Data Sheet

SA56004X
SMBus-compatible, 8-pin, remote/local digital temperature
sensor with overtemperature alarms
Rev. 7 — 25 February 2013
Product data sheet
1. General description
The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital
temperature sensor with overtemperature alarms. The remote channel of the SA56004X
monitors a diode junction, such as a substrate PNP of a microprocessor or a diode
connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP). With factory trimming,
remote sensor accuracy of 1 C is achieved.
Undertemperature and overtemperature alert thresholds can be programmed to cause the
ALERT output to indicate when the on-chip or remote temperature is out of range. This
output may be used as a system interrupt or SMBus alert. The T_CRIT output is activated
when the on-chip or remote temperature measurement rises above the programmed
T_CRIT threshold register value. This output may be used to activate a cooling fan, send
a warning or trigger a system shutdown. To enhance system reliability further, the
SA56004X employs an SMBus time-out protocol. The SA56004X has a unique device
architecture.
The SA56004X is available in the SO8, TSSOP8 and HVSON8 packages. SA56004X has
8 factory-programmed device address options. The SA56004X is pin-compatible with the
LM86, MAX6657/8, and ADM1032.
2. Features and benefits
 Accurately senses temperature of remote microprocessor thermal diodes or diode
connected transistors within 1 C
 On-chip local temperature sensing within 2 C
 Temperature range of 40 C to +125 C
 11-bit, 0.125 C resolution
 8 different device addresses are available for server applications. The SA56004ED
with marking code 56004E, and SA56004EDP with marking code 6004E are address
compatible with the National LM86, the MAX6657/8 and the ADM1032.
 Offset registers available for adjusting the remote temperature accuracy
 Programmable under/overtemperature alarms: ALERT and T_CRIT
 SMBus 2.0 compatible interface, supports TIMEOUT
 Operating voltage range: 3.0 V to 3.6 V
 I2C-bus Standard-mode and Fast-mode compatible
 SO8, TSSOP8 and HVSON8 packages
 Programmable conversion rate (0.0625 Hz to 26 Hz)
 Undervoltage lockout prevents erroneous temperature readings
 Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
3. Applications





System thermal management in laptops, desktops, servers and workstations
Computers and office electronic equipment
Electronic test equipment and instrumentation
HVAC
Industrial controllers and embedded systems
4. Ordering information
Table 1.
Ordering information
Type number[1] Topside
marking
Package
Name
Description
Version
SA56004AD
56004AD
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
SA56004BD
56004BD
SA56004CD
56004CD
TSSOP8
plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1
HVSON8
plastic thermal enhanced very thin small outline package; no leads; SOT782-1
8 terminals; body 3  3  0.85 mm
SA56004DD
56004DD
SA56004ED
56004ED
SA56004FD
56004FD
SA56004GD
56004GD
SA56004HD
56004HD
SA56004ADP
6004A
SA56004BDP
6004B
SA56004CDP
6004C
SA56004DDP
6004D
SA56004EDP
6004E
SA56004FDP
6004F
SA56004GDP
6004G
SA56004HDP
6004H
SA56004ATK
6004A
SA56004ETK
6004E
[1]
There are 8 device slave address options, as described in Table 4.
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
Packing method
Minimum
order quantity
Temperature
SA56004AD
SA56004AD,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004AD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004BD
SA56004BD,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004BD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004CD
SA56004CD,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004CD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004DD
SA56004DD,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004DD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004ED
SA56004ED,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004ED,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004FD
SA56004FD,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004FD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004GD
SA56004GD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004HD
SA56004HD,112
SO8
Tube, bulk pack
2000
Tamb = 40 C to +125 C
SA56004HD,118
SO8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004ADP
SA56004ADP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004BDP
SA56004BDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004CDP
SA56004CDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004DDP
SA56004DDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004EDP
SA56004EDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004FDP
SA56004FDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004GDP
SA56004GDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004HDP
SA56004HDP,118
TSSOP8
Reel pack, SMD, 13-inch
2500
Tamb = 40 C to +125 C
SA56004ATK
SA56004ATK,118
HVSON8
Reel pack, SMD, 13-inch
6000
Tamb = 40 C to +125 C
SA56004ETK
SA56004ETK,118
HVSON8
Reel pack, SMD, 13-inch
6000
Tamb = 40 C to +125 C
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
5. Block diagram
SA56004X
ONE-SHOT
REGISTER
VDD
LOCAL
TEMP
SENSOR
D+
D−
CONTROL
LOGIC
11-BIT
Σ-Δ
A-to-D
CONVERTER
LOCAL
REMOTE
MUX
ALERT
REMOTE OFFSET
REGISTER
CONFIGURATION
REGISTER
COMMAND
REGISTER
CONVERSION
REGISTER
LOCAL HIGH TEMP
THRESHOLD
LOCAL TEMP HIGH
LIMIT REGISTER
LOCAL TEMP
DATA REGISTER
LOCAL LOW TEMP
THRESHOLD
LOCAL TEMP LOW
THRESHOLD
REMOTE TEMP
DATA REGISTER
REMOTE HIGH
TEMP THRESHOLD
REMOTE TEMP
HIGH LIMIT REG.
T_CRIT
HYSTERESIS
REMOTE LOW
TEMP THRESHOLD
REMOTE TEMP
LOW LIMIT REG.
ALERT
INTERRUPT
STATUS REGISTER
GND
T_CRIT
T_CRIT
INTERRUPT
OTP DEVICE
ADDRESS REGISTER
SMBus INTERFACE
002aad202
SDATA
Fig 1.
SCLK
Block diagram
SA56004X
Product data sheet
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
6. Pinning information
6.1 Pinning
VDD
1
8
SCLK
D+
2
7
SDATA
D−
3
6
ALERT
T_CRIT
4
5
GND
VDD
1
8
SCLK
D+
2
7
SDATA
6
ALERT
5
GND
SA56004XD
D−
3
T_CRIT
4
SA56004XDP
002aad199
002aad198
Fig 2.
Pin configuration for SO8
Fig 3.
Pin configuration for TSSOP8
terminal 1
index area
VDD
1
D+
2
8
SCLK
7
SDATA
SA56004XTK
D−
3
6
ALERT
T_CRIT
4
5
GND
002aad200
Transparent top view
Fig 4.
Pin configuration for HVSON8
6.2 Pin description
Table 3.
SA56004X
Product data sheet
Pin description
Symbol
Pin
Description
VDD
1
Positive supply voltage. DC voltage from 3.0 V to 5.5 V.
D+
2
Diode current source (anode).
D
3
Diode sink current (cathode).
T_CRIT
4
T_CRIT alarm is open-drain, active LOW output which requires an external
pull-up resistor. It functions as a system interrupt or power shutdown.
GND
5
Power supply ground.
ALERT
6
ALERT alarm is an open-drain, active LOW output which requires an
external pull-up resistor. It functions as an interrupt indicating that the
temperature of the on-chip or remote diode is above or below programmed
overtemperature or undertemperature thresholds.
SDATA
7
SMBus/I2C-bus bidirectional data line. This is an open-drain output which
requires an external pull-up resistor.
SCLK
8
SMBus/I2C-bus clock input which requires an external pull-up resistor.
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
7. Functional description
Refer to Figure 1 “Block diagram”.
7.1 Serial bus interface
The SA56004X should be connected to a compatible two-wire serial interface System
Management Bus (SMBus) as a slave device using the two device terminals SCLK and
SDATA. The ALERT pin can optionally be used with the SMBus protocol to implement the
ARA response. The controller provides a clock signal to the device SCLK pin and
write/read data to/from the device through the device SDATA pin. External pull-up
resistors, about 10 k each, are needed for these device pins due to open-drain circuitry.
Data of 8-bit digital byte or word are used for communication between the controller and
the device using SMBus 2.0 protocols which are described more in Section 7.10 “SMBus
interface”. The operation of the device to the bus is described with details in the following
sections.
7.2 Slave address
The SA56004X has a 7-bit slave address register which is factory programmed in OTP
memory. Eight unique devices are available with different slave addresses as defined in
Table 4. Up to eight devices can reside on the same SMBus without conflict, if their
addresses are unique.
Table 4.
Slave addresses
Type number
Device slave address[1]
SA56004AD
1001 000
SA56004ADP
SA56004ATK
SA56004BD
1001 001
SA56004BDP
SA56004CD
1001 010
SA56004CDP
SA56004DD
1001 011
SA56004DDP
SA56004ED[2]
1001 100
SA56004EDP[2]
SA56004ETK[2]
SA56004FD
1001 101
SA56004FDP
SA56004GD
1001 110
SA56004GDP
SA56004HD
1001 111
SA56004HDP
SA56004X
Product data sheet
[1]
The device slave address is factory programmed in OTP device address register.
[2]
The SA56004ED/EDP/ETK has the bus address of the National LM86, MAX6657/8 and the ADM1032.
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
7.3 Register overview
The SA56004X contains three types of SMBus addressable registers: read-only (R),
write-only (W), and read-write (R/W). Attempting to write to any R-only register or read
data from any W-only register produces an invalid result. Some of the R/W registers have
separate addresses for reading and writing operations.
The registers of the SA56004X serve four purposes:
•
•
•
•
Control and configuration of the SA56004X
Status reporting
Temperature measurement storage
ID and manufacturer test registers
Table 5 describes the names, addresses, Power-On Reset (POR), and functions of each
register. The data of the temperature-related registers is in two’s complement format in
which the MSB is the sign bit. The 8-bit data of other registers is in 8-bit straight format.
SA56004X
Product data sheet
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
Table 5.
Register assignments
Register
name
Command byte
POR state
Function
Bits
Access
Read
address
Write
address
LTHB
00h
n/a
0000 0000
local temperature high byte
8
R
RTHB
01h
n/a
0000 0000
remote temperature high byte
8
R
SR
02h
n/a
0000 0000
status register
8
R
CON
03h
09h
0000 0000
configuration register
8
R/W
CR
04h
0Ah
1000
conversion rate
4
R/W
LHS
05h
0Bh
0100 0110
local high setpoint
8
R/W
LLS
06h
0Ch
0000 0000
local low setpoint
8
R/W
RHSHB
07h
0Dh
0100 0110
remote high setpoint high byte
8
R/W
RLSHB
08h
0Eh
0000 0000
remote low setpoint high byte
8
R/W
One Shot
n/a
0Fh
-
writing register initiates a one-shot conversion 0
W
RTLB
10h
n/a
0000 00
remote temperature low byte
6 (MSBs)
R
RTOHB
11h
11h
0000 0000
remote temperature offset high byte
8
R/W
RTOLB
12h
12h
000
remote temperature offset low byte
3 (MSBs)
R/W
RHSLB
13h
13h
000
remote high setpoint low byte
3 (MSBs)
R/W
RLSLB
14h
14h
000
remote low setpoint low byte
3 (MSBs)
R/W
RCS
19h
19h
0101 0101
remote T_CRIT setpoint
8
R/W
LCS
20h
20h
0101 0101
local T_CRIT setpoint
8
R/W
TH
21h
21h
0 1010
T_CRIT hysteresis
5
R/W
ATLB
22h
n/a
0000 0000
local temperature low byte
3 (MSBs)
R
AM
BFh
BFh
0
Alert mode
1
R/W
RMID
FEh
n/a
1010 0001
read manufacturer’s ID
8
R
RDR
FFh
n/a
0000 0000
read stepping or die revision
8
R
7.4 Power-on reset
When power is applied to the SA56004X, the device enters its Power-On Reset (POR)
state and its registers are reset to their default values. The configuration, status, and
temperature-reading registers remain in these states until after the first conversion. As
shown in Table 5 this results in:
1. Command register set to 00h.
2. Local Temperature register (LTHB and LTLB) set to 0 C.
3. Remote Diode Temperature register (RTHB and RTLB) set to 0 C until the end of the
first conversion.
4. Status register (SR) set to 00h.
5. Configuration register (CON) set to 00h; interrupt latches are cleared, the ALERT and
T_CRIT output drivers are off and the ALERT and T_CRIT pins are pulled HIGH by
the external pull-up resistors.
6. Local T_CRIT temperature setpoints (LCS) and Remote T_CRIT temperature
setpoints (RCS) at 85 C.
7. Local HIGH setpoint (LHS) and remote HIGH temperature setpoint (RHSHB) at 70 C.
SA56004X
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB) at 0 C.
9. Conversion Rate register (CR) is set to 8h; the default value of about 16
conversions/s.
7.5 Starting conversion
Upon POR, the RUN/STOP bit 6 of the configuration register is zero (default condition),
then, the device enters into its free-running operation mode in which the device A/D
converter is enabled and the measurement function is activated. In this mode, the device
cycles the measurements of the local and remote temperature automatically and
periodically. The conversion rate is defined by the programmable conversion rate stored in
the conversion rate register. It also performs comparison between readings and limits of
the temperature in order to set the flags and interruption accordingly at the end of every
conversion. Measured values are stored in the temp registers, results of the limit
comparisons are reflected by the status of the flag bits in the status register and the
interruption is reflected by the logical level of the ALERT and T_CRIT output. If the
power-on temperature limit is not suitable, the temp limit values could be written into the
limit registers during the busy-conversion duration of about 38 ms of the first conversion
after power-up. Otherwise, the status register must be read and the configuration bit 7
must be reset in order to recover the device from interruption caused by the undesired
temp limits.
7.6 Low power software standby mode
The device can be placed in a software standby mode by setting the RUN/STOP bit 6 in
the configuration register HIGH (logic 1). In standby, the free-running oscillator is stopped,
the supply current is less than 10 A if there is no SMBus activity, all data in the registers
is retained. However, the SMBus is still active and reading and writing registers can still be
performed. A one-shot command initiates a single conversion which has the same effect
as any conversion that occurs when the device is in its free-running mode. To restore the
device to free running mode, set the RUN/STOP bit 6 LOW (logic 0).
7.7 Temperature data format
The temperature data can only be read from the Local and Remote Temperature
registers; the setpoint registers (for example, T_CRIT, LOW, HIGH) are read/write.
Both local and remote temperature reading data is represented by an 11-bit,
two’s complement word with the Least Significant Bit (LSB) = 0.125 C. The temperature
setpoint data for the remote channel is also represented by an 11-bit, two’s complement
word with the LSB = 0.125 C. The temperature setpoint data for both the local channel
and the T_CRIT setpoints are represented by 8-bit, two’s complement words with the
LSB =1.0 C. For 11-bit temp data, the data format is a left justified, 16-bit word available
in two 8-bit registers (high byte and low byte). For 8-bit temp data, the data is available in
a single 8-bit register (high byte only).
SA56004X
Product data sheet
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SA56004X
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Digital temperature sensor with overtemperature alarms
Table 6.
Temperature data format
Temperature
Digital output
Binary
Hexadecimal
+125 C
0111 1101 0000 0000
7D00h
+25 C
0001 1001 0000 0000
1900h
+1 C
0000 0001 0000 0000
0100h
+0.125 C
0000 0000 0010 0000
0020h
0 C
0000 0000 0000 0000
0000h
0.125 C
1111 1111 1110 0000
FFE0h
1 C
1111 1111 0000 0000
FF00h
25 C
1110 0111 0000 0000
E700h
55 C
1100 1001 0000 0000
C900h
7.8 SA56004X SMBus registers
7.8.1 Command register
The command register selects which register will be read or written to. Data for this
register should be transmitted during the Command Byte of the SMBus write
communication.
7.8.2 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB)
Table 7.
Byte
LTHB, LTLB, RTHB, RTLB - Local and remote temperature registers
High byte (read only; address 00h, 01h)
Low byte (read only; address 10h)
Bit
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Value
sign
64
32
16
8
4
2
1
0.5
0.25
0.125
0
0
0
0
0
7.8.3 Configuration register (CON)
The configuration register is an 8-bit register with read address 03h and write address
09h. Table 8 shows how the bits in this register are used.
