Package Outline Dimensions W-DFN3020-8 (Type K) A A3 A1 D e D3 L1 L2 E E3 E1 E2 D2 D1 E4 (2x) L (4x) Dim Min A 0.77 A1 0.00 A3 b 0.25 D 2.95 D1 1.025 D2 1.05 D3 0.375 D4 0.40 E 1.95 D4 (2x) W-DFN3020-8 Type K Max Typ Dim Min Max Typ E1 0.83 0.80 0.56 0.76 0.66 E2 0.05 0.02 0.26 0.46 0.36 E3 0.605 0.805 0.705 0.15 E4 0.275 0.475 0.375 0.35 0.30 L 3.05 3.00 0.425 0.525 0.475 1.225 1.125 L1 0.30 0.40 0.35 L2 1.25 1.15 0.60 0.70 0.65 Z 0.575 0.475 0.375 e 0.60 0.50 0.65 2.05 2.00 All Dimensions in mm b Z (4x) Suggested Pad Layout W-DFN3020-8 (Type K) Dimensions Value (in mm) C 0.650 X 0.600 X1 0.400 X2 0.825 X3 0.675 X4 1.250 X5 2.750 Y 0.675 Y1 0.550 Y2 0.850 Y3 0.755 Y4 1.455 Y5 1.000 Y6 0.650 Y7 1.455 Y8 2.300 X5 X (2x) C Y (4x) X4 Y8 Y3 X3 Y7 Y4 Y6 Y5 X2 Y2 X1 (6x) Y1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-08 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated