1104212-Si4702-03 Fab Site and Assy Sites Expansion Std

Process Change Notice #1104212
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PCN Date: 21Apr11
Effective Date: 26Jul11
Title: Si4702/03 Fab Site (SMIC) and Assembly Sites (SPIL and ASEKR) Expansion
Originator: Wade Gillham
Phone: 512-532-5248
Dept: Broadcast Marketing
Customer Contact: Kathy Haggar
Phone: 512-532-5261
Dept: Sales
PCN Type:
Assembly
Discontinuance
Package
Datasheet
Fabrication
Product Revision
Packing
Labeling
Location
Test
Other
Last Order Date: 26Jul11
PCN Details
Description of Change:
Silicon Laboratories (Silicon Labs) is pleased to announce the successful qualification of the
following additional fab and assembly sites for the Si4702/03 family of FM receiver products:
 Fab Site - Semiconductor Manufacturing International Corporation (SMIC) in Shanghai, China
SMIC is an existing fab site for Silicon Labs, is certified to ISO9001, ISO14001 and ISO/TS16949
and is a Sony Green Partner.

Assembly Site - Siliconware Precision Industries Co. Ltd., Taiwan (SPIL)
SPIL is an existing assembly site for Silicon Labs, is certified to ISO9001, ISO14001 and
ISO/TS16949 and is a Sony Green Partner.

Assembly Site - Advanced Semiconductor Engineering in Korea (ASEKR)
ASEKR is an existing assembly site for Silicon Laboratories and is certified for ISO9001, ISO14001,
ISO/TS 16949 and is a Sony Green Partner.
Si4702/03 devices manufactured in SMIC will be noted with an incremented die revision number
making the part numbers Si4702/03-D30; however the devices are a drop-in replacement for the
Si4702/03-C19.
Approved Bills of Material
Supplier
ASEKR (Au wire)
ASEKR (Cu wire)
SPIL
Leadframe
Half Etched, Copper
C7025, Ring Ag-Plating
Half Etched, Copper
C7025, Ring Ag-Plating
Etched, EFTEC 64T
Pre-Plating
Die Attach
Hitachi EN4900GC
Hitachi EN4900GC
Sumitomo 1033BF
Wire bond
1.0 mil Au wire
0.9mil CuPd wire
1.0 mil Au wire
Sumitomo EME- G700
Sumitomo EME- G700
Sumitomo EME- G770
Sn 100 (Matte Tin)
Sn 100 (Matte Tin)
Sn 100 (Matte Tin)
Mold Compound
Lead finish
Reason for Change:
Expand manufacturing capacity for the Si4702/03 product family.
W7206F1 Process Change Notice Form rev Z
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1
Process Change Notice #1104212
____________________________________________________________________________________________________
Impact on Form, Fit, Function, Quality, Reliability:
There is no impact to the Form, Fit, Quality or Reliability of the Si4702/03 family of FM receivers
manufactured at SMIC. The Si4702/03-D30 parts are a drop-in replacement for the existing
Si4702/03-C19 parts.
The Function has changed where the power consumption has increased slightly (~8%) for the SMIC
produced parts.
There is no impact on Form Fit, Function, Quality or Reliability of the Si4702/03-D30 variants
assembled at either SPIL or ASEKR assembly sites.
Product Identification:
This PCN applies to devices ordered using the following ordering part numbers.
Part Number
Fabrication
Facility
Assembly
Location
Assembly
Location
Si4702-C19-GM
TSMC
SPIL
ASEKR
Si4702-D30-GM
SMIC
SPIL
ASEKR
Si4703-C19-GM
TSMC
SPIL
ASEKR
Si4703-D30-GM
SMIC
SPIL
ASEKR
Note: Affected Part Numbers also include tape and reel equivalents (“R” suffix).
Last Date of Unchanged Product: 26Jul11
Following the Effective Date of this PCN, Silicon Laboratories may utilize any of the qualified
foundries or assembly sites to schedule and fulfill orders for the Si4702/03 products. Orders placed
using any of the above part numbers may be fulfilled with their equivalent counterpart at Silicon
Labs’ discrection.
Qualification Samples:
Samples are available now. Please contact your local Silicon Laboratories sales representative to
order samples. A list of authorized sales representatives may be found at www.silabs.com
Customer Early Acceptance Sign Off:
Customers may approve early PCN acceptance by completing the information below:
Early Acceptance Date:
Name:
Company:
Email your early Acceptance approval to: [email protected]
Qualification Data: See Appendix A for the Qualification Report
W7206F1 Process Change Notice Form rev Z
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2
Process Change Notice #1104212
____________________________________________________________________________________________________
Appendix A: Si4702/03-D30-GM Qualification Report
Part Rev D30, SMIC Fabrication, ASEKR Assembly except as noted
Test Name
Test Condition
Qualification
Lot ID or
Start
Fail/Pass
or End
Notes
Summary
1
3 lots
Status
Test Group A – Accelerated Environment Stress Tests - ASEKR 3x3 QFN
JA110
HAST
Q23521
0/78
Q23544
0/78
Vcc=5.5V, 96 hours
Q23548
0/78
JA104
Q25083
0/80
Q23546
0/78
Q23549
0/78
Q25083
0/80
Q25109
0/79
6 lots
Q25115
0/76
0/471
Q23616
0/78
Q23617
0/78
Q23618
0/78
130°C, 85%RH
Cond C: -65°C to 150°C
Temp Cycle
3 lots, N=>25
3 lots, N=>25
500 cycles
JA103
HTSL
150°C, 1000hr
3 lots, N=>25
0/234
Pass
1
1
Pass
3 lots
0/234
Pass
Test Group A – Accelerated Environment Stress Tests - ASEKR - Copper Wire
JA110
HAST
Temp Cycle
HTSL
Q29832
0/30
Q29824
0/30
Vcc=5.5V, 192 hours
Q29816
0/30
JA104
Q29834
0/26
Q29826
0/26
2000 cycles
Q29818
0/26
JA103
Q29833
0/28
Q29825
0/28
Q29817
0/28
130°C, 85%RH
Cond C: -65°C to 150°C
150°C, 2000 hours
3 lots, N=>25
3 lots, N=>25
3 lots, N=>25
1
3 lots
0/90
1
3 lots
0/78
1
Pass
Pass
3 lots
0/84
Pass
Test Group A – Accelerated Environment Stress Tests - SPIL 3x3 QFN
JA110
HAST
Temp Cycle
HTSL
423506.1
0/25
423881.1
0/25
Vcc=5.5V, 96 hours
424560.1
0/25
JA104
423506.1
0/25
423881.1
0/25
500 cycles
424560.1
0/25
JA103
423506.1
0/25
423881.1
0/25
424560.1
0/25
130°C, 85%RH
Cond C: -65°C to 150°C
150°C, 1000hr
3 lots, N=>77
3 lots, N=>77
1 lot, N=>45
1
3 lots
0/75
1
3 lots
0/75
1
Pass
Pass
3 lots
0/75
Pass
Appendix A: Si4702/03-D30-GM Qualification Report (continued)
W7206F1 Process Change Notice Form rev Z
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3
Process Change Notice #1104212
____________________________________________________________________________________________________
Part Rev D30, SMIC Fabrication, ASEKR Assembly except as noted
Test Name
Lot ID
or
Start
Fail/Pass
or End
Q29407
0/79
Q29408
0/80
3 lots
Vcc=5.5V, 1000 hours
Q29409
0/80
0/239
JA108
Q27772
0/83
Test Condition
Qualification
Notes
Summary
Status
Test Group B – Accelerated Lifetime Simulation Tests
JA108
HTOL
LTOL
125°C, Dynamic
-10°C, Dynamic
3 lots, N=>77
1 lot, N=>32
1 lots
Vcc=5.5V, 1000 hours
0/83
JA108
125°C, Dynamic
3 lots, N=>500
Vcc=5.5V, 48 hours
ELFR
Pass
Q29624
0/999
Q29626
0/998
Q29632
0/958
Q29633
0/1035
Q29634
0/1040
Q29637
0/1038
Q29638
0/1040
8 lots
Q29639
0/1040
0/8148
Q29098
0/3
Q29099
0/3
Q29100
0/3
Q29101
0/3
Q29097
0/3
ASEKR
±750V
Q29766
0/3
ASEKR, Cu
±750V
Q28689
0/3
SPIL
±1250V
Q29096
0/6
85°C
Q29102
0/6
25°C
Pass
Pass
Test Group E – Electrical Verification
JA114
ESD-HBM
1 lot, N=>3
JA115
ESD-MM
1 lot, N=>3
JC101
ESD-CDM
1 lot, N=>3
JESD78
Latch Up
±200mA
1 lot, N=>6
Overvoltage = 8.25V
2
±2250V
±750V
2
Class
2
±125V
±25V
Class
A
Pass
2 lots
0/12
Pass
Notes:
1. Preceeded by MSL2 @260C Preconditioning
2. No-connect pins 1 and 20 excluded
W7206F1 Process Change Notice Form rev Z
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4
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