LCD-160H128B-TFK-VZ Datasheet

LCD-160H128B-TFK-VZ
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Vishay
160 x 128 Graphic LCD
FEATURES
• Type: Graphic
• Display format: 160 x 128 dots
• Built-in controller: RA6963
• Duty cycle: 1/128
• + 5 V power supply
• Optional N.V.
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
ITEM
ABSOLUTE MAXIMUM RATINGS
STANDARD VALUE
Module Dimension
UNIT
129.0 x 102.0 x 16.5 (max.)
Viewing Area
101.0 x 82.0
Dot Size
0.56 x 0.56
Dot Pitch
0.60 x 0.60
Mounting Hole
122.0 x 95.0
Character Size
N/a
mm
ITEM
SYMBOL
Power
Supply
STANDARD VALUE
MIN.
TYP.
MAX.
VDD to VSS
4.75
5.0
5.25
VI
VSS
-
VDD
Input Voltage
UNIT
V
Note
• VSS = 0 V, VDD = 5.0 V
ELECTRICAL CHARACTERISTICS
ITEM
Input Voltage
Supply Current
Recommended LC Driving
Voltage for Normal Temperature
Version Module
SYMBOL
CONDITION
VDD
STANDARD VALUE
UNIT
MIN.
TYP.
MAX.
L level
VDD - 2.2
-
VDD
V
VIO
H level
0
-
0.8
V
IDD
VDD = + 5 V
-
45
50
mA
- 20 °C
-
-
-
VDD to V0
0 °C
-
-
22.1
25 °C
-
19.2
-
50 °C
16.8
-
-
V
70 °C
-
-
-
CCFL Forward Voltage
VF
25 °C
-
-
-
VRMS
CCFL Forward Current
IF
25 °C
-
-
-
mA
LED Forward Voltage
VF
25 °C
-
-
-
V
LED Forward Current
IF
25 °C
-
-
-
mA
OPTIONS
PROCESS COLOR
TN
BACKLIGHT
STN
Gray
STN
Yellow
STN
Blue
FSTN
B&W
x
x
x
x
STN
Color
None
LED
EL
CCFL
x
x
x
x
For detailed information, please see the “Product Numbering System” document.
Document Number: 37469
1
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INTERFACE PIN FUNCTION
PIN NO.
SYMBOL
FUNCTION
1
FG
Frame ground
2
VSS
Ground (0 V)
3
VDD
Power supply for logic (+ 5 V)
Power supply for LCD contrast adjustment
4
VADJ
5
VEE
Negative voltage output
6
WR
Data write, write data into RA6963 when WR = L
7
RD
Data read, read data from RA6963 when RD = L
8
CE
Chip enable the controller RA6963
9
C/D
WR = L, C/D = H: Command write, C/D = L: Data write
RD = L, C/D = H: Status read, C/D = L: Data read
10
HALT
Clock operating stop signal
11
RESET
Reset signal
12
DB0
Data bus line
13
DB1
Data bus line
14
DB2
Data bus line
15
DB3
Data bus line
16
DB4
Data bus line
17
DB5
Data bus line
18
DB6
Data bus line
19
DB7
Data bus line
20
NC
No connection
DIMENSIONS in millimeters
129.0 ± 0.5
3.5
118.0
101.0 (VA)
13.12
2.54
95.96 (AA)
3.5
16.5 Max.
11.9
2.5
19
20
20 x Ø 1.0 PTH
20 x Ø 2.0 PAD
0.6
0.56
22.86
(P2.54 x 9)
2
33.5
1
75.76 (AA)
82.0 (VA)
88.0
96.2
95.0
102.0 ± 0.5
39.6
7.0
10.0
3.5
2.9
16.52
0.6
0.56
14.0
Dot Size
K
4 x Ø 3.5
3.5
57.5
57.0
122.0
5.0
A
4.0
1.6
LED B/L
Document Number: 37469
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1.Module Classification Information
