Si5010-EVB User Guide

Si 5 0 1 0 - EVB
EVALUATION BOARD FOR Si5010 OC-12/3, STM-4/1
S O N E T / S D H C L O C K A N D D ATA R E C O V E R Y I C
Description
Features
The Si5010 evaluation board provides a platform for
testing and characterizing Silicon Laboratories’ Si5010
multi-rate OC-12/3 and STM-4/1 clock and data
recovery (CDR) device.

Single 2.5 V power supply
Differential I/Os ac coupled
 Simple jumper configuration

All high-speed I/Os are ac coupled to ease interfacing to
industry standard test equipment
Function Block Diagram
Jitter
Analyzer
Pulse
G enerator
Z C = 50 
+
REFCLK
Z C = 50 
–
+
CLKO UT
–
Z C = 50 
Z C = 50 
Si5010
Pattern
G enerator
Z C = 50 
+
DATAIN
Z C = 50 
–
Scope
+
DATAO UT
Z C = 50 
–
Z C = 50 
Pattern
Analyzer
LOL
RATESEL
PW RDN/CAL
REXT
10 k 
Jum pers
Test
Point
Si5010-EVB
Rev C
Rev. 1.0 12/02
Copyright © 2016 by Silicon Laboratories
Si5010-EVB-10
Si5010-EVB
CAUTION: The evaluation board is designed so that the
body of the SMA jacks and GND are shorted. Care must
be taken when powering the PCB at potentials other
than GND at 0.0 V and VDD at 2.5 V relative to chassis
GND.
Self-Calibration
The Si5010 device provides an internal self-calibration
function that optimizes the loop gain parameters within
the internal DSPLLTM. Self-calibration is initiated by a
high-to-low transition of the PWRDN/CAL signal while a
valid reference clock is supplied to the REFCLK input.
On the Si5010-EVB board, a voltage detector IC is
utilized to initiate self-calibration. The voltage detector
drives the PWRDN/CAL signal low after the supply
voltage has reached a specific voltage level. This circuit
is described in Silicon Laboratories application note
AN42. On the Si5010-EVB, the PWRDN/CAL signal is
also accessible via a jumper located in the lower lefthand corner of the evaluation board. PWRDN/CAL is
wired to the signal post adjacent to the 2.5 V post.
REFCLK
REFCLK is used to center the frequency of the
DSPLL™ so that the device can lock to the data. Ideally
the REFCLK frequency should be 19.44 77.76, or
155.52 MHz, and must have a frequency accuracy of
±100 PPM.
Internally,
the
CDR
automatically
recognizes the REFCLK frequency within one of these
three frequency ranges. REFCLK is ac coupled to the
SMA jacks located on the top side of the evaluation
board.
RATESEL
RATESEL is used to configure the CDR to recover clock
and data at different data rates. RATESEL is a binary
input that is controlled via a jumper located in the lower
left-hand corner of the evaluation board. RATESEL is
wired to the center post (signal post) between 2.5 V and
GND. For example, the OC-12 data rate is selected by
jumping RATESEL to 0.0 V.
The table given on the evaluation board lists
approximate data rates for the jumper configurations
shown in Figure 1.
Device Powerdown
The CDR can be powered down via the PWRDN/CAL
signal. When asserted the evaluation board will draw
minimal current. PWRDN/CAL is controlled via one
jumper located in the lower left-hand corner of the
evaluation board. PWRDN/CAL is wired to the signal
post adjacent to the 2.5 V post.
CLKOUT, DATAOUT, DATAIN
These high-speed I/Os are wired to the board perimeter
on 30 mil (0.030 inch) 50  microstrip lines to the endlaunch SMA jacks as labeled on the PCB. These I/Os
are ac coupled to simplify direct connection to a wide
array of standard test hardware. Because each of these
signals are differential both the positive (+) and negative
(–) terminals must be terminated to 50 . Terminating
only one side will adversely degrade the performance of
the CDR. The inputs are terminated on the die with 50 
resistors.
2
2.5 V
The evaluation board requires one 2.5 V supply. Supply
filtering is placed on the board to filter typical system
noise components, however, initial performance testing
should use a linear supply capable of supplying 2.5 V
±5% dc.
GND
Power Supply
Note: The 50  termination is for each terminal/side of a differential signal, thus the differential termination is actually 50  + 50  = 100 .
2.5 V
The evaluation board simplifies characterization of the
Si5010 clock and data recovery (CDR) device by
providing access to all of the Si5010 I/Os. Device
performance can be evaluated by following the Test
Configuration section below. Specific performance
metrics include jitter tolerance, jitter generation, and
jitter transfer.
To improve the DATAOUT eye-diagram, short 100 
transmission line segments precede the 50  highspeed traces. These segments increase the interface
bandwidth from the chip to the 50  traces and reduce
data inter-symbol-interference. Please refer to Silicon
Laboratories application note AN43 for more details.
GND
Functional Description
RATESEL
RATESEL
PW RDN/
CAL
PW RDN/
CAL
622 M bps
155 M bps
Figure 1. RATESEL Jumper Configurations
Loss-of-Lock (LOL)
LOL is an indicator of the relative frequency between
the data and the REFCLK. LOL will assert when the
frequency difference is greater than ±600 PPM. In order
to prevent LOL from de-asserting prematurely, there is
hysterisis in returning from the out-of-lock condition.
LOL will be de-asserted when the frequency difference
is less than ±300 PPM.
LOL is wired to a test point which is located on the
upper right-hand side of the evaluation board.
Rev. 1.0
Si5010-EVB
Test Configuration
The three critical tests that are typically performed on a
CDR device are jitter transfer, jitter tolerance, and jitter
generation. By connecting the Si5010 Evaluation Board
as shown in Figure 2, all three measurements can be
easily made.
REFCLK should be within ±100 PPM of 19.44, 77.76, or
155.52 MHz. RATESEL must be configured to match
the desired data rate, and PWRDN/CAL must be
unjumpered.
Jitter Tolerance: Referring to Figure 2, this test
requires a pattern generator, a clock source
(synthesizer signal source), a modulation source, a jitter
analyzer, a pattern analyzer, and a pulse generator (all
unconnected high-speed outputs must be terminated to
50 ). During this test the Jitter Analyzer causes a
modulation on the data pattern which drives the DATAIN
ports of the CDR. The Bit-Error-Rate (BER) is monitored
on the Pattern Analyzer. The modulation (jitter)
frequency and amplitude is recorded when the BER
approaches a specified threshold.
Jitter Generation: Referring to Figure 2, this test
requires a pattern generator, a clock source
(synthesizer signal source), a jitter analyzer, and a
pulse generator (all unconnected high-speed outputs
must be terminated to 50 ). During this test, there is no
modulation of the Data Clock, so the data that is sent to
the CDR is jitter free. The Jitter Analyzer measures the
RMS and peak-to-peak jitter on the CDR CLKOUT.
Thus, any jitter measured is jitter generated by the
CDR.
Jitter Transfer: Referring to Figure 2, this test requires
a pattern generator, a clock source (synthesizer signal
source), a modulation source, a jitter analyzer, and a
pulse generator (all unconnected high-speed outputs
must be terminated to 50 ). During this test the Jitter
Analyzer modulates the data pattern and data clock
reference. The modulated data clock reference is
compared with the CLKOUT of the CDR. Jitter on
CLKOUT relative to the jitter on the data clock reference
is plotted versus modulation frequency at predefined
jitter amplitudes.
