Package Outline Dimensions PowerDI5060-8 (SWP) (Type R) D D1 8 0(4x) E1 E 1.400 1.900 PowerDI5060-8 (SWP) (Type R) Dim Min Max Typ A 0.90 1.10 1.00 A1 0 0.05 -b 0.30 0.50 0.41 b2 0.20 0.35 0.25 b4 0.25REF c 0.230 0.330 0.277 D 5.15 BSC D1 4.70 5.10 4.90 D2 1.40 1.60 1.50 D2a 3.78 4.18 3.98 E 6.40 BSC E1 5.60 6.00 5.80 E2 3.46 3.86 3.66 e 1.27BSC k 1.05 --k1 0.56 --L 0.635 0.835 0.735 La 0.635 0.835 0.735 L1 0.200 0.400 0.300 L1a 0.050REF L4 0.025 0.225 0.125 M 3.205 4.005 3.605 θ 10° 12° 11° θ1 6° 8° 7° All Dimensions in mm A1 c Seating Plane e 1 0(4 x) Ø1.000 Depth 0.07±0.030 b(8x) e/2 DETAIL A 1 L D2a E2 b2(2x) k k1 A L4 D2 M D2 La DETAIL A 8 L1a(8x) b4(8x) L1 Suggested Pad Layout PowerDI5060-8 (SWP) (Type R) X4 8 Dimensions X3 Y1 X2 Y2 Y3 G1 X1 Y(4x) 1 X C C G G1 X X1 X2 X3 X4 Y Y1 Y2 Y3 Value (in mm) 1.270 0.660 0.820 0.610 3.910 1.650 1.650 4.420 1.270 1.020 3.810 6.610 G ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2016-03-25 1 of 2 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2016-03-25 2 of 2 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated