Data Sheet

CBTU04083
1.8 V, wide bandwidth, 4 differential channel,
2 : 1 multiplexer/demultiplexer switch
Rev. 1 — 16 July 2010
Product data sheet
1. General description
CBTU04083 is an 8-to-4 differential channel multiplexer/demultiplexer switch. The
CBTU04083 can switch four differential signals to one of two locations. Using a unique
design technique, NXP has minimized the impedance of the switch such that the
attenuation observed through the switch is negligible, and also minimized the
channel-to-channel skew as well as channel-to-channel crosstalk, as required by the
high-speed serial interface. CBTU04083 allows expansion of existing high speed ports for
extremely low power.
2. Features and benefits
„
„
„
„
„
„
„
„
4 differential channel, 2 : 1 multiplexer/demultiplexer
High-speed signal switching; 8.0 Gbit/s
Low intra-pair skew: 10 ps maximum (between positive and negative bits)
Low inter-pair skew: 35 ps maximum
Low crosstalk: −30 dB at 4 GHz
Low off-state isolation: −30 dB at 4 GHz
VDD operating range: 1.8 V ± 10 %
ESD tolerance:
‹ 6 kV HBM
‹ 1 kV CDM
„ HVQFN42 package
3. Applications
„ Routing of high-speed differential signals with low signal attenuation
‹ PCIe Gen3
‹ DisplayPort 1.2
‹ USB 3.0
‹ SATA 6 Gbit/s
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
4. Ordering information
Table 1.
Ordering information
Type number
CBTU04083BS
Package
Name
Description
Version
HVQFN42
plastic thermal enhanced very thin quad flat package; no leads;
42 terminals; body 3.5 × 9 × 0.85 mm
SOT1144-1
5. Functional diagram
A0_P
B0_P
A0_N
B0_N
A1_P
B1_P
A1_N
B1_N
C0_P
C0_N
C1_P
C1_N
A2_P
B2_P
A2_N
B2_N
A3_P
B3_P
A3_N
B3_N
C2_P
C2_N
C3_P
C3_N
SEL
002aae642
Fig 1.
CBTU04083
Product data sheet
Functional diagram of CBTU04083
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
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CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
6. Pinning information
39 GND
40 VDD
41 GND
42 VDD
6.1 Pinning
GND
1
38 B0_P
A0_P
2
37 B0_N
A0_N
3
36 B1_P
GND
4
35 B1_N
VDD
5
34 C0_P
A1_P
6
33 C0_N
A1_N
7
32 C1_P
VDD
8
SEL
9
31 C1_N
CBTU04083BS 30 VDD
GND 10
29 B2_P
A2_P 11
28 B2_N
A2_N 12
27 B3_P
VDD 13
26 B3_N
25 C2_P
GND 14
A3_P 15
A3_N 16
GND
(exposed
thermal pad)
24 C2_N
23 C3_P
22 C3_N
GND 21
VDD 20
VDD 18
GND 19
GND 17
002aaf592
Transparent top view
Fig 2.
Pin configuration for HVQFN42
6.2 Pin description
Table 2.
CBTU04083
Product data sheet
Pin description
Symbol
Pin
Type
Description
A0_P
2
I/O
channel 0, port A differential signal input/output
A0_N
3
I/O
A1_P
6
I/O
A1_N
7
I/O
A2_P
11
I/O
A2_N
12
I/O
A3_P
15
I/O
A3_N
16
I/O
B0_P
38
I/O
B0_N
37
I/O
B1_P
36
I/O
B1_N
35
I/O
channel 1, port A differential signal input/output
channel 2, port A differential signal input/output
channel 3, port A differential signal input/output
channel 0, port B differential signal input/output
channel 1, port B differential signal input/output
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
3 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
Table 2.
Pin description …continued
Symbol
Pin
Type
Description
B2_P
29
I/O
channel 2, port B differential signal input/output
B2_N
28
I/O
B3_P
27
I/O
B3_N
26
I/O
C0_P
34
I/O
C0_N
33
I/O
C1_P
32
I/O
C1_N
31
I/O
C2_P
25
I/O
C2_N
24
I/O
C3_P
23
I/O
channel 3, port B differential signal input/output
channel 0, port C differential signal input/output
channel 1, port C differential signal input/output
channel 2, port C differential signal input/output
channel 3, port C differential signal input/output
C3_N
22
I/O
SEL
9
CMOS
operation mode select
single-ended input
SEL = LOW: A → B
SEL = HIGH: A → C
VDD
5, 8, 13, 18, 20, power
30, 40, 42
positive supply voltage, 1.8 V to 2.0 V (± 0.1 V)
GND
1, 4, 10, 14, 17, power
19, 21, 39, 41,
center pad
supply ground
7. Functional description
Refer to Figure 1 “Functional diagram of CBTU04083”.
7.1 Function selection
Table 3.
CBTU04083
Product data sheet
Function selection
SEL
Function
LOW
An to Bn
HIGH
An to Cn
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© NXP B.V. 2010. All rights reserved.
4 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDD
supply voltage
Tcase
case temperature
VESD
electrostatic discharge voltage
Min
Max
Unit
−0.5
+2.5
V
−40
+85
°C
HBM
[1]
-
6000
V
CDM
[2]
-
1000
V
[1]
Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model Component level; Electrostatic Discharge Association, Rome, NY, USA.
[2]
Charged Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing, Charged Device
Model - Component level; Electrostatic Discharge Association, Rome, NY, USA.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
supply voltage
VI
input voltage
Tamb
ambient temperature
Conditions
operating in free air
Min
Typ
Max
Unit
1.62
1.8
1.98
V
−0.5
-
VDD
V
−40
-
+85
°C
10. Static characteristics
Table 6.
Static characteristics
VDD = 1.8 V ± 10 %; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IDD
supply current
VDD = max.; VI = GND or VDD
-
-
4
mA
IIH
HIGH-level input current
VDD = max.; VI = VDD
-
-
±5[2]
μA
μA
IIL
LOW-level input current
VDD = max.; VI = GND
-
-
±5[2]
VIH
HIGH-level input voltage
SEL pin
0.65VDD
-
-
V
VIL
LOW-level input voltage
SEL pin
−0.5
-
0.15VDD
V
VIK
input clamping voltage
VDD = max.; II = −18 mA
-
−0.7
−1.2
V
[1]
Typical values are at VDD = 1.8 V, Tamb = 25 °C, and maximum loading.
[2]
Input leakage current is ±50 μA if differential pairs are pulled to HIGH and LOW.
CBTU04083
Product data sheet
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
5 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
11. Dynamic characteristics
Table 7.
Dynamic characteristics
VDD = 1.8 V ± 10 %; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
αct
crosstalk attenuation
f = 4 GHz
-
−30
-
dB
f = 100 MHz
-
−70
-
dB
αiso(off)
off-state isolation
f = 4 GHz
-
−30
-
dB
f = 100 MHz
-
−60
-
dB
f = 4 GHz
-
−2.8
-
dB
f = 100 MHz
-
−0.5
-
dB
-
4.3
-
GHz
-
80
-
ps
DDIL
differential insertion loss
B−3dB
−3 dB bandwidth
tPD
propagation delay
from left-side port to
right-side port, or vice versa
Switching characteristics
tPZH
OFF-state to HIGH propagation delay
-
-
8.0
ns
tPZL
OFF-state to LOW propagation delay
-
-
8.0
ns
tPHZ
HIGH to OFF-state propagation delay
-
-
8.0
ns
tPLZ
LOW to OFF-state propagation delay
-
-
8.0
ns
tsk(dif)
differential skew time
intra-pair
-
-
10
ps
tsk
skew time
inter-pair
-
-
35
ps
[1]
Typical values are at VDD = 1.8 V; Tamb = 25 °C, and maximum loading.
VDD
SEL
0.5VDD
0.5VDD
0V
tPZL
tPLZ
VOH
output 1
0.5VDD
tPZH
output 2
0.5VDD
VOL + 0.15 V
VOL
tPHZ
VOH − 0.15 V
VOH
VOL
002aae654
Output 1 is for an output with internal conditions such that the output is LOW except when disabled
by the output control.
Output 2 is for an output with internal conditions such that the output is HIGH except when disabled
by the output control.
The outputs are measured one at a time with one transition per measurement.
Fig 3.
CBTU04083
Product data sheet
Voltage waveforms for enable and disable times
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CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
12. Test information
VDD
PULSE
GENERATOR
VI
RL
200 Ω
VO
2 × VDD
open
GND
DUT
CL
50 pF
RT
RL
200 Ω
002aae653
CL = load capacitance; includes jig and probe capacitance.
RT = termination resistance; should be equal to Zo of the pulse generator.
All input pulses are supplied by generators having the following characteristics: PRR ≤ MHz;
Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns.
Fig 4.
Test circuitry for switching times
4-PORT, 20 GHz
NETWORK ANALYZER
PORT 2
PORT 3
PORT 1
PORT 4
DUT
002aae655
Fig 5.
Test circuit
Table 8.
Test data
Test
CBTU04083
Product data sheet
Load
Switch
CL
RL
tPLZ, tPZL (output on B side)
50 pF
200 Ω
2 × VDD
tPHZ, tPZH (output on B side)
50 pF
200 Ω
GND
tPD
50 pF
200 Ω
open
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
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CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
13. Package outline
HVQFN42: plastic thermal enhanced very thin quad flat package; no leads;
42 terminals; body 3.5 x 9 x 0.85 mm
A
B
D
SOT1144-1
terminal 1
index area
A
E
A1
c
detail X
e1
1/2 e
e
L
18
21
C
C A B
C
v
w
b
y1 C
y
22
17
e
e2
Eh
38
1
terminal 1
index area
42
39
X
Dh
0
2.5
scale
Dimensions
Unit(1)
mm
5 mm
A
A1
b
max 1.00 0.05 0.30
nom 0.85 0.02 0.25
min 0.80 0.00 0.20
c
D
Dh
E
Eh
0.2
3.6
3.5
3.4
2.30
2.05
1.90
9.1
9.0
8.9
7.70
7.55
7.40
e
e1
0.5
1.5
e2
L
v
8.0
0.5
0.4
0.3
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1144-1
---
---
---
Fig 6.
sot1144-1_po
European
projection
Issue date
09-08-26
09-08-28
Package outline SOT1144-1 (HVQFN42)
CBTU04083
Product data sheet
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
8 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
CBTU04083
Product data sheet
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
9 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 7) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 7.
CBTU04083
Product data sheet
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
10 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 7.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CDM
Charged-Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
I/O
Input/Output
LVDS
Low-Voltage Differential Signalling
PCI
Peripheral Component Interconnect
PCIe
PCI express
PRR
Pulse Repetition Rate
SATA
Serial Advanced Technology Attachment
USB
Universal Serial Bus
16. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
CBTU04083 v.1
20100716
Product data sheet
-
-
CBTU04083
Product data sheet
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© NXP B.V. 2010. All rights reserved.
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CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
CBTU04083
Product data sheet
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Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
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CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
CBTU04083
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 16 July 2010
© NXP B.V. 2010. All rights reserved.
13 of 14
CBTU04083
NXP Semiconductors
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 MUX/deMUX switch
19. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Function selection. . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Soldering of SMD packages . . . . . . . . . . . . . . . 9
Introduction to soldering . . . . . . . . . . . . . . . . . . 9
Wave and reflow soldering . . . . . . . . . . . . . . . . 9
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 July 2010
Document identifier: CBTU04083
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