Si4702/03-C19 B R O A D C A S T F M R A D I O TU N E R FOR P O R TA B L E A P P L I C A T I O N S Features Ordering Information: See page 38. Pin Assignments (Top View) Pb-free/RoHS compliant RDS/RBDS Processor (Si4703) Integrated crystal oscillator Si4702/03-GM Applications Portable navigation Consumer electronics Description The Si4702/03 integrates the complete tuner function from antenna input to stereo audio output for FM broadcast radio reception. NC 1 FMIP 2 RFGND 3 GND 4 RST 5 Functional Block Diagram Si4702/03 I ADC FMIP RFGND LNA PGA Q ADC DSP FILTER DEMOD MPX AUDIO DAC DAC 19 18 17 16 15 GND 14 LOUT GND PAD 13 ROUT 12 GND 6 7 8 9 10 11 VD U.S. and International Patents LOUT ROUT AMPLIFIER Headphone Cable 20 RCLK USB FM radio PDAs Notebook PCs SDIO SEN Cellular handsets MP3 players Portable radios SCLK VA GPIO3 VIO Adaptive noise suppression Volume control Line-level analog output 32.768 kHz reference clock 2-wire and 3-wire control interface 2.7 to 5.5 V supply voltage Integrated LDO regulator allows direct connection to battery 3 x 3 mm 20-pin QFN package GPIO2 GPIO1 This data sheet applies to Si4702/03-C Firmware 19 and greater Worldwide FM band support (76–108 MHz) Digital low-IF receiver Frequency synthesizer with integrated VCO Seek tuning Automatic frequency control (AFC) Automatic gain control (AGC) Excellent overload immunity Signal strength measurement Programmable de-emphasis (50/75 µs) NC pending—Abbreviated U.S. Patent List: 7272375, 7127217, 7272373, 7272374, 7321324, 7339503, 0 / 90 LOW-IF GPIO 32.768 kHz 2.7–5.5 V VA VD Rev. 1.1 7/09 AFC TUNE REG XTAL OSC RDS (Si4703) RSSI CONTROL INTERFACE VIO RCLK RST SDIO SCLK SEN 7339504, 7355476, 7426376, CONTROLLER AGC GPIO Copyright © 2009 by Silicon Laboratories 7436252, 7471940 Si4702/03-C19 2 Rev. 1.1 TABLE O F C ONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2. FM Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.3. General Purpose I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4. RDS/RBDS Processor and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.5. Stereo Audio Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.6. Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.7. Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 4.8. Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 4.9. Reset, Powerup, and Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.10. Audio Output Summation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.11. Initialization Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.12. Programming Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5. Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 7. Pin Descriptions: Si4702/03-C19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 9. Package Markings (Top Marks) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.1. Si4702 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.2. Si4703 Top Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 9.3. Top Mark Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 10. Package Outline: Si4702/03-C19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 11. PCB Land Pattern: Si4702/03-C19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 Rev. 1.1 3 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Digital Supply Voltage VD 2.7 — 5.5 V Analog Supply Voltage VA 2.7 — 5.5 V Interface Supply Voltage VIO 1.5 — 3.6 V Digital Power Supply Power-Up Rise Time VDRISE 10 — — µs Analog Power Supply Power-Up Rise Time VARISE 10 — — µs Interface Power Supply Power-Up Rise Time VIORISE 10 — — µs TA –20 25 85 °C Ambient Temperature Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at VD = VA = 3.3 V and 25 °C unless otherwise stated. Parameters are tested in production unless otherwise stated. Table 2. Absolute Maximum Ratings1,2 Parameter Symbol Value Unit Digital Supply Voltage VD –0.5 to 5.8 V Analog Supply Voltage VA –0.5 to 5.8 V Interface Supply Voltage VIO –0.5 to 3.9 V Input Current3 IIN ±10 mA 3 VIN –0.3 to (VIO + 0.3) V Operating Temperature TOP –40 to 95 °C Storage Temperature TSTG –55 to 150 °C 0.4 VpK Input Voltage RF Input Level4 Notes: 1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond recommended operating conditions for extended periods may affect device reliability. 2. The Si4702/03-C19 device is a high-performance RF integrated circuit with an ESD rating of < 2 kV HBM. Handling and assembly of this device should only be done at ESD-protected workstations. 3. For input pins SCLK, SEN, SDIO, RST, RCLK, GPIO1, GPIO2, and GPIO3. 4. At RF input pins. 4 Rev. 1.1 Table 3. DC Characteristics1 (VD = VA = 2.7 to 3.6 V, VIO = 1.5 to 3.6 V, TA = –20 to 85 °C) Parameter Symbol Test Condition Min Typ Max Unit IA ENABLE = 1 — 10.8 — mA ID ENABLE = 1 — 3.3 — mA Interface Operating Supply Current2 IIO ENABLE = 1 — 0.3 — mA Total Operating Supply Current2,3,4,5 IOP ENABLE = 1 Low SNR signal — 15.3 16.8 mA Total Operating Supply Current2,3,4 IOP ENABLE = 1 — 14.4 15.9 mA Total Operating Supply Current2,3,4,6 IOP ENABLE = 1 RDS = 1 — 14.9 16.4 mA Total Operating Supply Current2,3,4,6 IOP ENABLE = 1 RDS = 1, Low SNR signal — 15.8 16.8 mA Analog Powerdown Supply Current2,7 IAPD ENABLE = 0 — 3.5 — µA Digital Powerdown Supply Current2,7 IDPD ENABLE = 0 — 2.5 — µA Interface Powerdown Supply Current2,7 IIOPD ENABLE = 0 SCLK, RCLK inactive — 2.5 — µA IPD ENABLE = 0 — 8.5 12.0 µA Analog Operating Supply Current2 Current2 Digital Operating Supply Total Powerdown Supply Current2,7 8 VIH 0.7 x VIO — VIO + 0.3 V Low Level Input Voltage8 VIL –0.3 — 0.3 x VIO V 8 IIH VIN = VIO = 3.6 V –10 — 10 µA Low Level Input Current8 IIL VIN = 0 V, VIO = 3.6 V –10 — 10 µA High Level Output Voltage9 VOH IOUT = 500 µA 0.8 x VIO — — V Low Level Output Voltage9 VOL IOUT = –500 µA — — 0.2 x VIO V High Level Input Voltage High Level Input Current Notes: 1. All specifications for the Si4702 unless otherwise noted. 2. Refer to Register 02h, "Power Configuration" on page 24 for ENABLE bit description. 3. The LNA is automatically switched to higher current mode for optimum sensitivity in low SNR conditions. 4. Analog and digital supply currents are simultaneously adjusted based on SNR level. 5. Stereo and RDS functionality are disabled at low SNR levels. 6. RDS functionality only available for Si4703. 7. Refer to Section 4.9. "Reset, Powerup, and Powerdown" on page 19. 8. For input pins SCLK, SEN, SDIO, RST, RCLK, GPIO1, GPIO2, and GPIO3. 9. For output pins SDIO, GPIO1, GPIO2, and GPIO3. Rev. 1.1 5 Table 4. Reset Timing Characteristics (Busmode Select Method 1)1,2,3 Parameter Symbol Test Condition Min Typ Max Unit RSTpulse width and GPIO3 Setup to RST tGSRST14 GPIO3 = 0 100 — — µs SEN and SDIO Setup to RST tSRST1 30 — — ns SEN, SDIO, and GPIO3 Hold from RST tHRST1 30 — — ns Notes: 1. When selecting 2-wire Mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is high) does not occur within 300 ns before the rising edge of RST. 2. When selecting 3-wire Mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the rising edge of RST. 3. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until after the 1st start condition. 4. If GPIO3 is driven low by the user, then minimum tGSRST1 is only 30 ns. If GPIO3 is hi-Z, then minimum tGSRST1 is 100 µs, to provide time for an on-chip 1 M pulldown device (active while RST is low) to discharge the pin. tGSRST1 tHRST1 70% RST GPIO3 SEN, SDIO 30% 70% tSRST1 30% 70% 30% Figure 1. Reset Timing Parameters for Busmode Select Method 1 (GPIO3 = 0) 6 Rev. 1.1 Table 5. Reset Timing Characteristics (Busmode Select Method 2)1,2,3 Parameter Symbol Test Condition Min Typ Max Unit GPIO1 and GPIO3 Setup to RST tSRST2 GPIO3 = 1 30 — — ns GPIO1 and GPIO3 Hold from RST tHRST2 30 — — ns Notes: 1. When selecting 2-wire Mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is high) does not occur within 300 ns before the rising edge of RST. 2. When selecting 3-wire Mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the rising edge of RST. 3. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until after the 1st start condition. tSRST2 RST 70% GPIO3 70% GPIO1 70% tHRST2 30% 30% 30% Figure 2. Reset Timing Parameters for Busmode Select Method 2 (GPIO3 = 1) Rev. 1.1 7 Table 6. 3-Wire Control Interface Characteristics (VD = VA = 2.7 to 5.5 V, VIO = 1.5 to 3.6 V, TA = –20 to 85 °C) Parameter Symbol Test Condition Min Typ Max Unit SCLK Frequency fCLK 0 — 2.5 MHz SCLK High Time tHIGH 25 — — ns SCLK Low Time tLOW 25 — — ns tS 20 — — ns SDIO Input to SCLKHold tHSDIO 10 — — ns SEN Input to SCLKHold tHSEN1 10 — — ns SEN Input to SCLKHold tHSEN2 10 — — ns SDIO Input, SEN to SCLKSetup SCLKto SDIO Output Valid tCDV Read 2 — 25 ns SCLKto SDIO Output High Z tCDZ Read 2 — 25 ns Note: When selecting 3-wire Mode, the user must ensure that a rising edge of SCLK does not occur within 300 ns before the rising edge of RST. SCLK 70% SEN 70% SDIO 70% 30% t HSDIO tS tHIGH tLOW tHSEN1 tS tHSEN2 30% 30% A7 A6-A5, R/W, A4-A1 A0 Address In D15 D14-D1 D0 Data In Figure 3. 3-Wire Control Interface Write Timing Parameters 8 Rev. 1.1 SCLK 70% SEN 70% 30% tHSDIO tS tCDV t HSEN1 tS tCDZ tHSEN2 30% 80% SDIO A7 20% A6-A5, R/W, A4-A1 Address In A0 D15 ½ Cycle Bus Turnaround D14-D1 D0 Data Out Figure 4. 3-Wire Control Interface Read Timing Parameters Rev. 1.1 9 Table 7. 2-Wire Control Interface Characteristics1,2,3 (VD = VA = 2.7 to 5.5 V, VIO = 1.5 to 3.6 V, TA = –20 to 85 °C) Parameter Symbol Test Condition Min Typ Max Unit SCLK Frequency fSCL 0 — 400 kHz SCLK Low Time tLOW 1.3 — — µs SCLK High Time tHIGH 0.6 — — µs SCLK Input to SDIO Setup (START) tSU:STA 0.6 — — µs SCLK Input to SDIO Hold (START) tHD:STA 0.6 — — µs SDIO Input to SCLK Setup tSU:DAT 100 — — ns SDIO Input to SCLK Hold4,5 tHD:DAT 0 — 900 ns SCLK input to SDIO Setup (STOP) tSU:STO 0.6 — — µs STOP to START Time tBUF 1.3 — — µs SDIO Output Fall Time tf:OUT 20 + 0.1 Cb — 250 ns SDIO Input, SCLK Rise/Fall Time tf:IN tr:IN 20 + 0.1 Cb — 300 ns SCLK, SDIO Capacitive Loading Cb — — 50 pF Input Filter Pulse Suppression tSP — — 50 ns Notes: 1. When VIO = 0 V, SCLK and SDIO are low impedance. 2. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until after the 1st start condition. 3. When selecting 2-wire mode, the user must ensure that a 2-wire start condition (falling edge of SDIO while SCLK is high) does not occur within 300 ns before the rising edge of RST. 4. As a 2-wire transmitter, the Si4702/03-C19 delays SDIO by a minimum of 300 ns from the VIH threshold of SCLK to comply with the 0 ns tHD:DAT specification. 5. The maximum tHD:DAT has only to be met when fSCL = 400 kHz. At frequencies below 400 KHz, tHD:DAT may be violated so long as all other timing parameters are met. 10 Rev. 1.1 SCLK 70% SDIO 70% tSU:STA tHD:STA tLOW START tr:IN tHIGH tr:IN tf:IN tSP tSU:STO tBUF 30% 30% tf:IN, tf:OUT tHD:DAT tSU:DAT STOP START Figure 5. 2-Wire Control Interface Read and Write Timing Parameters SCLK A6-A0, R/W SDIO START ADDRESS + R/W D7-D0 ACK DATA D7-D0 ACK DATA ACK STOP Figure 6. 2-Wire Control Interface Read and Write Timing Diagram Rev. 1.1 11 Table 8. FM Receiver Characteristics1,2 (VD = VA = 2.7 to 5.5 V, VIO = 1.5 to 3.6 V, TA = –20 to 85 °C) Parameter Symbol Min Typ Max Unit 76 — 108 MHz (S+N)/N = 26 dB — 1.7 3.5 µVEMF Sensitivity (50 matching network)3,4,5,6,8 (S+N)/N = 26 dB — 1.1 — µVEMF RDS Sensitivity8 f = 2 kHz, RDS BLER < 5% — 15 — µVEMF 3 4 5 k 4 5 6 pF 104 106 — dBµVEMF Input Frequency Sensitivity Test Condition fRF 3,4,5,6,7 LNA Input Resistance8,9 LNA Input Input Capacitance8,9 IP38,10 Suppression3,4,5,8,9 m = 0.3 40 55 — dB Adjacent Channel Selectivity ±200 kHz 35 50 — dB Alternate Channel Selectivity ±400 kHz 60 70 — dB In-band 35 — — dB — 32.768 — kHz Frequency Spacing = 100 or 200 kHz –200 — 200 Frequency Spacing = 50 kHz –50 — 50 72 80 90 mVRMS — — 1 dB AM Spurious Response Rejection8 RCLK Frequency RCLK Frequency Tolerance11 Audio Output Voltage3,4,5,9 Audio Output L/R Imbalance3,4,9,12 Audio Frequency Response Low 8 –3 dB — — 30 Hz 8 –3 dB 15 — — kHz 25 — — dB Audio Frequency Response High Audio Stereo Separation ppm 3,9,12 Notes: 1. Additional testing information is available in Application Note AN234. Volume = maximum for all tests. 2. Important Note: To ensure proper operation and FM receiver performance, follow the guidelines in “AN231: Si4700/01/02/03 Headphone and Antenna Interface.” Silicon Laboratories will evaluate schematics and layouts for qualified customers. 3. FMOD = 1 kHz, 75 µs de-emphasis 4. MONO = 1, and L = R unless noted otherwise. 5. f = 22.5 kHz. 6. BAF = 300 Hz to 15 kHz, A-weighted. 7. Typical sensitivity with headphone matching network. 8. Guaranteed by characterization. 9. VEMF = 1 mV. 10. |f2 – f1| > 1 MHz, f0 = 2 x f1 – f2. AGC is disabled by setting AGCD = 1. Refer to "6. Register Descriptions" on page 23. 11. The channel spacing is selected with the SPACE[1:0] bits. Refer to "6. Register Descriptions" on page 23. Seek/Tune timing is guaranteed for 100 and 200 kHz channel spacing. 12. f = 75 kHz. 13. The de-emphasis time constant is selected with the DE bit. Refer to "6. Register Descriptions" on page 23. 14. At LOUT and ROUT pins. 15. Do not enable STC interrupts before the powerup time is complete. If STC interrupts are enabled before the powerup time is complete, an interrupt will be generated within the powerup interval when the initial default tune operation is complete. See "AN230: Si4700/01/02/03 Programmer’s Guide" for more information. 16. Minimum and maximum at room temperature (25 °C). 12 Rev. 1.1 Table 8. FM Receiver Characteristics1,2 (Continued) (VD = VA = 2.7 to 5.5 V, VIO = 1.5 to 3.6 V, TA = –20 to 85 °C) Parameter Symbol Mono/Stereo Switching Level3,8,12 Test Condition Min Typ Max Unit BLNDADJ = 10 10 dB stereo separation — 34 — dBµVEMF 55 60 — dB — 58 — dB — 0.1 0.5 % DE = 0 70 75 80 µs Audio Mono S/N3,4,5,6,9 Audio Stereo S/N 3,5,6,8 BLNDADJ = 10 3,4,9,12 Audio THD 13 De-emphasis Time Constant DE = 1 45 50 54 µs 14 ENABLE = 1 0.65 0.8 0.9 V Audio Common Mode Voltage14 ENABLE = 0 AHIZEN = 1 — 0.5 x VIO — V RL Single-ended 10 — — k CL Single-ended — — 50 pF SPACE[1:0] = 0x, RCLK tolerance = 200 ppm, (x = 0 or 1) — — 60 ms/ channel From powerdown (Write ENABLE bit to 1) — — 110 ms Input levels of 8 and 60 dBµV at RF input –3 — 3 dB Audio Common Mode Voltage Audio Output Load Resistance8,14 Audio Output Load Capacitance Seek/Tune Time Powerup Time15 RSSI Offset16 8,11 8,14 Notes: 1. Additional testing information is available in Application Note AN234. Volume = maximum for all tests. 2. Important Note: To ensure proper operation and FM receiver performance, follow the guidelines in “AN231: Si4700/01/02/03 Headphone and Antenna Interface.” Silicon Laboratories will evaluate schematics and layouts for qualified customers. 3. FMOD = 1 kHz, 75 µs de-emphasis 4. MONO = 1, and L = R unless noted otherwise. 5. f = 22.5 kHz. 6. BAF = 300 Hz to 15 kHz, A-weighted. 7. Typical sensitivity with headphone matching network. 8. Guaranteed by characterization. 9. VEMF = 1 mV. 10. |f2 – f1| > 1 MHz, f0 = 2 x f1 – f2. AGC is disabled by setting AGCD = 1. Refer to "6. Register Descriptions" on page 23. 11. The channel spacing is selected with the SPACE[1:0] bits. Refer to "6. Register Descriptions" on page 23. Seek/Tune timing is guaranteed for 100 and 200 kHz channel spacing. 12. f = 75 kHz. 13. The de-emphasis time constant is selected with the DE bit. Refer to "6. Register Descriptions" on page 23. 14. At LOUT and ROUT pins. 15. Do not enable STC interrupts before the powerup time is complete. If STC interrupts are enabled before the powerup time is complete, an interrupt will be generated within the powerup interval when the initial default tune operation is complete. See "AN230: Si4700/01/02/03 Programmer’s Guide" for more information. 16. Minimum and maximum at room temperature (25 °C). Rev. 1.1 13 2. Typical Application Schematic GPIO1 19 GPIO1 18 GPIO2 17 GPIO3 16 VA NC 20 GPIO2 GPIO3 LOUT ROUT 7 SCLK 8 SDIO 9 RCLK 10 VIO GND PAD 15 GND 14 LOUT 13 ROUT 12 GND 11 VD 6 SEN FMIP RFGND 1 NC 2 FMIP 3 RFGND 4 GND 5 RST VBATTERY 2.7 to 5.5 V C1 RST SEN SCLK SDIO X1 GPIO3 C2 RCLK VIO 1.5 to 3.6 V RCLK C3 Optional: for crystal oscillator option Notes: 1. Place C1 close to VD pin. 2. All grounds connect directly to GND plane on PCB. 3. Pins 1 and 20 are no connects, leave floating. 