent (loop)
to LEDOUT(1)
STOP
Bypass mode when
registers still at zeroes
RESET
registers reset
to zeroes
002aac605
(1) PCA9901 goes directly to Shutdown mode if a training sequence has not been previously performed.
Fig 4.
State machine of the PCA9901
PCA9901
Product data sheet
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PCA9901
NXP Semiconductors
One wire single LED driver
7.4 Lighting training sequence
Training sequence starts after a TRAINING START command has been issued by the
host controller and ends after a TRAINING END command has been issued.
The LED ON timing is provided when CTRL is HIGH and the LED OFF timing is provided
when CTRL is LOW.
LEDOUT follows CTRL Logic state during the Training sequence: The LED is ON when
CTRL = HIGH, and the LED is OFF when CTRL = LOW.
The sequence is as follows:
Pattern 1 ON – Pattern 1 OFF – Pattern 2 ON – Pattern 2 OFF – Pattern 3 ON –
Pattern 3 OFF
A sequence composed by only 1 or 2 patterns can also be stored by issuing the
TRAINING END command after either the first or the second pattern. Non-programmed
registers during the training sequence remain programmed with zeroes; when the state
machine encounters a Zero ON time register, it loops to the beginning of the sequence.
• LED ON timing: 1 ms step with a 12-bit resolution – Time between 1 ms and at least
255 ms.
An ON time higher than 255 ms causes the ON counter to saturate at max value
(0xFF).
• LED OFF timing: 20 ms step with a 12-bit resolution – Time between at least 20 ms
and 5.1 s.
An OFF time higher than 5.1 s causes the OFF counter to saturate at max value
(0xFF).
ON and OFF timings are stored on the 8-bit registers. The registers are reset to zeroes
when the host controller sends a TRAINING START or RESET command.
LED ON
TRAINING
START
LED ON
LED OFF
1_ON
LED ON
LED OFF
2_ON
1_OFF
Pattern 1
LED OFF
TRAINING
END
3_ON
2_OFF
Pattern 2
3_OFF
Pattern 3
sequence
LEDOUT pin follows CTRL state dring the sequence capture
002aac606
1_ON, 2_ON and 3_ON timings: between 1 ms and at least 255 ms (4096 steps).
2_OFF, 2_OFF and 3_OFF timings: between at least 20 ms and 5.1 s (4096 steps).
Fig 5.
Lighting sequence capture
PCA9901
Product data sheet
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PCA9901
NXP Semiconductors
One wire single LED driver
7.5 TRAINING START and TRAINING END commands waveforms
last LED OFF timing
TRAINING START command
TRAINING END command
first LED ON timing
1.5 ms minimum
1.5 ms minimum
Training sequence
PCA9901 goes to Shutdown mode
PCA9901 leaves Shutdown mode
and is ready for capture within 1.5 ms (max).
All registers are set to zeroes.
Fig 6.
002aac607
TRAINING START and TRAINING END commands
7.6 RUN ONCE, RUN, STOP and RESET commands waveforms
RUN ONCE command
programmed
sequence
runs once
LEDOUT = OFF
PCA9901 goes to Shutdown mode
1.5 ms minimum
STOP command
PCA9901 goes to Shutdown mode immediately
if LED is OFF (counting LED OFF time).
RUN command
1.5 ms minimum
or
programmed sequence
runs in loop
PCA9901 goes to Shutdown mode
once the current LED ON time
has been performed.
LED on
RESET command
PCA9901 leaves
Shutdown mode
All registers set to zeroes;
PCA9901 goes to
Shutdown mode.
1.5 ms minimum
PCA9901 leaves
Shutdown mode
Fig 7.
002aac608
RUN ONCE, RUN, STOP and RESET commands
7.7 Bypass mode
A Bypass mode allows the PCA9901 LEDOUT pin to be directly driven by the CTRL logic
state.
A TRAINING START command followed immediately by a TRAINING END command
enters the Bypass mode. Once the TRAINING END command has been issued, the
LEDOUT output follows the CTRL logic state (LED ON when CTRL = HIGH, LED OFF
when CTRL = 0). Sending a RESET command exits the Bypass mode.
The Bypass mode allows the microcontroller to directly control the LED and blink it or
dim it.
PCA9901
Product data sheet
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PCA9901
NXP Semiconductors
One wire single LED driver
7.8 Time-out
The time-out circuitry allows the PCA9901 to be safely set back to the Shutdown mode
when a communication problem occurs between the host controller and the PCA9901.
7.8.1 CTRL LOW too long after receiving a TRAINING START command
The PCA9901 is waiting for the first LED ON timing.
1. Once the TRAINING START command has been decoded (end of the 1.5 ms
window), a time-out counter starts counting as long as CTRL stays LOW.
2. The time-out counter counts until it reaches the maximum allowed ON value. The
maximum allowed ON time is greater than or equal to 255 ms.
Remark: If CTRL goes HIGH before reaching the maximum counter value, the
time-out counter is reset and the PCA9901 starts counting the LED ON timing or
decoding the command that has been issued.
3. If the maximum time-out value is reached, the training sequence is automatically
terminated and the PCA9901 goes to Shutdown mode.
Remark: When the time-out occurs and the PCA9901 goes to Shutdown mode, the
registers are still programmed with zeroes.
7.8.2 CTRL HIGH too long during the training sequence
The PCA9901 is counting the ON timing and reaches the counter maximum value (0xFF).
If CTRL does not go LOW when reaching the max value:
1. The PCA9901 switches off the LEDOUT pin.
2. Maximum ON count is stored in the corresponding ON register.
3. A time-out counter starts counting until it reaches the maximum allowed OFF value.
The maximum allowed OFF time is greater than or equal to 5.11 seconds.
4. When the maximum time-out counter value is reached, maximum OFF count is stored
in the corresponding OFF register.
Remark: If CTRL goes LOW before reaching the maximum counter value, the
time-out counter is reset and the PCA9901 starts counting the LED OFF timing.
5. If the maximum time-out value is reached, the training sequence is automatically
terminated and the PCA9901 goes to Shutdown mode.
7.8.3 CTRL LOW too long during the training sequence
The PCA9901 is counting the OFF timing and reaches the counter maximum value
(0xFF). If CTRL does not go HIGH when reaching the maximum value:
1. Maximum OFF count is stored in the corresponding OFF register.
2. A time-out counter starts counting until it reaches the maximum allowed OFF value.
The maximum allowed OFF time is greater than or equal to 5.11 seconds.
3. When the maximum time-out counter value is reached, the training sequence is
automatically terminated and the PCA9901 goes to Shutdown mode.
Remark: If CTRL goes HIGH before reaching the maximum counter value, the
time-out counter is reset and the PCA9901 starts counting the LED ON timing or
decoding the command that has been issued.
PCA9901
Product data sheet
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PCA9901
NXP Semiconductors
One wire single LED driver
7.8.4 ‘Synchronization’ signal not generated after RUN ONCE command
The PCA9901 is waiting for the ‘Synchronization’ signal (rising edge of CTRL) after a
RUN ONCE command has been issued.
1. Once the RUN ONCE command has been decoded (end of the 1.5 ms window), a
time-out counter starts counting as long as CTRL stays LOW.
2. The time-out counter counts until it reaches the maximum allowed ON value. The
maximum allowed ON time is greater than or equal to 255 ms.
Remark: If CTRL goes HIGH before reaching the maximum counter value, the
time-out counter is reset and the PCA9901 runs the sequence once.
3. If the maximum time-out value is reached, the RUN ONCE command is automatically
aborted and the PCA9901 goes to Shutdown mode.
7.9 Current source generation
The LED output contains a constant current driver that will source a current that is
determined by an external resistor connected between ISET pin and GND. The current
can be set using the following formula:
( 1.23 × 400 )
I O = -----------------------------R ext
(1)
Rext can be chosen so that a maximum LED current value between 1 mA and 20 mA can
be programmed.
Remark: LED current accuracy is proportional to the accuracy and temperature
coefficient tolerance of Rext.
When no external resistor is connected between the ISET pin and GND, the LED output is
able to source 5 mA through a fully internal current source. It is automatically shut down
when an external resistor is connected to ISET.
Remark: The LED current accuracy is proportional to the tolerance and temperature
coefficient of the resistor.
Remark: To save power, the current source generator is only enabled when the LED
needs to be turned on.
7.10 Short-circuit and thermal protection
A short-circuit and thermal protection circuitry disables the LED output driver and the
current generator when a short occurs or when a high temperature condition has been
detected.
The circuitry is active during normal mode operation (Programing, RUN ONCE, RUN or
Bypass modes). When a fault condition is detected, the reference current circuitry (ISET)
and the LED output stage (LEDOUT) are automatically shut down. This will cause
LEDOUT to be OFF as long as the fault condition is present. The other analog blocks
(oscillator, voltage reference) are kept enabled as long as the PCA9901 is in normal mode
operation.
The PCA9901 goes automatically to Power-down mode when it exits the programming,
RUN ONCE, RUN or Bypass modes.
PCA9901
Product data sheet
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PCA9901
NXP Semiconductors
One wire single LED driver
If the fault condition goes away during normal mode operation, the reference current
circuitry and the LED output stage are again enabled, allowing the PCA9901 to resume
control of the LED output stage (LEDOUT).
A short-circuit condition is detected when the PCA9901's current consumption becomes
higher than 50 mA.
An overtemperature condition is detected when the temperature goes above 125 °C. It
goes away when the temperature goes 15 °C below the overtemperature condition.
7.11 Shutdown mode
Shutdown mode is the low power mode where the internal oscillator, band gap, current
generator and LED driver are turned off to save power, and is the default mode at
power-up.
Shutdown mode is automatically entered after:
•
•
•
•
•
A RUN ONCE sequence has been executed
A STOP command
A TRAINING END command
A RESET command
A Time-out condition has been detected.
When in Shutdown mode, setting CTRL HIGH immediately exits the Shutdown mode: the
oscillator and the band gap are turned on and it takes up to 1.5 ms for the device to be up
and running and decode the command issued by the host controller.
7.12 Reset
Reset mode is achieved by sending a RESET command and causes all the registers to be
reset to zeroes and the device to go to Shutdown mode.
PCA9901
Product data sheet
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PCA9901
NXP Semiconductors
One wire single LED driver
8. Application design-in information
VBAT
VDD
VDD
CTRL
ILEDOUT
LEDOUT
HOST
CONTROLLER
PCA9901
GND
ISET
GND
Rext(1)
002aac609
(1) Accuracy of the output current directly proportional to the accuracy of the external resistor.
× 400
R ext = 1.23
------------------------I LEDOUT
Fig 8.
Application diagram
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
supply voltage
VI
input voltage
Conditions
Min
Max
Unit
−0.3
+6.0
V
CTRL pin
−0.3
VDD + 0.2
V
ISET pin
−0.3
VDD + 0.2
V
II
input current
ISET
-
125
μA
IO
output current
LEDOUT
-
50
mA
Tstg
storage temperature
Tamb
ambient temperature
VESD
electrostatic discharge
voltage
-
125
μA
−65
+150
°C
operating
−40
+85
°C
HBM
−2000
+2000
V
MM
−200
+200
V
CDM
−500
+500
V
−2000
+2000
V
ISET
VESD(LEDOUT) electrostatic discharge
voltage on pin LEDOUT
[1]
PCA9901
Product data sheet
HBM
[1]
ESD rating on that specific pin may be higher. Will be updated if needed when device available and ESD
test performed.
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PCA9901
NXP Semiconductors
One wire single LED driver
10. Static characteristics
Table 5.
