Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series SMF Series RoHS Description The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and deliverying one of the lowest height profiles (1.1mm) in the industry. Features Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10x1000µs (Note 1) PPPM 200 W Thermal Resistance Junction- toAmbient RTHJ-A 220 °C/W Thermal Resistance Junction- toLead RTHJ-L 100 °C/W Operating and Storage Temperature Range TJ,TSTG -55 to 150 °C •Compatible with industrial standard package SOD-123 • For surface mounted applications to optimize board space • Low profile: maximum height of 1.1mm. • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2) Notes: 1. Non-repetitive current pulse, per Fig. 4 and derated above TA=25ºC per Fig. 3. • EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4) • Low inductance, excellent clamping capability • 200W peak pulsepower capability at 10 x 1000µs waveform, repetition rate (duty cycle): 0.01% • Fast response time: typically less than 1.0ns from 0 Volts to VBR min •H igh temperature soldering: 260°C/40 seconds at terminals • Glass passivated junction • Built-in strain relief •M atte tin lead–free plated • Halogen-free and RoHS compliant Applications SMF devices are ideal for the protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones, portable devices, business machines, power supplies and other consumer applications. SMF Series 9 Revised: July 17, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. HF RoHS SMF Series TVS Diode Arrays (SPA™ Family of Products) Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Electrical Characteristics (T =25°C unless otherwise noted) TVS Diode Arrays (SPA™ Family of Products) A Part Number SMF5.0A SMF6.0A SMF6.5A SMF7.0A SMF7.5A SMF8.0A SMF8.5A SMF9.0A SMF10A SMF11A SMF12A SMF13A SMF14A SMF15A SMF16A SMF17A SMF18A SMF20A SMF22A SMF24A SMF26A SMF28A SMF30A SMF33A SMF36A SMF40A SMF43A SMF45A SMF48A SMF51A SMF54A Breakdown Voltage VBR (Volts) @ IT Code MIN MAX Test Current IT (mA) AE AG AK AM AP AR AT AV AX AZ BE BG BK BM BP BR BT BV BX BZ CE CG CK CM CP CR CT CV CX CZ DE 6.4 6.67 7.22 7.78 8.33 8.89 9.44 10.0 11.1 12.2 13.3 14.4 15.6 16.7 17.8 18.9 20.0 22.2 24.4 26.7 28.9 31.1 33.3 36.7 40.0 44.4 47.8 50.0 53.3 56.7 60.0 7.0 7.37 7.98 8.6 9.21 9.83 10.4 11.1 12.3 13.5 14.7 15.9 17.2 18.5 19.7 20.9 22.1 24.5 26.9 29.5 31.9 34.4 36.8 40.6 44.2 49.1 52.8 55.3 58.9 62.7 66.3 10 10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Marking Maximum Reverse Reverse Stand off Leakage @ VR Voltage VR (V) IR (µA) 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 400 400 250 100 50 25 10 5 2.5 2.5 2.5 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Maximum Peak Pulse Current Ipp (A) 21.7 19.4 17.9 16.7 15.5 14.7 13.9 13 11.8 11 10.1 9.3 8.6 8.2 7.7 7.2 6.8 6.2 5.6 5.1 4.8 4.4 4.1 3.8 3.4 3.1 2.9 2.8 2.6 2.4 2.3 Maximum Clamping Voltage @Ipp VC (V) 9.2 10.3 11.2 12 12.9 13.6 14.4 15.4 17 18.2 19.9 21.5 23.2 24.4 26 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 Notes: 1. VBR measured after IT applied for 300µs, IT = sequare wave pulse or equivalent. 2. Surge current waveform per 10 x 1000µs exponential wave and derated per Fig.2. 3. All terms and symbols are consistent with ANSI/IEEE C62.35. SMF Series 10 Revised: July 17, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series I-V Curve Characteristics TVS Diode Arrays (SPA™ Family of Products) Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum current that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Curve Voltage Transients PPPM-Peak Pulse Power (kW) 10 Voltage or Current Voltage Across TVS Current Through TVS 1 0.1 0.000001 0.00001 0.0001 0.001 td-Pulse Width (sec.) Time continues on next page. SMF Series 11 Revised: July 17, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) TVS Diode Arrays (SPA™ Family of Products) A Figure 3 - Pulse Derating Curve Figure 4 - Pulse Waveform - 10x1000µS 150 80 60 40 20 0 tr=10µsec IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 0 25 50 75 100 125 150 Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 0 175 TA-Ambient temperature (ºC) 10/1000µsec. Waveform as defined by R.E.A td 0 1.0 2.0 3.0 4.0 t-Time (ms) Figure 5 - Steady State Power Dissipation Derating Curve Figure 6 - Forward Voltage 1.2 Vf - Typical forward dropped voltage 1.50 PM(AV), Steady State Power Dissipation (W) TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM 1.25 1.00 0.75 0.50 0.25 25 50 75 100 125 TL - Tab temperature (ºC) 150 0.8 0.6 0.4 0.2 0 -55 0 0 1 175 10 75 140 Temperature (ºC) Figure 7 - Cj vs. Working Peak Reverse Voltage 10000 1000 Cj (pf) Measured@Vr=0v 100 10 1 Measured@50%Vr 10 100 Vbr - Reverse breakdown voltage SMF Series 12 Revised: July 17, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Soldering Parameters TVS Diode Arrays (SPA™ Family of Products) Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Ramp-up TL Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260 20 – 40 seconds Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat t 25˚C to Peak Time (t) °C Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Physical Specifications Environmental Specifications Case SOD-123 plastic over glass passivated junction Polarity Color band denotes cathode except bipolar Terminal Matte tin-plated leads, solderable per JESD22-B102D SMF Series tL 25˚C Time within 5°C of actual peak Temperature (tp) +0/-5 tp TP Temperature (T) Reflow Condition Temperature Cycle JESD22-A104 Pressure Cooker JESD22-A102 High Temp. Storage JESD22-A103 HTRB JESD22-A108 Thermal Shock JESD22-A106 13 Revised: July 17, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information. Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series Dimensions - SOD-123 Package TVS Diode Arrays (SPA™ Family of Products) E B A E Dimensions F C G H D Millimeters Inches Min Max Min Max A 2.50 2.90 0.0984 0.1142 B 3.40 3.90 0.1339 0.1535 C 0.70 1.20 0.0275 0.0472 D 1.50 2.00 0.0591 0.0787 E 0.35 0.90 0.0138 0.0354 F 0.05 0.26 0.0020 0.0102 G 0.00 0.10 0.0000 0.0039 H 0.95 1.10 0.0374 0.0433 Mounting Pad Layout 1.6 (0.062) 1.3 (0.051) 1.4 (0.055) Part Numbering System Part Marking System SMF xx A LF 5% VBR VOLTAGE TOLERANCE XX YM VR VOLTAGE SERIES Cathode Band Marking Code Trace Code Marking Y:Year Code M: Month Code Packaging Part number SMFXXX Component Package SOD-123 Quantity 3000 Packaging Option Tape & Reel – 8mm/7” tape Packaging Specification EIA RS-481 Tape and Reel Specification 0.157 (4.0) Cathode 0.31 (8.0) 0.157 (4.0) 0.059 DIA (1.5) Cover tape 7.0 (178) 0.80 (20.2) Arbor Hole Dia. 0.33 (8.5) SMF Series Dimensions are in inches (and millimeters). Direction of Feed 14 Revised: July 17, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.Littelfuse.com/series/SMF.html for current information.