Datasheet

Datasheet
Simple design with built-in self-controlled cell balance features circuit
Cell Balance LSI of 4 to 6 Series Power
Storage Element Cells for Automotive
BD14000EFV-C
General Description
Key Specifications
BD14000EFV is a LSI IC designed as a self-controlled
cell balancer. It has a built-in shunt-type power storage
element balancer function that can respond to 4 to 6
cells. All the functions necessary in a cell balancer are
built-in making power storage element cell balancing
possible only in this LSI.
This chip can be used for electric double layer
capacitors (EDLC) with cell detection voltage range of
2.4V to 3.1V and power storage capacitors which is
important for cell balancers with similar electrical
characteristics
Input Voltage Range:8.0V to 24.0V
Cell Voltage Detection Range:2.4V to 3.1V
Cell Voltage Detection Accuracy:③1%(Max. at
25°C)
Shunt Switch ON Resistance:1Ω(Typ.)
Operating Temp. Range :-40°C to +105°C
Package
HTSSOP-B30
W (Typ) x D (Typ) x H (Max)
10.00mm x 7.60mm x 1.00mm
It has a built-in multiple over-voltage detection function
and can also detect abnormal mode such as any
characteristic deterioration in cells.
Also, application-dependent operation can be set since
enable control is possible.
Features
HTSSOP-B30
(Note1)
AEC-Q100 qualified
All EDLC cell balancer functions are integrated on
a single chip
Self- controlled EDLC balance function
Adopts shunt resistance method for simple
balancing
4 to 6 cell series connection ready
Multiple chip series connection is possible
Built-in over-voltage detection flag output
Detection voltage can be set
(Note1 : Grade2)
Typical Application Circuit
Applications
Renewable energy power storage for Automotive,
Production machinery, Building machinery, etc.
UPS and other devices that stabilizes power
supplies
Figure 1 Typical application circuit
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Datasheet
BD14000EFV-C
Pin Configuration
T
_
_
_
T
T
_
T
T
T
Figure 2 Pin Configuration
Pin Description
PIN No.
Symbol
1
C6
Function
PIN No.
Symbol
16
C1
Positive (+) connection terminal
pin of cell 6
Function
Positive (+) connection terminal pin of
cell 1
Shunt switch connection terminal
Shunt switch connection terminal pin for
17
D1
pin for cell 6.
cell 1
Shunt switch connection terminal
Shunt switch connection terminal pin for
3
S6
18
S1
pin for cell 6.
cell 1
Positive (+) connection terminal
Analog ground (connect to (-) side of
4
C5
19
VSS
pin of cell 5
bottom cell)
Shunt switch connection terminal
5
D5
20
VSET2
Detection voltage setting input pin 2
pin for cell 5.
Shunt switch connection terminal
6
S5
21
VSET1
Detection voltage setting input pin 1
pin for cell 5.
Positive (+) connection terminal
7
C4
22
VSET0
Detection voltage setting input pin 0
pin of cell 4.
Shunt switch connection terminal
8
D4
OVLOSEL
23
Over-voltage detection setting input pin
pin for cell 4.
Shunt switch connection terminal
9
S4
24
TEST0
TEST terminal pin (connect to VSS)
pin for cell 4.
Positive (+) connection terminal
10
C3
25
ENIN
Enable signal input pin
pin of cell 3.
Shunt switch connection terminal
11
D3
VO_OK
26
Self-Check OK signal output pin
pin for cell 3.
Shunt switch connection terminal
12
S3
VO_OVLO2
27
Overvoltage flag output pin 2
pin for cell 3.
Positive (+) connection terminal
13
C2
28
VO_OVLO1
Overvoltage flag output pin 1
pin of cell 2
Shunt switch connection terminal
Regulator circuit output pin
14
D2
29
VREG
pin for cell 2.
(output capacitor : 1.0µF)
Shunt switch connection terminal
15
S2
30
VCC
Regulator circuit power input pin
pin for cell 2.
The back PAD is used for enhancing the radiation of heat. This PAD is needed to connect VSS.
TEST0 : This pin is used for ROHM internal test. This pin is needed to connect VSS for normal operation.
2
D6
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Datasheet
BD14000EFV-C
Block Diagram
T
T
T
T
T
T
T
T
,
T
,
T
_
_
_
T
T
Figure 3 Block Diagram
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BD14000EFV-C
Description of Blocks
CONTROL block
1. Cell voltage detection block
Setting the detection voltage is possible with cell balance voltage detection and two types of OVLO available
for each cell.
Additionally, protection detection error can be controlled by setting delays for each voltage detection.
2. Detect control block
ON/OFF control is possible by setting the ENIN pin.
Additionally, cell detection voltages can be set via VSET0, 1, 2 and OVLOSEL pins.
