Data Sheet

INTEGRATED CIRCUITS
NE1619
HECETA4
Temperature and voltage monitor
Product data sheet
Supersedes data of 2004 May 10
2004 Oct 05
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
FEATURES
• Monitor local and remote temperatures
• Temperature accuracy of ±2 °C for local, and ±3 °C for remote
channel
• Temperature resolution of 1 °C
• 2.8 V to 5.5 V supply range
• Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, VCCP, VDD
• VIN accuracy of ±2% of full scale
• Differential non-linearity of ±1LSB
• No calibration required
• Programmable temperature and voltage limits for alarms
• Programmable Reset low state pulse output
• SMBus 2-wire serial interface
• Small 16-lead SSOP (QSOP) package
• Compatible with Intel “Heceta 4” specification and reference
GENERAL DESCRIPTION
The NE1619 is designed for monitoring the temperatures and supply
voltages of microprocessor-based systems by measuring those
parameters and comparing the readings with programmable limits.
The device provides five possible analog inputs, a remote
temperature sensor input and on-board local temperature sensor.
The device also monitors its own power supply and provides digital
inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus
(System Management bus) by which it can be programmed for
operation and data collection. Readings come from conversions of
the on-board A-to-D converter which cycles through all
measurements in sequence in approximately one second when the
conversion is started. The device includes a number of registers to
store data of the device configuration, status, readings and limits.
Except for the temperature-related data which are in 8-bit digital
2’s complement format, all the data are in 8-bit digital straight format.
designs utilizing it
• ESD protection exceeds 2000 V HBM per JESD22-A114,
250 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101
• Latch-up testing is done to JESDEC Standard JESD78 which
exceeds 100 mA
APPLICATIONS
• System thermal and hardware monitor
• Desktop computers
• Notebook computers
• Industrial controllers
• Telecom equipment
ORDERING INFORMATION
Tamb = 0 °C to +125 °C
Type number
NE1619DS
Topside mark
NE1619
Package
Name
Description
Version
SSOP16
(QSOP)
plastic shrink small outline package; 16 leads; body width 3.9 mm;
lead pitch 0.635 mm
SOT519-1
Standard packing quantities and other packaging data are available at www.standardproducts.philips.com/packaging.
2004 Oct 05
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
PINNING
Pin Configuration
SDA
1
16 A0/RESET/NTEST_OUT
SCL
2
15 VCCPVIN
GND
3
14 2.5VIN
VDD/3.3VSB
4
13 3.3VIN
VID0
5
12 5VIN
VID1
6
11 12VIN/VID4
VID2
7
10 D+
VID3
8
9
D–/NTEST_IN
SL01228
Figure 1. Pin configuration
Pin Description
PIN #
SYMBOL
FUNCTION DESCRIPTION
1
SDA
Digital I/O. SMBus serial bi-directional data. Open-drain output.
2
SCL
Digital Input. SMBus serial clock input.
3
GND
Ground. To be connected to system ground.
4
VDD/3.3VSB
Power supply. Can be connected to +3.3 V standby power if monitoring in low power states is
required. This pin also serves as the analog input to monitor the VDD voltage level.
5
VID0
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status
register (LSB bit).
6
VID1
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
7
VID2
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
8
VID3
Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register.
9
D–/NTEST_IN
Analog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for
analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode.
10
D+
11
12VIN/VID4
Analog Input. This pin is connected to the positive terminal of the remote temperature sensor.
Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is
programmable to be a digital input for voltage ID readouts from the processor. Its state is read into
the VID4 status register.
12
5VIN
13
3.3VIN
Analog Input. For monitoring the +3.3 V supply.
14
2.5VIN
Analog Input. For monitoring the +2.5 V supply.
15
VCCPVIN
16
A0/RESET/NTEST_OUT
2004 Oct 05
Analog Input. For monitoring the +5 V supply.
Analog Input. For monitoring the processor voltage supply (0 to 3.0 V)
Digital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address.
This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions
as the output in the NAND–TREE test mode.
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
FUNCTIONAL BLOCK DIAGRAM
NE1619
D+
D-/
NTEST_IN
Address Decoder
and Register
Local Temp
Sensor
Control
Logic
Configuration
Register
Command
Pointer Register
Temp
Mux
Local Temp
RDG Register
Local Temp
HL Register
Local Temp
LL Register
Status
Register 1
A-to-D
Converter
Remote Temp
RDG Register
Remote Temp
HL Register
Remote Temp
LL Register
Status
Register 2
Voltage
Mux
VDD Reading
Register
VDD HL
Register
VDD LL
Register
Company #
Register
VCCP Reading
Register
VCCP HL
Register
VCCP LL
Register
Step Version
Register
2.5 V Reading
Register
2.5 V HL
Register
2.5 V LL
Register
Test
Register
3.3 V Reading
Register
3.3 V HL
Register
3.3 V LL
Register
Reset Pulse
Circuit
Switch
5 V Reading
Register
5 V HL
Register
5 V LL
Register
VID 0-3
Register
Vid4
Register
12 V Reading
Register
12 V HL
Register
12 V LL
Register
A0/
RESET/
NTEST_OUT
GND
VDD
VCCVIN
2.5 VIN
VIN
Attenuators
3.3 VIN
5 VIN
12 VIN/
VID4
NTEST
Circuit
SMBus Interface
SCL
SDA
SL01229
Figure 2. Functional block diagram
2004 Oct 05
VID3
VID2
VID1
VID0
4
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
TYPICAL APPLICATION CIRCUIT
Remote Sensor
VDD
0.1 µF
10 kΩ
10 kΩ
100 kΩ
4
Ground
VDD/3.3VSB
µP On-Board PNP Transistor
SMBus
SCL
10
D+
SDA
2
1
CLOCK
DATA
See
Note 1
9
D–
A0/RESET/ 16
NTEST_OUT
or Discrete NPN Transistor
NE1619
System Power
Supplies
VCCP
15
2.5 V
14
13
3.3 V
12
5.0 V
VCCPVIN
Processor Voltage
ID Code
VID0
2.5VIN
VID1
3.3VIN
VID2
5VIN
VID3
5
6
7
8
12.0 V
11
Selectable
A0/RESET/NTEST_OUT
VID0
VID1
VID2
VID3
VID4
12VIN/VID4
GND
3
Ground
SL01230
NOTE:
1. Should be placed close to D+ and D– pins.
May be required in noisy environment, about 1 nF.
Figure 3. Typical application circuit
ABSOLUTE MAXIMUM RATINGS
PARAMETER
MIN.
MAX.
UNIT
VDD to GND
–0.3
6
V
12VIN to GND
–0.3
18
V
5VIN, 3.3VIN, 2.5VIN, VCCP to GND
–0.3
6
V
Other pins to GND
–0.3
VDD+0.3
V
Input current at any pin
–5
5
mA
Package input current
–20
20
mA
0
+125
°C
–
+150
°C
–65
+150
°C
Operating temperature range
Maximum junction temperature
Storage temperature range
2004 Oct 05
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
20
100
15
80
5
from D+ pin to GND
Stdby Supply Current (uA)
Remote Temp Error(deg. C)
10
0
–5
–10
from D+ pin to VDD
–15
–20
–25
–30
60
40
20
0
1
10
100
0
1
2
Leakage Resistance (Mohm)
3
4
5
6
Supply Voltage (V)
SL01245
SL01243
Figure 4. Temp Error versus PC Board Leakage Resistance
Figure 6. Standby Current versus Supply Voltage
50
0
–1
40
–3
Stdby Supply Current (uA)
Temperature Error (deg. C)
–2
–4
–5
–6
–7
–8
–9
–10
1
2.2
3.3
4.7
6.8
10
22
33
47
VDD = 5.0 V
30
VDD = 3.8 V
VDD = 3.3 V
20
VDD = 2.8 V
10
0
–50
D+ to D– Capacitance (nF)
–25
0
25
50
75
100
125
Temperatures (deg. C)
SL01242
SL01244
Figure 5. Temp Error versus D+D– Capacitance
2004 Oct 05
Figure 7. Standby Current versus Temperature
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
250
10
9
Temperature Error (deg. C)
Stdby Supply Current (uA)
200
150
VDD = 5 V
100
50
VDD = 3.3 V
6
5
4
3
2
1
0
–1
1k
0
1k
10 k
100 k
NOISE=10MVP–P SQ.WAVE
APPLIED BETWEEN D+ & D– PINS
8
7
10 k
100 k
1000 k
10000 k
100000 k
Noise Frequency (Hz)
1000 k
SCLK Frequency (Hz)
SL01246
SL01240
Figure 10. Temp error versus Different Mode Noise Frequency
Figure 8. Standby Current versus SCLK Frequency
30
20
Temp Reading (Decimal)
Temperature Error (deg. C)
125
NOISE IS AC COUPLED TO D– PINS
25
15
10
NOISE=100MVPP
NOISE=50MVPP
5
0
–5
–10
100
75
50
25
0
1k
10 k
100 k
1000 k
10000 k
100000 k
0
25
50
75
100
125
Noise Frequency (Hz)
Temperature (deg. C)
SL01247
SL01241
Figure 11. Relationship between Temperature and
Temp reading
Figure 9. Temp Error versus Common Mode Noise
2004 Oct 05
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
DC ELECTRICAL CHARACTERISTICS
VDD = 3.3 V (see Note 4); Tamb = 0 °C to +125 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
2.8
3.3
5.5
V
VDD
Supply voltage
IDD
Supply current
Standby mode
–
100
–
µA
IDD
Supply current
Operating mode
–
250
500
µA
tC
Total monitoring cycle time1
All conversions
–
0.25
0.50
sec
TR
Temperature resolution
Local and Remote
–
±1.0
–
°C
–
Internal temperature accuracy
Tamb = 25 °C
–
TAI
±2.0
°C
Tamb = 0 °C to +120 °C
–
–
±3.0
°C
–
External temperature accuracy
Tamb = 25 °C
–
TAE
±3.0
°C
Tamb = 0 °C to +120 °C
–
–
±5.0
°C
High level
–
100
–
µA
Low level
–
10
–
µA
IS
Remote source current
Voltage-to-Digital converter (12VIN, 5VIN, 3.3VIN, 2.5VIN, VCCP, VDD)
VUE
Unadjusted error
–
–
±2.0
%FS
VDNL
Differential non-linearity error
–
±1.0
–
LSB
VRIN
VIN input resistance
100
200
–
kΩ
VPSS
VIN power supply sensitivity
–
±1.0
–
%/V
Digital output (SDA, A02)
VOH
Output High voltage
IOUT = –3.0 mA, VDD = 2.8 V
–
–
2.4
V
VOL
Output Low voltage
IOUT = 3.0 mA, VDD = 3.8 V
0.4
–
–
V
IOH
Output High leakage current
VOUT = VDD
–
0.1
10.0
µA
–
–
0.6VDD
V
–
–
0.3VDD
V
SMB digital input voltages (SDA, SCL)
VIH
Input High voltage
VIL
Input Low voltage
Digital input voltages (A0, VID0–4,
NT_IN3)
VIH
Input High voltage
–
–
2.0
V
VIL
Input Low voltage
0.4
–
–
V
Digital input current (all digital inputs)
IIH
Input High current
VIN = VDD
–1.0
–
–
µA
IIL
Input Low current
VIN = GND
–
–
1.0
µA
CIN
Input capacitance
–
20.0
–
pF
NOTES:
1. Total monitoring cycle time includes all temperature conversions and all voltage conversions.
2. When A0 is selected as output in NAND-TREE test mode.
3. When D– is selected as input in NAND-TREE test mode.
4. Operating the device at 2.8 V to 5.5 V is allowed, but parameter values in characteristics table are not guaranteed.
2004 Oct 05
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
SMBus INTERFACE AC CHARACTERISTICS
VDD = 3.3 V, Tamb = 0 °C to +125 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITION
MIN.
TYP.
MAX.
UNIT
–
–
400
kHz
tSCL
SCL clock frequency
tBUF
SMBus free time
4.7
–
–
µs
tLOW
SCL Low time
4.7
–
–
µs
tHIGH
SCL High time
4.0
–
–
µs
tSU:STA
Start set-up time
100
–
–
ns
tHD:STA
Start hold time
100
–
–
ns
tSU:STO
Stop set-up time
4.0
–
–
µs
tSU:DAT
Data set-up time
250
–
–
ns
tHD:DAT
Data hold time
0
–
–
ns
tF
Fall time
–
–
1.0
µs
NOTE:
