Data Sheet

PCF8578
LCD row/column driver for dot matrix graphic displays
Rev. 06 — 5 May 2009
Product data sheet
1. General description
The PCF8578 is a low power CMOS1 LCD row and column driver, designed to drive dot
matrix graphic displays at multiplex rates of 1:8, 1:16, 1:24 or 1:32. The device has
40 outputs, of which 24 are programmable and configurable for the following ratios of
rows/columns: 32⁄8, 24⁄16, 16⁄24 or 8⁄32. The PCF8578 can function as a stand-alone LCD
controller and driver for use in small systems. For larger systems it can be used in
conjunction with up to 32 PCF8579s for which it has been optimized. Together these two
devices form a general purpose LCD dot matrix driver chip set, capable of driving displays
of up to 40960 dots. The PCF8578 is compatible with most microcontrollers and
communicates via a two-line bidirectional bus (I2C-bus). Communication overhead is
minimized by a display RAM with auto-incremented addressing and display bank
switching.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
1.
Single chip LCD controller and driver
Stand-alone or may be used with up to 32 PCF8579s (40960 dots possible)
40 driver outputs, configurable for several ratios of rows/columns: 32⁄8, 24⁄16, 16⁄24 or 8⁄32
Selectable multiplex rates: 1:8, 1:16, 1:24 or 1:32
Externally selectable bias configuration, 5 or 6 levels
1280-bit RAM for display data storage and scratch pad
Display memory bank switching
Auto-incremented data loading across hardware subaddress boundaries (with
PCF8579)
Provides display synchronization for PCF8579
On-chip oscillator, requires only 1 external resistor
Power-On Reset (POR) blanks display
Logic voltage supply range 2.5 V to 6 V
Maximum LCD supply voltage 9 V
Low power consumption
I2C-bus interface
Compatible with most microcontrollers
Optimized pinning for single plane wiring in multiple device applications (with
PCF8579)
Space saving 56-lead small outline package and 64 pin quad flat pack
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 15.
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
3. Applications
n
n
n
n
n
Automotive information systems
Telecommunication systems
Point-of-sale terminals
Industrial computer terminals
Instrumentation
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
PCF8578T/1
VSO56
plastic very small outline package; 56 leads
SOT190-1
PCF8578H/1
LQFP64
plastic low profile quad flat package; 64 leads; body
10 × 10 × 1.4 mm[1]
SOT314-2
PCF8578HT/1
TQFP64
plastic thin quad flat package; 64 leads;
body 10 × 10 × 1.0 mm
SOT357-1
[1]
Version
Should not be used for new designs.
5. Marking
Table 2.
Marking codes
Type number
Marking code
PCF8578T/1
PCF8578T
PCF8578H/1
PCF8578H
PCF8578HT/1
PCF8578HT
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
2 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
6. Block diagram
C39 - C32
R31/C31 - R8/C8
R7 - R0
VDD
V2
V3
ROW/COLUMN(1)
DRIVERS
V4
PCF8578
V5
VLCD
TEST
DISPLAY
MODE
CONTROLLER
OUTPUT
CONTROLLER
Y DECODER
AND SENSING
AMPLIFIERS
32 × 40-BIT
DISPLAY RAM
DISPLAY
DECODER
X DECODER
SUBADDRESS
COUNTER
POWER-ON
RESET
SCL
Y
I2C-BUS
CONTROLLER
INPUT
FILTERS
SDA
RAM DATA POINTER
X
COMMAND
DECODER
SYNC
TIMING
GENERATOR
CLK
OSC
OSCILLATOR
Rext(OSC)
VSS
msa842
n.c.
n.c.
SA0
(1) Operates at LCD voltage levels, all other blocks operate at logic levels.
Fig 1.
Block diagram
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
3 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
7. Pinning information
7.1 Pinning
SDA
1
56 R0
SCL
2
55 R1
SYNC
3
54 R2
CLK
4
53 R3
VSS
5
52 R4
TEST
6
51 R5
SA0
7
50 R6
OSC
8
49 R7
VDD
9
48 R8/C8
V2 10
47 R9/C9
V3 11
46 R10/C10
V4 12
45 R11/C11
V5 13
44 R12/C12
VLCD 14
n.c. 15
43 R13/C13
PCF8578T
42 R14/C14
n.c. 16
41 R15/C15
C39 17
40 R16/C16
C38 18
39 R17/C17
C37 19
38 R18/C18
C36 20
37 R19/C19
C35 21
36 R20/C20
C34 22
35 R21/C21
C33 23
34 R22/C22
C32 24
33 R23/C23
R31/C31 25
32 R24/C24
R30/C30 26
31 R25/C25
R29/C29 27
30 R26/C26
R28/C28 28
29 R27/C27
001aaj842
Top view. For mechanical details, see Figure 29.
Fig 2.
Pinning diagram of PCF8578T/1 (VSO56)
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
4 of 46
PCF8578
NXP Semiconductors
49 R21/C21
50 R20/C20
51 R19/C19
52 R18/C18
53 R17/C17
54 R16/C16
55 R15/C15
56 R14/C14
57 R13/C13
58 R12/C12
59 R11/C11
60 R10/C10
61 R9/C9
62 R8/C8
63 R7
64 R6
LCD row/column driver for dot matrix graphic displays
R5
1
48 R22/C22
R4
2
47 n.c.
R3
3
46 R23/C23
R2
4
45 R24/C24
R1
5
44 R25/C25
R0
6
43 R26/C26
SDA
7
42 R27/C27
SCL
8
SYNC
9
41 R28/C28
PCF8578H
40 R29/C29
CLK 10
39 R30/C30
VSS 11
38 R31/C31
C36 32
C37 31
C38 30
C39 29
n.c. 28
n.c. 27
n.c. 26
VLCD 25
V5 24
V4 23
V3 22
33 C35
V2 21
34 C34
OSC 16
VDD 20
35 C33
n.c. 15
n.c. 19
36 n.c.
n.c. 14
n.c. 18
37 C32
SA0 13
n.c. 17
TEST 12
001aaj840
Top view. For mechanical details, see Figure 30.
Fig 3.
Pinning diagram of PCF8578H/1 (LQFP64)
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
5 of 46
PCF8578
NXP Semiconductors
49 R21/C21
50 R20/C20
51 R19/C19
52 R18/C18
53 R17/C17
54 R16/C16
55 R15/C15
56 R14/C14
57 R13/C13
58 R12/C12
59 R11/C11
60 R10/C10
61 R9/C9
62 R8/C8
63 R7
64 R6
LCD row/column driver for dot matrix graphic displays
R5
1
48 R22/C22
R4
2
47 n.c.
