Data Sheet

PX1011B
PCI Express stand-alone X1 PHY
Rev. 6 — 27 June 2011
Product data sheet
1. General description
The PX1011B is a high-performance, low-power, single-lane PCI Express electrical
PHYsical layer (PHY) that handles the low level PCI Express protocol and signaling. The
PX1011B PCI Express PHY is compliant to the PCI Express Base Specification,
Rev. 1.0a, and Rev. 1.1. The PX1011B includes features such as Clock and Data
Recovery (CDR), data serialization and de-serialization, 8b/10b encoding, analog buffers,
elastic buffer and receiver detection, and provides superior performance to the Media
Access Control (MAC) layer devices.
The PX1011B is a 2.5 Gbit/s PCI Express PHY with 8-bit data PXPIPE interface. Its
PXPIPE interface is a superset of the PHY Interface for the PCI Express (PIPE)
specification, enhanced and adapted for off-chip applications with the introduction of a
source synchronous clock for transmit and receive data. The 8-bit data interface operates
at 250 MHz with SSTL_2 signaling. The SSTL_2 signaling is compatible with the I/O
interfaces available in FPGA products.
The PX1011B PCI Express PHY supports advanced power management functions.
The PX1011BI is for the industrial temperature range (40 C to +85 C).
Automotive AEC-Q100 compliant version PX1011B-EL1/Q900 is available.
2. Features and benefits
2.1 PCI Express interface










Compliant to PCI Express Base Specification 1.1
Single PCI Express 2.5 Gbit/s lane
Data and clock recovery from serial stream
Serializer and De-serializer (SerDes)
Receiver detection
8b/10b coding and decoding, elastic buffer and word alignment
Supports loopback
Supports direct disparity control for use in transmitting compliance pattern
Supports lane polarity inversion
Low jitter and Bit Error Rate (BER)
2.2 PHY/MAC interface




Based on Intel PHY Interface for PCI Express architecture v1.0 (PIPE)
Adapted for off-chip with additional synchronous clock signals (PXPIPE)
8-bit parallel data interface for transmit and receive at 250 MHz
2.5 V SSTL_2 class I signaling
PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
2.3 JTAG interface
 JTAG (IEEE 1149.1) boundary scan interface
 Built-In Self Test (BIST) controller tests SerDes and I/O blocks at speed
 3.3 V CMOS signaling
2.4 Power management
 Dissipates < 300 mW in L0 normal mode
 Support power management of L0, L0s and L1
2.5 Clock
 100 MHz external reference clock with 300 ppm tolerance
 Supports spread spectrum clock to reduce EMI
 On-chip reference clock termination
2.6 Miscellaneous
 LFBGA81 leaded or lead-free packages
 Operating ambient temperature
 Commercial: 0 C to +70 C
 Industrial: 40 C to +85 C
 ESD protection voltage for Human Body Model (HBM): 2000 V
3. Quick reference data
Table 1.
Quick reference data
Symbol Parameter
PX1011B
Product data sheet
Conditions
Min
Typ
Max
Unit
VDDD1
digital supply voltage 1
for JTAG I/O
3.0
3.3
3.6
V
VDDD2
digital supply voltage 2
for SSTL_2 I/O
2.3
2.5
2.7
V
VDDD3
digital supply voltage 3
for core
1.15
1.2
1.3
V
VDD
supply voltage
for high-speed
serial I/O and PVT
1.15
1.2
1.3
V
VDDA1
analog supply voltage 1
for serializer
1.15
1.2
1.3
V
VDDA2
analog supply voltage 2
for serializer
3.0
3.3
3.6
V
fclk(ref)
reference clock frequency
99.97
100
100.03
MHz
Tamb
ambient temperature
commercial
0
-
+70
C
industrial
40
-
+85
C
operating
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
2 of 32
PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
4. Ordering information
Table 2.
Ordering information
Type number
Solder process
Package
Name
Description
Version
PX1011B-EL1/G
Pb-free (SnAgCu
LFBGA81 plastic low profile fine-pitch ball grid array
solder ball compound)
package; 81 balls; body 9  9  1.05 mm
SOT643-1
PX1011B-EL1/N
SnPb solder ball
compound
LFBGA81 plastic low profile fine-pitch ball grid array
package; 81 balls; body 9  9  1.05 mm
SOT643-1
PX1011BI-EL1/G
Pb-free (SnAgCu
LFBGA81 plastic low profile fine-pitch ball grid array
solder ball compound)
package; 81 balls; body 9  9  1.05 mm
SOT643-1
LFBGA81 plastic low profile fine-pitch ball grid array
PX1011B-EL1/Q900[1] Pb-free (SnAgCu
solder ball compound)
package; 81 balls; body 9  9  1.05 mm
SOT643-1
[1]
PX1011B-EL1/Q900 is AEC-Q100 compliant. Contact [email protected] for PPAP.
5. Marking
Table 3.
Leaded package marking
Line
Marking
Description
A
PX1011B-EL1/N
full basic type number
B
xxxxxxx
diffusion lot number
C
2PNyyww
manufacturing code:
2 = diffusion site
P = assembly site
N = leaded
yy = year code
ww = week code
Table 4.
Lead-free package marking
Line
Marking
Description
A
PX1011B-EL1/G
full basic type number
PX1011BI-EL1/G[1]
PX1011B-EL1/Q[1]
B
xxxxxxx
diffusion lot number
C
2PGyyww
manufacturing code:
2 = diffusion site
P = assembly site
G = lead-free
yy = year code
ww = week code
[1]
PX1011B
Product data sheet
Industrial temperature range.
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
3 of 32
PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
6. Block diagram
PCI Express MAC
TXCLK
TXDATA [7:0]
RXDATA [7:0]
RXCLK
RESET_N
PCI Express PHY
Ln_TxData0
REGISTER
8
Ln_TxData1
10b/8b
DECODE
8b/10b
ENCODE
ELASTIC
BUFFER
PARALLEL
TO
SERIAL
10
250 MHz
clock
K28.5
DETECTION
SERIAL
TO
PARALLEL
DATA
RECOVERY
CIRCUIT
CLK
GENERATOR
TX I/O
REFCLK I/O
TX_P TX_N REFCLK_P REFCLK_N
Fig 1.