1. These specifications are guaranteed by design and not tested in production.
TIMING DIAGRAM
tHIGH
tLOW
SCL
tHD:STA
tSU:STO
tSU:DAT
tSU:STA
tHD:DAT
SDA
tBUF
P
tF
S
S
S: Start Condition
P: Stop Condition
2004 Oct 05
P
SL01231
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
Table 1. List of registers
NAME
COMMAND OR ADDRESS
R/W
POR STATE
DESCRIPTION
CR
40h
R/W
0000 1000
Configuration register
SR1
41h
Read only
0000 0000
Status register #1
SR2
42h
Read only
0000 0000
Status register #2
VID
47h
Read only
0000 xxxx
VID register, xxxx = VID3–VID0
VID4
49h
Read only
1000 000x
VID4 register, x = VID4
CID
3Eh
Read only
1010 0001
Company number
SID
3Fh
Read only
0010 0001
Stepping version number
TEST
15h
R/W
N/A
Manufacturer test register
2.5VR
20h
Read only
N/A
2.5VIN reading register
VCCPR
21h
Read only
N/A
VCCPVIN reading register
3.3VR
22h
Read only
N/A
3.3VIN reading register
5VR
23h
Read only
N/A
5VIN reading register
12VR
24h
Read only
N/A
12VIN reading register
VDDR
25h
Read only
N/A
VDD reading register
ETR
26h
Read only
N/A
External or remote temperature reading register
ITR
27h
Read only
N/A
Internal or local temperature reading register
2.5VHL
2Bh
R/W
0000 0000
2.5VIN high limit register
2.5VLL
2Ch
R/W
0000 0000
2.5VIN low limit register
VCCPHL
2Dh
R/W
0000 0000
VCCPVIN high limit register
VCCPLL
2Eh
R/W
0000 0000
VCCPVIN low limit register
3.3VHL
2Fh
R/W
0000 0000
3.3VIN high limit register
3.3VLL
30h
R/W
0000 0000
3.3VIN low limit register
5VHL
31h
R/W
0000 0000
5VIN high limit register
5VLL
32h
R/W
0000 0000
5VIN low limit register
12VHL
33h
R/W
0000 0000
12VIN high limit register
12VLL
34h
R/W
0000 0000
12VIN low limit register
VDDHL
35h
R/W
0000 0000
VDDVIN high limit register
VDDLL
36h
R/W
0000 0000
VDDVIN low limit register
ETHL
37h
R/W
0000 0000
External or remote temperature high limit register
ETLL
38h
R/W
0000 0000
External or remote temperature low limit register
ITHL
39h
R/W
0000 0000
Internal or local temperature high limit register
ITLL
3Ah
R/W
0000 0000
Internal or local temperature low limit register
2004 Oct 05
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
Table 2. Configuration Register (CR, 40h, default = 0000 1000)
BIT
0
NAME
START
R/W
R/W
DESCRIPTION
Logic 1 enables startup of monitor device, logic 0 places the device in standby mode.
Power–up default = 0.
At startup, limit checking functions and scanning begins. Note, all High and Low limits
should be set into the ASIC prior turning on this bit.
1
Reserved
Read
Power-up default = 0.
2
Reserved
Read
Power-up default = 0.
3
Reserved
Read
Power-up default = 1.
4
RESET
R/W
Setting this bit generates a minimum 20ms low pulse on the Reset pin, if the reset
function is enabled. Power-up default = 0.
5
12VIN/VID4
SELECT
R/W
Selects whether pin 11 acts as a 12 volt analog input monitoring pin, or as a VID[4] input.
This pin defaults to the 12 volt analog input. Power–up default = 0.
6
Reserved
Read
Power–up default = 0.
7
Initialization
R/W
Logic 1 restores power–up default values to the configuration register and the status
registers. This bit automatically clears itself. Power–up default = 0.
Table 3. Status Register 1 (SR1, 41h, default = 0000 0000)
BIT
NAME
R/W
DESCRIPTION
0
+2.5V_ERROR
Read
A one indicates 2.5VIN High or Low limit has been exceeded.
1
VCCP_ERROR
Read
A one indicates VCCPVIN High or Low limit has been exceeded.
2
+3.3V_ERROR
Read
A one indicates 3.3VIN High or Low limit has been exceeded.
3
+5V_ERROR
Read
A one indicates 5VIN High or Low limit has been exceeded.
4
Internal Temp Error
Read
A one indicates internal or local temp High or Low limit has been exceeded.
5
External Temp Error
Read
A one indicates external or remote temp High or Low limit has been exceeded.
6
Reserved
Read
7
Reserved
Read
Table 4. Status Register 2 (SR2, 42h, default = 0000 0000)
BIT
NAME
R/W
DESCRIPTION
0
+12V_ERROR
Read
A one indicates 12VIN High or Low limit has been exceeded.
1
VDD_ERROR
Read
A one indicates VDD High or Low limit has been exceeded.
2
Reserved
Read
Undefined.
3
Reserved
Read
Undefined.
4
Reserved
Read
Undefined.
5
Reserved
Read
Undefined.
6
Remote Diode Fault
Read
A one indicates either a short or open circuited fault on the remote thermal diode inputs.
7
Reserved
Read
Undefined.