R3
3
46 R23/C23
R2
4
45 R24/C24
R1
5
44 R25/C25
R0
6
43 R26/C26
SDA
7
42 R27/C27
SCL
8
SYNC
9
41 R28/C28
PCF8576HT
40 R29/C29
CLK 10
39 R30/C30
VSS 11
38 R31/C31
C36 32
C37 31
C38 30
C39 29
n.c. 28
n.c. 27
n.c. 26
VLCD 25
V5 24
V4 23
V3 22
33 C35
V2 21
34 C34
OSC 16
VDD 20
35 C33
n.c. 15
n.c. 19
36 n.c.
n.c. 14
n.c. 18
37 C32
SA0 13
n.c. 17
TEST 12
001aaj911
Top view. For mechanical details, see Figure 31.
Fig 4.
Pinning diagram of PCF8578HT/1 (TQFP64)
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
6 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
VSO56
LQFP64,
TQFP64
SDA
1
7
I2C-bus serial data input/output
SCL
2
8
I2C-bus serial clock input
SYNC
3
9
cascade synchronization output
CLK
4
10
external clock input/output
VSS
5
11
ground
TEST[1]
6
12
test pin
SA0
7
13
I2C-bus slave address input (bit 0)
OSC
8
16
oscillator input
VDD
9
20
supply voltage
V2 to V5
10 to 13
21 to 24
LCD bias voltage inputs
VLCD
14
25
LCD supply voltage
n.c.
15, 16
14, 15,
17 to 19,
26 to 28, 36,
47
not connected
C39 to C32
17 to 24
29 to 35, 37
LCD column driver outputs
R31/C31 to R8/C8
25 to 48
38 to 46,
48 to 62
LCD row and column driver outputs
R7 to R0
49 to 56
63, 64, 1 to 6
LCD row driver outputs
[1]
The TEST pin must be connected to VSS.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
7 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
8. Functional description
8.1 Display configurations
The PCF8578 row and column driver is designed for use in one of three ways:
• Stand-alone row and column driver for small displays (mixed mode)
• Row and column driver with cascaded PCF8579s (mixed mode)
• Row driver with cascaded PCF8579s (mixed mode and row mode)
Table 4.
Applicatio
n
Possible display configurations
Multiplex rate Mixed mode
stand alone 1:8
with
PCF8579
Row mode
Rows
Columns Rows
Columns
8
32
-
-
1:16
16
24
-
-
1:24
24
16
-
-
1:32
32
8
-
1:8
8[1]
632[1]
8×
1:16
16[1]
624[1]
16 × 2[2] 640[2]
1:24
24[1]
616[1]
24[2]
640[2]
1:32
32[1]
608[1]
32[2]
640[2]
[1]
Using 15 PCF8579s.
[2]
Using 16 PCF8579s.
Typical applications
small digital or
alphanumeric displays
4[2]
640[2]
alphanumeric displays
and dot matrix graphic
displays
In mixed mode, the device functions as both a row and column driver. It can be used in
small stand-alone applications, or for larger displays with up to 15 PCF8579s
(31 PCF8579s when two slave addresses are used). See Table 4 for common display
configurations.
In row mode, the device functions as a row driver with up to 32 row outputs and provides
the clock and synchronization signals for the PCF8579. Up to 16 PCF8579s can normally
be cascaded (32 when two slave addresses are used).
Timing signals are derived from the on-chip oscillator, whose frequency is determined by
the value of the resistor connected between pin OSC and pin VSS.
Five commands are available to configure and control the operation of the device.
Communication is made via a two-line bidirectional I2C-bus. The device may have one of
two slave addresses. The only difference between these slave addresses is the least
significant bit, which is set by the logic level applied to SA0. The PCF8578 and PCF8579
have different subaddresses. The subaddress of the PCF8578 is only defined in mixed
mode and is fixed at 0111 100 (see Section 8.8.7 on page 19). The RAM may only be
accessed in mixed mode and data is loaded as described for the PCF8579.
Bias levels may be generated by an external potential divider with appropriate decoupling
capacitors. For large displays, bias sources with high drive capability should be used. A
typical mixed mode system operating with up to 15 PCF8579s is shown in Figure 5 (a
stand-alone system would be identical but without the PCF8579).
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
8 of 46
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8578_6
Product data sheet
LCD DISPLAY
n
rows
VDD
40 n
columns
VDD
C
40
columns
R1
V2
C
R2
V3
C
R3
V4
PCF8578
SCL
C
SDA
R2
VDD
VDD
VLCD
VLCD
VSS
VSS
VSS/VDD
SA0
SDA
V5
C
A0
A1
PCF8579
A2
subaddress 1
VSS/VDD
A3
SCL CLK SYNC V4
V3
R1
VLCD
VSS
VSS
VLCD
SA0
VSS/VDD
OSC
Rext(OSC)
SDA SCL CLK SYNC
Fig 5.
Typical mixed mode configuration
PCF8578
9 of 46
© NXP B.V. 2009. All rights reserved.
msa843
LCD row/column driver for dot matrix graphic displays
Rev. 06 — 5 May 2009
HOST
MICROCONTROLLER
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
Table 5 shows the relative values of the resistors required in the configuration of Figure 5
to produce the standard multiplex rates.
Table 5.
Multiplex rates and resistor values for Figure 5
Resistors
Multiplex rate (1:n)
n=8
n = 16, 24, 32
R1
R
R
R2
( n – 2 )R
( 3 – n )R
R
R3
( n – 3 )R
8.2 Power-on reset
At power-on the PCF8578 resets to a defined starting condition as follows:
1. Display blank
2. 1:32 multiplex rate, row mode
3. Start bank 0 selected
4. Data pointer is set to X, Y address 0, 0
5. Character mode
6. Subaddress counter is set to 0
7. I2C-bus interface is initialized
Remark: Do not transfer data on the I2C-bus for at least 1 ms after power-on to allow the
reset action to complete.
8.3 Multiplexed LCD bias generation
The bias levels required to produce maximum contrast depend on the multiplex rate and
the LCD threshold voltage (Vth). Vth is typically defined as the RMS voltage at which the
LCD exhibits 10 % contrast. Table 6 shows the optimum voltage bias levels and Table 7
the discrimination ratios (D) for the different multiplex rates as functions of Voper.
(1)
V oper = V DD – V LCD
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with the equation
V on ( RMS ) =
V oper
1
n–1
--- + -----------------------n n( n + 1)
(2)
and the RMS off-state voltage (Voff(RMS)) with the equation
V off ( RMS ) =
V oper
2( n – 1)
------------------------------2n( n + 1)
PCF8578_6
Product data sheet
(3)
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
10 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
where the values for n are determined by the multiplex rate (1:n). Valid values for n are:
n = 8 for 1:8 multiplex
n = 16 for 1:16 multiplex
n = 24 for 1:24 multiplex
n = 32 for 1:32 multiplex
Table 6.
Optimum LCD voltages
Bias ratios
Multiplex rate
1:8
1:16
1:24
1:32
V2
-------------V oper
0.739
0.800
0.830
0.850
V3
-------------V oper
0.522
0.600
0.661
0.700
V4
-------------V oper
0.478
0.400
0.339
0.300
V5
-------------V oper
0.261
0.200
0.170
0.150
Table 7.
Discrimination ratios
Discrimination
ratios
Multiplex rate
1:8
1:16
1:24
1:32
V off ( RMS )
------------------------V oper
0.297
0.245
0.214
0.193
V on ( RMS )
----------------------V oper
0.430
0.316
0.263
0.230
V on ( RMS )
D = ------------------------V off ( RMS )
1.447
1.291
1.230
1.196
V oper
-------------V th
3.370
4.080
4.680
5.190
Figure 6 shows the values of Table 6 as graphs.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
11 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
msa838
1.0
Vbias
Voper
V2/Voper
0.8
V3/Voper
0.6
V4/Voper
0.4
V5/Voper
0.2
0
1:8
1:16
1:24
1:32
multiplex rate
Vbias = V2, V3, V4, V5; see Table 6.
Fig 6.
Vbias/Voper as a function of the multiplex rate
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
12 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
8.4 LCD drive mode waveforms
Tfr
ROW 0
COLUMN
0
VDD
V2
V3
V4
V5
VLCD
1
2
ON
3
4
5
6
OFF
7
1:8
VDD
V2
V3
V4
V5
VLCD
SYNC
ROW 0
COLUMN
VDD
V2
V3
V4
V5
VLCD
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1:16
VDD
V2
V3
V4
V5
VLCD
SYNC
VDD
V2
ROW 0
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
V3
V4
V5
VLCD
1:24
VDD
V2
COLUMN
V3
V4
V5
VLCD
SYNC
VDD
V2
ROW 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
V3
V4
V5
VLCD
1:32
VDD
V2
COLUMN
V3
V4
V5
VLCD
SYNC
msa841
Fig 7.
column
display
LCD row and column waveforms
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
13 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
Tfr
ROW 1
R1 (t)
VDD
V2
V3
V4
V5
VLCD
ROW 2
R2 (t)
VDD
V2
V3
V4
V5
VLCD
COL 1
C1 (t)
VDD
V2
V3
V4
V5
VLCD
COL 2
C2 (t)
VDD
V2
V3
V4
V5
VLCD
state 1 (OFF)
state 2 (ON)
dot matrix
1:8 multiplex rate
Voper
0.261 Voper
Vstate 1(t)
0V
0.261 Voper
Voper
Voper
0.478 Voper
0.261 Voper
Vstate 2(t)
0V
0.261 Voper
0.478 Voper
Voper
msa840
Vstate1(t) = C1(t) − R1(t).
V on ( RMS )
----------------------- =
V oper
1
8–1
--- + ------------------------ = 0.430
8 8( 8 + 1)
Vstate2(t) = C2(t) − R2(t).
V off ( RMS )
------------------------ =
V oper
Fig 8.
2( 8 – 1)
------------------------------2- = 0.297
8( 8 + 1)
LCD drive mode waveforms for 1:8 multiplex rate
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
14 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
state 1 (OFF)
state 2 (ON)
Tfr
ROW 1
R1 (t)
VDD
V2
V3
V4
V5
VLCD
ROW 2
R2 (t)
VDD
V2
V3
V4
V5
VLCD
COL 1
C1 (t)
VDD
V2
V3
V4
V5
VLCD
COL 2
C2 (t)
dot matrix
1:16 multiplex rate
VDD
V2
V3
V4
V5
VLCD
Voper
Vstate 1(t)
0.2 Voper
0V
0.2 Voper
Voper
Voper
0.6 Voper
Vstate 2(t)
0.2 Voper
0V
0.2 Voper
0.6 Voper
Voper
msa836
Vstate1(t) = C1(t) − R1(t).
V on ( RMS )
----------------------- =
V oper
1
16 – 1
------ + ------------------------------ = 0.316
16 16 ( 16 + 1 )
Vstate2(t) = C2(t) − R2(t).
V off ( RMS )
------------------------ =
V oper
Fig 9.
2 ( 16 – 1 )
------------------------------------2- = 0.254
16 ( 16 + 1 )
LCD drive mode waveform for 1:16 multiplex rate
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
15 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
8.5 Oscillator
8.5.1 Internal clock
The clock signal for the system may be generated by the internal oscillator and prescaler.
The frequency is determined by the value of the resistor Rext(OSC), see Figure 10. For
normal use a value of 330 kΩ is recommended. The clock signal, for cascaded
PCF8579s, is output at CLK and has a frequency of 1⁄6 (multiplex rate 1:8, 1:16 and 1:32)
or 1⁄8 (multiplex rate 1:24) of the oscillator frequency.
msa837
103
fosc
(kHz)
102
10
1
10
102
103
104
Rext(OSC) (kΩ)
To avoid capacitive coupling, which could adversely affect oscillator stability, Rext(OSC) should be
placed as closely as possible to the OSC pin. If this proves to be a problem, a filtering capacitor
may be connected in parallel to Rext(OSC).
Fig 10. Oscillator frequency as a function of external oscillator resistor, Rext(OSC)
8.5.2 External clock
If an external clock is used, OSC must be connected to VDD and the external clock signal
to CLK. Table 8 summarizes the nominal CLK and SYNC frequencies.
Table 8.
Signal frequencies required for nominal 64 Hz frame frequency[1]
Oscillator frequency,
fosc (Hz)[2]
Frame frequency,
ffr (Hz)
Multiplex rate, Division ratio Clock frequency,
(1:n)
fclk (Hz)
12288
64
1:8, 1:16, 1:32 6
2048
12288
64
1:24
1536
8
[1]
A clock signal must always be present, otherwise the LCD may be frozen in a DC state.
[2]
Rext(OSC) = 330 kΩ.
8.6 Timing generator
The timing generator of the PCF8578 organizes the internal data flow of the device and
generates the LCD frame synchronization pulse SYNC, whose period is an integer
multiple of the clock period. In cascaded applications, this signal maintains the correct
timing relationship between the PCF8578 and PCF8579s in the system.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
16 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
8.7 Row and column drivers
Outputs R0 to R7 and C32 to C39 are fixed as row and column drivers respectively. The
remaining 24 outputs R8/C8 to R31/C31 are programmable and may be configured (in
blocks of 8) to be either row or column drivers. The row select signal is produced
sequentially at each output from R0 up to the number defined by the multiplex rate (see
Table 4). In mixed mode the remaining outputs are configured as columns. In row mode all
programmable outputs (R8/C8 to R31/C31) are defined as row drivers and the outputs
C32 to C39 should be left open-circuit.
Using a 1:16 multiplex rate, two sets of row outputs are driven, thus facilitating split-screen
configurations, i.e. a row select pulse appears simultaneously at R0 and R16/C16, R1 and
R17/C17 etc. Similarly, using a multiplex rate of 1:8, four sets of row outputs are driven
simultaneously. Driver outputs must be connected directly to the LCD. Unused outputs
should be left open circuit.
Depending on the multiplex rate the following outputs are rows:
•
•
•
•
In MUX 1:8 R0 to R7
In MUX 1:16 R0 to R15/C15
In MUX 1:24 R0 to R23/C23
In MUX 1:32 R0 to R31/C31
The configuration of the outputs (row or column) and the selection of the appropriate
driver waveforms are controlled by the display mode controller.
8.8 Characteristics of the I2C-bus
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial Data Line (SDA) and a Serial Clock Line (SCL) which must be
connected to a positive supply via a pull-up resistor. Data transfer may be initiated only
when the bus is not busy.
8.8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this
moment will be interpreted as control signals.
8.8.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line, while the clock is HIGH, is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock is HIGH, is defined as the STOP
condition (P).
8.8.3 System configuration
A device transmitting a message is a transmitter, a device receiving a message is the
receiver. The device that controls the message flow is the master and the devices which
are controlled by the master are the slaves.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
17 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
8.8.4 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each data byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse. A slave receiver
which is addressed must generate an acknowledge after the reception of each byte. Also
a master must generate an acknowledge after the reception of each byte that has been
clocked out of the slave transmitter. The device that acknowledges must pull down the
SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during
the HIGH period of the acknowledge related clock pulse (set-up and hold times must be
taken into consideration). A master receiver must signal the end of a data transmission to
the transmitter by not generating an acknowledge on the last byte that has been clocked
out of the slave. In this event the transmitter must leave the data line HIGH to enable the
master to generate a STOP condition.
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 11. Bit transfer
SDA
SCL
S
P
START condition
STOP condition
mba608
Fig 12. Definition of START and STOP condition
SDA
SCL
MASTER
TRANSMITTER /
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER /
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER /
RECEIVER
mba605
Fig 13. System configuration
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
18 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
clock pulse for
acknowledgement
START
condition
SCL FROM
MASTER
1
2
9
8
DATA OUTPUT
BY TRANSMITTER
S
DATA OUTPUT
BY RECEIVER
mba606
The general characteristics and detailed specification of the I2C-bus are available on request.
Fig 14. Acknowledgement on the I2C-bus
8.8.5 I2C-bus controller
The I2C-bus controller detects the I2C-bus protocol, slave address, commands and display
data bytes. It performs the conversion of the data input (serial-to-parallel) and the data
output (parallel-to-serial). The PCF8578 acts as an I2C-bus slave transmitter/receiver in
mixed mode, and as a slave receiver in row mode. A slave device cannot control bus
communication.
8.8.6 Input filters
To enhance noise immunity in electrically adverse environments, RC low-pass filters are
provided on the SDA and SCL lines.
8.8.7 I2C-bus protocol
Two 7-bit slave addresses (0111 100 and 0111 101) are reserved for both the PCF8578
and PCF8579. The least significant bit of the slave address is set by connecting input SA0
to either logic 0 (VSS) or logic 1 (VDD). Therefore, two types of PCF8578 or PCF8579 can
be distinguished on the same I2C-bus which allows:
1. One PCF8578 to operate with up to 32 PCF8579s on the same I2C-bus for very large
applications.
2. The use of two types of LCD multiplex schemes on the same I2C-bus.
In most applications the PCF8578 will have the same slave address as the PCF8579.
The I2C-bus protocol is shown in Figure 15. All communications are initiated with a START
condition (S) from the I2C-bus master, which is followed by the desired slave address and
read/write bit. All devices with this slave address acknowledge in parallel. All other devices
ignore the bus transfer.
In WRITE mode (indicated by setting the read/write bit LOW) one or more commands
follow the slave address acknowledgement. The commands are also acknowledged by all
addressed devices on the bus. The last command must clear the continuation bit C.
After the last command a series of data bytes may follow. The acknowledgement after
each byte is made only by the (A0, A1, A2 and A3) addressed PCF8579 or PCF8578 with
its implicit subaddress 0. After the last data byte has been acknowledged, the I2C-bus
master issues a STOP condition (P).
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
19 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
acknowledge
by A0, A1, A2 and A3
selected PCF8578s /
PCF8579s only
acknowledge by
all addressed
PCF8578s / PCF8579s
R/ W
slave address
S
0 1 1 1 1 0 A 0 A C
0
S
A
COMMAND
DISPLAY DATA
n ≥ 0 byte(s)
1 byte
A
P
n ≥ 0 byte(s)
update data pointers
and if necessary,
subaddress counter
(a)
msa830
a. Master transmits to slave receiver (WRITE mode)
acknowledge by
all addressed
PCF8578s / PCF8579s
slave address
S
acknowledge
from master
slave address
S
0 1 1 1 1 0 A 0 A C
0
R/ W
COMMAND
A S
n ≥ 1 byte
S
0 1 1 1 1 0 A 1 A
0
DATA
no acknowledge
from master
A
DATA
n bytes
R/W
at this moment master
transmitter becomes a
master receiver and
PCF8578/PCF8579 slave
receiver becomes a
slave transmitter
1
P
last byte
update data pointers
and if necessary
subaddress counter
msa832
(b)
b. Master reads after sending command string (write commands; read data)
acknowledge by
all addressed
PCF8578s / PCF8579s
acknowledge
from master
no acknowledge
from master
slave address
S
S
0 1 1 1 1 0 A 1 A
0
R/ W
DATA
A
n bytes
(c)
DATA
1
P
last byte
update data pointers
and if necessary,
subaddress counter
msa831
c. Master reads slave immediately after sending slave address (READ mode)
Fig 15. I2C-bus protocol
In READ mode, indicated by setting the read/write bit HIGH, data bytes may be read from
the RAM following the slave address acknowledgement. After this acknowledgement the
master transmitter becomes a master receiver and the PCF8578 becomes a slave
transmitter. The master receiver must acknowledge the reception of each byte in turn. The
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
20 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
master receiver must signal an end of data to the slave transmitter, by not generating an
acknowledge on the last byte clocked out of the slave. The slave transmitter then leaves
the data line HIGH, enabling the master to generate a STOP condition (P).
Display bytes are written into, or read from the RAM at the address specified by the data
pointer and subaddress counter. Both the data pointer and subaddress counter are
automatically incremented, enabling a stream of data to be transferred either to, or from
the intended devices.
In multiple device applications, the hardware subaddress pins of the PCF8579s (A0 to A3)
are connected to VSS or VDD to represent the desired hardware subaddress code. If two or
more devices share the same slave address, then each device must be allocated to a
unique hardware subaddress.