PX1011B
Product data sheet
CLOCK RECOVERY
CIRCUIT PLL
RX I/O
RX_P RX_N
bit stream at 2.5 Gbit/s
002aac211
Block diagram
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Rev. 6 — 27 June 2011
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4 of 32
PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
7. Pinning information
7.1 Pinning
ball A1
index area
PX1011B-EL1/G
PX1011B-EL1/N
PX1011BI-EL1/G
PX1011B-EL1/Q900
1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
002aad017
Transparent top view
Fig 2.
Pin configuration for LFBGA81
1
2
3
4
5
6
7
8
9
A
VSS
RXIDLE
RXDATA6
RXDATA4
RXDATA3
RXDATA1
RXDATAK
RXCLK
RXSTATUS0
B
REFCLK_P
VSS
RXDATA7
RXDATA5
VSS
RXDATA2
RXDATA0
VSS
RXSTATUS1
C
REFCLK_N
VSS
VDDD2
VSS
VDDD2
VSS
VDDD2
RXVALID
RXSTATUS2
D
VSS
VSS
VDD
VDDA2
VDDA1
PVT
VSS
PHYSTATUS
TXDATA0
E
RX_P
VSS
VDDD1
TMS
VDDD1
VDDD3
VDDD2
VSS
TXDATA1
F
RX_N
VSS
TCK
TRST_N
VDDD3
VDDD3
VSS
TXDATA3
TXDATA2
G
VSS
VSS
TDI
VSS
VDDD2
VSS
VDDD2
TXDATA5
TXDATA4
H
TX_P
VSS
TDO
TXIDLE
VSS
PWRDWN0
RXDET_
LOOPB
VSS
TXDATA6
J
TX_N
VREFS
RESET_N
RXPOL
TXCOMP
PWRDWN1
TXDATAK
TXCLK
TXDATA7
002aad018
Transparent top view.
Fig 3.
Ball mapping
PX1011B
Product data sheet
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
7.2 Pin description
The PHY input and output pins are described in Table 5 to Table 12. Note that input and
output is defined from the perspective of the PHY. Thus a signal on a pin described as an
output is driven by the PHY and a signal on a pin described as an input is received by the
PHY. A basic description of each pin is provided.
Table 5.
Symbol
Pin
Type
Signaling
Description
RX_P
E1
input
PCIe I/O
RX_N
F1
input
PCIe I/O
differential input receive pair with 50 
on-chip termination
TX_P
H1
output
PCIe I/O
TX_N
J1
output
PCIe I/O
Table 6.
PXPIPE interface transmit data signals
Pin
Type
Signaling
Description
TXDATA[7:0]
J9, H9, G8, G9,
F8, F9, E9, D9
input
SSTL_2
8-bit transmit data input from the MAC
to the PHY
TXDATAK
J7
input
SSTL_2
selection input for the symbols of
transmit data; LOW = data byte;
HIGH = control byte
PXPIPE interface receive data signals
Symbol
Pin
Type
Signaling
Description
RXDATA[7:0]
B3, A3, B4, A4,
A5, B6, A6, B7
output
SSTL_2
8-bit receive data output from the PHY
to the MAC
RXDATAK
A7
output
SSTL_2
selection output for the symbols of
receive data; LOW = data byte;
HIGH = control byte
Table 8.
Product data sheet
differential output transmit pair with
50  on-chip termination
Symbol
Table 7.
PX1011B
PCI Express serial data lines
PXPIPE interface command signals
Symbol
Pin
Type
Signaling
Description
RXDET_ LOOPB
H7
input
SSTL_2
used to tell the PHY to begin a receiver
detection operation or to begin loopback;
LOW = reset state
TXIDLE
H4
input
SSTL_2
forces TX output to electrical idle. TXIDLE
should be asserted while in power states P0s
and P1.
TXCOMP
J5
input
SSTL_2
used when transmitting the compliance
pattern; HIGH-level sets the running disparity
to negative
RXPOL
J4
input
SSTL_2
signals the PHY to perform a polarity inversion
on the receive data; LOW = PHY does no
polarity inversion; HIGH = PHY does polarity
inversion
RESET_N
J3
input
SSTL_2
PHY reset input; active LOW
PWRDWN0
H6
input
SSTL_2
PWRDWN1
J6
input
SSTL_2
transceiver power-up and power-down inputs
(see Table 13); 0x2 = reset state
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
Table 9.
Symbol
Pin
Type
Signaling
Description
RXVALID
C8
output
SSTL_2
indicates symbol lock and valid data on
RX_DATA and RX_DATAK
PHYSTATUS
D8
output
SSTL_2
used to communicate completion of several PHY
functions including power management state
transitions and receiver detection
RXIDLE
A2
output
SSTL_2
indicates receiver detection of an electrical idle;
this is an asynchronous signal
RXSTATUS0
A9
output
SSTL_2
RXSTATUS1
B9
output
SSTL_2
RXSTATUS2
C9
output
SSTL_2
encodes receiver status and error codes for the
received data stream and receiver detection (see
Table 15)
Table 10.
Product data sheet
Clock and reference signals
Symbol
Pin
Type
Signaling
Description
TXCLK
J8
input
SSTL_2
source synchronous 250 MHz transmit clock
input from MAC. All input data and signals to the
PHY are synchronized to this clock.
RXCLK
A8
output
SSTL_2
source synchronous 250 MHz clock output for
received data and status signals bound for the
MAC.
REFCLK_P
B1
input
PCIe I/O
REFCLK_N
C1
input
PCIe I/O
100 MHz reference clock input. This is the
spread spectrum source clock for PCI Express.
Differential pair input with 50  on-chip
termination.
PVT
D6
-
analog I/O
VREFS
J2
input
Table 11.
PX1011B
PXPIPE interface status signals
input or output to create a compensation signal
internally that will adjust the I/O pads
characteristics as PVT drifts. Connect to VDD
through a 49.9  resistor.
reference voltage input for SSTL_2 class I
signaling. Connect to 1.25 V.