Table 8.
Bit
7
CON - Configuration register (read address 03h; write address 09h)
bit assignments
Description
POR state
ALERT mask.
0
The ALERT interrupt is enabled when this bit is LOW. The ALERT interrupt
is disabled (masked) when this bit is HIGH.
6
0
RUN/STOP.
Standby or run mode control. Running mode is enabled when this bit is
LOW. The SA56004X is in standby mode when this bit is HIGH.
5
4
Not defined; defaults to logic 0.
0
Remote T_CRIT mask.
0
The T_CRIT output will be activated by a remote temperature that exceeds
the remote T_CRIT setpoint when this bit is LOW. The T_CRIT output
will not be activated under this condition when this bit is HIGH.
3
SA56004X
Product data sheet
Not defined; defaults to logic 0.
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SA56004X
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Digital temperature sensor with overtemperature alarms
Table 8.
CON - Configuration register (read address 03h; write address 09h)
bit assignments …continued
Bit
Description
POR state
2
Local T_CRIT mask.
0
The T_CRIT output will be activated by a local temperature that exceeds
the local T_CRIT setpoint when this bit is LOW. The T_CRIT output will not
be activated under this condition when this bit is HIGH.
1
Not defined; defaults to logic 0.
0
0
Fault queue.
0
A single remote temperature measurement outside the HIGH, LOW or
T_CRIT setpoints will trigger an outside limit condition resulting in setting
the status bits and associated output pins when this bit is LOW. Three
consecutive measurements outside of one of these setpoints are required
to trigger an outside of limit condition when this bit is HIGH.
7.8.4 Status register (SR)
The contents of the status register reflect condition status resulting from all activities:
comparison between temperature measurements and temperature limits, the status of
A/D conversion, and the hardware condition of external diode to the device. Bit
assignments are listed in Table 9. This register is read-only and its address is 02h. Upon
POR, all bits are set to zero.
Remark: Any one of the fault conditions, with the exceptions of Diode OPEN and
A/D BUSY, introduces an Alert interrupt (see Section 7.9.1.2). Also, whenever a one-shot
command is executed, the status byte should be read after the conversion is completed,
which is about 38 ms (1 conversion time period) after the one-shot command is sent.
Table 9.
SA56004X
Product data sheet
SR - Status register (read-only address 02h) bit assignments
Bit
Name
Description
7
BUSY
When logic 1, A/D is busy converting. POR state = n/a.
6
LHIGH
When logic 1, indicates local HIGH temperature alarm. POR state = 0.
5
LLOW
When logic 1, indicates a local LOW temperature alarm. POR state = 0.
4
RHIGH
When logic 1, indicates a remote diode HIGH temperature alarm. POR state = 0.
3
RLOW
When logic 1, indicates a remote diode LOW temperature alarm. POR state = 0.
2
OPEN
When logic 1, indicates a remote diode disconnect. POR state = 0.
1
RCRIT
When logic 1, indicates a remote diode critical temperature alarm. POR state = 0.
0
LCRIT
When logic 1, indicates a local critical temperature alarm. POR state = 0.
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Digital temperature sensor with overtemperature alarms
7.8.5 Conversion rate register (CR)
The conversion rate register is used to store programmable conversion data, which
defines the time interval between conversions in the standard free-running auto convert
mode. Table 10 shows all applicable data values and rates for the SA56004X. Only the
4 LSBs of the register are used and the other bits are reserved for future use. The register
is R/W using the read address 04h and write address 0Ah. The POR default conversion
data is 08h.
Table 10.
Conversion rate control byte (CR)
Data value
Conversion rate (Hz)
00h
0.06
01h
0.12
02h
0.25
03h
0.50
04h
1.0
05h
2
06h
4
07h
8
08h
16
09h
32
0Ah to FFh
n/a
7.8.6 Temperature limit registers
Table 11.
Byte
LHS, RHSHB, RHSLB - Local and remote HIGH setpoint registers
Low byte (read/write address 13h)[2]
High byte (read only address 05h, 07h;
write address 0Bh, 0Dh)[1]
Bit
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Value
sign
64
32
16
8
4
2
1
0.5
0.25
0.125
0
0
0
0
0
[1]
POR default LHS = RHSHV = 46h (70 C).
[2]
POR default RHSLB = 00h.
Table 12.
Byte
LLS, RLSHB, RLSLB - Local and remote LOW setpoint registers
Low byte (read/write address 14h)[2]
High byte (read address 06h, 08h;
write address 0Ch, 0Eh)[1]
Bit
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Value
sign
64
32
16
8
4
2
1
0.5
0.25
0.125
0
0
0
0
0
[1]
POR default LLS = RLSHV = 00h.
[2]
POR default RLSLB = 00h (0 C).
Table 13.
Byte
Product data sheet
Single high byte (read/write address 20h, 19h)[1]
Bit
D7
D6
D5
D4
D3
D2
D1
D0
Value
sign
64
32
16
8
4
2
1
[1]
SA56004X
LCS, RCS - Local and remote T_CRIT registers
POR default LCS = RCS = 55h (85 C).
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Digital temperature sensor with overtemperature alarms
Table 14.
TH - T_CRIT hysteresis register
Single high byte (read/write address 21h)[1]
Byte
Bit
Value
[1]
D7
D6
D5
D4
D3
D2
D1
D0
-
-
-
16
8
4
2
1
POR default TH = 0Ah (10 C).
7.8.7 Programmable offset register (remote only)
Table 15.
Byte
RTOHB, RTOLB - Remote temperature offset registers
High byte (read/write address 11h)[1]
Low byte (read/write address 12h)[2]
Bit
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
Value
sign
64
32
16
8
4
2
1
0.5
0.25
0.125
0
0
0
0
0
[1]
POR default RTOHB = RTOLB = 00h.
[2]
POR default RTOLB = 00h.
7.8.8 ALERT mode register (AM)
Table 16. AM - ALERT mode register
Read and write address BFh.
Bit
Value
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
ALERT mode
D[7:1] is not defined and defaults to logic 0.
D0: The ALERT output is in interrupt mode when this bit is LOW. The ALERT output is in
comparator mode when this bit is HIGH.
7.8.9 Other registers
The Manufacturers ID register has a default value A1h (1010 0001) and a read address
FEh.
The Die Revision Code register has a default value 00h (0000 0000) and read address
FFh. This register increments by 1 every time there is a revision to the die.
7.8.10 One-shot register
The one-shot register is used to initiate a single conversion and comparison cycle when
the device is in the standby mode; upon completion of the single conversion cycle, the
device returns to the standby mode. It is not a data register; it is the write operation that
causes the one-shot conversion. The data written to this register is not stored; an FFh
value will always be read from this register. To initiate a one-shot operation, send a
standard write command with the command byte of 0Fh (One-Shot Write Address).
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Digital temperature sensor with overtemperature alarms
7.9 Interruption logic and functional description
7.9.1 ALERT output
The ALERT output is used to signal Alert interruptions from the device to the SMBus or
other system interrupt handler and it is active LOW. Because this is an open-drain output,
a pull-up resistor (typically 10 k) to VDD is required. Several slave devices can share a
common interrupt line on the same SMBus.
The ALERT function is very versatile and accommodates three separate operating
modes:
• Temperature comparator
• System interrupt based on temperature
• SMBus Alert Response Address (ARA) response.
The ARA and interrupt modes are different only in how the user interacts with the
SA56004X.
At the end of every temperature reading, digital comparators determine if the readings are
above the HIGH or T_CRIT setpoint or below the LOW setpoint register values. If so, the
corresponding bit in the Status register is set. If the ALERT mask bit 7 of the Configuration
register is not HIGH, then any bit set in the Status register other than the BUSY (D7) and
OPEN (D2) causes the ALERT output pin to be active LOW. An alert will be triggered after
any conversion cycle that finds the temperature is out of the limits defined by the setpoint
registers. In order to trigger an ALERT in all alert modes, the ALERT mask bit 7 of the
Configuration register must be cleared (not HIGH).
