PANASONIC 2SA0886

Power Transistors
2SA0886 (2SA886)
Silicon PNP epitaxial planar type
For low-frequency power amplification
Complementary to 2SC1847
Unit: mm
8.0+0.5
–0.1
3.2±0.2
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
−50
V
Collector-emitter voltage (Base open)
VCEO
−40
V
Emitter-base voltage (Collector open)
VEBO
−5
V
Collector current
IC
−1.5
A
Peak collector current
ICP
−3
A
Collector power dissipation
PC
1.2
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0.75±0.1
0.5±0.1
4.6±0.2
1
3.05±0.1
3.8±0.3
1.9±0.1
• Output of 4 W can be obtained by a complementary pair with
2SC1847
• TO-126B package which requires no insulation plate for installation to the heat sink
16.0±1.0
■ Features
11.0±0.5
φ 3.16±0.1
2
0.5±0.1
1.76±0.1
2.3±0.2
1: Emitter
2: Collector
3: Base
TO-126B-A1 Package
3
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Min
Typ
Collector-base voltage (Emitter open)
VCBO
IC = −1 mA, IE = 0
−50
V
Collector-emitter voltage (Base open)
VCEO
IC = −2 mA, IB = 0
−40
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = −20 V, IE = 0
−1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = −10 V, IB = 0
−100
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = −5 V, IC = 0
−10
µA
Forward current transfer ratio *
hFE
VCE = −5 V, IC = −1 A
220

80
Max
Unit
Collector-emitter saturation voltage
VCE(sat)
IC = −1.5 A, IB = − 0.15 A
−1.0
V
Base-emitter saturation voltage
VBE(sat)
IC = −2 A, IB = − 0.2 A
−1.5
V
Transition frequency
fT
Collector output capacitance
(Common base, input open circuited)
Cob
VCB = −5 V, IE = 0.5 A, f = 200 MHz
150
MHz
VCB = −20 V, IE = 0, f = 1 MHz
45
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
Q
R
hFE1
80 to 160
120 to 220
Note) The part numbers in the parenthesis show conventional part number.
Publication date: February 2003
SJD00003BED
1
2SA0886
IC  VCE
TC=25˚C
IB=–40mA
–3.5
–35mA
1.2
Collector current IC (A)
Collector power dissipation PC (W)
VCE(sat)  IC
–4.0
Collector-emitter saturation voltage VCE(sat) (V)
PC  Ta
1.6
0.8
0.4
–3.0
–30mA
–25mA
–2.5
–20mA
–2.0
–15mA
–1.5
–10mA
–1.0
–5mA
–0.5
0
0
40
80
120
0
160
0
–2
–4
–6
–8
–10
Ambient temperature Ta (°C)
Collector-emitter voltage VCE (V)
VBE(sat)  IC
hFE  IC
IC/IB=10
–10
–1
TC=100˚C
–0.1
25˚C
–0.01
–0.01
–25˚C
–0.1
–1
Collector current IC (A)
fT  I E
1000
100˚C
25˚C
–0.1
–0.01
–0.01
–0.1
TC=100˚C
100
10
Cob  VCB
40
0
0.01
0.1
100
80
60
40
20
–100
Collector-base voltage VCB (V)
1
10
Emitter current IE (A)
ICEO  Ta
1000
VCE=–12V
TC=25˚C
–50
–40
ICEO (Ta)
ICEO (Ta = 25°C)
120
–10
80
VCER  RBE
IE=0
f=1MHz
TC=25˚C
140
120
–1
–60
Collector-emitter voltage
(V)
(Resistor between B and E) VCER
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
–0.1
160
Collector current IC (A)
Collector current IC (A)
2
25˚C
–25˚C
1
–0.01
–1
200
Transition frequency fT (MHz)
TC=–25˚C
–1
0
–1
VCB=–5V
f=200MHz
TC=25˚C
VCE=–5V
IC/IB=10
–10
Forward current transfer ratio hFE
Base-emitter saturation voltage VBE(sat) (V)
240
–30
–20
100
10
–10
0
0.001
1
0.01
0.1
1
10
Base-emitter resistance RBE (kΩ)
SJD00003BED
0
20
40
60
80
100
Ambient temperature Ta (°C)
120
2SA0886
Rth  t
Safe operation area
−10
Single pulse
TC=25˚C
−1
IC
t=10ms
t=1s
− 0.1
− 0.01
− 0.001
− 0.1
−1
−10
−100
(1)Without heat sink
(2)With a 100×100×2mm Al heat sink
104
Thermal resistance Rth (°C/W)
Collector current IC (A)
ICP
103
(1)
102
(2)
10
1
10−1
10–4
10–3
10–2
10–1
1
10
102
103
104
Time t (s)
Collector-emitter voltage VCE (V)
SJD00003BED
3
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and semiconductors described in this material
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Consult our sales staff in advance for information on the following applications:
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the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
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2002 JUL
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