Table 5. VID (VID, 47h, default = 0000 VID[3:0] )
BIT
NAME
R/W
DESCRIPTION
0–3
VID[0:3]
Read
The VID[0:3] inputs from Pentium/PRO power supplies ID to indicate the operating
voltage (e.g. 1.5V to 2.9V). Power-up default = VID[0:3].
4–6
Reserved
Read
Undefined.
RESET ENABLE
Read
When set to 1, enables the RESET pin output function.
This bit defaults to 0 at Power–up and enables addressing function.
7
Table 6. VID4 (VID4, 49h, default = 1000 000VID[4] )
BIT
0
1–7
NAME
R/W
DESCRIPTION
VID4
Read
VID4 input, if selected, from Pentium/PRO power supplied ID.
Power-up default = 0 and pin 11 is not selected for VID4.
Reserved
Read
Power-up default = 1000 000
2004 Oct 05
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Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
Because all limit registers are reset to zero, writing limits into the
limits registers should usually be the first action to be performed
after power-on reset.
FUNCTIONAL DESCRIPTION
SMBus serial interface
The NE1619 can be connected to a compatible 2-wire serial
interface SMBus as a slave device under the control of a master
device or controller, using two device terminals SCL and SDA. The
controller will provide a clock signal to the device SCL pin and
write/read data to/from the device through the SDA pin.
Initialization
Initialization or software reset of the NE1619 can be initiated by
setting bit 7 of the configuration register. This bit automatically clears
itself after being set. The initialization performs a similar reset function
to power-on reset, except that the reading and limit registers are
not reset.
Data of 8-bit digital byte or word are used for communication
between the controller and the device.
Starting conversion
Notice that external pull-up resistors, about 10 kΩ, are needed for
the two terminals SCL and SDA.
The NE1619 monitoring function is started by setting (to 1) the
START bit (bit 0) of the configuration register. The device then
performs a loop of monitoring about every second. In monitoring
function, the device cycles sequentially through all measurements of
temperatures and voltages and also performs the comparisons
between readings and limits accordingly. The inputs are sampled in
this order: Remote diode temperature, Local temperature, VDDVIN,
12VIN, 5VIN. 3.3VIN, 2.5VIN and VCCPVIN.
Slave address
The NE1619 slave address on the SMBus is defined by the
hardware connection applied to the device pin 16. At power-up this
pin is automatically reset to its address sensing function A0. This
logic input will set up the value of the LSB bit of the 7-bit address.
Because A0 is a two-level digital input and the other 6 bits of the
address are predefined to 010110, only two slave addresses can be
used as listed below for the device:
Measured values are stored in reading registers and results of limit
comparison are reflected by the state of the flag bits in the status
registers. Reading and status data can be read at any time. Limit
values should be written into limit registers before starting
conversion to avoid false conditions of the status.
Table 7.
A0 connection (Pin 16)
Slave address
GND
0101100
VDD
0101101
Resetting (to 0) the START bit (bit 0) of the configuration register will
stop the monitoring function and put the device into its standby
mode thereby reducing power consumption.
Temperature measurement
Because the logic is sampled and latched into the device storage
only at power-up, the device pin 16 can be programmed for different
functions while power is on without effecting the address definition.
The NE1619 contains an on-chip temperature sensor to measure
the local or internal temperature and provides input pins (D– and
D+) to measure the remote or external temperature with the use of a
remote diode-type sensor. The remote sensor should be connected
to the D– and D+ pins properly.
Registers
The NE1619 contains a number of registers, as listed in Table 1, in
order to store data of the device setup and operation results. The
table indicates the command value and read/write capability of each
register for SMBus communication and also the power-up default
values for some registers. It includes:
– Configuration register to provide control and configuration as well
as initialization the NE1619,
– Status registers to provide the flags resulting from limit
comparisons,
– Reading registers to store results of measurements,
– Limit registers to store programmable limit data,
– ID and test registers.
The method of temperature measurement is based on the change of
the diode VBE at two different operating current levels given by:
∆VBE = (KT/q)*LN(N)
where:
K: Boltzmann’s constant
T: absolute temperature in °K
q: charge on the electron
N: ratio of the two currents
LN: natural logarithm
The NE1619 provides two current sources of about 10 µA and
100 µA during the measurement of the remote diode VBE and the
sensed voltage between two pins D– and D+ is limited within 0.25 V
and 0.95 V.
Data are stored in registers by 8-bit digital byte, either in 2’s
complement format for temperature-related data or in straight format
for others. Writing and reading registers will be done on the SMBus
by a controller using the SMBus protocols that will be described
more in the last section of this functional description. Notice that
attempting to write to a “Read only” register will produce an invalid
result.