4. Important Note: FM Receiver performance is subject to adherence to antenna design guidelines in “AN231: Si4700/01/02/03 Headphone and Antenna Interface.” Failure to use these guidelines will negatively affect the performance of the Si4702/03-C19, particularly in weak signal and noisy environments. Silicon Laboratories will evaluate schematics and layouts for qualified customers. 5. Pin 2 connects to the antenna interface, refer to “AN231: Si4700/01/02/03 Headphone and Antenna Interface.” 6. Place Si4702/03-C19 as close as possible to antenna jack and keep the FMIP trace as short as possible. 7. Refer to Si4702/03 Internal Crystal Oscillator Errata. 8. Refer to "AN299: External 32.768 kHz Crystal Oscillator." 3. Bill of Materials Component(s) Value/Description Supplier(s) C1 Supply bypass capacitor, 22 nF, ±20%, Z5U/X7R Murata U1 Si4702/03-C19 FM Radio Tuner Silicon Laboratories C2, C3 Crystal load capacitors, 22 pF, ±5%, COG (Optional: for crystal oscillator option) Venkel X1 32.768 kHz crystal (Optional: for crystal oscillator option) Epson 14 Rev. 1.1 4. Functional Description RFGND LNA PGA Q ADC AGC 0 / 90 DSP FILTER DEMOD MPX AUDIO LOW-IF DAC DAC GPIO 32.768 kHz ROUT GPIO VD AFC TUNE VA REG RDS (Si4703) XTAL OSC RSSI CONTROL INTERFACE VIO RCLK 2.7 - 5.5 V LOUT RST SDIO SCLK CONTROLLER I ADC FMIP AMPLIFIER Si4702/03 Headphone Cable SEN Figure 7. Si4702/03-C19 FM Receiver Block Diagram 4.1. Overview The Si4702/03-C19 extends Silicon Laboratories Si4700/01 FM tuner family, and further increases the ease and attractiveness of adding FM radio reception to mobile devices through small size and board area, minimum component count, flexible programmability, and superior, proven performance. Si4702/03-C19 software is backwards compatible to existing Si4700/01 and Si4702/03-B16 FM Tuner designs. The Si4702/03-C19 benefits from proven digital integration and 100% CMOS process technology, resulting in a completely integrated solution. It is the industry's smallest footprint FM tuner IC requiring only 10 mm2 board space and one external bypass capacitor. The device offers significant programmability, and caters to the subjective nature of FM listeners and variable FM broadcast environments world-wide through a simplified programming interface and mature functionality. The Si4703-C incorporates a digital processor for the European Radio Data System (RDS) and the US Radio Broadcast Data System (RBDS) including all required symbol decoding, block synchronization, error detection, and error correction functions. RDS enables data such as station identification and song name to be displayed to the user. The Si4703-C offers a detailed RDS view and a standard view, allowing adopters to selectively choose granularity of RDS status, data, and block errors. Si4703-C software is backwards compatible to the proven Si4701, adopted by leading world-wide. cell-phone and MP3 manufacturers The Si4702/03-C19 is based on the superior, proven performance of Silicon Laboratories' Aero architecture offering unmatched interference rejection and leading sensitivity. The device uses the same programming interface as the Si4701 and supports multiple bus-modes. Power management is also simplified with an integrated regulator allowing direct connection to a 2.7 to 5.5 V battery. The Si4702/03-C19 device’s high level of integration and complete FM system production testing increases quality to manufacturers, improves device yields, and simplifies device manufacturing and final testing. 4.2. FM Receiver The Si4702/03-C19’s patented digital low-IF architecture reduces external components and eliminates the need for factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (76 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers. For testing purposes, the AGC can be disabled with the AGCD bit. Refer to Section 6. "Register Descriptions" on page 23 for additional programming and configuration information. The Si4702/03-C19 architecture and antenna design increases system performance. To ensure proper performance and operation, designers should refer to the guidelines in "AN231: Si4700/01/02/03 Headphone Rev. 1.1 15 An image-reject mixer downconverts the RF signal to low-IF. The quadrature mixer output is amplified, filtered, and digitized with high resolution analog-to-digital converters (ADCs). This advanced architecture achieves superior performance by using digital signal processing (DSP) to perform channel selection, FM demodulation, and stereo audio processing compared to traditional analog architectures. 4.3. General Purpose I/O Pins The pins GPIO1–3 can serve multiple functions. GPIO1 and GPIO3 can be used to select between 2-wire and 3-wire modes for the control interface as the device is brought out of reset. See Section “4.9. Reset, Powerup, and Powerdown”. After powerup of the device, the GPIO1–3 pins can be used as general purpose inputs/outputs, and the GPIO2–3 pins can be used as interrupt request pins for the seek/tune or RDS ready functions and as a stereo/mono indicator respectively. See register 04h, bits [5:0] in Section “6. Register Descriptions” for information on the control of these pins. It is recommended that the GPIO2–3 pins not be used as interrupt request outputs until the powerup time has completed (see Section “4.9. Reset, Powerup, and Powerdown”). The GPIO3 pin has an internal, 1 M, ±15% pull-down resistor that is only active while RST is low. General purpose input/output functionality is available regardless of the state of the VA and VD supplies, or the ENABLE and DISABLE bits. (RDSS) and block error rate A, B, C and D (BLERA, BLERB, BLERC, and BLERD) are unused and will read 0. This mode is backward compatible with earlier firmware revisions. Setting the RDS mode bit high places the device in RDS verbose mode. The device sets RDSS high when synchronized and low when synchronization is lost. If the device is synchronized, RDS ready (RDSR) will be set for a minimum of 40 ms when a RDS group has been received. Setting the RDS interrupt enable (RDSIEN) bit and GPIO2[1:0] = 01 will configure GPIO2 to pulse low for a minimum of 5 ms if the device is synchronized and an RDS group has been received. BLERA, BLERB, BLERC and BLERD provide block-error levels for the RDS group. The number of bit errors in each block within the group is encoded as follows: 00 = no errors, 01 = one to two errors, 10 = three to five errors, 11 = six or more errors. Six or more errors in a block indicate the block is uncorrectable and should not be used. *Note: RDS/RBDS is referred to only as RDS throughout the remainder of this document. 4.5. Stereo Audio Processing The output of the FM demodulator is a stereo multiplexed (MPX) signal. The MPX standard was developed in 1961 and is used worldwide. Today's MPX signal format consists of left + right (L+R) audio, left – right (L–R) audio, a 19 kHz pilot tone, and RDS/RBDS data as shown in Figure 8. Modulation Level and Antenna Interface". Conformance to these guidelines will help to ensure excellent performance even in weak signal or noisy environments. 