8.9 Display RAM
The PCF8578 contains a 32 × 40-bit static RAM which stores the display data. The RAM
is divided into 4 banks of 40 bytes (4 × 8 × 40 bits). During RAM access, data is
transferred to and from the RAM via the I2C-bus. The first eight columns of data (0 to 7)
cannot be displayed but are available for general data storage and provide compatibility
with the PCF8579. There is a direct correspondence between X-address and column
output number.
8.9.1 Data pointer
The addressing mechanism for the display RAM is realized using the data pointer. This
allows an individual data byte or a series of data bytes to be written into, or read from, the
display RAM, controlled by commands sent on the I2C-bus.
8.9.2 Subaddress counter
The storage and retrieval of display data is dependent on the content of the subaddress
counter. Storage takes place only when the contents of the subaddress counter match
with the hardware subaddress. The hardware subaddress of the PCF8578, valid in mixed
mode only, is fixed at 0000.
8.10 Command decoder
The command decoder identifies command bytes that arrive on the I2C-bus.
The five commands available to the PCF8578 are defined in Table 9.
Table 9.
Definition of PCF8578 commands
Command
Operation code
Reference
Bit
7
6
5
4
3
set-mode
C
1
0
T
E[1:0]
set-start-bank
C
1
1
1
1
device-select
C
1
1
0
A[3:0]
RAM-access
C
1
1
1
G[1:0]
load-X-address
C
0
X[5:0]
2
1
1
0
M[1:0]
Table 11
B[1:0]
Table 12
Table 13
Y[1:0]
Table 14
Table 15
The most-significant bit of a command is the continuation bit C (see Table 10 and
Figure 16). Commands are transferred in WRITE mode only.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
21 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
Table 10.
C bit description
Bit
Symbol
7
C
Value
Description
continue bit
0
last control byte in the transfer; next byte will be regarded
as display data
1
control bytes continue; next byte will be a command too
MSB
C
LSB
REST OF OPCODE
msa833
C = 0; last command.
C = 1; commands continue.
Fig 16. General information of command byte
Table 11.
Set-mode - command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Table 10
6, 5
-
10
fixed value
4
T
3, 2
1, 0
display mode
0
row mode
1
mixed mode
E[1:0]
display status
00
blank
01
normal
10
all segments on
11
inverse video
M[1:0]
LCD drive mode
01
1:8 MUX (8 rows)
10
1:16 MUX (16 rows)
11
1:24 MUX (24 rows)
00
1:32 MUX (32 rows)
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
22 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
Table 12.
Set-start-bank - command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Table 10
6 to 2
-
11111
1, 0
B[1:0]
[1]
fixed value
start bank pointer (see Figure 20)[1]
00
bank 0
01
bank 1
10
bank 2
11
bank 3
Useful for scrolling, pseudo-motion and background preparation of new display content.
Table 13.
Bit
Device-select - command bit description
Symbol
Value
Description
7
C
0, 1
see Table 10
6 to 4
-
110
fixed value
3 to 0
A[3:0]
0 to 15[1]
hardware subaddress;
4 bit binary value; transferred to the subaddress
counter to define one of sixteen hardware
subaddresses
[1]
Values shown in decimal.
Table 14.
RAM-access - command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Table 10
6 to 4
-
111
fixed value
3, 2
G[1:0]
RAM access mode;
defines the auto-increment behavior of the
address for RAM access (see Figure 18)
1, 0
Y[1:0]
00
character
01
half-graphic
10
full-graphic
11
not allowed[1]
0 to 3[2]
RAM row address;
two bits of immediate data, transferred to the
Y-address pointer to define one of four display
RAM rows (see Figure 17)
[1]
See operation code for set-start-bank in Table 12.
[2]
Values shown in decimal.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
23 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
Table 15.
Load-X-address - command bit description
Bit
Symbol
Value
Description
7
C
0, 1
see Table 10
6
-
0
fixed value
5 to 0
X[5:0]
0 to 39[1]
RAM column address;
six bits of immediate data, transferred to the
X-address pointer to define one of forty display
RAM columns (see Figure 17)
[1]
Values shown in decimal.
8.11 RAM access
1 byte
0
LSB
Y address
Y max
MSB
0
X address
X max
001aaj920
Fig 17. RAM addressing scheme
RAM operations are only possible when the PCF8578 is in mixed mode. In this event its
hardware subaddress is internally fixed at 0000 and the hardware subaddresses of any
PCF8579 used in conjunction with the PCF8578 must start at 0001.
There are three RAM-access modes:
• Character
• Half-graphic
• Full-graphic
These modes are specified by the bits G[1:0] of the RAM-access command. The
RAM-access command controls the order in which data is written to or read from the RAM
(see Figure 18).
To store RAM data, the user specifies the location into which the first byte will be loaded
(see Figure 19):
• Device subaddress (specified by the device-select command)
• RAM X-address (specified by the bits X[5:0] of the load-X-address command)
• RAM bank (specified by the bits Y[1:0] of the RAM-access command)
Subsequent data bytes will be written or read according to the chosen RAM-access mode.
Device subaddresses are automatically incremented between devices until the last device
is reached. If the last device has subaddress 15, further display data transfers will lead to
a wrap-around of the subaddress to 0.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
24 of 46
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
PCF8579
driver 1
driver 2
NXP Semiconductors
PCF8578_6
Product data sheet
PCF8578/PCF8579
driver k
bank 0
bank 1
RAM
4 bytes
bank 2
bank 3
PCF8578/PCF8579 system RAM
1 ≤ k ≤ 16
40-bits
Rev. 06 — 5 May 2009
1 byte
0
1
2
3
4
5
6
7
8
LSB
9 10 11
character mode
0
2
4
6
8 10 12 14 16 18 20 22
1
3
5
7
9 11 13 15 17 19 21 23
2 bytes
half-graphic mode
4
8 12 16 20 24 28 32 36 40 44
1
5
9 13 17 21 25 29 33 37 41 45
2
6 10 14 18 22 26 30 34 38 42 46
3
7 11 15 19 23 27 31 35 39 43 47
4 bytes
25 of 46
© NXP B.V. 2009. All rights reserved.
RAM data bytes are
written or read as
indicated above
Fig 18. RAM access mode
full-graphic mode
msa849
PCF8578
0
LCD row/column driver for dot matrix graphic displays
MSB
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8578_6
Product data sheet
DEVICE SELECT:
subaddress 12
RAM ACCESS:
bank 0
character mode
bank 1
bank 1
bank 2
RAM
bank 3
Rev. 06 — 5 May 2009
LOAD X-ADDRESS: X-address = 8
R/ W
slave address
S
S 0 1 1 1 1 0 A 1 A
0
DATA
A
R /W
slave address
S
DEVICE SELECT
LOAD X-ADDRESS
RAM ACCESS
S
0 1 1 1 1 0 A 0 A 1 1 1 0 1 1 0 0 A 1 0 0 0 1 0 0 0 A 0 1 1 1 0 0 0 1 A
0
last command
WRITE
DATA
A
DATA
A
msa835
PCF8578
26 of 46
© NXP B.V. 2009. All rights reserved.