3.3 V JTAG signals
Symbol
Pin
Type
Signaling
Description
TMS
E4
input
3.3 V CMOS
test mode select input
TRST_N
F4
input
3.3 V CMOS
test reset input for the JTAG interface;
active LOW
TCK
F3
input
3.3 V CMOS
test clock input for the JTAG interface
TDI
G3
input
3.3 V CMOS
test data input
TDO
H3
output
3.3 V CMOS
test data output
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
Table 12.
PCI Express PHY power supplies
Symbol
Pin
Type
VDDA1
D5
power
1.2 V analog power supply for serializer and
de-serializer
VDDA2
D4
power
3.3 V analog power supply for serializer and
de-serializer
VDDD1
E3, E5
power
3.3 V power supply for JTAG I/O
VDDD2
C3, C5, C7, E7,
G5, G7
power
2.5 V power supply for SSTL_2 I/O
VDDD3
E6, F5, F6
power
1.2 V power supply for core
VDD
D3
power
1.2 V power supply for high-speed serial
PCI Express I/O pads and PVT
VSS
A1, B2, B5, B8,
C2, C4, C6, D1,
D2, D7, E2, E8,
F2, F7, G1, G2,
G4, G6, H2, H5,
H8
ground
ground
Signaling
Description
8. Functional description
The main function of the PHY is to convert digital data into electrical signals and vice
versa. The PCI Express PHY handles the low level PCI Express protocol and signaling.
The PX1011B PCI Express PHY consists of the Physical Coding Sub-layer (PCS), a
Serializer and De-serializer (SerDes) and a set of I/Os (pads). The PCI Express PHY
handles the low level PCI Express protocol and signaling. This includes features such as
Clock and Data Recovery (CDR), data serialization and de-serialization, 8b/10b encoding,
analog buffers, elastic buffer and receiver detection.
The PXPIPE interface between the MAC and PX1011B is a superset of the PHY Interface
for the PCI Express (PIPE) specification. The following feature have been added:
• Source synchronous clocks for RX and TX data to simplify timing closure.
The 8-bit data width PXPIPE interface operates at 250 MHz with SSTL_2 class I
signaling. PX1011B does not integrate SSTL_2 termination resistors inside the IC.
The PCI Express link consists of a differential input pair and a differential output pair. The
data rate of these signals is 2.5 Gbit/s.
8.1 Receiving data
Incoming data enters the chip at the RX interface. The receiver converts these signals
from small amplitude differential signals into rail-to-rail digital signals. The carrier detect
circuit detects whether data is present on the line and passes this information through to
the SerDes and PCS.
If a valid stream of data is present the Clock and Data Recovery unit (CDR) first recovers
the clock from the data and then uses this clock for re-timing the data (i.e., recovering the
data).
PX1011B
Product data sheet
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
The de-serializer or Serial-to-Parallel converter (S2P) de-serializes this data into 10-bits
parallel data.
Since the S2P has no knowledge about the data, the word alignment is still random. This
is fixed in the digital domain by the PCS block. It first detects a 10-bit comma character
(K28.5) from the random data stream and aligns the bits. Then it converts the 10-bit raw
data into 8-bit words using 8b/10b decoding. An elastic buffer and FIFO brings the
resulting data to the right clock domain, which is the RX source synchronous clock
domain.
8.2 Transmitting data
When the PHY transmits, it receives 8-bit data from the MAC. This data is encoded using
an 8b/10b encoding algorithm. The 2 bits overhead of the 8b/10b encoding ensures the
serial data will be DC-balanced and has a sufficient 0-to-1 and 1-to-0 transition density for
clock recovery at the receiver side.
The serializer or Parallel-to-Serial converter (P2S) serializes the 10 bits data into serial
data streams. These data streams are latched into the transmitter, where they are
converted into small amplitude differential signals. The transmitter has built-in
de-emphasis for a larger eye opening at the receiver side.
The PLL has a sufficiently high bandwidth to handle a 100 MHz reference clock with a
30 kHz to 33 kHz spread spectrum.
8.3 Clocking
There are three clock signals used by the PX1011B:
• REFCLK is a 100 MHz external reference clock that the PHY uses to generate the
250 MHz data clock and the internal bit rate clock. This clock may have
30 kHz to 33 kHz spread spectrum modulation.
• TXCLK is a reference clock that the PHY uses to clock the TXDATA and command.
This source synchronous clock is provided by the MAC. The PHY expects that the
rising edge of TXCLK is centered to the data. The TXCLK has to be synchronous with
RXCLK.
• RXCLK is a source synchronous clock provided by the PHY. The RXDATA and status
signals are synchronous to this clock. The PHY aligns the rising edge of RXCLK to the
center of the data. RXCLK may be used by the MAC to clock its internal logic.
8.4 Reset
The PHY must be held in reset until power and REFCLK are stable. It takes the PHY
64 s maximum to stabilize its internal clocks. RXCLK frequency is the same as REFCLK
frequency, 100 MHz, during this time. The PHY de-asserts PHYSTATUS when internal
clocks are stable.
The PIPE specification recommends that while RESET_N is asserted, the MAC should
have RXDET_LOOPB de-asserted, TXIDLE asserted, TXCOMP de-asserted, RXPOL
de-asserted and power state P1. The MAC can also assert a reset if it receives a physical
layer reset packet.
PX1011B
Product data sheet
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
RXCLK
RESET_N
PHYSTATUS
100 MHz
250 MHz
002aac172
Fig 4.
Reset
8.5 Power management
The power management signals allow the PHY to manage power consumption. The PHY
meets all timing constraints provided in the PCI Express base specification regarding
clock recovery and link training for the various power states.
Four power states are defined: P0, P0s, P1 and P2. P0 state is the normal operational
state for the PHY. When directed from P0 to a lower power state, the PHY can
immediately take whatever power saving measures are appropriate.
In states P0, P0s and P1, the PHY keeps internal clocks operational. For all state
transitions between these three states, the PHY indicates successful transition into the
designated power state by a single cycle assertion of PHYSTATUS. For all power state
transitions, the MAC must not begin any operational sequences or further power state
transitions until the PHY has indicated that the initial state transition is completed. TXIDLE
should be asserted while in power states P0s and P1.