LCD -160 H 128 B -T F K
c
d
e
f
g
h
i
j
-VZ
k
1. Brand᧶Vishay Intertechnology, Inc.
2. Horizontal Format: 160 columns
3. Display Type᧶Nൺ Character Type, Hൺ Graphic Type
4. Vertical Format:
128 Lines
5. Model serials no.: B
6. Backlight
Type᧶
Nൺ Without backlight
Aൺ LED, Amber
Bൺ EL, Blue green
Rൺ LED, Red
Dൺ EL, Green
Oൺ LED, Orange
Wൺ EL, White
Gൺ LED, Green
Fൺ CCFL, White
Tൺ LED, White
Yൺ LED, Yellow Green
7. LCD Mode᧶ Bൺ TN Positive, Gray
Tൺ FSTN Negative
Nൺ TN Negative,
Gൺ STN Positive, Gray
Yൺ STN Positive, Yellow Green
Mൺ STN Negative, Blue
Fൺ FSTN Positive
8. LCD
Polarizer
Type/
Temperature
range/ View
direction
Aൺ Reflective, N.T, 6:00
Hൺ Transflective, W.T,6:00
Dൺ Reflective, N.T, 12:00
Kൺ Transflective, W.T,12:00
Gൺ Reflective, W. T, 6:00
Cൺ Transmissive, N.T,6:00
Jൺ Reflective, W. T, 12:00
Fൺ Transmissive, N.T,12:00
Bൺ Transflective, N.T,6:00
Iൺ Transmissive, W. T, 6:00
Eൺ Transflective, N.T.12:00
Lൺ Transmissive, W.T,12:00
9. Special Code V: built-in Negative Voltage
Z:ICNT7086
Compliant with the ROHS Directions and regulations
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2.Precautions in use of LCD Modules
(1) Avoid applying excessive shocks to the module or making any alterations or modifications to it.
(2) Don’t make extra holes on the printed circuit board, modify its shape or change the components of
LCD module.
(3) Don’t disassemble the LCM.
(4) Don’t operate it above the absolute maximum rating.
(5) Don’t drop, bend or twist LCM.
(6) Soldering: only to the I/O terminals.
(7) Storage: please storage in anti-static electricity container and clean environment.
(8). Supplier has the right to change the passive components
(9). Supplier has the right to change the PCB Rev.
3.General Specification
ITEM
Number of Dots
STANDARD VALUE
UNIT
160 ™128
129.0™102.0™16.5(MAX)
mm
View area
101.0™82.0
mm
Active area
95.96 x 76.76
mm
Dot size
0.56™0.56
mm
Dot pitch
0.60 ™0.60
mm
Module dimension
LCD type
FSTN Positive, Transflective
(In LCD production, It will occur slightly color difference. We can
only guarantee the same color in the same batch.)
Duty
View direction
Backlight
1/128
12 o’clock
LED, White
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4.Absolute Maximum Ratings
ITEM
SYMBOL
MIN.
TYP.
MAX.
UNIT
Operating Temperature
T OP
-20
᧩
+70
ഒ
Storage Temperature
T ST
-30
᧩
+80
ഒ
Input Voltage
VI
V SS
᧩
V DD
V
Supply Voltage For Logic
VCC-V SS
-0.3
᧩
+7
V
Supply Voltage For LCD
V CC -V EE
0
᧩
28
V
5.Electrical Characteristics
ITEM
Supply Voltage For
Logic
SYMBOL
CONDITION
MIN.
TYP.
MAX.
UNIT
V DD -V SS
᧩
4.75
5.0
5.25
V
Ta=0ഒ
᧩
᧩
22.1
V
Ta=25ഒ
᧩
19.2
᧩
V
Ta=50ഒ
16.8
᧩
᧩
V
Supply Voltage For LCD
*Note
V DD -V 0
Input High Volt.
V IH
᧩
V DD -2.2
᧩
V DD
V
Input Low Volt.
V IL
᧩
0
᧩
0.8
V
Output High Volt.
V OH
᧩
V DD -0.3
᧩
V DD
V
Output Low Volt.
V OL
᧩
0
᧩
0.3
V
Supply Current
I DD
V DD =5V
᧩
42
50
mA
* Note: Please design the VOP adjustment circuit on customer's main board
Vcc
VR
10K~20K
Vadj
LCM
Module
Vee
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6.Optical Characteristics
ITEM
SYMBAL CONDITION
MIN.
TYP.
MAX.