The external diode should be selected to meet this current and
voltage requirements. The diode-connected PNP transistor provided
on the Pentium series microprocessor is typically used, or the
discrete diode-connected transistor 2N3904 is recommended.
Power-on reset
For temperature measurement, local or remote, the ∆VBE is
converted into digital data by the on-chip sigma-delta A-to-D
converter. The result is stored in the temperature reading register
and is also compared with the limits stored in the temperature limit
registers in order to set the temperature flag bits in the status
register as described in Table 3.
When the power is applied to the NE1619, also called hardware
reset, the registers are reset to their default value, if defined, as
shown in Table 1. The content of registers which have indeterminate
default value such as reading registers will be unknown. The
on-board A-to-D converter is disabled and the monitoring function is
not started. The device enters standby mode and draws a supply
current less than 100 µA.
2004 Oct 05
NE1619
12
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
necessary. No external resistor-divider should be used for the VIN
pins because of the effect of the internal input resistors, about
140 kΩ at each pin, on the divider accuracy.
Temperature data is represented by a digital 8-bit byte or word in
two’s complement format with a resolution of 1 °C. Theoretically, the
temperature value can be from –128 °C to +127 °C but, practically,
the operation range is limited to (0 °C, 120 °C). Here are some of
temperature values and data:
Processor Voltage ID (VID)
The NE1619 provides 5 digital pins (VID0–VID4) to read the
processor voltage ID code and store it into the VID registers so that
the code can be read over the SMBus:
Table 8.
TEMPERATURE VALUE (°C)
TEMPERATURE DATA
+127
0111 1111
+126
0111 1110
+100
0110 0100
+25
0001 1001
+1
0000 0001
0
0000 0000
–1
1111 1111
VID register:
VID4 register:
bit 0–bit3
bit 0
reflect VID0–VID3 respectively
reflects VID4
Because the VID4 function of 12VIN/VID4 pin (Pin 11) is not selected
at power-up (default function of this pin is 12VIN), the process of
selecting this pin must be performed, if VID4 is needed, by setting
(to 1) bit 5 (12VIN/VID4 SELECT) of the configuration register.
The default value of bit 0 of the VID4 register is 0.
–25
1110 0111
The VID inputs should not be left floating because they are not
internally biased. If they are not used then they should be connected
to either GND or VDD with resistors.
–50
1100 1110
Limit data
High and Low limits for temperatures and voltages should be
programmed into the limit registers using the format as described
above. During monitoring cycle, the measured data is automatically
compared with the limits and flag bits in the status registers are set
accordingly to the results. The assignment of the status bits are
listed in Tables 3 and 4.
Voltage measurement
The NE1619 provides 5 analog inputs for directly monitoring the
power supplies typically found in a PC or multiservice equipment,
having nominal values of +2.5 V, +3.3 V, +5.0 V, +12.0 V and VCCP
(2.25 V). The device also monitors its own VDD whose nominal
value is 3.3 V. Note: at power-up, the device Pin 11 is defaulted to its
12VIN function. These inputs are internally attenuated by on-chip
resistor networks to the reference levels that are then multiplexed to
a 8-bit Delta-Sigma A-to-D converter for converting into digital data.
Each VIN input is overall scaled in such a way that the decimal value
of the data for its nominal voltage value is equal to 192. It means
that the overall step size of the conversion for each VIN is equal to
1/
192 of its nominal value. Reading data are stored in the VIN reading
registers and are also compared with the limits stored in the VIN limit
registers in order to set the voltage flag bits in the status registers as
described in Tables 3 and 4.
Status registers
Results of limits comparisons are reflected by status or flag bits
stored in the status register 1 and 2. If the reading is within the limits
then the corresponding flag bit will be cleared to 0. Otherwise, it will
be set to 1. Status data can be read over the SMBus. Notice that
because the flag bits are automatically updated at every monitoring
cycle, their states only reflect the last measurements.
Diode fault status
The hardware connection at the diode pins (D+ and D–) are also
checked at the measurement of external temperature and the fault
condition is indicated by the flag bit 6 of the status register 2. This bit
is set to 1 if either short or open circuit fault is detected.
The VIN data, different from the temperature data, is represented by
a digital 8-bit byte or word in straight format with a resolution LSB
equal to 1/192 of the nominal value, and has any value from 0 to 255.
This is how to calculate the VIN error from the VIN reading at any
input including VDD:
RESET output function
The NE1619 Pin 16 can be selected as a reset pulse output. When
this function is selected and the reset pulse is initiated, this pin will
output a single (minimum 20 ms) low state pulse.