Rev. 1.0
3
Si5010-EVB
Pulse
Generator
DATAOUT–
Scope
Pattern
Analyzer
GPIB
2.5 V
+ –
REFCLK+
+
REFCLK
–
DATAOUT
+
–
CLKOUT
+
–
DATAOUT+
REFCLK–
DATAIN+
+
DATAIN
–
DATAIN–
CLKOUT+
CLKOUT–
Si5010-EVB
Pattern
Generator
Jitter
Analyzer
Data Clock+
GPIB
GPIB
Clock
Synthesizer
Signal Source
FM
Modulation
Source
GPIB
Figure 2. Test Configuration for Jitter Tolerance, Transfer, and Generation
4
Rev. 1.0
POS2
POS1
2
1
MKDSN 2,5/3-5,08
J9
1206 BLM31A601S
L1
C13
0603 100pF
2
2
2
SIG
SIG
SIG
1
JC 142-0701-801
BODY
J2
1
JC 142-0701-801
BODY
J1
JC 142-0701-801
1
JC 142-0701-801
BODY
J8
2
SIG
1
C16
0603 100pF
BODY
J7
C15
0603 100pF
VDD
2
C9
VDD
VDD
REXT
REFCLK-
REFCLK+
DIN-
DIN+
NC
RATESEL
PWRDN/CAL
R1
0603 10k
1
5
4
10
9
20
19
15
Figure 3. Si5010 Schematic
0603 0.1uF
C7
0603 0.1uF
C8
0603 0.1uF
C6
0603 0.1uF
C5
0603 2.5k
R2
0805 Do Not Install
VDD
MAX6376XR23-T
OUT
V?
U4
tantalum 10uF
C12
1
GND
3
VCC
2.5V
JP2
2
7
11
14
DOUT+
DOUT-
LOL
VDD
Si5010
CLKOUT+
CLKOUT-
U5
VDDA
VDDB
VDDC
VDDD
GNDA
GNDB
GNDC
Rev. 1.0
3
8
18
JP1
17
16
13
12
6
JP4
0603 0.1uF
C1
0603 0.1uF
C2
0603 0.1uF
C3
0603 0.1uF
C4
1
1
2
2
JC 142-0701-801
SIG
BODY
JC 142-0701-801
2
JC 142-0701-801
SIG
SIG
J6
2
JC 142-0701-801
BODY
J4
SIG
BODY
BODY
J5
1
1
J3
Si5010-EVB
5
Si5010-EVB
Bill of Materials
Si5010EVB Assy Rev B-02 BOM
Reference
Part Desc
C1,C2,C3,C4,C5,
C6,C7,C8
CAP, SM, 0.1uF, 0603
CAP, SM, 10 uF, TANTALUM,
C12
3216
C13,C15,C16
CAP, SM, 100 pF, 16V, 0603
JP1,JP4
CONNECTOR, HEADER, 2X1
JP2
CONNECTOR, HEADER, 3X1
J1,J2,J3,J4,J5,J6, CONNECTOR, SMA, SIDE
J7,J8
MOUNT
CONNECTOR, POW ER, 2
J9
POS
L1
R2
U4
U5
PCB
RESISTOR, SM, 0 OHM, 1206
RESISTOR, SM, 10K, 1%,
0603
RESISTOR, SM, 2.55K, 1%,
0603
MAX6376XR23-T
Si5010
PRINTED CIRCUIT BOARD
No Load
C9
SPARE,0805
R1
6
Part Number
Manufacturer
C0603X7R160-104KNE
Venkel
TA010TCM106KAR
C0603C0G500101KNE
2340-6111TN or 2380-6121TN
2340-6111TN or 2380-6121TN
Venkel
Venkel
3M
3M
901-10003
Amphenol
1729018
Phoenix Contact
CR1206-8W -000T
Venkel
CR0603-16W -1002FT
Venkel
CR0603-16W -2551FT
MAX6376XR23-T
SI5010-BM
Si5010-EVB PCB Rev C
Venkel
Maxim
Silicon Laboratories
Silicon Laboratories
Rev. 1.0
Si5010-EVB
Figure 4. Si5010 Silkscreen
Rev. 1.0
7
Si5010-EVB
Figure 5. Si5010 Component Side
8
Rev. 1.0
Si5010-EVB
Figure 6. Si5010 Solder Side
Rev. 1.0
9
Si5010-EVB
Document Change List
Revision 0.41 to Revision 1.0

“Preliminary” language removed.
Evaluation Board Assembly Revision History
10
Assembly Level
PCB
Si5010 Device
Assembly Notes
B-01
B
B
Assemble per BOM rev B-01.
B-02
C
B
Assemble per BOM rev B-02.
Rev. 1.0
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