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ECMF02-3F3
Common mode filter with ESD protection
Datasheet  production data
Figure 1. Pin configuration (bump side)
1
2
A
B
C
Flip Chip
6 bumps
Figure 2. Schematic (bump side)
Features
 Very large differential bandwidth
A1
DP_int
 Very low PCB space consumption
 High ESD robustness: IEC 61000-4-2 level 4
ESD 2kV
A2
DP_ext
ESD 15kV
 Withstand 1000 ESD strikes
 Lead-free Flip-Chip package
B1
DM_int
 Small footprint
ESD 2kV
 Very low profile
Complies with the following standard:
C1
GND
 IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
B2
DM_ext
ESD 15kV
C2
ID
ESD 15kV
Description
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required such as:
 Mobile phones
The ECMF02-3F3 is a highly integrated common
mode filter designed to suppress EMI/RFI
common mode noise on high speed differential
serial buses.
 Computers
 Portable navigation devices
 Digital still cameras
 Portable multimedia players
TM: IPAD is a trademark of STMicroelectronics.
December 2013
This is information on a product in full production.
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Characteristics
1
ECMF02-3F3
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
15
8
kV
IEC 61000-4-2 (C = 150 pF, R = 330 
External pins (A2, B2 and C2): level 4
Air discharge
Contact discharge
Internal pins (A1, B1): level 1
Air discharge
Contact discharge
VPP
2
2
Pd
Line resistance power dissipation at 85 °C (top max)
Tj
Tstg
60
mW
Operating temperature range
- 30 to + 85
°C
Storage temperature range
- 55 to 150
°C
Figure 3. Electrical characteristics (definitions)
I
IF
Symbol
Parameter
V BR
I RM
R DC
Breakdown voltage
=
=
=
Leakage current @VBM
Serial resistance
VCL VBR VRM
IRM
IPP
Table 2. Electrical characteristics (values, Tamb = 25 °C)
Symbol
2/12
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3 V per line
RDC
DC serial resistance
Min.
Typ.
Max.
6
V
3.4
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Unit
100
nA
4.5

ECMF02-3F3
Characteristics
Figure 4. SDD21 differential attenuation versus frequency
SDD21 (dB)
0.00
-1.00
-2.00
-3.00
F(Hz)
-4.00
100.0k
1.0M
10.0M
100.0M
1.0G
Figure 5. SCC21 common mode attenuation versus frequency (ID pin floating)
SCC21 (dB)
0.00
-5.00
-10.00
-15.00
-20.00
-25.00
-30.00
-35.00
F(Hz)
-40.00
100.0k
1.0M
10.0M
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100.0M
1.0G
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Characteristics
ECMF02-3F3
Figure 6. SDD11 / SDD22 differential return loss versus frequency (ID pin floating)
SDD11 / SDD22 (dB)
0.00
-5.00
-10.00
-15.00
SDD22
-20.00
-25.00
SDD11
-30.00
-35.00
F(Hz)
-40.00
100.0k
1.0M
10.0M
100.0M
1.0G
Figure 7. Eye diagram (according to USB 2.0 high speed specification mask1)
Through ISS
(Impedance
Standard Substrate)
Board only
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ID open
With ECMF02-3F3
With ECMF02ID pin floating
3F3, Id pin open
200 mV/c
200 mV/c
347.2 ps/c
347.2 ps/c
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ECMF02-3F3
Characteristics
Figure 8. TDR: Z0 DIFF = 100 tR = 400 ps (10% - 90%),
12.5 Ω / div
100 Ω
Figure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge)
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Characteristics
ECMF02-3F3
Figure 10. ESD response to IEC 61000-4-2 (- 8 kV contact discharge)
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ECMF02-3F3
2
USB 2.0 application schematic
USB 2.0 application schematic
Figure 11. Application schematic
V BUS
D+
ESD 15kV
D-
ESD 2kV
B1
DM_int
B2
DM_ext
ESD 15kV
ID
D-
ESD 2kV
C2
ID
ESD 15kV
D+
A1
DP_int
A2
DP_ext
C1
GND
ECMF02-3F3
GND
USB
CONTROLLER
USB
CONNECTOR
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Ordering information scheme
3
ECMF02-3F3
Ordering information scheme
Figure 12. Ordering information scheme
ECMF
Function
ESD common mode filter
Number of lines
02 = 2 lines
Number of ESD protected lines
3 = 3 ESD protected lines
Package
F3 = Flip Chip, 0.4 mm pitch
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3
F3
ECMF02-3F3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 13. Package dimensions
400 µm ± 40
500 µm ± 50
400 µm ± 40
1330 µm ± 40 µm
255 µm ± 40
215 µm
830 µm ± 30 µm
265 µm
4
Package information
Figure 14. Marking
DocID023283 Rev 3
x x z
y ww
Dot
ECOPACK grade
xx = marking
z = manufacturing location
yww = date code
(y = year
ww = week)
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Package information
ECMF02-3F3
Figure 15. Footprint recommendations
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Dot identifying Pin A1 location
Ø 1.50 ± 0.1
4.0 ± 0.1
2.0 ± 0.05
3.5 ± 0.05
1.43 ± 0.05
xxz
yww
ST
xxz
yww
0.93 ± 0.05
ST
xxz
yww
ST
8.0 + 0.3 / - 0.1
0.20 ± 0.02
1.75 ± 0.1
Figure 16. Flip Chip tape and reel specification
4.0 ± 0.1
0.59 ± 0.05
All dimensions are in mm
Note:
User direction of unreeling
More information is available in the application notes:
AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
AN1751, “EMI filters: recommendations and measurements”
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ECMF02-3F3
5
Ordering information
Ordering information
Table 3. Ordering information
6
Order code
Marking
Package
Weight
Base qty
Delivery mode
ECMF02-3F3
KH
Flip Chip
1.2 mg
5000
Tape and reel 7”
Revision history
Table 4. Document revision history
Date
Revision
Changes
19-Nov-2012
1
Initial release.
22-May-2013
2
Moved dot position in Figure 13. Moved arrow in Figure 16 to point
to pin A1 location.
19-Dec-2013
3
Corrected typographical error in Figure 13.
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ECMF02-3F3
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