UNIT
(V)˥
CRฺ 2
30
60
deg
(H)˳
CRฺ 2
-45
45
deg
CR
᧩
5
T rise
᧩
200
300
ms
T fall
᧩
200
300
ms
View Angle
Contrast Ratio
᧩
Response Time
6.1ġġ Definitions
ˍView Anglesġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ġ ˍContrast Ratio
Z
( Visual angle direction )
Brightness at selected state ( BS )
Brightness at non-selected state ( Bns )
Selected state
CR =
Brightness (%)
T
LCD
X
I
Non-selected state
Bs
Bns
Y
Operating voltage for LCD driving
( Best visual angle direction )
႑ Response Time
Selected Condition
Nonselected Condition
90 %
100 %
Brightness
Nonselected Condition
10 %
tr
Rise Time
td
Decay Time ( fall time tf )
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7.Power Supply for LCD Module and Contrast Adjust
Vcc
3
Vadj
4
10 K:
5V
LCD
MODULE
2
VSS
Vee
5
VDD-V0:
LCD Operating Voltage
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8.Outline dimension & block diagram
CData
LP
FR
HSCP
ED
10K~20K
VR
Vdd
Vadj
(optional)
(Vee)
Vdd,Vss,V1,V4,V5
Seg1~80
Seg81~160
Seg Driver
Seg Driver
Bias and
Power Circuit
Vss
-16V
Com81~128
32K8
SRAM
160X128 DOT
Com Driver
Address Data
Com1~80
80 series
or
68 series
RA6963
Controller
Com Driver
MPU
WR
RD
CE
C/D
HALT
RESET
DB0~DB7
N.V.
Generator
Vdd,Vss,V2,V3,V5
Frame
(Bezel)
FG
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9.Interface Pin Function
Pin No. Symbol
Level
Description
1
FG
Frame ground
2
Vss
0V
3
VDD
5.0V
4
Vadj
Power supply for LCD contrast adjustment
5
Vee
Negative voltage Output
6
/WR
L
Data write. Write data into RA6963 when /WR = L
7
/RD
L
Data read. Read data from RA6963 when RD = L
8
/CE
L
Chip enable the controller RA6963
9
C/D
Ground
Power supply for logic
H / L WR=L , C/D=H : Command Write C/D=L: Data write
RD=L , C/D=H : Status Read
10
/HALT
L
Clock operating stop signal
11
/RESET
L
Reset signal
12
DB0
H / L Data bus line
13
DB1
H / L Data bus line
14
DB2
H / L Data bus line
15
DB3
H / L Data bus line
16
DB4
H / L Data bus line
17
DB5
H / L Data bus line
18
DB6
H / L Data bus line
19
DB7
H / L Data bus line
20
NC
C/D=L: Data read
NC
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10.Display control instruction
10.1 Communications with MPU
xStatus Read
A status check must be performed before data is read or written.
Status Check
The Status of RA6963 can be read from the data lines.
The RA6963 status word format is as follows:
Note 1: It is necessary to check STA0 and STA1 at the same time.
There is a possibility of erroneous operation due to a hardware interrupt.
Note 2: For most modes STA0 /STA1 are used as a status check.
Note 3: STA2 and STA3 are valid in Auto mode; STA0 and STA1 are invalid.
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Note 4: When using the MSB=0 command, a Status Read must be performed.
If a status check is not carried out, the RA6963 cannot operate normally, even
after a delay time.
The hardware interrupt occurs during the address calculation period (at the end of
each line).
If a MSB=0 command is sent to the RA6963 during this period, the RA6963
enters Wait status.
If a status check is not carried out in this state before the next command is sent,
there is the possibility that command or data will not be received.
x Setting Data
When using the RA6963, first set the data, then set the command.
Note: When sending more than two data, the last datum (or last two data) is valid.
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x Command Definitions
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10.2 Setting Registers
x Set Cursor Pointer
The X-Adrs and Y-Adrs specify the position of the cursor. The cursor position can only be moved by
this command. Data read /write from the MPU never changes the cursor pointer. X-Adrs and Y-Adrs
are specified as follows.
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x Set Offset Register
The offset register is used to determine the external character generator RAM area. The RA6963 has
a 16-bit address bus as follows:
RA6963 assign External character generator, when character code set 80h to FFh in using
Internal character generator. Character code 00h to 80h assign External character
generator, when External generator mode
The senior five bits define the start address in external memory of the CG RAM area.