7.9.1.1
ALERT output in comparator mode
When operating the SA56004X in a system that utilizes an SMBus controller not having
an interrupt, the ALERT output may be operated as a temperature comparator. In this
mode, when the condition that triggered the ALERT to be asserted is no longer present,
the ALERT output is released as it goes HIGH. In order to use the ALERT output as a
temperature comparator, bit D0 (the ALERT configure bit) in the ALERT Mode (AM)
register must be set HIGH. This is not the POR default.
7.9.1.2
ALERT output in interrupt mode
In the interrupt mode, the ALERT output is used to provide an interrupt signal that remains
asserted until the interrupt service routine has elapsed. In the interrupt operating mode, a
read of the Status register will set the ALERT mask bit 7 of the Configuration register if
any of the temperature alarm bits of the Status register is set, with exception of BUSY (D7)
and OPEN (D2). This protocol prevents further ALERT output triggering until the master
device has reset the ALERT mask bit at the end of the interrupt service routine. The
Status register bits are cleared only upon a read of the Status register by the serial bus
master (see Figure 5). In order for the ALERT output to be used as an interrupt, the
ALERT Configure bit D0 of the ALERT Mode (AM) register must be set LOW (POR
default).
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Digital temperature sensor with overtemperature alarms
remote temperature high limit
remote diode temperature
ALERT pin
status register bit 4
(RHIGH)
A
B, C
D
E, F
002aad216
Fig 5.
ALERT output in interrupt mode
The following events summarize the ALERT output interrupt mode of operation:
Event A: Master senses ALERT output being active-LOW.
Event B: Master reads the SA56004X Status register to determine what cause the
ALERT interrupt.
Event C: SA56004X clears the Status register, resets the ALERT output HIGH, and sets
the ALERT mask bit 7 in the Configuration register.
Event D: A new conversion result indicates that the temperature is still above the high
limit, however the ALERT pin is not activated due to the ALERT mask.
Event E: Master should correct the conditions that caused the ALERT output to be
triggered. For instance, the fan is started, setpoint levels are adjusted.
Event F: Master resets the ALERT mask bit 7 in the Configuration register.
7.9.1.3
ALERT output in SMBus ALERT mode
When several slave devices share a common interrupt line, an SMBus alert line is
implemented. The SA56004X is designed to accommodate the Alert interrupt detection
capability of the SMBus 2.0 Alert Response Address (ARA) protocol, defined in SMBus
specification 2.0. This procedure is designed to assist the master in resolving which slave
device generated the interrupt and in servicing the interrupt while minimizing the time to
restore the system to its proper operation. Basically, the SMBus provides Alert response
interrupt pointers in order to identify slave devices which have caused the Alert interrupt.
When the ARA command is received by all devices on the SMBus, the devices pulling the
SMBus alert line LOW send their device addresses to the master; await an
acknowledgement and then release the alert line. This requirement to disengage the
SMBus alert line prevents locking up the alert line. The SA56004X complies with this ARA
disengagement protocol by setting the ALERT mask bit 7 in the Configuration register at
address 09h after successfully sending out its address in response to an ARA command
and releasing the ALERT output. Once the mask bit is activated, the ALERT output is
disabled until enabled by software. In order to enable the ALERT the master must read
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Digital temperature sensor with overtemperature alarms
the Status register, at address 02h, during the interrupt service routine and then reset the
ALERT mask bit 7 in the Configuration register to logic 0 at the end of the interrupt service
routine (see Figure 6).
In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT
mode register must be set LOW.
ALERT mask bit 7 and the ALERT mode bit D0 are both LOW for the POR default.
remote temperature high limit
remote diode temperature
temperature
ALERT pin
status register bit 4
(RHIGH)
A
Fig 6.
B
C
D
002aad215
ALERT pin in SMBus Alert mode
The following events summarize the ALERT output interrupt operation in the SMBus Alert
mode:
Event A: Master senses the ALERT line being LOW.
Event A to B: Master sends a read command using the common 7-bit Alert Response
Address (ARA) of 0001100.
Event A to B: Alerting device(s) return ACK signal and their addresses using the
I2C-bus Arbitration (the device with the lowest address value sends its address first. The
master can repeat the alert reading process and work up through all the interrupts).
Event B: Upon the successful completion of returning address, the SA56004X resets its
ALERT output (to OFF) and sets the ALERT mask bit 7 in its configuration register.
Event C: Master should read the device status register to identify and correct the
conditions that caused the Alert interruption. The status register is reset.
Event D: Master resets the ALERT mask bit 7 in the configuration register to enable the
device ALERT output interruption.
Remark: The bit assignment of the returned data from the ARA reading is listed in
Table 17. If none of the devices on the bus is alerted, then the returned data from ARA
reading is FFh (1111 1111).
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Digital temperature sensor with overtemperature alarms
Table 17.
ALERT response bit assignment
ALERT response bit
Device address bit
Function
7 (MSB)
ADD6
address bit 6 (MSB) of alerted device
6
ADD5
address bit 5 of alerted device
5
ADD4
address bit 4 of alerted device
4
ADD3
address bit 3 of alerted device
3
ADD2
address bit 2 of alerted device
2
ADD1
address bit 1 of alerted device
1
ADD0
address bit 0 of alerted device
0
1
always logic 1
7.9.2 T_CRIT output
The T_CRIT output is LOW when any temperature reading is greater than the preset limit
in the corresponding critical temperature setpoint register. When one of the T_CRIT
setpoint temperatures is exceeded, the appropriate status register bit, 1 (RCRIT) or 0
(LCRIT), is set.
After every local and remote temperature conversion the status register flags and the
T_CRIT output are updated. Figure 7 is a timing diagram showing the relationship of
T_CRIT output, Status bit 1 (RCRIT) and the remote critical temperature setpoint (RCS),
and critical temperature hysteresis (TH) with remote temperature changes. Note that the
T_CRIT output is de-activated only after the remote temperature is below the remote
temperature setpoint, RCS minus the hysteresis, TH. In the interrupt mode only, the
Status register flags are reset after the Status register is read.
RCS
remote temperature
RCS − TH
Status register bit 1
(RCRIT)
T_CRIT output
A
Fig 7.
B
C
002aad217
T_CRIT temperature response timing
Event A: T_CRIT goes LOW and Status bit 1 (RCRIT) is set HIGH when Remote
Temperature exceeds RCS, Remote T_CRIT Setpoint.
Event B: Remote Temperature goes below RCS  TH. T_CRIT is de-activated, but
Status register remains unchanged.
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Digital temperature sensor with overtemperature alarms
Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in
the interrupt mode).
7.9.3 Fault Queue
To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fault
Queue for both local and remote channel. The Fault Queue insures a temperature
measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering
until three consecutive out-of-limit measurements have been made. The fault queue
defaults OFF upon POR and may be activated by setting bit 0 in the Configuration register
(address 09h) to logic 1.
remote temperature
RCS
RCS − TH
remote HIGH setpoint
remote LOW setpoint
ALERT output
T_CRIT output
events
A
B
C
D
E
F
G
H
I
002aad218
Remark: All events indicate the completion of a conversion.
Fig 8.
Fault queue remote HIGH and LOW and T_CRIT, T_CRIT hysteresis setpoint
response (comparator mode)
Event A: The remote temperature has exceeded the Remote HIGH setpoint.
Event B: Three consecutive over limit measurements have been made exceeding the
Remote HIGH setpoint; the ALERT output is activated (goes LOW). By now, the remote
temp has exceeded the Remote T_CRIT setpoint (RCS).
Event C: Three consecutive over limit measurements have been made exceeding RCS;
the T_CRIT output is activated (goes LOW).
Event D: The remote temperature falls below the RCS  TH setpoint.
Event E: The ALERT output is de-activated (goes HIGH) after a below_high_limit
temperature measurement is completed.
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Digital temperature sensor with overtemperature alarms
Event F: Three consecutive measurements have been made with the remote
temperature below the RCS  TH threshold; the T_CRIT output is de-activated (goes
HIGH).
Event G: The remote temp falls below the Remote LOW setpoint.
Event H: Three consecutive measurements are made with the temp below the Remote
LOW setpoint; ALERT output is activated (goes LOW).
Event I: The ALERT output is de-activated (goes HIGH) after a above_low_limit
temperature measurement is completed.
7.9.4 Temperature measurement
To measure the remote temperature or the temperature of an externally attached diode,
the device automatically forces two successive currents of about 160 A and 10 A at D+
pin. It measures the voltage (VBE) between D+ and D, detects the difference between the
two VBE voltages or the VBE and then converts the VBE into a temperature data using
the basic PTAT voltage formula as shown in Equation 1. The device typically takes about
38 ms to perform a measurement during each conversion period or cycle, which is
selectable by programming the conversion rate register.
kT
l2
V BE = n  ------  ln  -----
 l1
q
(1)
Where:
n = diode ideality factor
k = Boltzmann’s constant
T = absolute temperature (K) = 273 C + T (C)
q = electron charge
ln = natural logarithm
l2, l1 = two source currents
Because the device does not directly convert the sensed VBE as in the old method of
temperature measurement systems, the VBE calibration is not required. Furthermore, the
device remote temperature error is adjusted at the manufacturer to meet the
specifications with the use of the reference diode-connected transistors such as the
2N3904/2N3906. The diode type to be used in customer applications must have the
characteristics as close to the 2N3904/2N3906 as possible in order to obtain optimal
results. Finally, to prevent the effects of system noise on the measured VBE signals, an
external capacitor of about 2200 pF connected between the D+ and D pins as well as the
grounded-shield cable for the diode connection wires are recommended.
7.9.5 Diode fault detection
The SA56004X is designed with circuitry to detect the fault conditions of the remote diode.
When the D+ pin is shorted to VDD or floating, the Remote Temperature High Byte (RTHB)
register is loaded with +127 C, the Remote Temperature Low Byte (RTLB) register is
loaded with 0 C, and the OPEN bit (bit 2 of the Status register) is set. Under the above
conditions of D+ shorted to VDD or floating, if the Remote T_CRIT setpoint is set less than
+127 C, and T_CRIT Mask are disabled, then, the T_CRIT output pins will be pulled
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Digital temperature sensor with overtemperature alarms
LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a
value less than +127 C and the Alert Mask is disabled, then the ALERT output will be
pulled LOW. Note that the OPEN bit itself will not trigger an ALERT.
When the D+ pin is shorted to ground or to D, the Remote Temperature High Byte
(RTHB) register is loaded with 128 C (1000 0000) and the OPEN (bit 2 in the Status
register) will not be set. Since operating the SA56004X is beyond its normal limits, this
temperature reading represents this shorted fault condition. If the value in the Remote
Low Setpoint High Byte (RLSHB) register is more than 128 C and the Alert Mask is
disabled, the ALERT output will be pulled LOW.
7.10 SMBus interface
The device can communicate over a standard two-wire serial interface System
Management Bus (SMBus) or compatible I2C-bus using SCLK and SDATA. The device
employs four standard SMBus protocols: Write Byte, Read Byte, Receive Byte, and
Send Byte. Data formats of four protocols are shown in Figure 9. The following key points
of protocol are important:
• The SMBus master initiates data transfer by establishing a START condition (S) and
terminates data transfer by generating a STOP condition (P).
• Data is sent over the serial bus in sequences of 9 clock pulses according to each 8-bit
data byte followed by 1-bit status of device acknowledgement (A).
• The 7-bit slave address is equivalent to factory-programmed address of the device.
• The command byte is equivalent to the address of the selected device register.
• The Receive Byte format is used for quicker transfer data from a device reading
register that was previously selected.
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1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
(cont.)
SCLK
a6
SDATA
a5
a4
a3
a2
a1
a0
D7
S
W
START
D6
D5
D4
D3
D2
D1
(cont.)
D0
A
A
device address
device register command
1
2
3
4
5
6
7
8
D7
D6
D5
D4
D3
D2
D1
D0
9
SCLK
SDATA
A
P
data to be written to register
STOP
002aad219
a. Write Byte format (to write a data byte to the device register)
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
(cont.)
SCLK
a6
SDATA
a5
a4
a3
a2
a1
a0
D7
S
W
START
D6
D5
D4
D3
D2
D1
(cont.)
D0
A
A
device address
P
STOP
device register command
1
2
3
4
5
6
7
8
a6
a5
a4
a3
a2
a1
a0
9
1
2
3
4
5
6
7
8
9
D7
D6
D5
D4
D3
D2
D1
D0
SCLK
SDATA
S
R
RESTART
A
NA
device address
P
STOP
data from device register
002aad220
b. Read Byte format (to read a data byte from the device register)
SCLK
(cont.)
(cont.)
SDATA
1
2
3
4
5
6
7
a6
a5
a4
a3
a2
a1
a0
S
8
9
R
RESTART
1
2
3
4
5
6
7
8
9
D7
D6
D5
D4
D3
D2
D1
D0
A
NA P
device address
STOP
data from device register
002aad221
c. Receive Byte format (to read a data byte from already pointed register)
1
2
3
4
5
6
7
a6
a5
a4
a3
a2
a1
a0
8
9
W
A
1
2
3
4
5
6
7
8
D7
D6
D5
D4
D3
D2
D1
D0
9
SCLK
SDATA
S
START
device address
A
device register command
P
STOP
002aad222
d. Send Byte format
Fig 9.
SMBus interface protocols
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7.10.1 Serial interface reset
If the SMBus master attempts to reset the SA56004X while the SA56004X is controlling
the data line and transmitting on the data line, the SA56004X must be returned to a known
state in the communication protocol. This may be accomplished in two ways:
1. When the SDATA is LOW, the SA56004X SMBus state machine resets to the SMBus
idle state if SCLK is held LOW for more than 35 ms (maximum TIMEOUT period).
According to SMBus specification 2.0, all devices are required to time out when the
SCLK line is held LOW for 25 ms to 35 ms. Therefore, to insure a time-out of all
devices on the bus, the SCLK line must be held LOW for at least 35 ms.
2. When the SDATA is HIGH, the master initiates an SMBus START. The SA56004X
responds properly to a SMBus START condition only during the data retrieving cycle.
After the START, the SA56004X expects an SMBus Address byte.
8. Application design-in information
8.1 Factors affecting accuracy
8.1.1 Remote sensing diode
The SA56004X is designed to work with substrate transistors built into processors’ CPUs
or with discrete transistors. Substrate transistors are generally PNP types with the
collector connected to the substrate. Discrete types can be either a PNP or an NPN
transistor connected as a diode (base shorted to collector). If an NPN transistor is used,
the collector and base are connected to D+ and the emitter to D. If a PNP transistor is
used, the collector and base are connected to D and the emitter to D+. Substrate
transistors are found in a number of CPUs. To reduce the error due to variations in these
substrate and discrete transistors, a number of factors should be considered:
• The ideality factor, nf, of the transistor. The ideality factor is a measure of the deviation
of the thermal diode from the ideal behavior. The SA56004X is trimmed for an nf value
of 1.008. Equation 2 can be used to calculate the error introduced at a temperature
T C when using a transistor whose nf does not equal 1.008. Consult the processor
data sheet for nf values.
This value can be written to the offset register and is automatically added to or
subtracted from the temperature measurement.
 n natural – 1.008 
T = ------------------------------------------   273.15 Kelvin + T 
1.008
(2)
• Some CPU manufacturers specify the high and low current levels of the substrate
transistors. The Isource high current level of the SA56004X is 100 A and the low-level
current is 10 A.
If a discrete transistor is being used with the SA56004X, the best accuracy is obtained by
choosing devices according to the following criteria:
• Base-emitter voltage greater than 0.25 V at 6 mA, at the highest operating
temperature.
