TSSOP 20EP

Package Outline Dimensions
TSSOP-20EP
D
X
E1
E
Y
PIN 1
ID MARK
e
0.25
Gauge Plane
A2
A

b
Seating Plane
L
A1
L1
TSSOP-20EP
Dim
Min
Max
Typ
A
1.20
A1
0.025 0.100
A2
0.80
1.05
0.90
b
0.19
0.30
c
0.09
0.20
D
6.40
6.60
6.50
E
6.20
6.60
6.40
E1
4.30
4.50
4.40
L
0.45
0.75
0.60
L1
1.0 REF
e
0.65 BSC
X
4.191
Y
2.997
θ1
0°
8°
All Dimensions in mm
DETAIL
Suggested Pad Layout
TSSOP-20EP
C
X
Dimensions
Y1
Y2
Y3
X1
Y
C
X
X1
X2
Y
Y1
Y2
Y3
Value
(in mm)
0.650
0.420
4.490
6.270
1.780
3.290
4.160
7.720
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-11-09
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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