Cancelled-ASEKR Die Bond Adhesive – Japan Earthquake and Tsunami Disaster Recovery

Process Change Notice # 1104011
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PCN Date: 06APR11
Effective Date: 06Jul11
Title: ASEKR Die Bond Adhesive – Japan Earthquake and Tsunami Disaster Recovery
Originator: Harold Melton
Phone: 512.428.1699
Dept: Product Quality
Customer Contact: Kathy Haggar
Phone: 512.532.5261
Dept: Sales
PCN Type:
Assembly
Discontinuance
Package
Datasheet
Fabrication
Product Revision
Packing
Labeling
Location
Test
Other
Last Order Date: N/A
PCN Details
Description of Change: Add Henkel Ablebond 8290 die attach epoxy as an additional approved
package material.
Reason for Change: Hitachi EN4900 supply continuity impacted by Japan earthquake and
tsunami.
Impact on Form, Fit, Function, Quality, Reliability: The new die attach epoxy is equivalent to
the Hitachi EN4900 and meets all quality and reliability requirements.
Product Identification: See Appendix A for the full list of affected part numbers.
Last Date of Unchanged Product: 06JUL11
Qualification Samples: Available on request within standard lead-times.
Customer Early Acceptance Sign Off:
Customers may approve early PCN acceptance by completing the information below:
Early Acceptance Date:
Name:
Company:
Email your early Acceptance approval to: [email protected]
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1
Process Change Notice # 1104011
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Qualification Data: See Appendix B for qualification data on 7x7 QFN using Ablebond 8290
epoxy. Additional qualification stresses will be reported as shown below
Package
Die Shear
3x3 QFN
6x6 QFN
6x6 QFN (multi-die)
4x4 QFN (AEC)
Date of Report
W7206F1 Process Change Notice Form rev AA
MSL
Verification
HAST
Temperature
Cycling
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19-Apr-11
2-May-11
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2
Process Change Notice # 1104011
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Appendix A
Affected Part Numbers
BCCC-P11901ZM7
BCDM-P13002ZM7
C8051F571-IM
C8051F580-IM
C8051F588-IM
C8051F980-GM
C8051F981-GM
Si2143-A30-GM
Si2153-A40-GM
Si2170-A20-GM
Si2170-B30-GM
Si2172-A10-GM
Si2172-A20-GM
Si2173-A30-GM
Si2173-A31-GM
Si2173-A40-GM
Si2173-A40-ZM7
Si2200-F-GM
Si3112-A-FM
Si3112-A-ZM1
Si3203-B-FM
Si3203-B-GM
Si3206-B-FM
Si3206-B-GM
Si3208-B-FM
Si3208-B-GM
Si3209-B-FM
Si3209-B-GM
Si3210-E-FM
Si3210-E-GM
Si3210M-E-FM
Si3210M-E-GM
Si3211-E-FM
Si3211-E-GM
Si3215-C-FM
Si3215-C-GM
Si3215M-C-FM
Si3215M-C-GM
Si3216-C-FM
Si3216-C-GM
Si3216M-C-FM
Si3216M-C-GM
Si3230-E-FM
Si3230-E-GM
Si3230M-E-FM
Si3230M-E-GM
Si3400-E1-GM
Si3402-A-GM
Si3500-A-GM
Si4112-D-GM
Si4113-D-GM
Si4123-D-GM
Si4126-F-GM
Si4133-D-GM
Si4136-F-GM
Si4702-B16-GM
Si4702-C19-GM
Si4702-D30-GM
Si4703-B17-GM
Si4703-B17-ZM1
Si4703-C19-GM
Si4703-D30-GM
Si4704-B20-GM
Si4704-C40-GM
Si4704-D50-GM
Si4704-D60-GM
Si4705-B20-GM
Si4705-C40-GM
Si4705-D50-GM
Si4705-D60-GM
Si4706-B20-GM
Si4706-C30-GM
Si4706-C31-GM
Si4706-D50-GM
Si4707-B20-GM
Si4708-B-GM
Si4708-C-GM
Si4709-B-GM
Si4709-C-GM
Si4710-B30-GM
Si4710-B31-GM
Si4711-B30-GM
Si4712-B30-GM
Si4713-B30-GM
Si4720-B20-GM
Si4721-B20-GM
Si4730-B20-GM
Si4730-C40-GM
Si4730-D60-GM
Si4731-B20-GM
Si4731-C40-GM
Si4731-D60-GM
Si4734-B20-GM
Si4734-C40-GM
Si4734-D60-GM
Si4735-B20-GM
Si4735-D60-GM
Si4736-B20-GM
Si4737-B20-GM
Si4738-B20-GM
Si4740-C10-GM
Si4741-C10-GM
Si4743-C10-AM
Si4743-C10-GM
Si4744-C10-GM
Si4745-C10-AM
Si4745-C10-GM
Si4749-C10-AM
Si4749-C10-GM
Si4749-C10-ZM1
Si4784-B20-GM
Si4785-B20-GM
500SxxxxxMxxxxACx
500DxxxxxMxxxxACx
Note: For Tape and Reel option, add a R suffix to the part number above
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3
Process Change Notice # 1104011
____________________________________________________________________________________________________
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4
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