Fig 19. Example of commands specifying initial data byte RAM locations
LCD row/column driver for dot matrix graphic displays
READ
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
8.12 Display control
The display is generated by continuously shifting rows of RAM data to the dot matrix LCD
via the column outputs. The number of rows scanned depends on the multiplex rate set by
bits M[1:0] of the set-mode command.
RAM
bank 0
top of LCD
bank 1
LCD
bank 2
bank 3
msa851
1:32 multiplex rate and start bank = 2.
Fig 20. Relationship between display and set-start-bank
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
27 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
The display status (all dots on or off and normal or inverse video) is set by the bits E[1:0]
of the set-mode command. For bank switching, the RAM bank corresponding to the top of
the display is set by the bits B[1:0] of the set-start-bank command. This is shown in
Figure 20. This feature is useful when scrolling in alphanumeric applications.
9. Limiting values
Table 16. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
−0.5
+8.0
V
VLCD
LCD supply voltage
VDD − 11
+8.0
V
VI
input voltage
−0.5
+8.0
V
VDD − 11
+8.0
V
−0.5
+8.0
V
VDD − 11
+8.0
V
VDD related;
on pins SDA, SCL,
CLK, TEST, SA0
and OSC
VLCD related;
V2 to V5
VO
output voltage
VDD related;
SYNC and CLK
VLCD related;
R0 to R7, R8/C8 to
R31/C31 and C32
to C39
II
input current
−10
+10
mA
IO
output current
−10
+10
mA
IDD
supply current
−50
+50
mA
IDD(LCD)
LCD supply current
−50
+50
mA
ISS
ground supply current
−50
+50
mA
Ptot
total power dissipation
-
400
mW
Po
output power
-
100
mW
−65
+150
°C
Tstg
[1]
per package
storage temperature
According to the NXP store and transport conditions (document SNW-SQ-623) the devices have to be
stored at a temperature of +5 °C to +45 °C and a humidity of 25 % to 75 %.
PCF8578_6
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
28 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
10. Static characteristics
Table 17. Static characteristics
VDD = 2.5 V to 6 V; VSS = 0 V; VLCD = VDD − 3.5 V to VDD − 9 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
2.5
-
6.0
V
VLCD
LCD supply voltage
VDD − 9
-
VDD − 3.5
V
IDD
supply current
-
6
15
µA
-
20
50
µA
0.8
1.3
1.8
V
external clock;
[1]
fclk = 2 kHz
internal clock;
Rext(OSC) = 330 kΩ
[2]
power-on reset voltage
VPOR
Logic
VIL
LOW-level input voltage
VSS
-
0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
VDD
V
IOL
LOW-level output current
at pins SYNC and CLK;
VOL = 1 V; VDD = 5 V
1
-
-
mA
at pin SDA;
3
-
-
mA
VOL = 0.4 V; VDD = 5 V
IOH
HIGH-level output current
at pins SYNC and CLK;
VOH = 4 V; VDD = 5 V;
-
-
−1
mA
IL
leakage current
at pins SDA, SCL, SYNC,
CLK, TEST and SA0;
Vi = VDD or VSS
−1
-
+1
mA
at pin OSC;
Vi = VDD
−1
-
+1
µA
-
-
5
pF
[3]
capacitance for each I/O pin
Ci
LCD outputs
IL
leakage current
at pins V2 to V5;
Vi = VDD or VLCD
−2
-
+2
µA
Voffset(DC)
DC offset voltage
on pins R0 to R7, R8/C8 to
R31/C31 and C32 to C39
-
±20
-
mV
RO
output resistance
on row output pins: R0 to
R7 and R8/C8 to R31/C31
[4]
-
1.5
3
kΩ
on column output pins:
R8/C8 to R31/C31 and C32
to C39
[4]
-
3
6
kΩ
[1]
Outputs are open; inputs at VDD or VSS; I2C-bus inactive; external clock with 50 % duty factor.
[2]
Resets all logic when VDD < VPOR.
[3]
Periodically sampled; not 100 % tested.
[4]
Resistance measured between output terminal (R0 to R7, R8/C8 to R31/C31 and C32 to C39) and bias input (V2 to V5, VDD and VLCD)
when the specified current flows through one output under the following conditions (see Table 6 on page 11):
a) Voper = VDD − VLCD = 9 V.
b) Row mode, R0 to R7 and R8/C8 to R31/C31: V2 − VLCD ≥ 6.65 V; V5 − VLCD ≤ 2.35 V; Iload = 150 µA.
c) Column mode, R8/C8 to R31/C31 and C32 to C39: V3 − VLCD ≥ 4.70 V; V4 − VLCD ≤ 4.30 V; Iload = 100 µA.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
29 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
11. Dynamic characteristics
Table 18. Dynamic characteristics
All timing values are referenced to VIH and VIL levels with an input voltage swing of VSS to VDD. VDD = 2.5 V to 6 V; VSS = 0 V;
VLCD = VDD − 3.5 V to VDD − 9 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fclk
clock frequency
at multiplex rate 1:8, 1:16
and 1:32;
Rext(OSC) = 330 kΩ;
VDD = 6 V
1.2
2.1
3.3
kHz
at multiplex rate 1:24;
Rext(OSC) = 330 kΩ;
VDD = 6 V
0.9
1.6
2.5
kHz
-
-
500
ns
-
-
100
µs
-
-
100
kHz
tPD(SYNC_N) SYNC propagation delay
tPD(drv)
driver propagation delay
VDD − VLCD = 9 V;
with test load of 45 pF
I2C-bus
fSCL
SCL clock frequency
tw(spike)
spike pulse width
-
-
100
ns
tBUF
bus free time between a STOP
and START condition
4.7
-
-
µs
tSU;STA
set-up time for a repeated START
condition
4.7
-
-
µs
tHD;STA
hold time (repeated) START
condition
4.0
4.0
-
µs
tLOW
LOW period of the SCL clock
4.7
-
-
µs
tHIGH
HIGH period of the SCL clock
4.0
-
-
µs
tr
rise time of both SDA and SCL
signals
-
-
1
µs
tf
fall time of both SDA and SCL
signals
-
-
0.3
µs
tSU;DAT
data set-up time
250
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
tSU;STO
set-up time for STOP condition
4.0
-
-
µs
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
30 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
1/fclk
0.7 VDD
CLK
0.3 VDD
0.7 VDD
SYNC
0.3 VDD
tPD(SYNC_N)
tPD(SYNC_N)
0.5 V
C39 to C32,
R31/C31 to R8/C8
and R7 to R0
(VDD − VLCD = 9 V)
0.5 V
tPD(drv)
msa834
Fig 21. Driver timing waveforms
SDA
tBUF
tLOW
tf
SCL
tHD;STA
tr
tHD;DAT
tHIGH
tSU;DAT
SDA
tSU;STA
tSU;STO
mga728
Fig 22. I2C-bus timing waveforms
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
31 of 46
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx
xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
Rev. 06 — 5 May 2009
R0 R1
R2
R3
R4
R5
R6
R7
NXP Semiconductors
12. Application information
PCF8578_6
Product data sheet
LCD DISPLAY
R8/ R9/ R10/ R11/ R12/ R13/ R14/ R15/ R16/ R17/ R18/ R19/ R20/ R21/ R22/ R23/ R24/ R25/ R26/ R27/
C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27
PCF8578
V3
V4
R31/ R30/ R29/ R28/
V5 VLCD n.c. n.c. C39 C38 C37 C36 C35 C34 C33 C32 C31 C30 C29 C28
Rext(OSC)
msa844
PCF8578
32 of 46
© NXP B.V. 2009. All rights reserved.