REG block
This is used as a power block for the chip’s internal blocks.
This block can also be used as I/F power source of control input/output.
Shunt SW
Shunt Switch is used for the cell balancing function.
SWDET
SWDET detects if the drain pins (D1~D6) are normally changed to “L” when cell balance voltage is
detected as a self-check function
Flag output
2 types of OVLO are output from VO_OVLO1, 2. Self-check function is output from VO_OK.
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
V1-1
-0.3 to 28
V
V2-1
-0.3 to 7
V
V2-2
-0.3 to 7
V
Supply Voltage
VCC,VCn(n=6) to VSS
Supply Voltage
VCn to Vcn-1(n=2~6)
VC1 to VSS
VDn to Vsn (n=1~6)
Supply Voltage
VREG,ENIN,VO_OVLO1,VO_OVLO2,
VO_OK,OVLOSEL,VSET0,VSET1,
VSET2,TEST0 to VSS
Power Dissipation
Pd
1.55
*1
W
Operating Temperature Range
Topr
-40 to +105
°C
Storage Temperature Range
Tstg
-55 to 150
°C
*1 This value is for ROHM standard board (1 layer 70x70x1.6mm) mounting. For temperatures above 25°C, use a 12.4mW/°C derating factor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in cases where the IC is
operated over the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +105°C)
Parameter
VCC Voltage
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Symbol
Rating
Unit
VCC
8.0 to 24
V
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BD14000EFV-C
Electrical Characteristics (Unless otherwise specified VCC=15V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
IVCC
40
80
µA
ON
25
50
µA
IVCC
20
40
µA
Conditions
Circuit Current
VCC circuit current when ON
VCC circuit current when standby
Cn(n=1~6) pin circuit current
when ON
Cn(n=5,6) pin circuit current
when standby
Cn(n=1~4) pin circuit current
when standby
Cell Voltage Detection
Cell Balance Start Detection
Voltage Range
Cell Balance Start
Detection Accuracy1
Cell Balance Start
Detection Accuracy2
Over- Voltage Detection 1
Detection Voltage1
Over- Voltage Detection 1
Detection Voltage2
Over- Voltage Detection 1
Detection Accuracy
Over- Voltage Detection 2
Detection Voltage1
Over- Voltage Detection 2
Detection Voltage2
Over- Voltage Detection 2
Detection Accuracy
Built-in Oscillator Frequency
ENIN=H
During cell balance start
voltage non-detection
ENIN=L
ENIN=H,Vcn-Vcn-1=2.5V
During cell balance start
voltage non-detection
ICN
OFF56
-
1
8
µA
ENIN=L, Vcn-Vcn-1=2.5V
OFF
-
0
5
µA
ENIN=H,Vcn-Vcn-1=2.5V
VCB
2.4
-
3.1
V
Set by VSET0~2 pin
-
-
③1
%
-
-
③2
%
-
V
-
V
③2
%
-
V
-
V
VCB
ERR1
VCB
ERR2
VOVLO
1-1
VOVLO
1-2
VOVLO1
ERR
VOVLO2
-1
VOVLO2
-2
VOVLO2
ERR
fosc
-
-
③2
%
20
40
80
kHz
VREG
3.6
4.3
5.0
V
VCB
+0.15
VCB
+0.25
-
-
-
-
VCB
+0.3
VCB
+0.5
-
-
Ta=-40~105°C
Set by VSET0~2 pin
and OVLOSEL=L
Set by VSET0~2 pin
and OVLOSEL=H
Ta=-40~105°C
Set by VSET0~2 pin
and OVLOSEL=L
Set by VSET0~2 pin
and OVLOSEL=H
Ta=-40~105°C
VREG
Output Voltage
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BD14000EFV-C
Electrical Characteristics (Unless otherwise specified VCC=15V Ta=25°C)
Parameter
Shunt SW
Switch on resistance
In between Dn-Sn (n=1~6)
Leak current during switch off
in between Dn-Sn (n=1~6)
Digital Input/ Output Terminal
Output L Level Voltage
(VO_OVLO1.2,VO_OK)
Leak Current when off
(VO_OVLO1.2,VO_OK)
Symbol
Min
Typ
Max
Unit
Ronsw
-
1.0
2.0
Ω
Vcn-Vcn-1=2.5V
ILEAIO
W
-
-
2
µA
Vdn-Vsn-1=3.5V
-
0.2
0.5
V
IIN=5mA
-
-
2
µA
VIN=3.5V
VOL
OVLO
ILFAK
OVLO
Conditions
Input H Level Voltage (ENIN)
VIHEN
1.8
-
VREG
+0.2
V
Input L Level Voltage (ENIN)
VILEN
-0.3
-
0.4
V
IIHEN
-
3.5
7.0
µA
VREG
X0.8
-
-0.3
-
-
-
2
µA
VIN=3.5V
-
-
2
µA
VIN=0.0V
Input current when H level input.
(ENIN)
Input H Level Voltage
(VSET0~2,OVLOSEL)
Input L Level Voltage
(VSET0~2,OVLOSEL)
Input current when H level input
(VSET0~2,OVLOSEL)
Output current when L level input
(VSET0~2,OVLOSEL)
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VIH
SET
VIL
SET
IIH
SET
IIL
SET
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VREG
+0.2
VREG
X0.2
VIN=3.5V
V
V
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Datasheet
BD14000EFV-C
Typical Performance Curves
Figure 5. Detection voltage for OVLO1 vs. Temp.
(Detection voltage=3.35V setting)
Figure 4. Detection voltage for cell balance vs. Temp.
(Detection voltage setting= 3.10V)
Figure 6. OVLO2 detection voltage vs. Temp.
(Detection voltage=3.60V setting)
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Figure 7. VREG vs IO
(VCC=15V)
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BD14000EFV-C
Function description and items that need attention
1.
Setting the operation mode from the Enable terminal
It is possible to control the cell balancer function ON/OFF setting of the IC via the operation mode setting pin (ENIN)
The settings for each input terminal is shown on the following table
Input
Balancer Setting
ENIN
ON/OFF
0
OFF
Standby
1
ON
Operating
Remarks
When standby, only the internal power supply (VREG) is operational.
When operating, the other blocks are also operational.
2.
Detection Voltage Setting
By using the detection voltage setting terminal pins (VSET0,1 and 2), setting the cell balance start detection voltage
(VCB) and over-voltage detection voltage 1,2 (VOVLO1,2) is possible. Output for each input terminal is shown on the
following table:
Input
Output
VSET2
VSET1
VSET0
VCB[V]
0
0
0
2.4
0
0
1
2.5
0
1
0
2.6
0
1
1
2.7
1
0
0
2.8
1
0
1
2.9
1
1
0
3.0
1
1
1
3.1
VOVLO1[V]
VOVLO2[V]
VCB+0.15(*1)
or
VCB+0.25(*2)
VCB+0.3(*1)
or
VCB+0.5(*2)
(*1):OVLOSEL=’L’ condition
(*2):OVLOSEL=’H’ condition
3.
Over-Voltage Flag output
The Over- Voltage Detection Output Terminals (VO_OVLO1, 2) are the OR output signals of the chip’s built-in overvoltage detection 1 and 2 output signals.
The flag output logic is shown on the following tables:
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Built-In OverVoltage
Detection
(OVLO1)
Output
(VO_OVLO1)
Non-Detection
Hi-Z
Detection
L
Built-In OverVoltage
Detection
(OVLO2)
Output
(VO_OVLO2)
Non-Detection
Hi-Z
Detection
L
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BD14000EFV-C
4.
Self-Check Function
This chip has a built-in self-check function to confirm if its cell balance function is working properly.
When cell balance detection voltage is exceeded, the shunt SW turns ON to make cell balance self-check
function possible.
The self-check OK detection output terminal (VO_OK) becomes the AND output of the output signals of the self-check
function of each of this LSI’s cells. This function is available for 4-, 5- or 6-cell applications.
The plug detection logic is shown on the following table:
Built-In Self-Check Detection
Output
VO_OK
Non-Detection
Hi-Z
Detection (OK)
L
To cope with 4-cell and 5-cell application, the detection pin gives an output as a dummy when not yet used in the
detect block for 5, 6 cells. Because of that, the cell check pin gives output “detect OK (L)” in case the cell 5 or cell 6 is
either shorted or damaged. During that time, cell module voltage becomes unbalanced and abnormal detection is
possible by monitoring the overvoltage pin “detect (L)” when the cell module becomes fully charged.
5.
Detection Time Setting
For cell balance voltage detection (VCB) and over-voltage detection 1, 2 (VOVLO1, 2), the detection time delays can
be set for transitions from non-detection to detection and detection to non-detection.
During non-detection, if detection signal matches the 4x td at td=25msec (typ) intervals, the detection flag will output.
Also, during detection, if the non-detection signal matches the 4x td at td=25msec (typ) intervals, the non-detection flag
will output.
Through this, detection time delay can be set from 75msec (3x td) to 100msec (4x td) (typ) as detection time delay.
Figure 8. Detection time setting
6.
VREG Terminal Application
VREG output voltage is used as I/F power supply and control power supply for the chip’s internal blocks.
It is assumed that up to 10mA maximum is applied as external load, and since it is a basic simple power supply, it
can only apply power to I/F. Please use only after a thorough inspection of electrical characteristics and confirm
that no problem will arise from use.