The next eight bits represent the character code of the character. In internal CG ROM
mode, character Codes 00h to 7Fh represent the predefined “internal” CG ROM
characters, and codes 80h to FFh Represent the user’s own “external” characters. In
external CG RAM mode, all 256 codes from 00h to FFh can be used to represent the
user’s own characters. The three least significant bits indicate one of the eight rows of
eight dots that define the character’s shape.
The Relationship between Display RAM Address and Offset Register
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x Set Address Pointer
The Set Address Pointer command is used to indicate the start address for writing to (or reading from)
External RAM.
The Flowchart for Set Address Pointer Command
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10.3 Set Control Word
The home address and column size are defined by this command.
x Set Text Home Address
The starting address in the external display RAM for text display is defined by this command. The
text home address indicates the leftmost and uppermost position.
The Relationship between Display RAM Address and Display Position
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x Set Graphic Home Address
The starting address of the external display RAM used for graphic display is defined by
this Command. The graphic home address indicates the leftmost and uppermost position.
The Relationship between External Display RAM Address and Display Position
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x Set Text Area
The display columns are defined by the hardware setting. This command can be used adjust the
columns of the display.
x Set Graphic Area
The display columns are defined by the hardware setting. This command can be used to
adjust the columns of the graphic display.
If the graphic area setting is set to match the desired number of columns on the LCD, the
addressing scheme will be automatically modified so that the start address of each line
equals the end address of the previous line +1.
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10.4 Mode Set
The display mode is defined by this command. The display mode does not change until the
next command is sent. The logical OR, EXOR, AND of text or graphic display can be
displayed.
In internal Character Generator mode, character codes 00h to 7Fh are assigned to the
built-in Character generator ROM. The character codes 80h to FFh are automatically
assigned to the external character generator RAM.
Note: Attribute functions can only be applied to text display, since the attribute data is
placed in the graphic RAM area.
Attribute Function
The attribute operations are Reverse display, Character blink, bold and Inhibit. The attribute
data is written into the graphic area, which was defined by the Set Control word command.
Only text display is possible in Attribute Function mode; graphic display is automatically
disabled. However, the Display Mode command must be used to turn both Text and Graphic
on that in order to for the Attribute function available.
The attribute data for each character in the text area is written to the same address in the
graphic area.
The Attribute function is defined as follows.
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10.5 Display Mode
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10.6 Cursor Pattern Select
10.7 Data Auto Read/Write
This command is convenient for sending a full screen of data from the external display RAM.
After Setting Auto mode, a Data Write (or Read) command does not need sent between each
datum. A Data Auto Write (or Read) command must be sent after a Set Address Pointer
command. After this Command, the address pointer is automatically incremented by 1 after
each datum. In Auto mode, the RA6963 cannot accept any other commands.
The Auto Reset command must be sent to the RA6963 after all data has been sent, to clear
Auto Mode.
Note: A Status Check for Auto Mode STA2, STA3 should be checked between sending of each
datum. Auto Reset should be performed after checking STA3=1 (STA2=1). Refer to the following
flowchart.
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Document Number: 37469
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10.8 Data Read/Write
This command is used for writing data from the MPU to external display RAM, and reading
data from external display RAM. Data Write / Data Read should be executed after setting
address using Set Address Pointer command, The address pointer can be automatically
incremented or decremented using this command.
Note: This command is necessary for each 1-byte datum.
Refer to the following flowchart.
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10.9 Screen Peek
This command is used to transfer 1 byte of displayed data to the data stack; this byte can be
read from the MPU by data access. The logical combination of text and graphic display data
on the LCD screen can be read by this command.
The status (STA6) should be checked just after the Screen Peek command. If the address
Determined by the Set Address Pointer command is not in the graphic area, this command
is ignored and a status flag (STA6) is set.
Refer to the following flowchart.
Note: This command is available when hardware column number and software column number are
the same. Hardware column number is related to MD2 and MD3 setting. Software column number is
related to Set Text Area and Set Graphic Area command.
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10-10 Screen Copy
This command copies a single raster line of data to the graphic area.
The start point must be set using the Set Address Pointer command.
Note 1: If the attribute function is being used, this command is not available. (With Attribute data is
graphic area data.)
Note 2: With Dual-Scan, this command cannot be used (because the RA6963 cannot separate the
upper screen data and lower screen data).
