517AK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN20 4x2, 0.4P
CASE 517AK−01
ISSUE O
DATE 14 NOV 2006
SCALE 4:1
A B
D
2X
L1
0.15 C
E
PIN 1
REFERENCE
DETAIL A
NOTE 5
2X
0.15 C
TOP VIEW
(A3)
0.10 C
A
20X
0.08 C
SIDE VIEW
A1
DETAIL A
C
19X
1
SEATING
PLANE
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
4.00 BSC
2.00 BSC
0.40 BSC
0.50
0.60
0.00
0.03
0.60
0.70
10
GENERIC
MARKING DIAGRAM*
(L2)
20
XXM
G
11
e
20X
e/2
BOTTOM VIEW
b
0.10
M
C A B
0.05
M
C
NOTE 3
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
MOUNTING FOOTPRINT
SOLDERMASK DEFINED
20X
19X
0.22
0.78
2.30
0.88
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON23419D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN20 4 X 2, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON23419D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. COOK.
DATE
14 NOV 2006
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 01O
Case Outline Number:
517AK
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