• P0 state: All internal clocks in the PHY are operational. P0 is the only state where the
PHY transmits and receives PCI Express signaling. P0 is the appropriate PHY power
management state for most states in the Link Training and Status State Machine
(LTSSM). Exceptions are listed for each lower power PHY state (P0s, P1 and P2).
• P0s state: The MAC will move the PHY to this state only when the transmit channel is
idle.
While the PHY is in either P0 or P0s power states, if the receiver is detecting an electrical
idle, the receiver portion of the PHY can take appropriate power saving measures. Note
that the PHY is capable of obtaining bit and symbol lock within the PHY-specified time
(N_FTS with or without common clock) upon resumption of signaling on the receive
channel. This requirement only applies if the receiver had previously been bit and symbol
locked while in P0 or P0s states.
• P1 state: Selected internal clocks in the PHY are turned off. The MAC will move the
PHY to this state only when both transmit and receive channels are idle. The PHY
indicates a successful entry into P1 (by asserting PHYSTATUS). P1 should be used
for the disabled state, all detect states, and L1.idle state of the Link Training and
Status State Machine (LTSSM).
• P2 state: PHY will enter P1 instead.
PX1011B
Product data sheet
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© NXP B.V. 2011. All rights reserved.
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
Table 13.
Summary of power management state
PWRDWN[1:0]
Power management state
Transmitter
Receiver
TX PLL
RXCLK
RX PLL/CDR
P0, normal operation
on[1]
on
on
on
on
01b
P0s, power saving state
idle[2]
idle
on
on
on
10b
P1, lower power state
idle[2]
idle
on
on
off
11b
illegal, PHY will enter P1
-
-
-
-
-
00b
[1]
TXIDLE = 0
[2]
TXIDLE = 1
8.6 Receiver detect
When the PHY is in the P1 state, it can be instructed to perform a receiver detection
operation to determine if there is a receiver at the other end of the link. Basic operation of
receiver detection is that the MAC requests the PHY to do a receiver detect sequence by
asserting RXDET_LOOPB. When the PHY has completed the receiver detect sequence,
it drives the RXSTATUS signals to the value of 011b if a receiver is present, and to 000b if
there is no receiver. Then the PHY will assert PHYSTATUS to indicate the completion of
receiver detect operation. The MAC uses the rising edge of PHYSTATUS to sample the
RXSTATUS signals and then de-asserts RXDET_LOOPB. A few cycles after the
RXDET_LOOPB de-asserts, the PHYSTATUS is also de-asserted.
TXCLK
RXDET_LOOPB
PWRDWN1,
PWRDWN0
10b
RXCLK
PHYSTATUS
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
000b
011b
000b
002aac173
Fig 5.
Receiver detect - receiver present
8.7 Loopback
The PHY supports an internal loopback from the PCI Express receiver to the transmitter
with the following characteristics.
The PHY retransmits each 10-bit data and control symbol exactly as received, without
applying scrambling or descrambling or disparity corrections, with the following rules:
• If a received 10-bit symbol is determined to be an invalid 10-bit code (i.e., no legal
translation to a control or data value possible), the PHY still retransmits the symbol
exactly as it was received.
• If a SKP ordered set retransmission requires adding a SKP symbol to accommodate
timing tolerance correction, any disparity can be chosen for the SKP symbol.
PX1011B
Product data sheet
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
11 of 32
PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
• The PHY continues to provide the received data on the PXPIPE interface, behaving
exactly like normal data reception.
• The PHY transitions from normal transmission of data from the PXPIPE interface to
looping back the received data at a symbol boundary.
The PHY begins to loopback data when the MAC asserts RXDET_LOOPB while doing
normal data transmission. The PHY stops transmitting data from the PXPIPE interface,
and begins to loopback received symbols. While doing loopback, the PHY continues to
present received data on the PXPIPE interface.
The PHY stops looping back received data when the MAC de-asserts RXDET_LOOPB.
Transmission of data on the parallel interface begins immediately.
The timing diagram of Figure 6 shows example timing for beginning loopback. In this
example, the receiver is receiving a repeating stream of bytes, Rx-a through Rx-z.
Similarly, the MAC is causing the PHY to transmit a repeating stream of bytes Tx-a
through Tx-z. When the MAC asserts RXDET_LOOPB to the PHY, the PHY begins to
loopback the received data to the differential TX_P and TX_N lines.
TXCLK
RXDET_LOOPB
TXDATA[7:0]
Tx-m
Tx-n
Tx-o
Tx-p
Tx-q
Rx-c
Rx-d
Rx-e
Rx-f
Rx-g
RXCLK
RXDATA[7:0]
TX_P, TX_N
Tx-m
Tx-n
Rx-e
002aac174
Fig 6.
Loopback start
The timing diagram of Figure 7 shows an example of switching from loopback mode to
normal mode. As soon as the MAC detects an electrical idle ordered-set, the MAC
de-asserts RXDET_LOOPB, asserts TXIDLE and changes the POWERDOWN signals to
state P1.
PX1011B
Product data sheet
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PCI Express stand-alone X1 PHY
RXCLK
RXDATA[7:0]
COM
IDL
Junk
TXCLK
RXDET_LOOPB
TXIDLE
includes electrical idle
ordered set
TX_P, TX_N
Looped back RX data
Junk
001aac785
Fig 7.
Loopback end
8.8 Electrical idle
The PCI Express Base Specification requires that devices send an Electrical Idle
ordered-set before TX goes to the electrical idle state.
The timing diagram of Figure 8 shows an example of timing for entering electrical idle.
TXCLK
TXDATA[7:0]
ScZero
COM
IDL
TXDATAK
TXIDLE
TX_P, TX_N
active (ends with Electrical Idle ordered-set)
002aac175
Fig 8.
PX1011B
Product data sheet
Electrical Idle
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PCI Express stand-alone X1 PHY
Table 14 summarizes the function of some PXPIPE control signals.
Table 14.