Refer to the following flowchart.
Note: This command is available when hardware column number is the same. Hardware
column number is related to MD2 and MD3 setting. Software column number is related to
Set Text Area and Set Graphic Area command.
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10-11 Bit Set/Reset
This command used to set or reset a bit of the byte specified by the address pointer. Only one
bit can be set / reset at time.
Refer to following flowchart.
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10-12 Screen Reverse
Bit0 = 0烉 Normally display.
Bit0 = 1烉 Reverse the whole screen.
This command (D0h) is used to reverse the displayed data of the whole screen. When this function is
enabled, the displayed data on the LCD are reversed to show reversing pattern.
10-13 Blink Time
The blink time of the blink functions are adjusted by this command (50h). For example, if
the frequency of the frame equals 60Hz, the blink time can be adjusted from 0.066 second to
2 second by using software selections. The selections are listed in the Table 6-26.
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10-14 Cursor Auto Moving
Bit0 = 0烉 Disable.
Bit0 = 1烉 Enable.
The RA6963 provides a unique function for the automatic cursor movement. After writing (reading)
each displayed datum, the cursor pointer is automatically increased/decreased by one in the Cursor
Auto-Moving mode.
10-15 CGROM Font Select
This command (70h) is a convenient function for selecting the Character Font Map. The user
can get more built-in characters from CGROM Font-01 or CGROM Font-02, which is
determined by software selections. The selections are listed in the Table 6-30.
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10-16 Character Font Map
The RA6963 has two part number - RA6963L2NA and RA6963L2NB. The RA6963L2NA
is compatible to T6963C(code 0101) and the default font is Figure 6-13 as above. The
RA6963L2NB is compatible to T6963C(code 0201) and the default font is Figure 6-14 as
above.
Although RA6963 provide an extra internal command for MCU to select both font of above,
but you do not need to change the software to select the font that if you chose the right part
number.
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10-17 RA6963 vs. T6963C
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11.Timing Characteristics
MPU Interface Timing
炷VDD=+5V±5炴,GND=0V,Ta= -20 to +70ć炸
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Driver Interface Timing
炷VDD=+5V±5炴,GND=0V,Ta= -20 to +70ć炸
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External Memory Interface
炷VDD=+5V±5炴,GND=0V,Ta= -20 to +70ć炸
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12.RELIABILITY
Content of Reliability Test (wide temperature, -20ഒ~70ഒ)
Environmental Test
Test Item
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity Operation
Content of Test
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the high storage
temperature for a long time.
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress to the
element for a long time.
Endurance test applying the electric stress under
low temperature for a long time.
The module should be allowed to stand at 60
ɗ,90%RH max
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal
temperature.
The sample should be allowed stand the
following 10 cycles of operation
-20ɗ
25ɗ
70ɗ
Thermal shock resistance
30min
5min
1 cycle
Test Condition
80ɗ
200hrs
-30ɗ
200hrs
Note
2
1,2
70ɗ
200hrs
——
-20ɗ
200hrs
1
60ɗ,90%RH
96hrs
-20ɗ/70ɗ
10 cycles
1,2
——
30min
Total fixed amplitude :
1.5mm
Vibration Frequency :
10~55Hz
One cycle 60 seconds
to 3 directions of X,Y,Z
for
Each 15
minutes
Vibration test
Endurance test applying the vibration during
transportation and using.
Static electricity test
VS=800V,RS=1.5kȟ
Endurance test applying the electric stress to the
CS=100pF
terminal.
1 time
3
——
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: Vibration test will be conducted to the product itself without putting it in a container.
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13.Backlight Information
Specification
PARAMETER
SYMBOL MIN
TYP
MAX
UNIT
TESTġġ CONDITION
Supply Current
ILED
115.2
128
200
mA
V=3.5V
Supply Voltage
V
3.4
3.5
3.6
V
炼
Reverse Voltage
VR
炼
炼
5
V
炼
IV
240
300
炼
CD/M2 ILED=128
X
炼
0.300
炼
nm
炼
Y
炼
0.310
炼
nm
炼
Luminous
Intensity
Chromaticity
Coordinate
Chromaticity
Coordinate
ILEDʀ
ʀ128
LED Life Time
(For Reference
only)
炼
Color
White
炼
50K
炼
Hr.