• Base-emitter voltage less than 0.95 V at 100 mA, at the lowest operating temperature.
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Digital temperature sensor with overtemperature alarms
• Base resistance less than 100 .
• Small variation in hFE (say 50 to 150) that indicates tight control of VBE characteristics.
Transistors such as 2N3904, 2N3906, or equivalents in SOT23 packages are suitable
devices to use. See Table 18 for representative devices.
Table 18.
Representative diodes for temperature sensing
Manufacturer
Model number
ROHM
UMT3904
Diodes Inc.
MMBT3904-7
Philips
MMBT3904
ST Micro
MMBT3904
ON Semiconductor
MMBT3904LT1
Chenmko
MMBT3904
Infineon Technologies
SMBT3904E6327
Fairchild Semiconductor
MMBT3904FSCT
National Semiconductor
MMBT3904N623
8.1.2 Thermal inertia and self-heating
Accuracy depends on the temperature of the remote-sensing diode and/or the internal
temperature sensor being at the same temperature as that being measured, and a
number of factors can affect this. Ideally, the sensor should be in good thermal contact
with the part of the system being measured, for example, the processor. If it is not, the
thermal inertia caused by the mass of the sensor causes a lag in the response of the
sensor to a temperature change. In the case of the remote sensor, this should not be a
problem, since it is either a substrate transistor in the processor or a small package
device, such as the SOT23, placed close to it.
The on-chip sensor, however, is often remote from the processor and is only monitoring
the general ambient temperature around the package. The thermal time constant of the
SSOP16 package in still air is about 140 seconds, and if the ambient air temperature
quickly changed by 100 C, it would take about 12 minutes (five time constants) for the
junction temperature of the SA56004X to settle within 1 C of this. In practice, the
SA56004X package is in electrical and therefore thermal contact with a printed-circuit
board and can also be in a forced airflow. How accurately the temperature of the board
and/or the forced airflow reflect the temperature to be measured also affects the accuracy.
Self-heating due to the power dissipated in the SA56004X or the remote sensor causes
the chip temperature of the device or remote sensor to rise above ambient. However, the
current forced through the remote sensor is so small that self-heating is negligible. In the
case of the SA56004X, the worst-case condition occurs when the device is converting at
16 conversions per second while sinking the maximum current of 1 mA at the ALERT
output. In this case, the total power dissipation in the device is about 11 mW. The thermal
resistance, Rth(j-a), of the SSOP16 package is about 121 C/W.
In practice, the package has electrical and therefore thermal connection to the printed
circuit board, so the temperature rise due to self-heating is negligible.
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
23 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
8.1.3 Layout considerations
Digital boards can be electrically noisy environments, and the SA56004X is measuring
very small voltages from the remote sensor, so care must be taken to minimize noise
induced at the sensor inputs. The following precautions should be taken.
1. Place the SA56004X as close as possible to the remote sensing diode. Provided that
the worst noise sources, that is, clock generators, data/address buses, and CRTs, are
avoided, this distance can be 4 inches to 8 inches.
2. Route the D+ and D tracks close together, in parallel, with grounded guard tracks on
each side. Provide a ground plane under the tracks if possible.
3. Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track
minimum width and spacing is recommended (see Figure 10).
4. Try to minimize the number of copper/solder joints, which can cause thermocouple
effects. Where copper/solder joints are used, make sure that they are in both the D+
and D path and at the same temperature.
Thermocouple effects should not be a major problem since 1 C corresponds to about
200 V and thermocouple voltages are about 3 V/C of temperature difference.
Unless there are two thermocouples with a large temperature differential between
them, thermocouple voltages should be much less than 200 V.
5. Place a 0.1 F bypass capacitor close to the VDD pin. In very noisy environments,
place a 1000 pF input filter capacitor across D+ and D close to the SA56004X.
6. If the distance to the remote sensor is more than 8 inches, the use of twisted-pair
cable is recommended. This works up to about 6 feet to 12 feet.
7. For really long distances (up to 100 feet), use shielded twisted pair, such as
Belden #8451 microphone cable. Connect the twisted pair to D+ and D and the
shield to GND close to the SA56004X. Leave the remote end of the shield
unconnected to avoid ground loops.
Because the measurement technique uses switched current sources, excessive cable
and/or filter capacitance can affect the measurement. When using long cables, the filter
capacitor can be reduced or removed.
Cable resistance can also introduce errors. 1  resistance introduces about 1 C error.
GND
10 mil
10 mil
10 mil
10 mil
10 mil
10 mil
10 mil
D+
D−
GND
002aag953
Fig 10. Typical arrangement of signal tracks
SA56004X
Product data sheet
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© NXP B.V. 2013. All rights reserved.
24 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
8.2 Power sequencing considerations
8.2.1 Power supply slew rate
When powering-up the SA56004X, ensure that the slew rate of VDD is less than 18 mV/s.
A slew rate larger than this may cause power-on reset issues and yield unpredictable
results.
8.2.2 Application circuit
Figure 11 shows a typical application circuit for the SA56004X, using a discrete sensor
transistor connected via a shielded, twisted-pair cable. The pull-ups on SCLK, SDATA,
and ALERT are required only if they are not already provided elsewhere in the system.
The SCLK and SDATA pins of the SA56004X can be interfaced directly to the SMBus of
an I/O controller, such as the Intel 820 chip set.
VDD
R
10 kΩ
1
VDD
SCLK
R
10 kΩ
R
10 kΩ
8
CLOCK
100 nF
SMBus
CONTROLLER
SA56004X
shielded twisted pair
2
D+
SDATA
D−
ALERT
VDD
7
DATA
2.2 nF(1)
3
remote sensor
2N3904 (NPN), 2N3906 (PNP),
or similar standalone, ASIC or
microprocessor thermal diode
+5 V
6
INT
VDD
R
10 kΩ
4
T_CRIT
GND
5
FAN CONTROL
CIRCUIT
002aad201
(1) Typical value, placed close to temperature sensor.
Fig 11. Typical application circuit
8.3 Timing and firmware consideration
It is important not to violate the conversion timing on this part.
Regardless of timing, the device ‘could’ report an erroneous reading, but NXP, nor
reporting customers have not encountered two subsequent erroneous readings in its
product reviews or evaluations. Masking of single or two sequential erroneous readings is
recommended by comparing several reads should there be a large prompt change in the
temperature reading before taking protective action.
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
25 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
9. Limiting values
Table 19. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
All voltages are referenced to GND.
Symbol
Parameter
Conditions
Min
Max
Unit
supply voltage
0.3
+6
V
voltage at SDATA, SCLK, ALERT, T_CRIT
0.3
+6
V
VD+
voltage at positive diode input
0.3
VDD + 0.3
V
VD
voltage at negative diode input
0.3
+0.8
V
Isink
sink current
1
+50
mA
ID+
D+ input current
1
+1
mA
-
2000
V
VDD
SDATA, SCLK, ALERT, T_CRIT
VESD
electrostatic discharge voltage
Tj(max)
maximum junction temperature
-
+150
C
Tstg
storage temperature
65
+165
C
[1]
Human Body Model
[1]
The D+ and D pins are 1000 V HBM due to the higher sensitivity of the analog pins that introduces a limitation to the circuit protection
structure.