Control signals function summary
PWRDWN[1:0]
RXDET_LOOPB
TXIDLE
Function description
P0: 00b
0
0
normal operation
0
1
transmitter in idle
1
0
loopback mode
1
1
illegal
P0s: 01b
X
0
illegal
1
transmitter in idle
P1: 10b
X
0
illegal
0
1
transmitter in idle
1
1
receiver detect
8.9 Clock tolerance compensation
The PHY receiver contains an elastic buffer used to compensate for differences in
frequencies between bit rates at the two ends of a link. The elastic buffer is capable of
holding at least seven symbols to handle worst case differences (600 ppm) in frequency
and worst case intervals between SKP ordered-sets. The PHY is responsible for inserting
or removing SKP symbols in the received data stream to avoid elastic buffer overflow or
underflow. The PHY monitors the receive data stream, and when a Skip ordered-set is
received, the PHY can add or remove one SKP symbol from each SKP ordered-set as
appropriate to manage its elastic buffer. Whenever a SKP symbol is added or removed,
the PHY will signal this to the MAC using the RXSTATUS signals. These signals have a
non-zero value for one clock cycle and indicate whether a SKP symbol was added or
removed from the received SKP ordered-set. RXSTATUS should be asserted during the
clock cycle when the COM symbol of the SKP ordered-set is moved across the parallel
interface. If the removal of a SKP symbol causes no SKP symbols to be transferred
across the parallel interface, then RXSTATUS is asserted at the same time that the COM
symbol (that was part of the received skip ordered-set) is transmitted across the parallel
interface.
Figure 9 shows a sequence where the PHY inserted a SKP symbol in the data stream.
Figure 10 shows a sequence where the PHY removed a SKP symbol from a SKP
ordered-set.
RXCLK
RXDATA[7:0]
active
COM
SKP
000b
001b
000b
SKP
active
RXVALID
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
001aac779
Fig 9.
PX1011B
Product data sheet
Clock correction - insert a SKP
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PCI Express stand-alone X1 PHY
RXCLK
RXDATA[7:0]
active
COM
SKP
000b
010b
000b
active
RXVALID
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
002aac176
Fig 10. Clock correction - remove a SKP
8.10 Error detection
The PHY is responsible for detecting receive errors of several types. These errors are
signaled to the MAC layer using the receiver status signals RXSTATUS.
Table 15.
Function table PXPIPE status interface signals
Operating mode
Output pin
RXSTATUS2 RXSTATUS1 RXSTATUS0
Received data OK
L
L
L
One SKP added
L
L
H
One SKP removed
L
H
L
Receiver detected
L
H
H
8b/10b decode error
H
L
L
Elastic buffer overflow
H
L
H
Elastic buffer underflow
H
H
L
Receive disparity error
H
H
H
Because of higher level error detection mechanisms (like CRC) built into the data link
layer of PCI Express, there is no need to specifically identify symbols with errors.
However, timing information about when the error occurred in the data stream is
important. When a receive error occurs, the appropriate error code is asserted for one
clock cycle at the point closest to where the error actually occurred.
There are four error conditions that can be encoded on the RXSTATUS signals. If more
than one error should happen to occur on a received byte, the errors are signaled with the
priority shown below.
1. 8b/10b decode error
2. Elastic buffer overflow
3. Elastic buffer underflow
4. Disparity error
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Product data sheet
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PCI Express stand-alone X1 PHY
8.10.1 8b/10b decode errors
For a detected 8b/10b decode error, the PHY places an EDB (EnD Bad) symbol in the
data stream in place of the bad byte, and encodes RXSTATUS with a decode error during
the clock cycle when the effected byte is transferred across the parallel interface. In
Figure 11 the receiver is receiving a stream of bytes Rx-a through Rx-z, and byte Rx-c has
an 8b/10b decode error. In place of that byte, the PHY places an EDB on the parallel
interface, and sets RXSTATUS to the 8b/10b decode error code. Note that a byte that
cannot be decoded may also have bad disparity, but the 8b/10b error has precedence.
RXCLK
RXDATA[7:0]
Rx-a
Rx-b
EDB
Rx-d
100b
000b
Rx-e
RXVALID
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
000b
001aac780
Fig 11. 8b/10b decode errors
8.10.2 Disparity errors
For a detected disparity error, the PHY asserts RXSTATUS with the disparity error code
during the clock cycle when the effected byte is transferred across the parallel interface. In
Figure 12 the receiver detected a disparity error on Rx-c data byte, and indicates this with
the assertion of RXSTATUS.
RXCLK
RXDATA[7:0]
Rx-a
Rx-b
Rx-c
Rx-d
111b
000b
Rx-e
RXVALID
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
000b
001aac781
Fig 12. Disparity errors
8.10.3 Elastic buffer
For elastic buffer errors, an underflow is signaled during the clock cycle when the spurious
symbol is moved across the parallel interface. The symbol moved across the interface is
the EDB symbol. In the timing diagram Figure 13, the PHY is receiving a repeating set of
symbols Rx-a through Rx-z. The elastic buffer underflow causing the EDB symbol to be
inserted between the Rx-c and Rx-d symbols. The PHY drives RXSTATUS to indicate
buffer underflow during the clock cycle when the EDB is presented on the parallel
interface.
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Product data sheet
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PCI Express stand-alone X1 PHY
RXCLK
RXDATA[7:0]
Rx-a
Rx-b
Rx-c
EDB
Rx-d
110b
000b
RXVALID
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
000b
001aac782
Fig 13. Elastic buffer underflow
For an elastic buffer overflow, the overflow is signaled during the clock cycle where the
dropped symbol would have appeared in the data stream. In the timing diagram of
Figure 14, the PHY is receiving a repeating set of symbols Rx-a through Rx-z. The elastic
buffer overflows causing the symbol Rx-d to be discarded. The PHY drives RXSTATUS to
indicate buffer overflow during the clock cycle when Rx-d would have appeared on the
parallel interface.
RXCLK
RXDATA[7:0]
Rx-a
Rx-b
Rx-c
Rx-e
Rx-f
101b
000b
RXVALID
RXSTATUS2,
RXSTATUS1,
RXSTATUS0
000b
001aac783
Fig 14. Elastic buffer overflow
8.11 Polarity inversion
To support lane polarity inversion, the PHY inverts received data when RXPOL is
asserted. The PHY begins data inversion within 20 symbols after RXPOL is asserted.