25ɗ
ɗ,50-60%RH,
(Note 1)
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
Note 1:50K hours is only an estimate for reference.
LED B\L Drive Method
1.Drive from A , K
R
A
B/L
K
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14. Inspection specification
NO
01
02
Item
Criterion
AQL
Electrical
Testing
1.1 Missing vertical, horizontal segment, segment contrast defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
Black or white 2.1 White and black spots on display ʀ0.25mm, no more than
spots on LCD
three white or black spots present.
(display only) 2.2 Densely spaced: No more than two spots or lines within 3mm
3.1 Round type : As following drawing
ȜľĩġŹġĬġźġĪġİġijġ ġ ġ ġ
ŔŊśņġ
łŤŤŦűŵŢţŭŦġŒġŕŚġ
ġ ġ ġ ġ ġ ȜʀıįIJıġ łŤŤŦűŵġůŰġťŦůŴŦġ
ijġ
ıįIJı᧸Ȝʀıįijıġ
03
04
IJġ
ıįijı᧸ȜʀıįijĶġ
LCD black
ġ
spots, white
ıġ
ıįijĶ᧸Ȝġ
spots,
contamination 3.2 Line type : (As following drawing)
(non-display)
Length
Width
Acceptable Q TY
--Wʀıįıij
Accept no dense
LʀĴįı 0.02᧸WʀıįıĴ
2
LʀijįĶ 0.03᧸WʀıįıĶġ
--As round type
0.05᧸W
Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size Ȝ
Ȝʀıįijı
ıįijı᧸ȜʀıįĶı
Acceptable Q TY
Accept no dense
3
ıįĶı᧸ȜʀIJįıı
2
IJįıı᧸Ȝ
Total Q TY
0
2.5
2.5
2.5
2.5
3
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NO
05
Item
Scratches
Vishay
Criterion
Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
AQL
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
śʀIJİijŵġ
06
Chipped
glass
źĻġńũŪűġŸŪťŵũġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġ
ŢųŦŢġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŹʀIJİĹŢġ
ŹʀIJİĹŢġ
IJİijŵ᧸Żʀijŵġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
ķįIJįijġńŰųůŦųġŤųŢŤŬĻġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
śʀIJİijŵġ
ġ
źĻġńũŪűġŸŪťŵũġ
ŏŰŵġŰŷŦųġŷŪŦŸŪůŨġ
ŢųŦŢġ
ŏŰŵġŦŹŤŦŦťġIJİĴŬġ ġ
2.5
ġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŹʀIJİĹŢġ
ŹʀIJİĹŢġ
IJİijŵ᧸Żʀijŵġ