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
26 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
10. Characteristics
Table 20. Electrical characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +125 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TERRL
local temperature error
Tamb = +60 C to +100 C
2
1
+2
C
Tamb = 40 C to +125 C
3
-
+3
C
TERRR
remote temperature error
Tamb = +25 C to +85 C;
TRD = +60 C to +100 C
1
-
+1
C
Tamb = 40 C to +85 C;
TRD = 40 C to +125 C
3
-
+3
C
remote temperature
resolution
-
11
-
bit
-
0.125
-
C
TRESL
local temperature resolution
-
11
-
bit
-
0.125
-
C
Tconv
conversion period
-
38
-
ms
VDD
supply voltage
3.0
-
5.5
V
IDD
quiescent current
during conversion,
16 Hz conversion rate
-
500
-
A
shut-down current
SMBus inactive
-
10
-
A
remote diode source current
high setting: D+  D = +0.65 V
-
160
-
A
TRESR
IRD
[1]
low setting
-
10
-
A
2.6
-
2.95
V
1.8
-
2.4
V
Vth(UVLO)
undervoltage lockout
threshold voltage[2]
VDD input disables A/D conversion
[3]
Vth(POR)
power-on reset threshold
voltage
VDD input falling edge
[4]
Tth(high)
high threshold temperature
local and remote ALERT high
default temperature settings;
default values set at power-up
-
+70
-
C
Tth(low)
low threshold temperature
local and remote ALERT low default
temperature settings;
default values set at power-up
-
0
-
C
Tth(crit)
critical threshold temperature
local and remote T_CRIT default
temperature settings;
default values set at power-up
-
+85
-
C
Thys
hysteresis temperature
T_CRIT; default value set at
power-up
-
+10
-
C
Vsat
saturation voltage
ALERT and T_CRIT output;
IO = 6.0 mA
-
-
0.4
V
[1]
The SA56004X is optimized for 3.3 V VDD operation.
[2]
Definition of UnderVoltage LockOut (UVLO) threshold voltage: The value of VDD below which the internal A/D converter is disabled. This
is designed to be a minimum of 200 mV above the power-on reset. While it is disabled, the temperature that is in the ‘read temperature
registers’ remains at the value that it was before the A/D was disabled. This is done to eliminate the possibility of reading unexpected
false temperatures due to the A/D converter not working correctly due to low voltage. In case of power-up (rising VDD), the reading that
is stored in the ‘read temperature registers’ will be the default value of 0 C. VDD will rise to the value of the Vth(UVLO), at which point the
A/D functions correctly and the normal temperature is read.
[3]
VDD (rising edge) voltage below which the A/D converter is disabled.
[4]
VDD (falling edge) voltage below which the logic is reset.
SA56004X
Product data sheet
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© NXP B.V. 2013. All rights reserved.
27 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
Table 21. SMBus interface characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +125 C; unless otherwise specified.
These specifications are guaranteed by design and not tested in production.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIH
HIGH-level input voltage
SCLK, SDATA; VDD = 2.7 V to 5.5 V
2.2
-
-
V
VIL
LOW-level input voltage
SCLK, SDATA; VDD = 2.7 V to 5.5 V
-
-
0.8
V
IOL
LOW-level output current
ALERT, T_CRIT; VOL = 0.4 V
1.0
-
-
mA
6.0
-
-
mA
IOH
HIGH-level output current
-
-
1.0
A
IIL
LOW-level input current
1.0
-
-
A
IIH
HIGH-level input current
-
-
1.0
A
Ci
input capacitance
-
5
-
pF
-
-
400
kHz
600
5000
-
ns
SDATA; VOL = 0.6 V
SCLK, SDATA
SMBus digital switching characteristics[1]
fSCLK
SCLK operating frequency
tLOW
SCLK LOW time
10 % to 10 %
tHIGH
SCLK HIGH time
90 % to 90 %
tBUF
SMBus free time[2]
tHD;STA
hold time of START condition[3]
tHD;DAT
data[4]
hold time of
10 % of SDATA to 90 % of SCLK
in[5]
tSU;DAT
set-up time of data
tSU;STA
set-up time of repeat START
condition[6]
tSU;STO
set-up time of STOP condition[7] 90 % of SCLK to 90 % of SDATA
90 % to 90 %
600
5000
-
ns
600
-
-
ns
600
-
-
ns
0
300
-
ns
250
-
-
ns
250
-
-
ns
250
-
-
ns
tr
rise time
SCLK and SDATA
-
-
1
s
tf
fall time
SCLK and SDATA
-
-
300
ns
tof
output fall time
CL = 400 pF; IO = 3 mA
-
-
250
ns
25
-
35
ms
tto(SMBus)
SMBus time-out
time[8]
[1]
The switching characteristics of the SA56004X fully meet or exceed all parameters specified in SMBus version 2.0. The following
parameters specify the timing between the SCLK and SDATA signals in the SA56004X. They adhere to, but are not necessarily
specified as the SMBus specifications.
[2]
Delay from SDATA STOP to SDATA START.
[3]
Delay from SDATA START to first SCLK HIGH-to-LOW transition.
[4]
Delay from SCLK HIGH-to-LOW transition to SDATA edges.
[5]
Delay from SDATA edges to SCLK LOW-to-HIGH transition.
[6]
Delay from SCLK LOW-to-HIGH transition to restart SDATA.
[7]
Delay from SCLK HIGH-to-LOW transition to SDATA STOP condition.
[8]
LOW period for reset of SMBus.
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
28 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
tr
tf
tHD;STA
tLOW
SCLK
tHD;DAT
tHD;STA
tHIGH
tSU;STA
tSU;STO
tSU;DAT
SDATA
tBUF
P
S
S
P
002aad237
Fig 12. Timing measurements
SA56004X
Product data sheet
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© NXP B.V. 2013. All rights reserved.
29 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
11. Performance curves
24
IDD
shutdown
(μA)
002aad228
VDD = 5.5 V
3.6 V
3.3 V
3.0 V
800
IDD
quiescent
(μA)
16
600
8
400
0
−50
−25
0
25
50
75
100
125
Tamb (°C)
Fig 13. Typical IDD shutdown versus temperature and
VDD
400
IDD
quiescent
(μA)
002aad230
VDD = 5.5 V
3.6 V
3.3 V
3.0 V
002aad229
VDD = 5.5 V
3.6 V
3.3 V
3.0 V
200
−50
−25
0
25
50
75
Fig 14. Typical IDD quiescent current versus
temperature and VDD (conversion rate = 16 Hz)
002aad231
500
IDD quiescent
(μA)
(1)
400
300
(2)
300
(3)
(4)
200
200
(8)
(9)
(5)
(6)
(7)
100
−50
100
125
Tamb (°C)
−25
0
25
50
75
100
125
Tamb (°C)
100
−50
−25
0
25
50
75
100
125
Tamb (°C)
Conversion rate:
(1) 16 Hz
(2) 8.0 Hz
(3) 4.0 Hz
(4) 2.0 Hz
(5) 1.0 Hz
(6) 0.5 Hz
(7) 0.25 Hz
(8) 0.12 Hz
(9) 0.06 Hz
Fig 15. Typical IDD quiescent current versus
temperature and VDD
(conversion rate = 0.06 Hz)
SA56004X
Product data sheet
Fig 16. Typical IDD quiescent current versus
temperature and conversion rate (VDD = 3.3 V)
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30 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
002aad232
14
VDD = 5.5 V
3.6 V
3.3 V
3.0 V
IOL
(mA)
VDD = 5.5 V
3.6 V
3.3 V
3.0 V
IOL
(mA)
10
8
6
6
2
−50
−25
0
25
50
75
100
125
Tamb (°C)
Fig 17. Typical T_CRIT IOL versus temperature and
VDD (VOL = 0.4 V)
002aad233
2.80
Vth(UVLO) (V)
002aad234
10
4
−50
−25
0
25
50
75
100
125
Tamb (°C)
Fig 18. Typical ALERT IOL versus temperature and VDD
(VOL = 0.4 V)
002aad235
2.6
Vth(POR)
(V)
2.78
2.2
2.76
1.8
2.74
2.72
VDD = 5.5 V
3.6 V
3.3 V
3.0 V
2.70
−50
−25
1.4
0
25
50
75
100
125
Tamb (°C)
Fig 19. Typical undervoltage lockout threshold
voltage versus temperature and VDD
SA56004X
Product data sheet
1.0
−50
−25
0
25
50
75
100
125
Tamb (°C)
Fig 20. Typical power-on reset threshold voltage
versus temperature
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© NXP B.V. 2013. All rights reserved.