Resolution in volts:
LSB = (VIN nominal in volt)/192
Full scale in volts:
FS= 255 * LSB
Reading value in volts: VIN value =
(decimal value of VIN reading) * LSB
Reading error in volts: VIN error = (VIN value) – (VIN applied)
VIN error in % of FS: VIN error % = 100*(VIN error)/FS
Applied value < 0 results in a reading of about 0
Applied value > FS results in a reading of about 255
The reset output function is selected by setting (to 1) the RESET
ENABLE bit (bit 7) of the VID register. Thereafter, the reset pulse is
generated whenever the RESET bit (bit 4) of the configuration
register is programmed to change from 0 to 1.
Because Pin 16 becomes an open-drain output when it is selected
as an output, an external pull-up resistor, about 100 kΩ is needed
for the output operation. This will restrict the address function on
Pin 16 to being high at power-up. Therefore, if multiple NE1619’s
are connected on the same bus, only one can have this function
enabled at one time.
Input safety
Since the power supply voltages will appear directly at VIN pins, a
small external resistor, about 500 Ω, should be connected in series
with each pin in order to prevent damaging the power supplies due
to accidental short. These resistors are recommended but not
2004 Oct 05
NE1619
13
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
To perform a NAND tree test all pins should be initially driven low.
Then one-by-one toggle them high (and keep them high), starting
with the input closest to the output, cycling toward the farthest, the
NAND tree output will toggle with each input change.
NAND-tree test
A NAND tree is provided in the NE1619 for Automated Test
Equipment (ATE) board level connectivity testing. The device is
placed into NAND tree test mode by powering up with Pin 9
(D–/NTEST_IN) held high. In this test mode Pin 16
(A0/RESET/NTEST_OUT) becomes the NAND-tree output and all
input pins become NAND-tree inputs as illustrated in Figure 12.
SDA
SCL
VID0
VID1
VID2
NTEST_OUT
VID3
VID4
SL01232
Figure 12. NAND-tree circuitry
Table 9. NAND-tree test vectors
VECTOR #
SDA
SCL
VID0
VID1
VID2
VID3
VID4
NTEST_OUT
1
L
L
L
L
L
L
L
H
2
L
L
L
L
L
L
H
L
3
L
L
L
L
L
H
H
H
4
L
L
L
L
H
H
H
L
5
L
L
L
H
H
H
H
H
6
L
L
H
H
H
H
H
L
7
L
H
H
H
H
H
H
H
8
H
H
H
H
H
H
H
L
2004 Oct 05
14
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
• The 7-bit slave address is replaced by the selected address of the
SMBus interface protocol
The NE1619 can communicate over a compatible 2-wire serial
interface SMBus using the two device pins SCL and SDA. The
device employs three standard SMBus protocols: Write Byte, Read
Byte and Receive byte.
device.
• The command byte is replaced by the selected command of the
device register.
• The receive byte format is used for quickly transfer data from a
Data formats of those protocols are shown below with following notices:
• The SMBus controller initiates data transfer by establishing a start
reading register which was previously selected by a read.
• During the transition between start and stop conditions, data must
condition (S) and terminates data transfer by generating a stop
condition (P).
be stable and valid when the SCL is high.
• Data is sent over the serial bus in sequence of 9 clock pulses for
each 8-bit data byte followed by 1-bit status of the device
acknowledgement (A).
Write Byte Format:
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
(TO NEXT)
SDA
0
1
0
1
1
0
a0
S
D7
W
D6
D5
D4
D3
D2
D1
(TO NEXT)
D0
A
A
DEVICE ADDRESS
DEVICE REGISTER COMMAND
1
2
3
4
5
6
7
8
D7
D6
D5
D4
D3
D2
D1
D0
9
SCL (continued)
SDA (continued)
A
P
DATA TO BE WRITTEN TO REGISTER
Read Byte Format:
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SCL
(TO NEXT)
SDA
0
1
0
1
1
0
a0
S
D7
W
D6
D5
D4
D3
D2
D1
D0
A
(TO NEXT)
A
DEVICE ADDRESS
DATA REGISTER COMMAND
1
2
3
4
5
6
7
0
1
0
1
1
0
a0
8
9
R
A
P
STOP
1
2
3
4
5
6
7
8
D7
D6
D5
D4
D3
D2
D1
D0
9
SCL (continued)
SDA (continued)
S
RESTART
NA
P
STOP
DATA FROM DEVICE REGISTER
DEVICE ADDRESS
Receive Byte Format:
1
2
3
4
5
6
7
0
1
0
1
1
0
a0
8
9
R
A
1
2
3
4
5
6
7
8
D7
D6
D5
D4
D3
D2
D1
D0
9
SCL
SDA
S
DEVICE ADDRESS
NA
(end)
Figure 13. NE1619 SMBus interface protocols
2004 Oct 05
P
DATA FROM DEVICE REGISTER
15
SL01233
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
5. Place a bypass capacitor of 100 nF close to the VDD pin and an
input filter capacitor of 2200 pF close to the D+ and D– pins.
Printed Circuit Board layout considerations
Care must be taken in PCB layout to minimize noise induced at the
remote temperature sensor inputs, especially in extremely noisy
environments, such as a computer motherboard. Noise induced in
the traces running between the device sensor inputs and the remote
diode can cause temperature conversion errors. Typical sensor
signal levels to the NE1619 is a few microvolts. The following
guidelines are recommended:
6. If the remote sensor is operating in a noisy environment and
located several feet away from the NE1619, a shielded twisted
pair cable is recommended. Make sure the shield of the cable is
connected to the NE1619 ground pin, and leave the shield at the
remote end unconnected. Shield connecting to ground of both
ends could create a ground loop (refer to Figure 15) and defeat
the purpose of the shielded cable. Also, cold soldered joints and
damaged cable could introduce series resistance and reslult in
measurement error. For instance, a 1 Ω resistance can introduce
a change of temperature of about 0.5 °C.
1. Place the NE1619 as close as possible to the remote sensor. It
can be from 4 to 8 inches, as long as the worst noise sources
such as clock generator, data and address buses, CRTs are
avoided.
2. Route the D+ and D– lines parallel and close together with
ground guards enclosing them (see Figure 14).
SHIELDED TWISTED PAIR
3. Leakage currents due to PC board contamination must be
considered. Error can be introduced by these leakage currents.
D+
NE1619
4. Use wide traces to reduce inductance and noise pickup. Narrow
traces more readily pickup noise. The minimum width of 10 mil
and space of 10 mil are recommended.
D–
REMOTE
SENSOR
GND
SL02156
GND
D+
Figure 15. Using shielded twisted pair
D–
GND
SL01218
Figure 14. PCB layout for D+ and D–
2004 Oct 05
16
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
SSOP16: plastic shrink small outline package; 16 leads;
body width 3.9 mm; lead pitch 0.635 mm
2004 Oct 05
17
NE1619
SOT519-1
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
REVISION HISTORY
Rev
Date
Description
_4
20041005
Product data sheet (9397 750 14175). Supersedes data of 2004 May 10 (9397 750 13254).
Modifications:
• “Features” section on page 2: add ESD and Latch-up bullets to bottom of list.
• “Ordering information” table: change temperature range from “Tamb = 0 °C to +120 °C” to “Tamb = 0 °C to +125 °C”
• Add figure titles to Pin configuration, Functional block diagram, Typical application circuit.
• Section “Typical operating circuit” re-named to “Typical application circuit”; figure modified.
• “Absolute maximum ratings” table: change Operating temperature range maximum from +120 °C to +125 °C
• Figure 4 re-titled
• “DC electrical characteristics” table: add Note 4 and its reference at table description line.
• “SMBus interface AC characteristics” table: change temperature range from “Tamb = 0 °C to +120 °C”
to “Tamb = 0 °C to +125 °C”
• Section “Printed Circuit Board layout condiserations”:
– paragraph 5: change from “Place a bypass capacitor of 10 nF close to ...” to “Place a bypass capacitor of
100 nF close to ...”
– paragraph 6 re-written
– add Figure 15
_3
20040510
Product data (9397 750 13254). Supersedes data of 2001 Aug 29.
_2
20010829
Product data (9397 750 08874). Supersedes data of 2000 Jul 13.
_1
20000713
Product specification (9397 750 07323).
2004 Oct 05
18
Philips Semiconductors
Product data sheet
HECETA4 Temperature and voltage monitor
NE1619
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent
to use the components in the I2C system provided the system conforms to the
I2C specifications defined by Philips. This specification can be ordered using the
code 9398 393 40011.
Data sheet status
Level
Data sheet status [1]
Product
status [2] [3]
Definitions
I
Objective data sheet
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data sheet
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data sheet
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
 Koninklijke Philips Electronics N.V. 2004
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 10-04
For sales offices addresses send e-mail to:
[email protected]
Document order number:
2004 Oct 05
19
9397 750 14175
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