TSM6025 +2.5V, Low-Power/Low-Dropout Precision Voltage Reference

TSM6025
A +2.5V, Low-Power/Low-Dropout Precision Voltage Reference
FEATURES
DESCRIPTION


The TSM6025 is a 3-terminal, series-mode 2.5-V
precision voltage reference and is a pin-for-pin,
alternate source for the MAX6025 voltage reference.
Like the MAX6025, the TSM6025 consumes only
27μA of supply current at no-load, exhibits an initial
output voltage accuracy of less than 0.2%, and a low
output voltage temperature coefficient of 15ppm/°C.
In addition, the TSM6025’s output stage is stable for
all capacitive loads to 2200pF and is capable of
sinking and sourcing load currents up to 500μA.








Alternate Source for MAX6025
Initial Accuracy:
0.2% (max) – TSM6025A
0.4% (max) – TSM6025B
Temperature Coefficient:
15ppm/°C (max) – TSM6025A
25ppm/°C (max) – TSM6025B
Quiescent Supply Current: 35μA (max)
Low Supply Current Change with VIN: <1μA/V
Output Source/Sink Current: ±500μA
Low Dropout at 500μA Load Current: 100mV
Load Regulation: 0.14μV/μA
Line Regulation : 25μV/V
Stable with CLOAD up to 2200pF
APPLICATIONS
Industrial and Process-Control Systems
Hard-Disk Drives
Battery-Operated Equipment
Data Acquisition Systems
Hand-Held Equipment
Precision 3V/5V Systems
Smart Industrial Transmitters
Since the TSM6025 is a series-mode voltage
reference, its supply current is not affected by
changes in the applied supply voltage unlike twoterminal shunt-mode references that require an
external resistor. The TSM6025’s small form factor
and low supply current operation combine to make it
an ideal choice in low-power, precision applications.
The TSM6025 is fully specified over the -40°C to
+85°C temperature range and is available in a 3-pin
SOT23 package.
TYPICAL APPLICATION CIRCUIT
Output Voltage Temperature Drift
OUTPUT VOLTAGE - Volt
2.5035
THREE TYPICAL DEVICES
2.5025
DEVICE #1
2.5015
DEVICE #2
2.5005
2.4995
DEVICE #3
2.4985
-40
-15
10
35
60
85
TEMPERATURE DRIFT- °C
Page 1
© 2014 Silicon Laboratories, Inc. All rights reserved.
TSM6025
ABSOLUTE MAXIMUM RATINGS
IN to GND................................................................. -0.3V to +13.5V
OUT to GND.................................................................... -0.3V to 7V
Short Circuit to GND or IN (VIN < 6V) .............................. Continuous
Output Short Circuit to GND or IN (VIN ≥ 6V) .............................. 60s
Continuous Power Dissipation (TA = +70°C)
3-Pin SOT23 (Derate at 4.0mW/°C above +70°C) .......... 320mW
Operating Temperature Range ................................. -40°C to +85°C
Storage Temperature Range .................................. -65°C to +150°C
Lead Temperature (Soldering, 10s)...................................... +300°C
Electrical and thermal stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections
of the specifications is not implied. Exposure to any absolute maximum rating conditions for extended periods may affect device reliability and
lifetime.
PACKAGE/ORDERING INFORMATION
ORDER NUMBER
PART
CARRIER QUANTITY
MARKING
TSM6025AEUR+
Tape
& Reel
-----
TSM6025AEUR+T
Tape
& Reel
3000
TSM6025BEUR+
Tape
& Reel
-----
Tape
& Reel
3000
ACX
ACY
TSM6025BEUR+T
Lead-free Program: Silicon Labs supplies only lead-free packaging.
Consult Silicon Labs for products specified with wider operating temperature ranges.
Page 2
TSM6025 Rev. 1.0
TSM6025
ELECTRICAL CHARACTERISTICS
VIN = +5V, IOUT = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C. See Note 1.
PARAMETER
OUTPUT
SYMBOL
CONDITIONS
TSM6025A
Output Voltage
VOUT
TA = +25°C
TSM6025B
Output Voltage Temperature
Coefficient (See Note 2)
Line Regulation
Load Regulation
Dropout Voltage (See Note 5)
OUT Short-Circuit Current
VOUT
∆VOUT/
∆VIN
∆VOUT/
∆IOUT
VIN -VOUT
ISC
TA = 0°C to +70°C
TA = -40°C to +85°C
TA = 0°C to +70°C
TA = -40°C to +85°C
MIN
TYP
MAX
UNITS
2.495
-0.20
2.490
-0.40
2.500
2.505
0.20
2.510
0.40
15
20
25
30
V
%
V
%
6
6
6
6
TSM6025A
TSM6025B
(VOUT + 0.2V) ≤ VIN ≤ 12.6V
Sourcing: 0 ≤ IOUT ≤ 500μA
Sinking: -500μA ≤ IOUT ≤ 0
IOUT = 500μA
VOUT Short to GND
VOUT Short to IN
0.14
0.18
100
4
4
Temperature Hysteresis
(See Note 3)
Long-Term Stability
∆VOUT/
time
2.500
ppm/°C
140
μV/V
0.60
0.80
200
μV/μA
mV
mA
130
ppm
1000hr at TA = +25°C
50
ppm/
1000hr
f = 0.1Hz to 10Hz
f = 10Hz to 10kHz
50
125
μVP-P
μVRMS
VIN = 5V ±100mV, f = 120Hz
82
dB
DYNAMIC
Noise Voltage
Ripple Rejection
Capacitive-Load Stability Range
INPUT
Supply Voltage Range
Quiescent Supply Current
Change in Supply Current
eOUT
∆VOUT/
∆VIN
COUT
VIN
IIN
IIN/VIN
See Note 4
Guaranteed by line-regulation test
0
VOUT + 0.2
27
(VOUT + 0.2V) ≤ VIN ≤ 12.6V
2.2
nF
12.6
35
2.0
V
μA
μA/V
Note 1: All devices are 100% production tested at TA = +25°C and are guaranteed by characterization for TA = TMIN to TMAX, as specified.
