TO263AB (D2PAK) (Type TH)

Package Outline Dimensions
TO263AB (D2PAK) (Type TH)
A
E
c2
L1
01
L4
Ø
D
1.
A2
50
H
01
L2
02
e
b
b2
c
See Detail B
E1a
L3
E1
D1
Gauge Plane
D1b D1a
Seating
Plane
0
L
E1b
A1
Detail B
TO263AB (D2PAK)
(Type TH)
Dim
Min Max Typ
A
4.40 4.70 4.57
A1
0.00 0.20 0.10
A2
2.59 2.79 2.69
b
0.77 0.90 0.813
b2
1.20 1.36 1.27
c
0.356 0.47 0.381
c2
1.22 1.32 1.27
D
8.60 8.80 8.70
D1
6.60 7.80 7.60
D1a
5.33 6.53 6.33
D1b
4.54 5.74 5.54
e
2.54 BSC
E
10.00 10.20 10.10
E1
6.67 7.87 7.67
E1a
4.94 6.14 5.94
E1b
7.06 8.26 8.06
H
14.70 15.50 15.10
L
2.00 2.60 2.30
L1
1.17 1.40 1.27
L2
1.45 1.70 1.55
L3
0.25 BSC
L4
2.50 REF
θ
0°
8°
5°
θ1
5°
9°
7°
θ2
1°
5°
3°
All Dimensions in mm
Suggested Pad Layout
X1
Dimensions
C
X
X1
Y
Y1
Y2
Y
Y2
Value (in mm)
5.08
1.10
10.41
3.50
7.01
15.99
X
Y1
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-06-11
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Package Outline Dimensions
Suggested Pad Layout
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