Package Outline Dimensions W-QFN2030-12 D PIN 1# DOT BY MARKING b PIN #1 ID C0.125 W-QFN2030-12 E e La(x5) L(x7) A3 A Dim Min Max Typ A 0.700 0.800 0.750 A1 -0.050 -A3 0.203 REF b 0.200 0.300 0.250 D 1.950 2.050 2.000 E 2.950 3.050 3.000 e 0.500 BSC L 0.350 0.450 0.400 La 0.450 0.550 0.50 All Dimensions in mm A1 Suggested Pad Layout W-QFN2030-12 X3 X2(5x) Y1(2x) Y2(8x) Y3 C Y(2x) X1(3x) Dimensions Value (in mm) C 0.500 X 0.350 X1 0.700 X2 0.600 X3 2.300 Y 0.600 Y1 0.700 Y2 0.350 Y3 3.300 X(4x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2016-05-11 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated