VEMD2503X01, VEMD2523X01 Datasheet

VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
Silicon PIN Photodiode
FEATURES
VEMD2503X01
• Package type: surface mount
VEMD2523X01
• Package form: GW, RGW
• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55
• AEC-Q101 qualified
• High radiant sensitivity
• Suitable for visible and neat infrared radiation
• Fast response times
• Angle of half sensitivity:  = ± 35°
• Package matched with IR emitter series
VSMB2943X01
DESCRIPTION
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
VEMD2503X01 and VEMD2523X01 are high speed and high
sensitive PIN photodiodes in a miniature surface mount
package (SMD) with dome lens. The clear epoxy allows light
detection of a wide wavelength range from 350 nm to
1120 nm. The photo sensitive area of the chip is 0.23 mm2.
• Lead (Pb)-free reflow soldering
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• High speed photo detector
• Light curtain
• Detector for optical switch
PRODUCT SUMMARY
COMPONENT
Ira (μA)
 (deg)
0.1 (nm)
VEMD2503X01
10
± 35
350 to 1120
VEMD2523X01
10
± 35
350 to 1120
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VEMD2503X01
Tape and reel
MOQ: 6000 pcs, 6000 pcs/reel
Reverse gullwing
VEMD2523X01
Tape and reel
MOQ: 6000 pcs, 6000 pcs/reel
Gullwing
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Power dissipation
Tamb 25 °C
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.0, 05-Apr-13
SYMBOL
VALUE
VR
60
UNIT
V
PV
215
mW
Tj
100
°C
Tamb
- 40 to + 100
°C
Tstg
- 40 to + 100
°C
Acc. reflow solder profile fig. 7
Tsd
260
°C
Acc. J-STD-051
RthJA
250
K/W
Document Number: 84163
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
IF = 50 mA
VF
IR = 100 μA, E = 0
V(BR)
VR = 10 V, E = 0
Iro
Forward voltage
Breakdown voltage
Reverse dark current
Diode capacitance
Open circuit voltage
MIN.
TYP.
MAX.
UNIT
1
V
32
V
1
10
nA
VR = 0 V, f = 1 MHz, E = 0
CD
4
VR = 5 V, f = 1 MHz, E = 0
CD
1.3
pF
Ee = 1 mW/cm2,  = 950 nm
Vo
350
mV
mV/K
pF
Temperature coefficient of Vo
Ee = 1 mW/cm2,  = 950 nm
TKVo
- 2.6
Short circuit current
Ee = 1 mW/cm2,  = 950 nm
Ik
10
μA
Temperature coefficient of Ik
Ee = 1 mW/cm2,  = 950 nm
TKIk
0.1
%/K
Ee = 1 mW/cm2,  = 950 nm, VR = 5 V
Ira
Reverse light current
7

Angle of half sensitivity
10
14
μA
± 35
deg
Wavelength of peak sensitivity
p
900
nm
Range of spectral bandwidth
0.1
350 to 1120
nm
Rise time
VR = 10 V, RL = 1 k,  = 820 nm
tr
100
ns
Fall time
VR = 10 V, RL = 1 k,  = 820 nm
tf
100
ns
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
100
Ira - Reverse Light Current (µA)
Iro - Reverse Dark Current (nA)
1000
100
10
VR = 10 V
1
20
94 8427
40
60
1
0.1
1
10
Ee - Irradiance (mW/cm2)
Tamb - Ambient Temperature (°C)
Fig. 1 - Reverse Dark Current vs. Ambient Temperature
Fig. 3 - Reverse Light Current vs. Irradiance
8
1.4
CD - Diode Capacitance (pF)
Ira, rel - Relative Reverse Light Current
10
0.1
0.01
100
80
VR = 5 V
VR = 5 V
λ = 950 nm
1.2
1.0
0.8
6
E=0
f = 1 MHz
4
2
0
0.6
0
94 8416
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 2 - Relative Reverse Light Current vs. Ambient Temperature
Rev. 1.0, 05-Apr-13
0.1
94 8430
1
10
100
VR- Reverse Voltage (V)
Fig. 4 - Diode Capacitance vs. Reverse Voltage
Document Number: 84163
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
0°
10°
20°
30°
1.0
0.8
0.6
0.4
0.2
40°
1.0
0.9
50°
0.8
60°
70°
ϕ - Angular Displacement
Srel - Relative Radiant Sensitivity
S (λ)rel - Relative Spectral Sensitivity
1.2
80°
0
400
500
600
700
800
900
1000 1100
Fig. 5 - Relative Spectral Sensitivity vs. Wavelength
REFLOW SOLDER PROFILE
0.4
0.2
0
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
max. 30 s
150
max. 100 s
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
0
0
19841
50
100
150
200
250
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label: 
Floor life: 4 weeks 
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
200
max. 120 s
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
DRYPACK
300
Temperature (°C)
0.7 0.6
λ - Wavelength (nm)
21553
300
Time (s)
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
Rev. 1.0, 05-Apr-13
Document Number: 84163
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: VEMD2503
Rev. 1.0, 05-Apr-13
Document Number: 84163
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: VEMD2523
Rev. 1.0, 05-Apr-13
Document Number: 84163
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VEMD2503
Rev. 1.0, 05-Apr-13
Document Number: 84163
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEMD2503X01, VEMD2523X01
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VEMD2523
Rev. 1.0, 05-Apr-13
Document Number: 84163
7
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000