U-DFN2020-6 (Type F)

Package Outline Dimensions
U-DFN2020-6 (Type F)
A1
A
A3
Seating Plane
D
e3
e4
k2
D2a
E
z2
D2
E2a
E2
k1
z1
z(4x)
e2
k
e
L
b
U-DFN2020-6
(Type F)
Dim
Min Max
Typ
A
0.57 0.63
0.60
A1
0.00 0.05
0.03
A3
0.15
b
0.25 0.35
0.30
D
1.95 2.05
2.00
D2
0.85 1.05
0.95
D2a 0.33 0.43
0.38
E
1.95 2.05
2.00
E2
1.05 1.25
1.15
E2a
0.65 0.75
0.70
e
0.65 BSC
e2
0.863 BSC
e3
0.70 BSC
e4
0.325 BSC
k
0.37 BSC
k1
0.15 BSC
k2
0.36 BSC
L
0.225 0.325 0.275
z
0.20 BSC
z1
0.110 BSC
z2
0.20 BSC
All Dimensions in mm
Suggested Pad Layout
U-DFN2020-6 (Type F)
X3
C
Y
X
Dimensions
Y3
Y2
Y1
Y4
X1
Pin1
C
X
X1
X2
X3
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.650
0.400
0.480
0.950
1.700
0.425
0.800
1.150
1.450
2.300
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-09-14
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Package Outline Dimensions
Suggested Pad Layout
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