˞ŊŧġŵũŦųŦġŢųŦġijġŰųġŮŰųŦġŤũŪűŴĭġŹġŪŴġŵũŦġŵŰŵŢŭġŭŦůŨŵũġŰŧġŦŢŤũġŤũŪűįġ
ġ
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NO
Vishay
Item
Criterion
AQL
ŔźŮţŰŭŴġĻġ
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
źĻġńũŪűġŸŪťŵũġ ġ
źʀıįĶŮŮġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŹʀIJİĹŢġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
ıġ ᧸ġ Żġʀġŵġ
ķįijįijġŏŰůĮŤŰůťŶŤŵŪŷŦġűŰųŵŪŰůĻġ
06
Glass
crack
2.5
źĻġńũŪűġŸŪťŵũġ ġ
źʀġōġ
ŹĻġńũŪűġŭŦůŨŵũġ
ŹʀIJİĹŢġ
ŻĻġńũŪűġŵũŪŤŬůŦŴŴġ
ġ
ıġ ᧸ġ Żġʀġŵġ
˞ŊŧġŵũŦġŤũŪűűŦťġŢųŦŢġŵŰŶŤũŦŴġŵũŦġŊŕŐġŵŦųŮŪůŢŭĭġŰŷŦųġijİĴġŰŧġŵũŦġŊŕŐġ
ŮŶŴŵġųŦŮŢŪůġŢůťġţŦġŪůŴűŦŤŵŦťġŢŤŤŰųťŪůŨġŵŰġŦŭŦŤŵųŰťŦġŵŦųŮŪůŢŭġ
ŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
˞ŊŧġŵũŦġűųŰťŶŤŵġŸŪŭŭġţŦġũŦŢŵġŴŦŢŭŦťġţźġŵũŦġŤŶŴŵŰŮŦųĭġŵũŦġŢŭŪŨůŮŦůŵġ
ŮŢųŬġůŰŵġţŦġťŢŮŢŨŦťįġ
ķįijįĴġŔŶţŴŵųŢŵŦġűųŰŵŶţŦųŢůŤŦġŢůťġŪůŵŦųůŢŭġŤųŢŤŬįġ
źĻġŸŪťŵũġ ġ
źʀIJİĴōġ
ġ
ŹĻġŭŦůŨŵũġ
ŹġʀġŢġ
ġ
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NO
07
08
09
10
Item
Cracked
glass
Backlight
elements
Bezel
PCBᇬCOB
Vishay
Criterion
AQL
ŕũŦġōńŅġŸŪŵũġŦŹŵŦůŴŪŷŦġŤųŢŤŬġŪŴġůŰŵġŢŤŤŦűŵŢţŭŦįġ
2.5
ĹįIJġŊŭŭŶŮŪůŢŵŪŰůġŴŰŶųŤŦġŧŭŪŤŬŦųŴġŸũŦůġŭŪŵįġ
ĹįijġŔűŰŵŴġŰųġŴŤųŢŵŤũŦťġŵũŢŵġŢűűŦŢųġŸũŦůġŭŪŵġŮŶŴŵġţŦġūŶťŨŦťįġ
ŖŴŪůŨġōńŅġŴűŰŵĭġŭŪůŦŴġŢůťġŤŰůŵŢŮŪůŢŵŪŰůġŴŵŢůťŢųťŴįġ
ĹįĴġŃŢŤŬŭŪŨũŵġťŰŦŴůȽŵġŭŪŨũŵġŰųġŤŰŭŰųġŸųŰůŨįġ
ġ
ĺįIJġŃŦŻŦŭġŮŢźġůŰŵġũŢŷŦġųŶŴŵĭġţŦġťŦŧŰųŮŦťġŰųġũŢŷŦġ
ŧŪůŨŦųűųŪůŵŴĭġŴŵŢŪůŴġŰųġŰŵũŦųġŤŰůŵŢŮŪůŢŵŪŰůįġ
ĺįijġŃŦŻŦŭġŮŶŴŵġŤŰŮűŭźġŸŪŵũġūŰţġŴűŦŤŪŧŪŤŢŵŪŰůŴįġ
ġ
ġ
IJıįIJġńŐŃġŴŦŢŭġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŭŢųŨŦųġŵũŢůġıįijŮŮġŰųġ
ŤŰůŵŢŮŪůŢŵŪŰůįġ
IJıįijġńŐŃġŴŦŢŭġŴŶųŧŢŤŦġŮŢźġůŰŵġũŢŷŦġűŪůũŰŭŦŴġŵũųŰŶŨũġŵŰġŵũŦġ
Ŋńįġ
IJıįĴġThe height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside
the seal area on the PCB. And there should be no more
than three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the
product characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad
or screw hold pad, make sure it is smoothed down.