RXCLK
RXDATA[7:0]
D21.5
D21.5
D10.2
D10.2
RXVALID
RXPOL
001aac786
Fig 15. Polarity inversion
PX1011B
Product data sheet
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PCI Express stand-alone X1 PHY
8.12 Setting negative disparity
To set the running disparity to negative, the MAC asserts TXCOMP for one clock cycle
that matches with the data that is to be transmitted with negative disparity.
TXCLK
TXDATA[7:0]
data
K28.5
K28.5
K28.5
K28.5
TXCOMP
byte transmitted
with negative disparity
TX_P, TX_N
valid data
K28.5−
K28.5+
002aac177
Fig 16. Setting negative disparity
8.13 JTAG boundary scan interface
Joint Test Action Group (JTAG) or IEEE 1149.1 is a standard, specifying how to control
and monitor the pins of compliant devices on a printed-circuit board. This standard is
commonly known as ‘JTAG Boundary Scan’.
This standard defines a 5-pin serial protocol for accessing and controlling the signal levels
on the pins of a digital circuit, and has some extensions for testing the internal circuitry on
the chip itself, which is beyond the scope of this data sheet.
Access to the JTAG interface is provided to the customer for the sole purpose of using
boundary scan for interconnect test verification between other compliant devices that may
reside on the board. Using JTAG for purposes other than boundary scan may produce
undesired effects.
The JTAG interface is a 3.3 V CMOS signaling. JTAG TRST_N must be asserted LOW for
normal device operation. If JTAG is not planned to be used, it is recommended to
pull down TRST_N to VSS.
PX1011B
Product data sheet
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PCI Express stand-alone X1 PHY
9. Limiting values
Table 16. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDDD1
digital supply voltage 1
for JTAG I/O
0.5
+4.6
V
VDDD2
digital supply voltage 2
for SSTL_2 I/O
0.5
+3.75
V
VDDD3
digital supply voltage 3
for core
0.5
+1.7
V
VDD
supply voltage
for high-speed
serial I/O and PVT
0.5
+1.7
V
VDDA1
analog supply voltage 1
for serializer
0.5
+1.7
V
VDDA2
analog supply voltage 2
for serializer
0.5
+4.6
V
HBM
[1]
-
2000
V
CDM
[2]
-
500
V
VESD
electrostatic discharge voltage
Tstg
storage temperature
55
+150
C
Tj
junction temperature
55
+125
C
Tamb
ambient temperature
commercial
0
+70
C
industrial
40
+85
C
operating
[1]
Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model Component level; Electrostatic Discharge Association, Rome, NY, USA.
[2]
Charged Device Model: ANSI/EOS/ESD-S5.3.1-1999, standard for ESD sensitivity testing, Charged Device
Model - component level; Electrostatic Discharge Association, Rome, NY, USA.
10. Thermal characteristics
Table 17.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
in free air
[1]
44
K/W
Rth(j-c)
thermal resistance from junction to case
in free air
[1]
10
K/W
[1]
PX1011B
Product data sheet
Significant variations can be expected due to system variables, such as adjacent devices, or actual air flow
across the package.
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PCI Express stand-alone X1 PHY
11. Characteristics
Table 18.
PCI Express PHY characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDDD1
digital supply voltage 1
for JTAG I/O
3.0
3.3
3.6
V
VDDD2
digital supply voltage 2
for SSTL_2 I/O
2.3
2.5
2.7
V
VDDD3
digital supply voltage 3
for core
1.15
1.2
1.3
V
VDD
supply voltage
for high-speed serial I/O
and PVT
1.15
1.2
1.3
V
VDDA1
analog supply voltage 1
for serializer
1.15
1.2
1.3
V
VDDA2
analog supply voltage 2
for serializer
3.0
3.3
3.6
V
IDDD1
digital supply current 1
for JTAG I/O
0.1
1
2
mA
IDDD2
digital supply current 2
for SSTL_2; no load
-
24
35
mA
Supplies
IDDD3
digital supply current 3
for core
5
10
15
mA
IDD
supply current
for high-speed serial I/O
and PVT
15
20
30
mA
IDDA1
analog supply current 1
for serializer
15
20
31
mA
IDDA2
analog supply current 2
for serializer
7
10
15
mA
Receiver
UI
unit interval
399.88 400
400.12 ps
VRX_DIFFp-p
differential input peak-to-peak voltage
0.205
1.2
tRX_MAX_JITTER
maximum receiver jitter time
-
-
0.6
UI
VIDLE_DET_DIFFp-p
electrical idle detect threshold
65
-
205
mV
ZRX_DC
DC input impedance
40
50
60

ZRX_HIGH_IMP_DC
powered-down DC input impedance
200
-
-
k
-
V
RLRX_DIFF
differential return loss
15
-
-
dB
RLRX_CM
common mode return loss
6
-
-
dB
tlock(CDR)(ref)
CDR lock time (reference loop)
-
-
50
s
tlock(CDR)(data)
CDR lock time (data loop)
-
-
2.5
s
tRX_latency
receiver latency
6
-
13
clock
cycle
1 clock cycle is 4 ns
Reference clock
fclk(ref)
reference clock frequency
99.97
100
100.03 MHz
fmod(clk)(ref)
reference clock modulation frequency
range
0.5
-
+0
%
fmod(clk)(ref)
reference clock modulation frequency
30
-
33
kHz
VIH(se)REFCLK
REFCLK single-end HIGH-level input
voltage
-
0.7
1.15
V
VIL(se)REFCLK
REFCLK single-end LOW-level input
voltage
0.3
0
-
V
ZC-DC
clock source DC impedance
40
50
60

PX1011B
Product data sheet
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PCI Express stand-alone X1 PHY
Table 18.
PCI Express PHY characteristics …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
dV/dt
rate of change of voltage
at rising edge;
measured from 150 mV
to +150 mV on the
differential waveform;
Figure 17
0.6
-
4.0
V/ns
at falling edge;
measured from +150 mV
to 150 mV on the
differential waveform;
Figure 17
0.6
-
4.0
V/ns
+150
-
-
mV
VIH
differential input HIGH voltage
VIL
differential input LOW voltage
REFCLK
duty cycle on pin REFCLK
on pin REFCLK_N and
pin REFCLK_P
-
-
150
mV
40
-
60
%
Transmitter
UI
unit interval
399.88 400
400.12 ps
VTX_DIFFp-p
differential peak-to-peak output
voltage
0.8
-
1.2
V
tTX_EYE_m-mJITTER
maximum time between the jitter
median and maximum deviation from
the median
-
35
50
ps
tTX_JITTER_MAX
maximum transmitter jitter time
-
60
100
ps
VTX_DE_RATIO
de-emphasized differential output
voltage ratio
3.0
-
4.0
dB
tTX_RISE
D+/D TX output rise time
50
75
-
ps
tTX_FALL
D+/D TX output fall time
50
75
-
ps
VTX_CM_ACp
RMS AC peak common mode output
voltage
-
-
20
mV
VCM_DC_ACT_IDLE absolute delta of DC common mode
voltage during L0 and electrical idle
0
-
100
mV
VCM_DC_LINE
absolute delta of DC common mode
voltage between D+ and D
0
-
25
mV
VTX_CM_DC
TX DC common mode voltage
0
-
3.6
V
ITX_SHORT
TX short-circuit current limit
-
20
90
mA
RLTX_DIFF
differential return loss
12
-
-
dB
RLTX_CM
common mode return loss
6
-
-
dB
ZTX_DC
transmitter DC impedance
40
50
60

CTX
AC coupling capacitor
75
100
200
nF
tlock(PLL)
PLL lock time
-
-
50
s
tTX_latency
transmitter latency
4
-
9
clock
cycle
tP0s_exit_latency
P0s state exit latency
-
-
2.5
s
tP1_exit_latency
P1 state exit latency
-
-
64
s
tRESET-PHYSTATUS
RESET_N HIGH to PHYSTATUS LOW
time
-
-
64
s
PX1011B
Product data sheet
1 clock cycle is 4 ns
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dV/dt
at rising edge
dV/dt
at falling edge
REFCLK+
minus
REFCLK−
VIH = +150 mV
0.0 V
VIL = −150 mV
002aad694
Fig 17. Differential measurement points
Table 19.
PXPIPE characteristics
Symbol
Parameter
Conditions
fRXCLK
RXCLK frequency
fTXCLK
TXCLK frequency
[1]
Min
Typ
Max
Unit
249.925
250
250.075
MHz
249.925
250
250.075
MHz
1.13
1.25
VVREFS
voltage on pin VREFS
1.38
V
VOH(SSTL2)
SSTL_2 HIGH-level output voltage
AC
VTT + 0.61 -
-
V
VOL(SSTL2)
SSTL_2 LOW-level output voltage
AC
-
VTT  0.61 V
VIH(SSTL2)
SSTL_2 HIGH-level input voltage
AC
Vref + 0.31 -
-
VIL(SSTL2)
SSTL_2 LOW-level input voltage
AC
-
-
Vref  0.31 V
see Figure 18
500
-
-
ps
see Figure 18
500
-
-
ps
see Figure 18
1500
-
-
ps
see Figure 18
1500
-
-
ps
-
V
Input signals; measured with respect to TXCLK
tsu(TX)(PXPIPE) set-up time of PXPIPE input signal
th(TX)(PXPIPE)
hold time of PXPIPE input signal
Output signals; measured with respect to RXCLK
tsu(RX)(PXPIPE) set-up time of PXPIPE output signal
th(RX)(PXPIPE)
[1]
hold time of PXPIPE output signal
Reference voltage for SSTL_2 class I I/O.
TXCLK
PXPIPE
INPUT
t su(TX)(PXPIPE)
t h(TX)(PXPIPE)
RXCLK
PXPIPE
OUTPUT
t su(RX)(PXPIPE)
t h(RX)(PXPIPE)
002aac316
Fig 18. Definition of PXPIPE timing
PX1011B
Product data sheet
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PCI Express stand-alone X1 PHY
001aac789
0.6
0.5
differential
signal 0.4
(V)
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
−0.5
−0.6
−0.2 −0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0 1.1
unit intervals
1.2
Tamb = 25 C; nominal VDD
Fig 19. Transition eye
001aac790
0.6
0.5
differential
signal 0.4
(V)
0.3
0.2
0.1
0
−0.1
−0.2
−0.3
−0.4
−0.5
−0.6
−0.2 −0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0 1.1
unit intervals
1.2
Tamb = 25 C; nominal VDD
Fig 20. Non transition eye
PX1011B
Product data sheet
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12. Package outline
LFBGA81: plastic low profile fine-pitch ball grid array package; 81 balls; body 9 x 9 x 1.05 mm
D
SOT643-1
A
B
ball A1
index area
A
A2
E
A1
detail X
C
e1
∅v M
b
e
∅w M
y
y1 C
C A B
C
J
H
G
e
F
E
e2
D
C
B
A
ball A1
index area
1
2
3
4
5
6
7
8
9
X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.6
0.4
0.3
1.20
0.95
0.5
0.4
9.1
8.9
9.1
8.9
0.8
6.4
6.4
0.15
0.08
0.12
0.1
OUTLINE
VERSION
SOT643-1
REFERENCES
IEC
JEDEC
JEITA
MO-205
---
EUROPEAN
PROJECTION
ISSUE DATE
00-11-01
02-03-28
Fig 21. Package outline SOT643-1 (LFBGA81)
PX1011B
Product data sheet
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13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PX1011B
Product data sheet
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13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20 and 21
Table 20.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 21.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
PX1011B
Product data sheet
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temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 22. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Appendix
14.1 Errata added 2009-09-01
The PX1011B (types PX1011B-EL1/G, PX1011BI-EL1/G, PX1011B-EL1/N and
PX1011B-EL1/Q900) is reported to sporadically produce communication failures in Intel
DX58S0-based systems in which the PCIe transmitter has full Active Power State
Management (ASPM) capability, and particularly when L0s mode is supported.