4.4. RDS/RBDS Processor and Functionality The Si4703 implements an RDS/RBDS* processor for symbol decoding, block synchronization, error detection, and error correction. RDS functionality is enabled by setting the RDS bit. The device offers two RDS modes, a standard mode and a verbose mode. The primary difference is increased visibility to RDS block-error levels and synchronization status with verbose mode. Setting the RDS mode (RDSM) bit low places the device in standard RDS mode (default). The device will set the RDS ready (RDSR) bit for a minimum of 40 ms when a valid RDS group has been received. Setting the RDS interrupt enable (RDSIEN) bit and GPIO2[1:0] = 01 will configure GPIO2 to pulse low for a minimum of 5 ms when a valid RDS group has been received. If an invalid group is received, RDSR will not be set and GPIO2 will not pulse low. In standard mode RDS synchronization 16 Mono Audio Left + Right 0 Stereo Pilot 15 19 23 Stereo Audio Left - Right 38 RDS/ RBDS 53 57 Frequency (kHz) Figure 8. MPX Signal Spectrum The Si4702/03-C19's integrated stereo decoder automatically decodes the MPX signal. The 0 to 15 kHz (L+R) signal is the mono output of the FM tuner. Stereo is generated from the (L+R), (L-R), and a 19 kHz pilot tone. The pilot tone is used as a reference to recover the (L-R) signal. Separate left and right channels are obtained by adding and subtracting the (L+R) and (L-R) signals, respectively. The Si4703-C uses frequency information from the 19 kHz stereo pilot to recover the 57 kHz RDS/RBDS signal. Adaptive noise suppression is employed to gradually Rev. 1.1 combine the stereo left and right audio channels to a mono (L+R) audio signal as the signal quality degrades to maintain optimum sound fidelity under varying reception conditions. The signal level range over which the stereo to mono blending occurs can be adjusted by setting the BLNDADJ[1:0] register. Stereo/mono status can be monitored with the ST register bit and mono operation can be forced with the MONO register bit. Pre-emphasis and de-emphasis is a technique used by FM broadcasters to improve the signal-to-noise ratio of FM receivers by reducing the effects of high frequency interference and noise. When the FM signal is transmitted, a pre-emphasis filter is applied to accentuate the high audio frequencies. All FM receivers incorporate a de-emphasis filter which attenuates high frequencies to restore a flat frequency response. Two time constants, 50 or 75 µs, are used in various regions. The de-emphasis time constant is programmable with the DE bit. High-fidelity stereo digital-to-analog converters (DACs) drive analog audio signals onto the LOUT and ROUT pins. The audio output may be muted with the DMUTE bit. Volume can be adjusted digitally with the VOLUME[3:0] bits. The volume dynamic range can be set to either –28 dBFS (default) or –58 dBFS by setting VOLEXT=1. The soft mute feature is available to attenuate the audio outputs and minimize audible noise in weak signal conditions. The soft mute attack and decay rate can be adjusted with the SMUTER[1:0] bits where 00 is the fastest setting. The soft mute attenuation level can be adjusted with the SMUTEA[1:0] bits where 00 is the most attenuated. The soft mute disable (DSMUTE) bit may be set high to disable this feature. 4.6. Tuning The Si4702/03-C19 uses Silicon Laboratories’ patented and proven frequency synthesizer technology including a completely integrated VCO. The frequency synthesizer generates the quadrature local oscillator signal used to downconvert the RF input to a low intermediate frequency. The VCO frequency is locked to the reference clock and adjusted with an automatic frequency control (AFC) servo loop during reception. The tuning frequency is defined as: Freq (MHz) = Spacing (kHz) Channel + Bottom of Band (MHz) Channel spacing of 50, 100 or 200 kHz is selected with bits SPACE[1:0]. The channel is selected with bits CHAN[9:0]. Band selection for Japan, Japan wideband, or Europe/U.S./Asia is set with BAND[1:0]. The tuning operation begins by setting the TUNE bit. After tuning completes, the seek/tune complete (STC) bit will be set and the RSSI level is available by reading bits RSSI[7:0]. The TUNE bit must be set low after the STC bit is set high in order to complete the tune operation and clear the STC bit. Seek tuning searches up or down for a channel with an RSSI greater than or equal to the seek threshold set with the SEEKTH[7:0] bits. In addition, optional SNR and/or impulse noise detector criteria may be used to qualify valid stations. The SKSNR[3:0] bits set the SNR threshold required. The SKCNT[3:0] bits set the impulse noise threshold. Using the extra seek qualifiers can reduce false stops and, in combination with lowering the RSSI seek threshold, increase the number of found stations. The SNR and impulse noise detectors are disabled by default for backwards compatibility. Two seek modes are available. When the seek mode (SKMODE) bit is low and a seek is initiated, the device seeks through the band, wraps from one band edge to the other, and continues seeking. If the seek operation is unable to find a valid channel, the seek failure/band limit (SF/BL) bit is set high and the device returns to the channel selected before the seek operation began. When the SKMODE bit is high and a seek is initiated, the device seeks through the band until the band limit is reached and the SF/BL bit is set high. A seek operation is initiated by setting the SEEK and SEEKUP bits. After the seek operation completes, the STC bit is set, and the RSSI level and tuned channel are available by reading bits RSSI[7:0] and bits READCHAN[9:0]. During a seek operation READCHAN[9:0] is also updated and may be read to determine and report seek progress. The STC bit is set after the seek operation completes. The channel is valid if the seek operation completes and the SF/BL bit is set low. At other times, such as before a seek operation or after a seek completes and the SF/BL bit is set high, the channel is valid if the AFC Rail (AFCRL) bit is set low and the value of RSSI[7:0] is greater than or equal to SEEKTH[7:0]. Note that if a valid channel is found but the AFCRL bit is set, the audio output is muted as in the softmute case discussed in Section “4.5. Stereo Audio Processing”. The SEEK bit must be set low after the STC bit is set high in order to complete the seek operation. Setting the STC bit low clears STC status and SF/BL bits. The seek operation may be aborted by setting the SEEK bit low at any time. The device can be configured to generate an interrupt on GPIO2 when a tune or seek operation completes. Setting the seek/tune complete (STCIEN) bit and GPIO2[1:0] = 01 will configure GPIO2 for a 5 ms low interrupt when the STC bit is set by the device. Rev. 1.1 17 For additional recommendations on optimizing the seek function, consult "AN284: Si4700/01/02/03 Seek Adjustability and Settings." 4.7. Reference Clock The Si4702/03-C19 accepts a 32.768 kHz reference clock to the RCLK pin. The reference clock is required whenever the ENABLE bit is set high. Refer to Table 3, “DC Characteristics1,” on page 5 for input switching voltage levels and Table 8, "FM Receiver Characteristics," on page 12 for frequency tolerance information. An onboard crystal oscillator is available to generate the 32.768 kHz reference when an external crystal and load capacitors are provided. Refer to 2. "Typical Application Schematic" on page 14. The oscillator must be enabled or disabled while in powerdown (ENABLE = 0) as shown in Figure 9, “Initialization Sequence,” on page 21. Register 07h, bits [13:0], must be preserved as 0x0100 while in powerdown. Note that RCLK voltage levels are not specified. The typical RCLK voltage level, when the crystal oscillator is used, is 0.3 Vpk-pk. 4.7.1. Si4702/03-C19 Internal Crystal Oscillator Errata The Si4702/03-C19 seek/tune performance may be affected by data activity on the SDIO bus when using the integrated internal oscillator. SDIO activity results from polling the tuner for status or communicating with other devices that share the SDIO bus. If there is SDIO bus activity while the Si4702/03-C19 is performing the seek/tune function, the crystal oscillator may experience jitter, which may result in mistunes and/or false stops. SDIO activity during all other operational states does not affect performance. For best seek/tune results, Silicon Laboratories recommends that all SDIO data traffic be suspended during Si4702/03-C19 seek and tune operations. This is achieved by keeping the bus quiet for all other devices on the bus, and delaying tuner polling until the tune or seek operation is complete. The STC (seek/tune complete) interrupt should be used instead of polling to determine when a seek/tune operation is complete. Please refer to Sections 4.6. "Tuning" on page 17 and 5. "Register Summary" on page 22 for specified seek/tune times and register use guidelines. The layout guidelines in Si4700/01/02/03 Evaluation Board User’s Guide, Section 8.3 Si4702/03-C19 Daughter Card should be followed to help ensure robust FM performance. Please refer to the posted Si4702/03 Internal Crystal Oscillator Errata for more information. 18 4.8. Control Interface Two-wire slave-transceiver and three-wire interfaces are provided for the controller IC to read and write the control registers. Refer to “4.9. Reset, Powerup, and Powerdown” for a description of bus mode selection. Registers may be written and read when the VIO supply is applied regardless of the state of the VD or VA supplies. RCLK is not required for proper register operation. 4.8.1. 3-Wire Control Interface For three-wire operation, a transfer begins when the SEN pin is sampled low by the device on a rising SCLK edge. The control word is latched internally on rising SCLK edges and is nine bits in length, comprised of a four bit chip address A7:A4 = 0110b, a read/write bit (write = 0 and read = 1), and a four bit register address, A3:A0. The ordering of the control word is A7:A5, R/W, A4:A0. Refer to Section 5. "Register Summary" on page 22 for a list of all registers and their addresses. For write operations, the serial control word is followed by a 16-bit data word and is latched internally on rising SCLK edges. For read operations, a bus turn-around of half a cycle is followed by a 16-bit data word shifted out on rising SCLK edges and is clocked into the system controller on falling SCLK edges. The transfer ends on the rising SCLK edge after SEN is set high. Note that 26 SCLK cycles are required for a transfer, however, SCLK may run continuously. For details on timing specifications and diagrams, refer to Table 6, “3-Wire Control Interface Characteristics,” on page 8, Figure 3, “3-Wire Control Interface Write Timing Parameters,” on page 8, and Figure 4, “3-Wire Control Interface Read Timing Parameters,” on page 9. 4.8.2. 2-wire Control Interface For two-wire operation, the SCLK and SDIO pins function in open-drain mode (pull-down only) and must be pulled up by an external device. A transfer begins with the START condition (falling edge of SDIO while SCLK is high). The control word is latched internally on rising SCLK edges and is eight bits in length, comprised of a seven bit device address equal to 0010000b and a read/write bit (write = 0 and read = 1). The device acknowledges the address by driving SDIO low after the next falling SCLK edge, for 1 cycle. For write operations, the device acknowledge is followed by an eight bit data word latched internally on rising edges of SCLK. The device acknowledges each byte of data written by driving SDIO low after the next falling SCLK edge, for 1 cycle. An internal address counter automatically increments to allow continuous data byte Rev. 1.1 writes, starting with the upper byte of register 02h, followed by the lower byte of register 02h, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous writes end. Data transfer ends with the STOP condition (rising edge of SDIO while SCLK is high). After every STOP condition, the internal address counter is reset. For read operations, the device acknowledge is followed by an eight bit data word shifted out on falling SCLK edges. An internal address counter automatically increments to allow continuous data byte reads, starting with the upper byte of register 0Ah, followed by the lower byte of register 0Ah, and onward until the lower byte of the last register is reached. The internal address counter then automatically wraps around to the upper byte of register 00h and proceeds from there until continuous reads cease. After each byte of data is read, the controller IC must drive an acknowledge (SDIO = 0) if an additional byte of data will be requested. Data transfer ends with the STOP condition. After every STOP condition, the internal address counter is reset. For details on timing specifications and diagrams, refer to Table 7, “2-Wire Control Interface Characteristics1,2,3,” on page 10, Figure 5, “2-Wire Control Interface Read and Write Timing Parameters,” on page 11 and Figure 6, “2-Wire Control Interface Read and Write Timing Diagram,” on page 11. 4.9. Reset, Powerup, and Powerdown Driving the RST pin low will disable the Si4702/03-C19 and its control bus interface, and reset the registers to their default settings. Driving the RST pin high will bring the device out of reset. As the device is brought out of reset, it will sample the state of several pins to select between 2-wire and 3-wire control interface operation, using one of two busmode selection methods. Busmode selection method 1 requires the use of the GPIO3, SEN, and SDIO pins. To use this busmode selection method, the GPIO3 and SDIO pins must be sampled low by the device on the rising edge of RST. The user may either drive the GPIO3 pin low externally, or leave the pin floating. If the pin is not driven by the user, it will be pulled low by an internal 1 M resistor which is active only while RST is low. The user must drive the SEN and SDIO pins externally to the proper state. To select 2-wire operation, the SEN pin must be sampled high by the device on the rising edge of RST. To select 3-wire operation, the SEN pin must be sampled low by the device on the rising edge of RST. Refer to Table 4, “Reset Timing Characteristics (Busmode Select Method 1)1,2,3,” on page 6 and Figure 1, “Reset Timing Parameters for Busmode Select Method 1 (GPIO3 = 0),” on page 6. Busmode selection method 2 requires only the use of the GPIO3 and GPIO1 pins. This is the recommended busmode selection method when not using the internal crystal oscillator. To use this busmode selection method, the GPIO3 pin must be sampled high on the rising edge of RST. The user must drive the GPIO3 pin high externally, or pull it up with a resistor of 100 k or less. The user must also drive the GPIO1 pin externally to the proper state. To select 2-wire operation, the GPIO1 pin must be sampled high by the device on the rising edge of RST. To select 3-wire operation, the GPIO1 pin must be sampled low by the device on the rising edge of RST. Refer to Table 5, “Reset Timing Characteristics (Busmode Select Method 2)1,2,3,” on page 7 and Figure 2, “Reset Timing Parameters for Busmode Select Method 2 (GPIO3 = 1),” on page 7. Table 9 summarizes the two bus selection methods. Rev. 1.1 19 4.10. Audio Output Summation Table 9. Selecting 2-Wire or 3-Wire Control Interface Busmode Operation1,2,3 2 X X 1 16 2 Xtal Oscillator NA NA NA NA NA The audio outputs LOUT and ROUT may be capacitively summed with another device. Setting the audio high-Z enable (AHIZEN) bit maintains a dc bias of 0.5 x VIO on the LOUT and ROUT pins to prevent the ESD diodes from clamping to the VIO or GND rail in response to the output swing of the other device. The bias point is set with a 370 k resistor to VIO and GND. Register 07h containing the AHIZEN bit must not be written during the powerup sequence and only takes effect when in powerdown and VIO is supplied. In powerup the LOUT and ROUT pins are set to the common mode voltage specified in Table 8, “FM Receiver Characteristics1,2,” on page 12, regardless of the state of AHIZEN. Bits 13:0 of register 07h must be preserved as 0x0100 while in powerdown and as 0x3C04 while in powerup. 2 Xtal Oscillator NA NA NA NA NA 4.11. Initialization Sequence Busmode SEN SDIO GPIO1 GPIO32 Select Method 1 1 0 1 0 0 Bus mode X 04 3-wire X 04 2-wire 3-wire 1 Xtal Oscillator 0 0 X 05 1 Xtal Oscillator 1 0 X 05 2-wire 2 X X 0 16 3-wire 2-wire Notes: 1. All parameters applied on rising edge of RST. 2. When selecting 2-wire mode, the user must ensure that SCLK is high during the rising edge of RST, and stays high until the 1st start condition. 3. GPIO3 is internally pulled down with a 1 M resistor. 4. GPIO3 should be externally driven low, set to high-Z (10 M or greater pull-up) or float. 5. GPIO3 should be left floating. 6. GPIO3 should be externally driven high (100 kor smaller pull-up). When proper voltages are applied to the Si4702/03-C19, the ENABLE and DISABLE bits in Register 02h can be used to select between powerup and powerdown modes. When voltage is first applied to the device, ENABLE = 0 and DISABLE = 0. Setting ENABLE = 1 and DISABLE = 0 puts the device in powerup mode. To power down the device, disable RDS to prevent any unpredictable behavior (Si4703 only), then write ENABLE and DISABLE bits to 1. After being written to 1, both bits will be cleared as part of the internal device powerdown sequence. To put the device back into powerup mode, set ENABLE = 1 and DISABLE = 0 as described above. The ENABLE bit should never be written to a 0. 20 Refer to Figure 9, “Initialization Sequence,” on page 21. To initialize the device: 1. Supply VA and VD. 2. Supply VIO while keeping the RST pin low. Note that steps 1 and 2 may be reversed. Power supplies may be sequenced in any order. 3. Select 2-wire or 3-wire control interface bus mode operation as described in Section 4.9. "Reset, Powerup, and Powerdown" on page 19. 4. Provide RCLK. Steps 3 and 4 may be reversed when using an external oscillator. Refer to AN230 when using internal oscillator. 5. Set the ENABLE bit high and the DISABLE bit low to powerup the device. Software should wait for the powerup time (as specified by Table 8, “FM Receiver Characteristics1,2,” on page 12) before continuing with normal part operation. To power down the device: 1. (Optional) Set the AHIZEN bit high to maintain a dc bias of 0.5 x VIO volts at the LOUT and ROUT pins while in powerdown, but preserve the states of the other bits in Register 07h. Note that in powerup the LOUT and ROUT pins are set to the common mode voltage specified in Table 8 on page 12, regardless of the state of AHIZEN. 2. Set the ENABLE bit high and the DISABLE bit high to place the device in powerdown mode. Note that all register states are maintained so long as VIO is supplied and the RST pin is high. 3. (Optional) Remove RCLK. 4. Remove VA and VD supplies as needed. Rev. 1.1 To power up the device (after power down): 1. Note that VIO is still supplied in this scenario. If VIO is not supplied, refer to device initialization procedure above. 2. (Optional) Set the AHIZEN bit low to disable the dc bias of 0.5 x VIO volts at the LOUT and ROUT pins, but preserve the states of the other bits in Register 07h. Note that in powerup the LOUT and ROUT pins are set to the common mode voltage specified in Table 8 on page 12, regardless of the state of AHIZEN. 3. Supply VA and VD. 4. Provide RCLK. Refer to AN230 when using internal oscillator. 5. Set the ENABLE bit high and the DISABLE bit low to powerup the device. VA,VD Supply VIO Supply RST Pin RCLK Pin ENABLE Bit 1 2 3 4 5 Figure 9. Initialization Sequence 4.12. Programming Guide Refer to "AN230: Si4700/01 Programming Guide" for control interface programming information. Rev. 1.1 21 22 Rev. 1.1 DEVICEID CHIPID POWERCFG CHANNEL SYSCONFIG1 SYSCONFIG2 SYSCONFIG3 TEST1 TEST2 BOOTCONFIG STATUSRSSI READCHAN RDSA RDSB RDSC RDSD 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh STCIEN RDSIEN2 STC AHIZEN BLERB[1:0]2,3 RDSR2 XOSCEN SMUTER[1:0] 0 DMUTE PN[3:0] D14 TUNE DSMUTE D15 DE 0 D9 0 0 D7 ST VOLEXT 0 SEEK RDSD[15:0]2 RDSC[15:0]2 RDSB[15:0]2 DISABLE READCHAN[9:0] D2 0 ENABLE D0 GPIO1[1:0] 0 D1 SKCNT[3:0] VOLUME[3:0] GPIO2[1:0] 0 FIRMWARE[5:0] D3 RSSI[7:0] SPACE[1:0] GPIO3[1:0] SKSNR[3:0] BAND[1:0] 0 D4 CHAN[9:0] 0 D5 MFGID[11:0] D6 BLNDADJ[1:0] 0 DEV[3:0] D8 RDSA[15:0]2 BLERA[1:0]2,3 AGCD 0 BLERD[1:0]2,3 AFCRL RDSS2,3 BLERC[1:0]2,3 SF/BL D10 RDSM2 SKMODE SEEKUP D11 SEEKTH[7:0] RDS2 0 0 D12 SMUTEA[1:0] 0 0 MONO REV[5:0] D13 Notes: 1. Any register not listed is reserved and should not be written. Writing to reserved registers may result in unpredictable behavior. 2. Si4703 only. 3. Available in RDS verbose mode only. Name Reg1 5. Register Summary 6. Register Descriptions Register 00h. Device ID Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 Name PN[3:0] MFGID[11:0] Type R R D4 D3 D2 D1 D0 D4 D3 D2 D1 D0 Reset value = 0x1242 Bit Name Function 15:12 PN[3:0] Part Number. 0x01 = Si4702/03 11:0 MFGID[11:0] Manufacturer ID. 0x242 Register 01h. Chip ID Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 Name REV[5:0] DEV[3:0] FIRMWARE[5:0] Type R R R Si4702C19 Reset value = 0x1053 if ENABLE = 1 Si4702C19 Reset value = 0x1000 if ENABLE = 0 Si4703C19 Reset value = 0x1253 if ENABLE = 1 Si4703C19 Reset value = 0x1200 if ENABLE = 0 Bit Name 15:10 REV[5:0] Chip Version. 0x04 = Rev C 9:6 DEV[3:0] Device. 0 before powerup = Si4702. 0001 after powerup = Si4702. 1000 before powerup = Si4703. 1001 after powerup = Si4703. 5:0 Function FIRMWARE[5:0] Firmware Version. 0 before powerup. Firmware version after powerup = 010011. Rev. 1.1 23 Register 02h. Power Configuration Bit D15 D14 D13 D12 D11 Name DSMUTE DMUTE MONO Type R/W R/W R/W 0 R/W D10 D9 D8 RDSM SKMODE SEEKUP SEEK R/W R/W R/W R/W D7 D6 0 DISABLE R/W R/W D5 D4 D3 D2 D1 0 0 0 0 0 R/W R/W R/W R/W R/W D0 ENABLE R/W Reset value = 0x0000 Bit Name Function 15 DSMUTE 14 DMUTE Mute Disable. 0 = Mute enable (default). 1 = Mute disable. 13 MONO Mono Select. 0 = Stereo (default). 1 = Force mono. 12 Reserved 11 RDSM 10 SKMODE Seek Mode. 0 = Wrap at the upper or lower band limit and continue seeking (default). 1 = Stop seeking at the upper or lower band limit. 9 SEEKUP Seek Direction. 0 = Seek down (default). 1 = Seek up. 8 SEEK Softmute Disable. 0 = Softmute enable (default). 1 = Softmute disable. Reserved. Always write to 0. RDS Mode. 0 = Standard (default). 1 = Verbose. Refer to “4.4. RDS/RBDS Processor and Functionality”. Seek. 0 = Disable (default). 1 = Enable. Notes: 1. Seek begins at the current channel, and goes in the direction specified with the SEEKUP bit. Seek operation stops when a channel is qualified as valid according to the seek parameters, the entire band has been searched (SKMODE = 0), or the upper or lower band limit has been reached (SKMODE = 1). 2. The STC bit is set high when the seek operation completes and/or the SF/BL bit is set high if the seek operation was unable to find a channel qualified as valid according to the seek parameters. The STC and SF/BL bits must be set low by setting the SEEK bit low before the next seek or tune may begin. 3. Seek performance for 50 kHz channel spacing varies according to RCLK tolerance. Silicon Laboratories recommends ±50 ppm RCLK crystal tolerance for 50 kHz seek performance. 4. A seek operation may be aborted by setting SEEK = 0. 24 Rev. 1.1 Bit Name Function 7 Reserved Reserved. Always write to 0. 6 DISABLE Powerup Disable. Refer to “4.9. Reset, Powerup, and Powerdown”. Default = 0. 5:1 Reserved Reserved. Always write to 0. 0 ENABLE Powerup Enable. Refer to “4.9. Reset, Powerup, and Powerdown”. Default = 0. Register 03h. Channel Bit D15 Name TUNE Type R/W D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 0 0 0 0 0 CHANNEL[9:0] R/W R/W R/W R/W R/W R/W D3 D2 D1 D0 Reset value = 0x0000 Bit Name Function 15 TUNE Tune. 0 = Disable (default). 1 = Enable. The tune operation begins when the TUNE bit is set high. The STC bit is set high when the tune operation completes. The STC bit must be set low by setting the TUNE bit low before the next tune or seek may begin. 14:10 Reserved Reserved. Always write to 0. 9:0 CHAN[9:0] Channel Select. Channel value for tune operation. If BAND 05h[7:6] = 00, then Freq (MHz) = Spacing (MHz) x Channel + 87.5 MHz. If BAND 05h[7:6] = 01, BAND 05h[7:6] = 10, then Freq (MHz) = Spacing (MHz) x Channel + 76 MHz. CHAN[9:0] is not updated during a seek operation. READCHAN[9:0] provides the current tuned channel and is updated during a seek operation and after a seek or tune operation completes. Channel spacing is set with the bits SPACE 05h[5:4]. Rev. 1.1 25 Register 04h. System Configuration 1 Bit D15 D14 Name RDSIEN STCIEN Type R/W R/W D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 RDS DE AGCD 0 0 BLNDADJ[1:0] GPIO3[1:0] GPIO2[1:0] GPIO1[1:0] R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Reset value = 0x0000 Bit Name Function 15 RDSIEN RDS Interrupt Enable. 0 = Disable Interrupt (default). 1 = Enable Interrupt. Setting RDSIEN = 1 and GPIO2[1:0] = 01 will generate a 5 ms low pulse on GPIO2 when the RDSR 0Ah[15] bit is set. 14 STCIEN Seek/Tune Complete Interrupt Enable. 0 = Disable Interrupt (default). 1 = Enable Interrupt. Setting STCIEN = 1 and GPIO2[1:0] = 01 will generate a 5 ms low pulse on GPIO2 when the STC 0Ah[14] bit is set. 13 Reserved 12 RDS 11 DE 10 AGCD 9:8 Reserved 6:7 5:4 26 Reserved. Always write to 0. RDS Enable. 0 = Disable (default). 1 = Enable. De-emphasis. 0 = 75 µs. Used in USA (default). 1 = 50 µs. Used in Europe, Australia, Japan. AGC Disable. 0 = AGC enable (default). 1 = AGC disable. Reserved. Always write to 0. BLNDADJ[1:0] Stereo/Mono Blend Level Adjustment. Sets the RSSI range for stereo/mono blend. 00 = 31–49 RSSI dBµV (default). 01 = 37–55 RSSI dBµV (+6 dB). 10 = 19–37 RSSI dBµV (–12 dB). 11 = 25–43 RSSI dBµV (–6 dB). ST bit set for RSSI values greater than low end of range. GPIO3[1:0] General Purpose I/O 3. 00 = High impedance (default). 01 = Mono/Stereo indicator (ST). The GPIO3 will output a logic high when the device is in stereo, otherwise the device will output a logic low for mono. 10 = Low. 11 = High. Rev. 1.1 Bit Name Function 3:2 GPIO2[1:0] General Purpose I/O 2. 00 = High impedance (default). 01 = STC/RDS interrupt. A logic high will be output unless an interrupt occurs as described below. 10 = Low. 11 = High. Setting STCIEN = 1 will generate a 5 ms low pulse on GPIO2 when the STC 0Ah[14] bit is set. Setting RDSIEN = 1 will generate a 5 ms low pulse on GPIO2 when the RDSR 0Ah[15] bit is set. 1:0 GPIO1[1:0] General Purpose I/O 1. 00 = High impedance (default). 01 = Reserved. 10 = Low. 11 = High. Rev. 1.1 27 Register 05h. System Configuration 2 Bit D15 D14 D13 D12 D11 Name SEEKTH[7:0] Type R/W D10 D9 D8 D7 D6 D5 D4 BAND[1:0] SPACE[1:0] R/W R/W D3 D2 D1 D0 VOLUME[3:0] R/W Reset value = 0x0000 Bit Name Function 15:8 SEEKTH[7:0] 7:6 BAND[1:0] Band Select. 00 = 87.5–108 MHz (USA, Europe) (Default). 01 = 76–108 MHz (Japan wide band). 10 = 76–90 MHz (Japan). 11 = Reserved. 5:4 SPACE[1:0] Channel Spacing. 00 = 200 kHz (USA, Australia) (default). 01 = 100 kHz (Europe, Japan). 10 = 50 kHz. 3:0 VOLUME[3:0] RSSI Seek Threshold. 0x00 = min RSSI (default). 0x7F = max RSSI. SEEKTH presents the logarithmic RSSI threshold for the seek operation. The Si4702/03-C19 will not validate channels with RSSI below the SEEKTH value. SEEKTH is one of multiple parameters that can be used to validate channels. For more information, see "AN284: Si4700/01 Firmware 15 Seek Adjustability and Settings." Volume. Relative value of volume is shifted –30 dBFS with the VOLEXT 06h[8] bit. VOLEXT = 0 (default). 0000 = mute (default). 0001 = –28 dBFS. : : 1110 = –2 dBFS. 1111 = 0 dBFS. VOLEXT = 1. 0000 = mute. 0001 = –58 dBFS. : : 1110 = –32 dBFS. 1111 = –30 dBFS. FS = full scale. Volume scale is logarithmic. 28 Rev. 1.1 Register 06h. System Configuration 3 Bit D15 D14 D13 D12 Name SMUTER[1:0] SMUTEA[1:0] Type R/W R/W D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 0 0 0 VOLEXT SKSNR[3:0] SKCNT[3:0] R/W R/W R/W R/W R/W R/W D0 Reset value = 0x0000 Bit Name Function 15:14 SMUTER[1:0] Softmute Attack/Recover Rate. 00 = fastest (default). 01 = fast. 10 = slow. 11 = slowest. 13:12 SMUTEA[1:0] Softmute Attenuation. 00 = 16 dB (default). 01 = 14 dB. 10 = 12 dB. 11 = 10 dB. 11:9 Reserved Reserved. Always write to zero. 8 VOLEXT Extended Volume Range. 0 = disabled (default). 1 = enabled. This bit attenuates the output by 30 dB. With the bit set to 0, the 15 volume settings adjust the volume between 0 and –28 dBFS. With the bit set to 1, the 15 volume settings adjust the volume between –30 and –58 dBFS. Refer to 4.5. "Stereo Audio Processing" on page 16. 7:4 SKSNR[3:0] Seek SNR Threshold. 0000 = disabled (default). 0001 = min (most stops). 0111 = max (fewest stops). Required channel SNR for a valid seek channel. 3:0 SKCNT[3:0] Seek FM Impulse Detection Threshold. 0000 = disabled (default). 0001 = max (most stops). 1111 = min (fewest stops). Allowable number of FM impulses for a valid seek channel. Rev. 1.1 29 Register 07h. Test 1 Bit D15 D14 D13 D12 D11 D10 D9 Name XOSCEN AHIZEN Type R/W D8 D7 D6 D5 D4 D3 D2 D1 D0 Reserved R/W R/W Reset value = 0x0100 Bit Name Function 15 XOSCEN Crystal Oscillator Enable. 0 = Disable (default). 1 = Enable. The internal crystal oscillator requires an external 32.768 kHz crystal as shown in 2. "Typical Application Schematic" on page 14. The oscillator must be enabled before powerup (ENABLE = 1) as shown in Figure 9, “Initialization Sequence,” on page 21. It should only be disabled after powerdown (ENABLE = 0). Bits 13:0 of register 07h must be preserved as 0x0100 while in powerdown and as 0x3C04 while in powerup. Refer to Si4702/03 Internal Crystal Oscillator Errata. 14 AHIZEN Audio High-Z Enable. 0 = Disable (default). 1 = Enable. Setting AHIZEN maintains a dc bias of 0.5 x VIO on the LOUT and ROUT pins to prevent the ESD diodes from clamping to the VIO or GND rail in response to the output swing of another device. Register 07h containing the AHIZEN bit must not be written during the powerup sequence and high-Z only takes effect when in powerdown and VIO is supplied. Bits 13:0 of register 07h must be preserved as 0x0100 while in powerdown and as 0x3C04 while in powerup. 13:0 Reserved 30 Reserved. If written, these bits should be read first and then written with their pre-existing values. Do not write during powerup. Rev. 1.1 Register 08h. Test 2 Bit D15 D14 D13 D12 D11 D10 D9 D8 Name Reserved Type R/W D7 D6 D5 D4 D3 D2 D1 D0 Reset value = 0x0000 Bit Name 15:0 Reserved Function Reserved. If written, these bits should be read first and then written with their pre-existing values. Do not write during powerup. Register 09h. Boot Configuration Bit D15 D14 D13 D12 D11 D10 D9 D8 Name Reserved Type R/W D7 D6 D5 D4 D3 D2 D1 D0 Reset value = 0x0000 Bit Name 15:0 Reserved Function Reserved. If written, these bits should be read first and then written with their pre-existing values. Do not write during powerup. Rev. 1.1 31 Register 0Ah. Status RSSI Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 Name RDSR STC SF/BL AFCRL RDSS BLERA[1:0] ST RSSI[7:0] Type R R R R R R R R D2 D1 D0 Reset value = 0x0000 Bit Name 15 RDSR 14 STC Seek/Tune Complete. 0 = Not complete (default). 1 = Complete. The seek/tune complete flag is set when the seek or tune operation completes. Setting the SEEK 02h[8] or TUNE 03h[15] bit low will clear STC. 13 SF/BL Seek Fail/Band Limit. 0 = Seek successful. 1 = Seek failure/Band limit reached. The SF/BL flag is set high when SKMODE 02h[10] = 0 and the seek operation fails to find a channel qualified as valid according to the seek parameters. The SF/BL flag is set high when SKMODE 02h[10] = 1 and the upper or lower band limit has been reached. The SEEK 02h[8] bit must be set low to clear SF/BL. 12 AFCRL AFC Rail. 0 = AFC not railed. 1 = AFC railed, indicating an invalid channel. Audio output is softmuted when set. AFCRL is updated after a tune or seek operation completes and indicates a valid or invalid channel. During normal operation, AFCRL is updated to reflect changing RF environments. 11 RDSS RDS Synchronized. 0 = RDS decoder not synchronized (default). 1 = RDS decoder synchronized. Available only in RDS Verbose mode (RDSM 02h[11] = 1). Refer to “4.4. RDS/RBDS Processor and Functionality”. 10:9 BLERA[1:0] 32 Function RDS Ready. 0 = No RDS group ready (default). 1 = New RDS group ready. Refer to “4.4. RDS/RBDS Processor and Functionality”. RDS Block A Errors. 00 = 0 errors requiring correction. 01 = 1–2 errors requiring correction. 10 = 3–5 errors requiring correction. 11 = 6+ errors or error in checkword, correction not possible. Available only in RDS Verbose mode (RDSM 02h[11] = 1). Refer to “4.4. RDS/RBDS Processor and Functionality”. Rev. 1.1 Bit Name 8 ST 7:0 RSSI[7:0] Function Stereo Indicator. 0 = Mono. 1 = Stereo. Stereo indication is also available on GPIO3 by setting GPIO3 04h[5:4] = 01. RSSI (Received Signal Strength Indicator). RSSI is measured units of dBµV in 1 dB increments with a maximum of approximately 75 dBµV. Si4702/03-C19 does not report RSSI levels greater than 75 dBuV. Rev. 1.1 33 Register 0Bh. Read Channel Bit D15 D14 D13 D12 D11 D10 D9 D8 Name BLERB[1:0] BLERC[1:0] BLERD[1:0] Type R R D7 D6 D5 D4 D3 D2 D1 D0 READCHAN[9:0] R R Reset value = 0x0000 Bit Name 15:14 BLERB[1:0] RDS Block B Errors. 00 = 0 errors requiring correction. 01 = 1–2 errors requiring correction. 10 = 3–5 errors requiring correction. 11 = 6+ errors or error in checkword, correction not possible. Available only in RDS Verbose mode (RDSM = 1). Refer to “4.4. RDS/RBDS Processor and Functionality”. 13:12 BLERC[1:0] RDS Block C Errors. 00 = 0 errors requiring correction. 01 = 1–2 errors requiring correction. 10 = 3–5 errors requiring correction. 11 = 6+ errors or error in checkword, correction not possible. Available only in RDS Verbose mode (RDSM = 1). Refer to “4.4. RDS/RBDS Processor and Functionality”. 11:10 BLERD[1:0] RDS Block D Errors. 00 = 0 errors requiring correction. 01 = 1–2 errors requiring correction. 10 = 3–5 errors requiring correction. 11 = 6+ errors or error in checkword, correction not possible. Available only in RDS Verbose mode (RDSM = 1). Refer to “4.4. RDS/RBDS Processor and Functionality”. 9:0 34 Function READCHAN[9:0] Read Channel. If BAND 05h[7:6] = 00, then Freq (MHz) = Spacing (MHz) x Channel + 87.5 MHz. If BAND 05h[7:6] = 01, BAND 05h[7:6] = 10, then Freq (MHz) = Spacing (MHz) x Channel + 76 MHz. READCHAN[9:0] provides the current tuned channel and is updated during a seek operation and after a seek or tune operation completes. Spacing and channel are set with the bits SPACE 05h[5:4] and CHAN 03h[9:0]. Rev. 1.1 Register 0Ch. RDSA Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 Name RDSA[15:0] Type R D6 D5 D4 D3 D2 D1 D0 D5 D4 D3 D2 D1 D0 Reset value = 0x0000 Bit Name 15:0 RDSA Function RDS Block A Data. Register 0Dh. RDSB Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 Name RDSB[15:0] Type R D6 Reset value = 0x0000 Bit Name 15:0 RDSB Function RDS Block B Data. Rev. 1.1 35 Register 0Eh. RDSC Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 Name RDSC[15:0] Type R D6 D5 D4 D3 D2 D1 D0 D5 D4 D3 D2 D1 D0 Reset value = 0x0000 Bit Name 15:0 RDSC Function RDS Block C Data. Register 0Fh. RDSD Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 Name RDSD[15:0] Type R D6 Reset value = 0x0000 Bit Name 15:0 RDSD 36 Function RDS Block D Data. Rev. 1.1 5 VA RST GPIO3 4 17 16 15 GND 14 LOUT GND PAD 13 ROUT 12 GND 6 7 8 9 10 VIO GND GPIO2 3 18 RCLK RFGND GPIO1 2 19 SDIO FMIP 20 SCLK 1 SEN NC NC 7. Pin Descriptions: Si4702/03-C19 11 VD Top View Pin Number(s) Name 1, 20 NC 2 FMIP 3 RFGND 4, 12, 15, PAD GND Ground. Connect to ground plane on PCB. 5 RST Device reset input (active low). 6 SEN Serial enable input (active low). 7 SCLK Serial clock input. 8 SDIO Serial data input/output. 9 RCLK External reference oscillator input. 10 VIO I/O supply voltage. 11 VD Digital supply voltage. May be connected directly to battery. 13 ROUT Right audio output. 14 LOUT Left audio output. 16 VA 17, 18, 19 Description No Connect. Leave floating. FM RF inputs. RF ground. Connect to ground plane on PCB. Analog supply voltage. May be connected directly to battery. GPIO3, GPIO2, General purpose input/output. GPIO1 Rev. 1.1 37 8. Ordering Guide Part Number* Package Type Operating Temperature Si4702-C19-GM Portable Broadcast Radio Tuner FM Stereo QFN Pb-free –20 to 85 °C Si4703-C19-GM Portable Broadcast Radio Tuner FM Stereo with RDS QFN Pb-free –20 to 85 °C Description *Note: Add an “(R)” at the end of the device part number to denote tape and reel option; 2500 quantity per reel. 38 Rev. 1.1 9. Package Markings (Top Marks) 9.1. Si4702 Top Mark Figure 10. Si4702 Top Mark 9.2. Si4703 Top Mark Figure 11. Si4703 Top Mark 9.3. Top Mark Explanation Mark Method: YAG Laser Line 1 Marking: Part Number 02 = Si4702 03 = Si4703 Firmware Revision 19 = Firmware Revision 19 R = Die Revision C = Revision C Die TTT = Internal Code Internal tracking code. Line 2 Marking: Line 3 Marking: Circle = 0.5 mm Diameter Pin 1 Identifier (Bottom-Left Justified) Y = Year WW = Workweek Assigned by the Assembly House. Corresponds to the last significant digit of the year and workweek of the mold date. Rev. 1.1 39 10. Package Outline: Si4702/03-C19 Figure 12 illustrates the package details for the Si4702/03-C19. Table 10 lists the values for the dimensions shown in the illustration. Figure 12. 20-Pin Quad Flat No-Lead (QFN) Table 10. Package Dimensions Symbol Millimeters Symbol Min Nom Max A 0.50 0.55 0.60 f A1 0.00 0.02 0.05 L 0.35 0.40 0.45 b 0.18 0.25 0.30 L1 0.00 — 0.10 c 0.27 0.32 0.37 aaa — — 0.10 bbb — — 0.10 ccc — — 0.08 ddd — — 0.10 eee — — 0.10 D D2 1.65 1.70 1.75 0.50 BSC E E2 Min 3.00 BSC e 3.00 BSC 1.65 1.70 1.75 Notes: 1. All dimensions are shown in millimeters unless otherwise noted. 2. Dimensioning and tolerancing per ANSI Y14.5M-1994. 40 Millimeters Rev. 1.1 Nom Max 2.53 BSC 11. PCB Land Pattern: Si4702/03-C19 Figure 13 illustrates the PCB land pattern details for the Si4702/03-C19. Table 11 lists the values for the dimensions shown in the illustration. Figure 13. PCB Land Pattern Rev. 1.1 41 Table 11. PCB Land Pattern Dimensions Symbol Millimeters Min D D2 Symbol Max 2.71 REF 1.60 1.80 Min Max GE 2.10 — W — 0.34 — e 0.50 BSC X E 2.71 REF Y E2 f GD 1.60 1.80 2.53 BSC 2.10 Millimeters 0.28 0.61 REF ZE — 3.31 ZD — 3.31 — Notes: General 1. All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on IPC-SM-782 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm. Notes: Solder Mask Design 1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm minimum, all the way around the pad. Notes: Stencil Design 1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 2. The stencil thickness should be 0.125 mm (5 mils). 3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads. 4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides approximately 70% solder paste coverage on the pad, which is optimum to assure correct component stand-off. Notes: Card Assembly 1. A No-Clean, Type-3 solder paste is recommended. 2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 42 Rev. 1.1 ADDITIONAL REFERENCE RESOURCES AN230: Si4700/01/02/03 Programming Guide AN231: Si4700/01/02/03 Headphone and Antenna Interface Si4700/01/02/03 EVB User’s Guide AN234: Si4700/01/02/03 EVB Test Procedure AN235: Si4700/01/02/03 EVB Quick Start Guide AN243: Using RDS/RBDS with the Si4701/03 AN284: Si4700/01/02/03 Seek Adjustability and Settings AN299: External 32.768 kHz Crystal Oscillator AN383: Antenna Selection and Universal Layout Guidelines Si4702/03 Internal Crystal Oscillator Errata Si4700/01/02/03 Customer Support Site: http://www.mysilabs.com This site contains all application notes, evaluation board schematics and layouts, and evaluation software. NDA is required for access. To request access, register at http://www.mysilabs.com and send user’s first and last name, company, NDA reference number, and mysilabs user name to [email protected]. Silicon Labs recommends an all lower case user name. Rev. 1.1 43 DOCUMENT CHANGE LIST Revision 0.8 to Revision 0.9 Updated Figure 1, “Reset Timing Parameters for Busmode Select Method 1 (GPIO3 = 0),” on page 6. Updated Table 3, “DC Characteristics1,” on page 5. Updated Table 7, “2-Wire Control Interface Characteristics1,2,3,” on page 10. Updated Table 8, “FM Receiver Characteristics1,2,” on page 12. Updated 4.4. "RDS/RBDS Processor and Functionality" on page 16. Updated Register 1, “Chip ID,” on page 23. Updated Register 5, “System Configuration 2,” on page 28. Revision 0.9 to Revision 1.0 Updated notes in Table 7 on page 10. Updated Table 8 on page 12. Updated “4. Functional Description”. Updated “5. Register Summary”. Updated “6. Register Descriptions”. Updated “7. Pin Descriptions: Si4702/03-C19”. Revision 1.0 to Revision 1.1 Updated Table 8 on page 12. Updated “4.11. Initialization Sequence”. Updated Register 06h: System Configuration 3. Updated additional reference resources. 44 Rev. 1.1 NOTES: Rev. 1.1 45 Smart. Connected. Energy-Friendly Products Quality Support and Community www.silabs.com/products www.silabs.com/quality community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. 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