31 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 21. Package outline SOT96-1 (SO8)
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
32 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
E
SOT505-1
A
X
c
y
HE
v M A
Z
5
8
A2
pin 1 index
(A3)
A1
A
θ
Lp
L
1
4
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
SOT505-1
Fig 22. Package outline SOT505-1 (TSSOP8)
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
33 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm
SOT782-1
X
B
D
A
E
A
A1
c
detail X
terminal 1
index area
e1
terminal 1
index area
e
1
4
C
C A B
C
v
w
b
y
y1 C
L
K
Eh
8
5
Dh
0
1
scale
Dimensions
Unit(1)
mm
2 mm
A
A1
b
max 1.00 0.05 0.35
nom 0.85 0.03 0.30
min 0.80 0.00 0.25
c
0.2
D
Dh
E
Eh
e
e1
K
L
3.10 2.45 3.10 1.65
0.35 0.45
3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40
2.90 2.35 2.90 1.55
0.25 0.35
v
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT782-1
---
MO-229
---
sot782-1_po
European
projection
Issue date
09-08-25
09-08-28
Fig 23. Package outline SOT782-1 (HVSON8)
SA56004X
Product data sheet
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Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
34 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SA56004X
Product data sheet
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SA56004X
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Digital temperature sensor with overtemperature alarms
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 24) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22 and 23
Table 22.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 23.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24.
SA56004X
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SA56004X
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Digital temperature sensor with overtemperature alarms
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Soldering: PCB footprints
5.50
0.60 (8×)
1.30
4.00
6.60
7.00
1.27 (6×)
solder lands
occupied area
placement accuracy ± 0.25
Dimensions in mm
sot096-1_fr
Fig 25. PCB footprint for SOT96-1 (SO8); reflow soldering
SA56004X
Product data sheet
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
1.20 (2×)
0.60 (6×)
enlarged solder land
0.3 (2×)
1.30
4.00
6.60
7.00
1.27 (6×)
5.50
board direction
solder lands
occupied area
solder resist
placement accurracy ± 0.25
Dimensions in mm
sot096-1_fw
Fig 26. PCB footprint for SOT96-1 (SO8); wave soldering
3.600
2.950
0.125
0.725
0.125
5.750
3.200
3.600
5.500
1.150
0.600
0.450
0.650
solder lands
occupied area
Dimensions in mm
sot505-1_fr
Fig 27. PCB footprint for SOT505-1 (TSSOP8); reflow soldering
SA56004X
Product data sheet
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SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
Footprint information for reflow soldering of HVSON8 package
SOT782-1
Gx
P
D
C
nSPx
Hy
SPy
Gy
SLy
By
Ay
nSPy
SPx
SLx
solder land
solder paste deposit
solder land plus solder paste
occupied area
DIMENSIONS in mm
P
Ay
By
C
D
SLx
SLy
SPx
SPy
Gx
Gy
Hy
nSPx
nSPy
0.65
3.25
2.2
0.525
0.3
2.45
1.65
1.1
0.65
3.25
3.25
3.5
1
1
Issue date
12-02-09
12-02-28
sot782-1_fr
Fig 28. PCB footprint for SOT782-1 (HVSON8); reflow soldering
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SA56004X
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Digital temperature sensor with overtemperature alarms
15. Abbreviations
Table 24.
Abbreviations
Acronym
Description
A/D
Analog-to-Digital
ARA
Alert Response Address
ASIC
Application Specific Integrated Circuit
CRT
Cathode Ray Tube
ESD
ElectroStatic Discharge
HBM
Human Body Model
HVAC
Heating, Ventilating and Air Conditioning
I2C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MSB
Most Significant Bit
OTP
One-Time Programmable
POR
Power-On Reset
PTAT
Proportional To Absolute Temperature
SMBus
System Management Bus
UVLO
Under Voltage LockOut
16. Revision history
Table 25.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SA56004X v.7
20130225
Product data sheet
-
SA56004X v.6
Modifications:
•
Table 1 “Ordering information”: added “Topside marking” column and corrected Topside marking for
SO8 package (appended “D”)
•
Table 2 “Ordering options” modified:
– deleted column “Topside marking” (moved to Table 1)
– added columns “Orderable part number”, “Package”, “Packing method”, “Minimum order
quantity”
•
•
•
•
Section 7.2 “Slave address”: added (new) Table 4 “Slave addresses”
Added (new) Section 8.3 “Timing and firmware consideration”
Deleted (old) Section 13 “Packing information”
Added (new) Section 14 “Soldering: PCB footprints”
SA56004X v.6
20120423
Product data sheet
-
SA56004X v.5
SA56004X v.5
20080522
Product data sheet
-
SA56004X v.4
SA56004X v.4
20060808
Product data sheet
-
SA56004X v.3
SA56004X v.3
20041006
(9397 750 13841)
Product data sheet
-
SA56004X v.2
SA56004X v.2
20030903
(9397 750 12015)
Objective data
-
SA56004-X v.1
SA56004-X v.1
20030819
(9397 750 10993)
Objective data
-
-
SA56004X
Product data sheet
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40 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SA56004X
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 25 February 2013
© NXP B.V. 2013. All rights reserved.
41 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SA56004X
Product data sheet
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42 of 43
SA56004X
NXP Semiconductors
Digital temperature sensor with overtemperature alarms
19. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.8.1
7.8.2
7.8.3
7.8.4
7.8.5
7.8.6
7.8.7
7.8.8
7.8.9
7.8.10
7.9
7.9.1
7.9.1.1
7.9.1.2
7.9.1.3
7.9.2
7.9.3
7.9.4
7.9.5
7.10
7.10.1
8
8.1
8.1.1
8.1.2
8.1.3
8.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Register overview . . . . . . . . . . . . . . . . . . . . . . . 7
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
Starting conversion . . . . . . . . . . . . . . . . . . . . . . 9
Low power software standby mode . . . . . . . . . 9
Temperature data format . . . . . . . . . . . . . . . . . 9
SA56004X SMBus registers . . . . . . . . . . . . . . 10
Command register . . . . . . . . . . . . . . . . . . . . . 10
Local and remote temperature registers
(LTHB, LTLB, RTHB, RTLB) . . . . . . . . . . . . . . 10
Configuration register (CON) . . . . . . . . . . . . . 10
Status register (SR) . . . . . . . . . . . . . . . . . . . . 11
Conversion rate register (CR). . . . . . . . . . . . . 12
Temperature limit registers . . . . . . . . . . . . . . . 12
Programmable offset register (remote only) . . 13
ALERT mode register (AM) . . . . . . . . . . . . . . 13
Other registers . . . . . . . . . . . . . . . . . . . . . . . . 13
One-shot register . . . . . . . . . . . . . . . . . . . . . . 13
Interruption logic and functional description . . 14
ALERT output . . . . . . . . . . . . . . . . . . . . . . . . . 14
ALERT output in comparator mode . . . . . . . . 14
ALERT output in interrupt mode . . . . . . . . . . . 14
ALERT output in SMBus ALERT mode . . . . . 15
T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 17
Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Temperature measurement . . . . . . . . . . . . . . 19
Diode fault detection . . . . . . . . . . . . . . . . . . . . 19
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 20
Serial interface reset. . . . . . . . . . . . . . . . . . . . 22
Application design-in information . . . . . . . . . 22
Factors affecting accuracy . . . . . . . . . . . . . . . 22
Remote sensing diode . . . . . . . . . . . . . . . . . . 22
Thermal inertia and self-heating . . . . . . . . . . . 23
Layout considerations. . . . . . . . . . . . . . . . . . . 24
Power sequencing considerations . . . . . . . . . 25
8.2.1
8.2.2
8.3
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
17
17.1
17.2
17.3
17.4
18
19
Power supply slew rate . . . . . . . . . . . . . . . . .
Application circuit . . . . . . . . . . . . . . . . . . . . . .
Timing and firmware consideration . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . .
Performance curves . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering. . . . . . . . . . . . . . . . .
Wave and reflow soldering. . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
Soldering: PCB footprints . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
25
25
25
26
27
30
32
35
35
35
35
36
37
40
40
41
41
41
41
42
42
43
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 February 2013
Document identifier: SA56004X
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