Fig 23. Stand alone application using 8 rows and 32 columns
LCD row/column driver for dot matrix graphic displays
VSS
SA0
OSC VDD V2
SDA SCL SYNC CLK
TEST
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
PCF8578: Segment Driver
Application
a
R0
f
R7
b
g
e
one line of 24 digits 7 segment
one line of 12 digits star-burst
(mux 1:16)
Total: 384 segments
c
dp
d
LCD
R8
R15
12
1
(Using 1:16 mux, the first
character data must be
loaded in bank 0 and 1
starting at byte number 16)
C16
16
0
C17
C39
17
39
Bank
0
EE
R
AM
1
ALTERNATE DISPLAY BANK
FR
DISPLAY
RAM
PCF8578
a LSB
b
f
g
c
e
d
dp MSB
ALTERNATE DISPLAY BANK
(1)
2
3
mlb423
1-byte
Fig 24. Segment driver application for up to 384 segments
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
33 of 46
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8578_6
Product data sheet
VDD
VDD
C
V2
C
R
C
(4 2 3)R
1:32 multiplex rate
32 × 40 × k dots (k ≤ 16)
(20480 dots max.)
32
R
LCD DISPLAY
rows
V3
Rev. 06 — 5 May 2009
8
V4
C
PCF8578
(ROW MODE)
R
40
columns
unused columns
40
columns
subaddress 0
40
columns
subaddress 1
subaddress k−1
V5
VSS
SA0
R
VLCD
VLCD
VSS
VDD
VDD
VLCD
OSC
V3
Rext(OSC)
VSS SDA SCL CLK SYNC
VSS
A0
#1
PCF8579
VDD
VDD
A1
VLCD
A2
V3
A0
VDD
VDD
#2
A1
VLCD
PCF8579
A2
V3
A0
#k
A1
PCF8579
A2
V4
A3
VSS SYNC CLK SCL SDA SA0
V4
A3
VSS SYNC CLK SCL SDA SA0
V4
A3
VSS SYNC CLK SCL SDA SA0
VSS
VSS
VSS
VSS
VSS
VSS
VDD
SCL
SDA
PCF8578
34 of 46
© NXP B.V. 2009. All rights reserved.
Fig 25. Typical LCD driver system with 1:32 multiplex rate
msa845
LCD row/column driver for dot matrix graphic displays
C
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8578_6
Product data sheet
VDD
VSS
A2
#k
PCF8579
A1
C
R
C
R
SA0 SDA SCL CLK SYNC VSS
A3
V3
V4
A2
VLCD
A1
VDD
40
columns
subaddress 1
VDD
#1
PCF8579
V4
VLCD
VDD
A0
VDD
40
columns
subaddress 0
1:16 multiplex rate
16 × 40 × k dots (k ≤ 16)
(10240 dots max.)
16
1:16 multiplex rate
16 × 40 × k dots (k ≤ 16)
(10240 dots max.)
PCF8578
8
(ROW MODE)
unused columns
V4
#2
PCF8579
A0
rows
V3
R
VDD
LCD DISPLAY
rows
V2
C
A1
VSS
40
columns
40
columns
subaddress 0
40
columns
subaddress 1
subaddress k 1
V5
C
SA0
R
VLCD
VLCD
VDD
VSS/VDD
VDD
V3
VSS
OSC
VSS SDA SCL CLK SYNC
A0
VLCD
#1
PCF8579
V4
Rext(OSC)
VSS
VSS
VSS
SYNC CLK
VDD
VDD
A0
A1
VLCD
A2
V3
A3
V4
SCL SDA SA0
VSS
VSS
VSS
#2
PCF8579
VDD
VDD
A0
A1
VLCD
A2
V3
A3
V4
#k
PCF8579
A1
A2
A3
SYNC CLK SCL SDA SA0
VSS
SYNC CLK SCL SDA SA0
VSS
VSS
VSS
VDD
SCL
SDA
msa847
PCF8578
35 of 46
© NXP B.V. 2009. All rights reserved.
Fig 26. Split screen application with 1:16 multiplex rate for improved contrast
LCD row/column driver for dot matrix graphic displays
Rev. 06 — 5 May 2009
R
A2
16
VDD
C
V4
VLCD
40
columns
subaddress k 1
VDD
VDD
SA0 SDA SCL CLK SYNC VSS
V3
A3
VDD
A0
VSS
VDD
SA0 SDA SCL CLK SYNC VSS
V3
A3
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8578_6
Product data sheet
VDD
VSS
SA0 SDA SCL CLK SYNC VSS
SA0 SDA SCL CLK SYNC VSS
A3
V3
A3
V4
A2
V4
A2
VLCD
A1
VLCD
A1
#k
PCF8579
VDD
PCF8579
VDD
A0
40
columns
subaddress 1
VDD
V3
#1
PCF8579
V4
VLCD
VDD
A0
VDD
40
columns
subaddress 0
1:32 multiplex rate
32 × 40 × k dots (k ≤ 16)
(20480 dots max.)
LCD DISPLAY
32
V2
32
1:32 multiplex rate
32 × 40 × k dots (k ≤ 16)
(20480 dots max.)