IJıįĺ The Scraping testing standard for Copper Coating of
PCB
0.65
2.5
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
11
Soldering
X * Y<=2mm2ġ
ġ
IJIJįIJġŏŰġŶůĮŮŦŭŵŦťġŴŰŭťŦųġűŢŴŵŦġŮŢźġţŦġűųŦŴŦůŵġŰůġŵũŦġőńŃįġ
IJIJįijġŏŰġŤŰŭťġŴŰŭťŦųġūŰŪůŵŴĭġŮŪŴŴŪůŨġŴŰŭťŦųġŤŰůůŦŤŵŪŰůŴĭġ
ŰŹŪťŢŵŪŰůġŰųġŪŤŪŤŭŦįġ
IJIJįĴġŏŰġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġőńŃįġ
IJIJįĵġŏŰġŴũŰųŵġŤŪųŤŶŪŵŴġŪůġŤŰŮűŰůŦůŵŴġŰůġőńŃįġ
ġ
2.5
2.5
2.5
0.65
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Revision: 11-Dec-12
LCD-160H128B-TFK-VZ
www.vishay.com
NO
12
Vishay
Item
Criterion
General
appearance
ġ
IJijįIJġŏŰġŰŹŪťŢŵŪŰůĭġŤŰůŵŢŮŪůŢŵŪŰůĭġŤŶųŷŦŴġŰųĭġţŦůťŴġŰůġŪůŵŦųŧŢŤŦġ
őŪůġĩŐōŃĪġŰŧġŕńőįġ
IJijįijġŏŰġŤųŢŤŬŴġŰůġŪůŵŦųŧŢŤŦġűŪůġĩŐōŃĪġŰŧġŕńőįġ
IJijįĴġŏŰġŤŰůŵŢŮŪůŢŵŪŰůĭġŴŰŭťŦųġųŦŴŪťŶŦġŰųġŴŰŭťŦųġţŢŭŭŴġŰůġűųŰťŶŤŵįġ
IJijįĵġŕũŦġŊńġŰůġŵũŦġŕńőġŮŢźġůŰŵġţŦġťŢŮŢŨŦťĭġŤŪųŤŶŪŵŴįġ
IJijįĶġŕũŦġŶűűŦųŮŰŴŵġŦťŨŦġŰŧġŵũŦġűųŰŵŦŤŵŪŷŦġŴŵųŪűġŰůġŵũŦġŪůŵŦųŧŢŤŦġ
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ŵŰġŴŦŷŦųįġ
IJijįķġŕũŦġųŦŴŪťŶŢŭġųŰŴŪůġŰųġŵŪůġŰŪŭġŰŧġŴŰŭťŦųŪůŨġĩŤŰŮűŰůŦůŵġŰųġ
ŤũŪűġŤŰŮűŰůŦůŵĪġŪŴġůŰŵġţŶųůŦťġŪůŵŰġţųŰŸůġŰųġţŭŢŤŬġŤŰŭŰųįġ
IJijįĸġŔŦŢŭŢůŵġŰůġŵŰűġŰŧġŵũŦġŊŕŐġŤŪųŤŶŪŵġũŢŴġůŰŵġũŢųťŦůŦťįġ
IJijįĹġőŪůġŵźűŦġŮŶŴŵġŮŢŵŤũġŵźűŦġŪůġŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
IJijįĺġōńŅġűŪůġŭŰŰŴŦġŰųġŮŪŴŴŪůŨġűŪůŴįġ
IJijįIJıġőųŰťŶŤŵġűŢŤŬŢŨŪůŨġŮŶŴŵġŵũŦġŴŢŮŦġŢŴġŴűŦŤŪŧŪŦťġŰůġ
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IJijįIJIJġőųŰťŶŤŵġťŪŮŦůŴŪŰůġŢůťġŴŵųŶŤŵŶųŦġŮŶŴŵġŤŰůŧŰųŮġŵŰġűųŰťŶŤŵġ
ŴűŦŤŪŧŪŤŢŵŪŰůġŴũŦŦŵįġ
ġ
AQL
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
Document Number: 37469
40
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 11-Dec-12
LCD-160H128B-TFK-VZ
www.vishay.com
Vishay
15. Material List of Components for RoHS
1. Declaration that all of or part of products (with the mark “H” in code), including, but not limited
to, the LCM, accessories or packages, manufactured and/or delivered to your company (including
your subsidiaries and affiliated company) directly or indirectly by our company (including our
subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all
applicable EU directives and regulations, including the following substances.
Exhibit A᧶The Harmful Material List
.
Material
(Cd)
(Pb)
(Hg)
(Cr6+)
PBBs
PBDEs
Limited
Value
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
Above limited value is set up according to RoHS.
2. Process for RoHS requirement᧶
(1) Use the Sn/Ag/Cu soldering surface᧷the surface of Pb-free solder is rougher than we used before.
(2) Heat-resistance temp.᧶
Reflow᧶250C, 30 seconds Max.᧷
Connector soldering wave or hand soldering᧶320C, 10 seconds max.
(3) Temp. curve of reflow, max. Temp.᧶235±5C᧷
Recommended customer’s soldering temp. of connector᧶280C, 3 seconds.
16. Storage
1. Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH
2. Do not place the module near organics solvents or corrosive gases.
3. Do not crush, shake, or jolt the module.
Document Number: 37469
41
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revision: 11-Dec-12
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000