Note 2: Temperature Coefficient is measured by the “box” method; i.e., the maximum ∆VOUT is divided by the maximum ∆T.
Note 3: Temperature hysteresis is defined as the change in the +25°C output voltage before and after cycling the device from TMIN to TMAX.
Note 4: Not production tested; guaranteed by design.
Note 5: Dropout voltage is the minimum input voltage at which VOUT changes ≤0.2% from VOUT at VIN = 5.0V.
TSM6025 Rev. 1.0
Page 3
TSM6025
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = +5V; IOUT = 0mA; TA = +25°C, unless otherwise noted.
Output Voltage Temperature Drift
Long-Term Output Voltage Drift
2.502
THREE TYPICAL DEVICES
OUTPUT VOLTAGE - Volt
OUTPUT VOLTAGE - Volt
2.5035
2.5025
DEVICE #1
2.5015
DEVICE #2
2.5005
2.4995
THREE TYPICAL DEVICES
DEVICE A
2.501
2.500
DEVICE B
2.499
DEVICE C
DEVICE #3
2.4985
2.498
-40
-15
35
10
60
85
1000
Line Regulation – ΔVOUT/ΔVIN
Dropout Voltage vs Source Current
0.4
TA = -40°C
DROPOUT VOLTAGE - Volt
OUTPUT VOLTAGE CHANGE - µV
750
TIME - Hours
200
TA = +25°C
100
TA = +85°C
0
-100
0.3
TA = +85°C
0.2
TA = +25°C
TA = -40°C
0.1
0
2
6
4
8
10
12
600
800
1000
SOURCE CURRENT- µA
Load Regulation – ΔVOUT/ΔILOAD
Power Supply Rejection vs Frequency
TA = -40°C
TA = +85°C
0
TA = +25°C
-0.2
-0.4
-500
400
200
SUPPLY VOLTAGE - Volt
POWER SUPPLY REJECTION – mV/V
0.2
0
14
0.4
OUTPUT VOLTAGE CHANGE - mV
500
TEMPERATURE DRIFT- °C
300
-250
0
250
LOAD CURRENT- µA
Page 4
250
0
500
100
VCC =+5.5V±0.25V
10
1
0.1
0.01
100
1k
10k
100k
1M
FREQUENCY - Hz
TSM6025 Rev. 1.0
TSM6025
TYPICAL PERFORMANCE CHARACTERISTICS
Supply Current vs Temperature
40
SUPPLY CURENT - µA
SUPPLY CURENT - µA
VIN = +5V; IOUT = 0mA; TA = +25°C, unless otherwise noted.
Supply Current vs Input Voltage
40
36
32
28
VCC =+12.5V
VCC =+7.5V
35
30
VCC = +2.5V, +5.5V
25
24
20
20
2
4
6
8
10
12
14
-40
-15
10
35
60
INPUT VOLTAGE - Volt
TEMPERATURE - °C
Output Impedance vs Frequency
0.1Hz to 10Hz Output Noise
85
1k
46µVpp
100
VOUT(N)
10µV/DIV
OUTPUT IMPEDANCE - Ω
10k
10
1
0.1
1
100
10k
1M
FREQUENCY - Hz
1s/DIV
Power-On Transient Response
Small-signal Load Transient Response
OUTPUT
1V/DIV
200µs/DIV
TSM6025 Rev. 1.0
IOUT = 0µA → 50µA → 0µA
OUTPUT
20mV/DIV
IOUT
50µA/DIV
INPUT
2V/DIV
0.1
10µs/DIV
Page 5
TSM6025
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = +5V; IOUT = 0mA; TA = +25°C, unless otherwise noted.