Static characteristics
VDD = 2.7 V to 5.5 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
2.7
VDD = 3.3 V; CTRL = GND;
LEDOUT = 0 mA; excludes LED
drive and current mirror currents
-
Typ
Max
Unit
3.3
5.5
V
-
40
μA
Supply
VDD
supply voltage
IDD
supply current
IDD(sd)
shutdown mode supply current
-
0.3
0.75
μA
Ith(det)sc
short-circuit detection
threshold current
maximum current before short
detected; guaranteed by design
-
50
70
mA
ΔIO/(IO×ΔVI)
line regulation
LEDOUT enabled
-
-
2
%/V
VPOR
power-on reset voltage
rising power supply
-
2.0
2.5
V
dropout voltage
when LED current dropped
10 % from the nominal current
value
ILEDOUT = 5 mA
-
-
30
mV
ILEDOUT = 10 mA
-
40
50
mV
ILEDOUT = 20 mA
-
75
110
mV
1.2
-
3.1
V
with external resistor
1
-
20
mA
without external resistor
-
5
-
mA
-
-
5
%
overtemperature and LED VF
change from 1.2 V to VDD with
external resistor
−10
-
+10
%
overtemperature and LED VF
change from 1.2 V to Vdo with
external resistor
−30
-
+30
%
overtemperature and LED VF
change from 1.2 V to 3.1 V
without external resistor
−30
-
+30
%
LEDOUT pin
Vdo
VLEDOUT
voltage on pin LEDOUT
ILEDOUT
current on pin LEDOUT
ΔIO/IO
relative output current variation symmetrical (peak-to-peak);
must not offset average current
setting
ΔILEDOUT/ILEDOUT relative current variation on
pin LEDOUT
current load regulation
CTRL pin
VIL
LOW-level input voltage
-
-
0.4
V
VIH
HIGH-level input voltage
1.2
-
-
V
IIH
HIGH-level input current
-
-
1
μA
ILI
input leakage current
−1
-
-
μA
Ci
input capacitance
-
-
5
pF
PCA9901
Product data sheet
VI = VSS or VDD
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PCA9901
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One wire single LED driver
Table 5.
Static characteristics …continued
VDD = 2.7 V to 5.5 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
1.23
-
V
ISET pin
VISET
voltage on pin ISET
ΔVISET/VISET
relative voltage variation on
pin ISET
ILEDOUT = 5 mA to 20 mA
−10
-
+10
%
ΔIO/Iexp
output current variation to
expected current ratio
linearity of ILED / ISET function
−2
-
2
%
ILED/IISET
LED current to ISET current
ratio
ILEDOUT = 5 mA to 20 mA
-
400
-
Thermal shutdown
Tsd
shutdown temperature
guaranteed by design
-
125
-
°C
Tsd(hys)
hysteresis of shutdown
temperature
guaranteed by design
-
15
-
°C
11. Dynamic characteristics
Table 6.
Dynamic characteristics
VDD = 2.7 V to 5.5 V; Tamb = −40 °C to 85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tWH(CTRL)
pulse width HIGH on pin CTRL
command pulse ON
2
-
50
μs
tWL(CTRL)
pulse width LOW on pin CTRL
command pulse OFF
2
-
75
μs
tdecod(cmd)
command decode time
-
1.5
-
ms
tw(spike)
spike pulse width
-
25
-
ns
CTRL pin
LEDOUT pin
tWH(LEDOUT) pulse width HIGH on pin LEDOUT
minimum LED ON period
[1]
-
1
±1 %
ms
[2]
-
20
±1 %
ms
tWL(LEDOUT)
pulse width LOW on pin LEDOUT
minimum LED OFF period
ΔTLED
LED period variation
internal oscillator clock cycle
−200
-
+200
μs
relative oscillator frequency variation
over temperature;
guaranteed by design
-
5
-
%
Oscillator
Δfosc/fosc
[1]
LED ON-time resolution.
[2]
LED OFF-time resolution.
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12. Tape and reel information
4.00 ± 0.10
2.00 ± 0.05
4.00 ± 0.10
∅ 1.50 + 0.10
1.75 ± 0.10
8.00
3.50 ± 0.05
+ 0.30
− 0.10
5° max.
K0 B0 1.35 ± 0.05
∅ 0.50 ± 0.05
0.75 ± 0.05
0.254 ± 0.02
K0
A0
1.15 ± 0.05
002aae764
Dimensions are in millimeter (mm).
Fig 9.
WL-CSP embossed carrier tape configuration
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13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
E
SOT505-1
A
X
c
y
HE
v M A
Z
5
8
A2
pin 1 index
(A3)
A1
A
θ
Lp
L
1
4
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
SOT505-1
Fig 10. Package outline SOT505-1 (TSSOP8)
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WLCSP6: wafer level chip-size package; 6 bumps; 1.0 x 1.2 x 0.6 mm
B
D
PCA9901UK
A
ball A1
index area
A2
E
A
A1
detail X
e
C
1/2 e
∅v
∅w
b
y1 C
C A B
C
y
C
B
e1
A
1
2
X
0
0.5
1 mm
scale
Dimensions
Unit
mm
A
A1
A2
b
max 0.63 0.23 0.40 0.29
nom 0.58 0.20 0.38 0.26
min 0.53 0.17 0.36 0.23
D
E
e
e1
1.1
1.0
0.9
1.25
1.20
1.15
0.4
0.8
v
w
y
0.01 0.04 0.02
pca9901uk_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
07-08-30
09-11-05
PCA9901UK
Fig 11. Package outline PCA9901UK (WLCSP6)
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14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
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14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 12) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 12.