(4 2 3)R
rows
V3
C
PCF8578
8
(ROW MODE)
unused columns
V4
R
#2
40
columns
40
columns
subaddress 0
40
columns
subaddress 1
subaddress k 1
V5
C
SA0
R
VLCD
VDD
VSS/VDD
VDD
V3
VLCD
VSS
VSS
OSC
SDA SCL CLK SYNC
A0
VLCD
#1
PCF8579
V4
Rext(OSC)
VSS
VSS SYNC CLK
VSS
VDD
VDD
A1
VLCD
A2
V3
A3
V4
SCL SDA SA0
VSS
A0
#2
PCF8579
VDD
VDD
A1
VLCD
A2
V3
A3
V4
A0
#k
PCF8579
A1
A2
VSS SYNC CLK SCL
SDA SA0
A3
VSS SYNC CLK SCL
SDA SA0
VSS
VSS
VSS
VSS
VDD
SCL
SDA
msa846
PCF8578
36 of 46
© NXP B.V. 2009. All rights reserved.
Fig 27. Split screen application with 1:32 multiplex rate
LCD row/column driver for dot matrix graphic displays
Rev. 06 — 5 May 2009
VDD
C
VDD
40
columns
subaddress k 1
VDD
R
VSS
V3
A0
C
VDD
A3
A1
R
VSS
SA0 SDA SCL CLK SYNC VSS
A2
C
VDD
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF8578_6
Product data sheet
VSS
SCL VDD
VLCD
SDA
R0
R
Rext(OSC)
(4 2 3)R
R R
R
n.c.
n.c.
LCD DISPLAY
PCF8578
C0
C27
C28
C39
C0
PCF8579
C27
C28
C39
PCF8579
c.
n.
c.
n.
msa852
Fig 28. Example of wiring, single screen with 1:32 multiplex rate (PCF8578 in row driver mode)
PCF8578
37 of 46
© NXP B.V. 2009. All rights reserved.
to other
PCF8579s
LCD row/column driver for dot matrix graphic displays
Rev. 06 — 5 May 2009
R31/C31
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
13. Package outline
VSO56: plastic very small outline package; 56 leads
SOT190-1
D
E
A
X
c
y
HE
v M A
Z
56
29
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
detail X
28
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
3.3
0.3
0.1
3.0
2.8
0.25
0.42
0.30
0.22
0.14
21.65
21.35
11.1
11.0
0.75
15.8
15.2
2.25
1.6
1.4
1.45
1.30
0.2
0.1
0.1
0.90
0.55
inches
0.13
0.012
0.004
0.12
0.11
0.01
0.017 0.0087 0.85
0.012 0.0055 0.84
0.44
0.62
0.0295
0.43
0.60
0.089
0.063
0.055
0.057
0.035
0.008 0.004 0.004
0.051
0.022
θ
7o
o
0
Notes
1. Plastic or metal protrusions of 0.3 mm (0.012 inch) maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
97-08-11
03-02-19
SOT190-1
Fig 29. Package outline SOT190-1 (VSO56) of PCF8578T/1
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
38 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
c
y
X
A
48
33
49
32
ZE
e
E HE
A
A2
(A 3)
A1
wM
θ
bp
pin 1 index
64
Lp
L
17
detail X
16
1
ZD
e
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
1.45
1.05
1.45
1.05
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT314-2
136E10
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 30. Package outline SOT314-2 (LQFP64) of PCF8578H/1
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
39 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
TQFP64: plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm
SOT357-1
c
y
X
A
48
33
49
32
ZE
e
E HE
A
(A 3)
A2 A
1
wM
pin 1 index
θ
bp
64
Lp
L
17
detail X
16
1
ZD
e
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.1
Z D(1) Z E(1)
1.45
1.05
1.45
1.05
θ
o
7
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT357-1
137E10
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
02-03-14
Fig 31. Package outline SOT357-1 (TQFP64) of PCF8578HT/1
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
40 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
41 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 32) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 19 and 20
Table 19.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 20.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 32.
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
42 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 32. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 21.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DC
Direct Current
I2C
Inter-Integrated Circuit
IC
Integrated Circuit
LCD
Liquid Crystal Display
LSB
Least Significant Bit
MSB
Most Significant Bit
MSL
Moisture Sensitivity Level
PCB
Printed-Circuit Board
POR
Power-On Reset
RC
Resistance-Capacitance
RAM
Random Access Memory
RMS
Root Mean Square
SCL
Serial Clock Line
SDA
Serial Data Line
SMD
Surface Mount Device
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
43 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
16. Revision history
Table 22.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF8578_6
20090505
Product data sheet
-
PCF8578_5
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Added package type TQFP64 (PCF8578HT/1)
Removed bare die types
Rearranged information in data sheet
Corrected values for 1:32 multiplex mode in Table 4
Changed letter symbols to NXP approved symbols
Added RAM addressing scheme (Figure 17)
PCF8578_5
20030414
Product specification
-
PCF8578_4
PCF8578_4
19980908
Product specification
-
PCF8578_3
PCF8578_3
19970328
Product specification
-
PCF8578_2
PCF8578_2
19961028
Product specification
-
PCF8578_1
PCF8578_1
19940125
Product specification
-
-
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
44 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF8578_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 5 May 2009
45 of 46
PCF8578
NXP Semiconductors
LCD row/column driver for dot matrix graphic displays
19. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.6
8.7
8.8
8.8.1
8.8.2
8.8.3
8.8.4
8.8.5
8.8.6
8.8.7
8.9
8.9.1
8.9.2
8.10
8.11
8.12
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional description . . . . . . . . . . . . . . . . . . . 8
Display configurations. . . . . . . . . . . . . . . . . . . . 8
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 10
Multiplexed LCD bias generation . . . . . . . . . . 10
LCD drive mode waveforms . . . . . . . . . . . . . . 13
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Internal clock. . . . . . . . . . . . . . . . . . . . . . . . . . 16
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 16
Timing generator. . . . . . . . . . . . . . . . . . . . . . . 16
Row and column drivers . . . . . . . . . . . . . . . . . 17
Characteristics of the I2C-bus . . . . . . . . . . . . . 17
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
START and STOP conditions . . . . . . . . . . . . . 17
System configuration . . . . . . . . . . . . . . . . . . . 17
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 18
I2C-bus controller . . . . . . . . . . . . . . . . . . . . . . 19
Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 19
Display RAM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Subaddress counter . . . . . . . . . . . . . . . . . . . . 21
Command decoder . . . . . . . . . . . . . . . . . . . . . 21
RAM access . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Display control . . . . . . . . . . . . . . . . . . . . . . . . 27
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 28
Static characteristics. . . . . . . . . . . . . . . . . . . . 29
Dynamic characteristics . . . . . . . . . . . . . . . . . 30
Application information. . . . . . . . . . . . . . . . . . 32
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 38
Soldering of SMD packages . . . . . . . . . . . . . . 41
Introduction to soldering . . . . . . . . . . . . . . . . . 41
Wave and reflow soldering . . . . . . . . . . . . . . . 41
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 41
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 42
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 44
17
17.1
17.2
17.3
17.4
18
19
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
45
45
45
45
45
45
46
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 May 2009
Document identifier: PCF8578_6
Similar pages