IOUT = 0mA → 1mA → 0mA
Line Transient Response
VIN
200mV/DIV
IOUT
1mA/DIV
Large-signal Load Transient Response
OUTPUT
100mV/DIV
OUTPUT
200mV/DIV
VIN =5V±0.25V, AC-Coupled
10µs/DIV
Page 6
2µs/DIV
TSM6025 Rev. 1.0
TSM6025
PIN FUNCTIONS
PIN
1
2
3
NAME
IN
OUT
GND
FUNCTION
Supply Voltage Input
+2.5V Output
Ground
DESCRIPTION/THEORY OF OPERATION
The TSM6025 incorporates a precision 1.25-V
bandgap reference that is followed by a output
amplifier configured to amplify the base bandgap
output voltage to a 2.5-V output. The design of the
bandgap reference incorporates proprietary circuit
design techniques to achieve its low temperature
coefficient of 15ppm/°C and initial output voltage
accuracy less than 0.2%. The design of the output
amplifier’s frequency compensation does not require
a separate compensation capacitor and is stable
with capacitive loads up to 2200pF. The design of
the output amplifier also incorporates low headroom
design as it can source and sink load currents to
500μA with a dropout voltage less than 200mV.
APPLICATIONS INFORMATION
Power Supply Input Capacitive Bypass
As shown in the Typical Application Circuit, the VIN
pin of the TSM6025 should be bypassed to GND
with a 0.1uF ceramic capacitor for optimal linetransient performance. Consistent with good analog
circuit engineering practice, the capacitor should be
placed in as close proximity to the TSM6025 as
practical with very short pcb track lengths.
Output/Load Capacitance Considerations
As mentioned previously, the TSM6025 does not
require a separate, external capacitor at VOUT for
transient response stability as it is stable for
capacitive loads up to 2200pF. On the other hand
and for improved large-signal line and load
regulation, the use of a capacitor at VOUT will provide
a reservoir of charge in reserve to absorb largesignal load or line transients. This in turn improves
the TSM6025’s VOUT settling time. If large load and
line transients are not expected in the application,
then the TSM6025 can be used without an external
capacitor at VOUT thereby reducing the overall circuit
footprint.
Supply Current
The TSM6025 exhibits excellent dc line regulation
as its supply current changes slightly as the applied
supply voltage is increased. While its supply current
is 35μA maximum, the change in its supply current
as a function of supply voltage (its ∆IIN/∆VIN) is less
TSM6025 Rev. 1.0
than 1μA/V. Since the TSM6025 is a series-mode
reference, load current is drawn from the supply
voltage only when required. In this case, circuit
efficiency is maintained at all applied supply
voltages. Reducing power dissipation and extending
battery life are the net benefits of improved circuit
efficiency.
On the other hand, an external resistor in series with
the supply voltage is required by two-terminal,
shunt-mode references. In this case, as the supply
voltage changes, so does the quiescent supply
current of the shunt reference. In addition, the
external resistor’s tolerance and temperature
coefficient contribute two additional factors that can
affect the circuit’s supply current. Therefore,
maximizing circuit efficiency with shunt-mode
references becomes an exercise involving three
variables. Additionally, shunt-mode references must
be biased at the maximum expected load current
even if the load current is not present at all times.
When the applied supply voltage is less than the
minimum specified input voltage of the TSM6025 (for
example, during the power-up transition), the
TSM6025 can draw up to 200μA above its nominal,
steady-state supply current. To ensure reliable
power-up behavior, the input power source must
have sufficient reserve power to provide the extra
supply current drawn during the power-up transition.
Page 7
TSM6025
Output Voltage Hysteresis
Reference output voltage thermal hysteresis is the
change in the reference’s +25°C output voltage after
temperature cycling from +85°C to +25°C and from 40°C to +25°C. Thermal hysteresis is caused by
differential package stress impressed upon the
TSM6025’s internal bandgap core transistors and
depends on whether the reference IC was previously
at a higher or lower temperature. At 130ppm, the
TSM6025’s typical temperature hysteresis is equal
to 0.33mV with respect to a 2.5V output voltage.
Voltage Reference Turn-On Time
combined turn-on and settling time to within 0.1% of
its 2.5V final value is approximately 340μs.
A Positive and Negative Low-Power Voltage
Reference
The circuit in Figure 1 uses a CD4049 hex inverter
and a few external capacitors as the power supply to
a dual-supply precision op amp to form a ±2.5V
precision, bipolar output voltage reference around
the TSM6025. The CD4049-based circuit is a
discrete charge pump voltage doubler/inverter that
generates ±6V supplies for any industry-standard
OP-07 or equivalent precision op amp.
With a (VIN – VOUT) voltage differential larger than
200mV and ILOAD = 0mA, the TSM6025’s typical
Figure 1: Positive and Negative 2.5V References from a Single +3V or +5V Supply
Page 8
TSM6025 Rev. 1.0
TSM6025
PACKAGE OUTLINE DRAWING
3-Pin SOT23 Package Outline Drawing
(N.B., Drawings are not to scale)
Patent Notice
Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size,
analog-intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class
engineering team.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice.
Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the
use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or
parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty,
representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended
to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where
personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized
application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders.
Silicon Laboratories, Inc.
400 West Cesar Chavez, Austin, TX 78701
+1 (512) 416-8500 ▪ www.silabs.com
Page 9
TSM6025 Rev. 1.0
Smart.
Connected.
Energy-Friendly
Products
Quality
Support and Community
www.silabs.com/products
www.silabs.com/quality
community.silabs.com
Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific
written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected
to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no
circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations
thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®,
USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of
ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
USA
http://www.silabs.com