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 12. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
15.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
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• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 9.
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
15.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
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• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
15.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
15.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
15.3.4 Cleaning
Cleaning can be done after reflow soldering.
16. Abbreviations
Table 10.
PCA9901
Product data sheet
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
GPRS
Global Packet Radio System
GSM
Global System for Mobile communications
HBM
Human Body Model
LED
Light Emitting Diode
MM
Machine Model
PWB
Printed Wiring Board
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17. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9901 v.2
20100902
Product data sheet
-
PCA9901 v.1
Modifications
•
•
Table 1 “Ordering information”: Removed type number PCA9901GD (row)
Table 2 “Ordering options”:
– Removed PCA9901GD
– Changed Topside mark for PCA9901UK from “P01” to “9901”
•
•
•
Removed (old) Section 5, “Marking”
Section 6.1 “Pinning”: removed (old) “Figure 4, Pin configuration for XSON8U”
Table 5 “Static characteristics”:
– Typical value for VPOR corrected from “1.8 V” to “2.0 V”.
– Maximum value for VPOR corrected from “2.0 V” to “2.5 V”.
•
PCA9901 v.1
PCA9901
Product data sheet
Section 13 “Package outline”: removed (old) Figure 13, “Package outline SOT996-2 (XSON8U)”
20091203
Product data sheet
-
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Rev. 2 — 2 September 2010
-
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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20. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.3
7.4
7.5
7.6
7.7
7.8
7.8.1
7.8.2
7.8.3
7.8.4
7.9
7.10
7.11
7.12
8
9
10
11
12
13
14
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Digital interface overview - CTRL pin . . . . . . . . 5
Command descriptions . . . . . . . . . . . . . . . . . . . 6
TRAINING START command . . . . . . . . . . . . . . 6
TRAINING END command . . . . . . . . . . . . . . . . 6
RUN ONCE command . . . . . . . . . . . . . . . . . . . 6
RUN command . . . . . . . . . . . . . . . . . . . . . . . . . 6
STOP command . . . . . . . . . . . . . . . . . . . . . . . . 6
RESET command . . . . . . . . . . . . . . . . . . . . . . . 7
State machine . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Lighting training sequence . . . . . . . . . . . . . . . . 8
TRAINING START and TRAINING END
commands waveforms . . . . . . . . . . . . . . . . . . . 9
RUN ONCE, RUN, STOP and RESET
commands waveforms . . . . . . . . . . . . . . . . . . . 9
Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Time-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CTRL LOW too long after receiving a
TRAINING START command . . . . . . . . . . . . . 10
CTRL HIGH too long during the training
sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
CTRL LOW too long during the training
sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
‘Synchronization’ signal not generated
after RUN ONCE command . . . . . . . . . . . . . . 11
Current source generation . . . . . . . . . . . . . . . 11
Short-circuit and thermal protection . . . . . . . . 11
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 12
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application design-in information . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Tape and reel information . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering of SMD packages . . . . . . . . . . . . . . 19
14.1
Introduction to soldering. . . . . . . . . . . . . . . . .
14.2
Wave and reflow soldering. . . . . . . . . . . . . . .
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
14.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
15
Soldering of WLCSP packages . . . . . . . . . . .
15.1
Introduction to soldering WLCSP packages .
15.2
Board mounting . . . . . . . . . . . . . . . . . . . . . . .
15.3
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
15.3.1
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.2
Quality of solder joint . . . . . . . . . . . . . . . . . . .
15.3.3
Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15.3.4
Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
17
Revision history . . . . . . . . . . . . . . . . . . . . . . .
18
Legal information . . . . . . . . . . . . . . . . . . . . . .
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
18.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
19
Contact information . . . . . . . . . . . . . . . . . . . .
20
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19
19
19
20
21
21
21
21
22
23
23
23
23
24
25
25
25
25
26
26
27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 September 2010
Document identifier: PCA9901
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