When the PCIe transmitter goes idle (enters L0s) for the purpose of power saving and
then returns to normal mode (exits L0s and enters L0), the PX1011B receiver PLL may
randomly fail to lock, preventing it from properly interpreting the data being transmitted on
the link. As a result the PX1011B may send symbols to the link device that it cannot
recognize.
This is a L0s exit failure which may prevent the system from recovering and could cause
the PCIe protocol to eventually fail and the link to go down. If this occurs, the PX1011B
stays in the exit failure state indefinitely. The receiver can only be re-initiated by applying a
hard reset to the PHY, returning it to normal mode.
You are strongly advised to disable the L0s mode whenever the PX1011B is used.
PX1011B
Product data sheet
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
15. Abbreviations
Table 22.
Abbreviations
Acronym
Description
BER
Bit Error Rate
BIST
Built-In Self Test
CMOS
Complementary Metal-Oxide Semiconductor
CRC
Cyclic Redundancy Check
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
FPGA
Field Programmable Gate Array
LTSSM
Link Training and Status State Machine
MAC
Media Access Control
P2S
Parallel to Serial
PCI
Peripheral Component Interconnect
PCS
Physical Coding Sub-layer
PHY
PHYsical layer
PLL
Phase-Locked Loop
PIPE
PHY Interface for the PCI Express
PVT
Process Voltage Temperature
S2P
Serial to Parallel
SerDes
Serializer and De-serializer
SKP
SKiP
SSTL_2
Stub Series Terminated Logic for 2.5 Volts
16. References
PX1011B
Product data sheet
[1]
PCI Express Base Specification — Rev. 1.0a - PCISIG
[2]
PHY Interface for the PCI Express Architecture (PIPE) Specification Version
1.00 — Intel Corporation
All information provided in this document is subject to legal disclaimers.
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17. Revision history
Table 23.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PX1011B v.6
20110627
Product data sheet
-
PX1011B v.5
Modifications:
PX1011B v.5
Modifications:
•
Section 1 “General description”, third paragraph: added last sentence
20110418
•
Product data sheet
-
PX1011B v.4
Table 2 “Ordering information”:
– Added type number PX1011B-EL1/Q900
– Added Table note [1] and cross-reference at PX1011B-EL1/Q900
•
•
•
Table 4 “Lead-free package marking”: added marking PX1011B-EL1/Q
Figure 2 “Pin configuration for LFBGA81”: added type number PX1011B-EL1/Q900
Table 18 “PCI Express PHY characteristics”:
– sub-section “Supplies”, IDD, supply current: Max value changed from “28 mA” to “30 mA”
– sub-section “Supplies”, IDDA1, analog supply current 1: Max value changed from “28 mA” to
“31 mA”
– sub-section “Receiver”, VRX_DIFFp-p, differential input peak-to-peak voltage: Min value changed
from “0.175 V” to “0.205 V”
– sub-section “Receiver”, VIDLE_DET_DIFFp-p, electrical idle detect threshold: Max value changed
from “175 mV” to “205 mV”
•
PX1011B v.4
Modifications:
PX1011B v.3
Modifications:
Section 14.1 “Errata added 2009-09-01”: added type number PX1011B-EL1/Q900 to first sentence
20090904
•
-
PX1011B v.3
-
PX1011B v.2
Section 14: Errata information added
20081020
•
Product data sheet
Product data sheet
Added type number PX1011B-EL1/N (affects Section 2.6 “Miscellaneous”, Table 2 “Ordering
information”, (new) Table 3 “Leaded package marking”, Figure 2 “Pin configuration for LFBGA81”)
PX1011B v.2
20080319
Product data sheet
-
PX1011B v.1
PX1011B v.1
20080213
Objective data sheet
-
-
PX1011B
Product data sheet
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
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PX1011B
NXP Semiconductors
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
PX1011B
Product data sheet
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
30 of 32
PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PX1011B
Product data sheet
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Rev. 6 — 27 June 2011
© NXP B.V. 2011. All rights reserved.
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PX1011B
NXP Semiconductors
PCI Express stand-alone X1 PHY
20. Contents
1
2
2.1
2.2
2.3
2.4
2.5
2.6
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.10.1
8.10.2
8.10.3
8.11
8.12
8.13
9
10
11
12
13
13.1
13.2
13.3
13.4
14
14.1
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
PCI Express interface . . . . . . . . . . . . . . . . . . . . 1
PHY/MAC interface . . . . . . . . . . . . . . . . . . . . . 1
JTAG interface . . . . . . . . . . . . . . . . . . . . . . . . . 2
Power management . . . . . . . . . . . . . . . . . . . . . 2
Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
Receiving data . . . . . . . . . . . . . . . . . . . . . . . . . 8
Transmitting data . . . . . . . . . . . . . . . . . . . . . . . 9
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power management . . . . . . . . . . . . . . . . . . . . 10
Receiver detect. . . . . . . . . . . . . . . . . . . . . . . . 11
Loopback . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrical idle . . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock tolerance compensation . . . . . . . . . . . . 14
Error detection . . . . . . . . . . . . . . . . . . . . . . . . 15
8b/10b decode errors . . . . . . . . . . . . . . . . . . . 16
Disparity errors . . . . . . . . . . . . . . . . . . . . . . . . 16
Elastic buffer . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Polarity inversion . . . . . . . . . . . . . . . . . . . . . . 17
Setting negative disparity . . . . . . . . . . . . . . . . 18
JTAG boundary scan interface . . . . . . . . . . . . 18
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19
Thermal characteristics . . . . . . . . . . . . . . . . . 19
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 20
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24
Soldering of SMD packages . . . . . . . . . . . . . . 25
Introduction to soldering . . . . . . . . . . . . . . . . . 25
Wave and reflow soldering . . . . . . . . . . . . . . . 25
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Errata added 2009-09-01 . . . . . . . . . . . . . . . . 27
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
17
18
18.1
18.2
18.3
18.4
19
20
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
29
30
30
30
30
31
31
32
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 27 June 2011
Document identifier: PX1011B
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