It is recommended to use a ceramic capacitor with a capacitance equal or greater than 1uF between VREG to VSS.
Please select a capacitor with good DC bias characteristics and with a high capacitance value.
7.
Detecting operation when cell voltage is up
Internal detector output of this chip varies with respect to the rise time of the cell voltage. Please use only after a
thorough inspection of electrical characteristics and confirm that no problem will arise from use.
8.
Cn(n=1-6) Terminal Application
When detect voltage may be influenced by noise from board or module, please use ceramic capacitors between
Cn (n=1-6) to VSS for stable detection only after a thorough inspection of electrical characteristics and confirm that no
problem will arise from use.
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BD14000EFV-C
Application Example
When using the power storage element with 4 cells and 5 cells, please connect all the unused terminals to the Cn terminal
where n is the number of actual cells in series. This chip can respond to 4 to 6 cells, but cannot respond to 3 cells or fewer
than 3 cells.
Sample pin connections for 6 cells
Sample pin connections for 5 cells
Sample pin connections for 4 cells
(Short the unused terminal to C5 terminal) (Short the unused terminals to C4 terminal)
Figure 9. Application circuit
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BD14000EFV-C
When using the power storage element for connection of over 8 cells, series connection of this chip is possible. Enable
control (ENIN pin control) and flag output (VO_OVLO1, VO_OVLO2, VO_OK pin output) are also available in the series
connection by using the following application circuit.
Figure 10. Application circuit for BD14000EFV-C series connection
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BD14000EFV-C
Power Dissipation
The maximum allowable junction temperature Tj of BD14000EFV-C is 150°C. Therefore, it is necessary to design
the system requirements and the board layout so that the junction temperature does not exceed 150°C in the
operating temperature range.
[ ]
・
・T
T
θ =
℃
θ =
℃
θ =
℃
θ =
θ
℃
T [℃]
Figure 11. Power Dissipation
[Maximum value of shunt current for cell balance]
Temperature increase, Tup[°C], of this chip can be estimated by total power consumption Pall[W] and thermal resistance
θja[°C /W]:
Tup = Pall x θja
Almost all of the power of this chip is consumed by shunt switches:
2
Tup = n x Ron x Ishunt x θja
(Ron[Ω] = shunt switch on resistance, Ishunt [A] = shunt current, n[pcs] = the number of cells)
So, the operating condition is described as follows:
Tj – Ta_max > Tup
(Ta_max[°C] = maximum operating temperature)
It is possible to decide shunt current value by using this expression.
(Example)
Tj=150°C, Ta_max=105°C,
θja=80.6°C /W (ROHM standard board, 1 layer board),
Ron_max=2.0Ω, n=6pcs
By using the above expressions,
2
150 – 105 > 6 x 2 x Ishunt x 80.6
⇔
Ishunt < 0.215A
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BD14000EFV-C
I/O equivalent circuits
Pin No.
Pin Name
1~18
A: Cn
B: Dn
C: Sn
(n=1~6)
29
VREG
25
24
ENIN
TEST0
22
21
20
23
VSET0
VSET1
VSET2
OVLOSEL
28
27
26
VO_OVLO1
VO_OVLO2
VO_OK
I/O equivalent circuit
Figure 12. I/O equivalent circuit
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BD14000EFV-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD14000EFV-C
Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 13. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD14000EFV-C
Ordering Information
B
D
1
4
0
0
Part Number
B
D
0
E
F
V
-
Package
EFV: HTSSOP-B30
1
4
0
Part Number
0
0
E
F
CE2
Product Rank
C: for Automotive
Packaging and forming specification
E2: Embossed tape and reel(2000pcs)
V
Package
EFV: HTSSOP-B30
-
CH2
Product Rank
C: for Automotive
Packaging and forming specification
H2: Embossed tape and reel(250pcs)
Marking Diagrams
HTSSOP-B30 (TOP VIEW)
Part Number Marking
BD14000EFV
LOT Number
1PIN MARK
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/18
TSZ02201-0Q3Q0JZ00270-1-2
22.Jun.2015 Rev.002
Datasheet
BD14000EFV-C
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
HTSSOP-B30
17/18
TSZ02201-0Q3Q0JZ00270-1-2
22.Jun.2015 Rev.002
Datasheet
BD14000EFV-C
Revision History
Date
Revision
9.Jul.2014
001
22,Jun,2015
002
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Changes
New Release
Added AEC-Q100 operating temperature grade
Added Ordering Information for H2 type
Added Tape and Reel Information for H2 type
18/18
TSZ02201-0Q3Q0JZ00270-1-2
22.Jun.2015 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSϪ
CLASSϩb
CLASSϪ
CLASSϪ
CLASSϫ
CLASSϪ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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