EFM8BB2 DataSheet

EFM8 Busy Bee Family
EFM8BB2 Data Sheet
The EFM8BB2, part of the Busy Bee family of MCUs, is a multipurpose line of 8-bit microcontrollers with a comprehensive feature
set in small packages.
These devices offer high-value by integrating advanced analog and enhanced highspeed communication peripherals into small packages, making them ideal for space-constrained applications. With an efficient 8051 core, enhanced pulse-width modulation, and
precision analog, the EFM8BB2 family is also optimal for embedded applications.
EFM8BB2 applications include the following:
• Medical equipment
• Lighting systems
• High-speed communication hub
• Motor control
• Consumer electronics
• Sensor controllers
KEY FEATURES
• Pipelined 8-bit C8051 core with 50 MHz
maximum operating frequency
• Up to 22 multifunction, 5 V tolerant I/O pins
• One 12-bit Analog to Digital converter
(ADC)
• Two Low-current analog comparators with
build-in DAC as reference input
• Integrated temperature sensor
• 3-channel PWM / PCA with special
hardware kill/safe state capability
• Five 16-bit timers
• Two UARTs, SPI, SMBus/I2C master/slave
and I2C slave
• Priority crossbar for flexible pin mapping
Core / Memory
Clock Management
CIP-51 8051 Core
(50 MHz)
Flash Program
Memory
RAM Memory
(2304 bytes)
(16 KB)
Debug Interface
with C2
Energy Management
External CMOS
Oscillator
High Frequency
49 MHz RC
Oscillator
Internal LDO
Regulator
Power-On Reset
Low Frequency
RC Oscillator
High Frequency
24.5 MHz RC
Oscillator
Brown-Out
Detector
5 V-to 3.3 V LDO
Regulator
8-bit SFR bus
Serial Interfaces
I/O Ports
Timers and Triggers
Analog Interfaces
2 x UART
SPI
External
Interrupts
Pin Reset
Timer
0/1/2
PCA/PWM
ADC
Comparator 0
I2C / SMBus
High-Speed
I2C Slave
General
Purpose I/O
Pin Wakeup
Watchdog
Timer
Timer 3/4
Comparator 1
Internal
Voltage
Reference
Security
16-bit CRC
Lowest power mode with peripheral operational:
Normal
Idle
Suspend
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Snooze
Shutdown
Rev. 1.2
EFM8BB2 Data Sheet
Feature List
1. Feature List
The EFM8BB2 highlighted features are listed below.
• Core:
• Pipelined CIP-51 Core
• Fully compatible with standard 8051 instruction set
• 70% of instructions execute in 1-2 clock cycles
• 50 MHz maximum operating frequency
• Memory:
• Up to 16 KB flash memory, in-system re-programmable
from firmware, including 1 KB of 64-byte sectors and 15
KB of 512-byte sectors.
• Up to 2304 bytes RAM (including 256 bytes standard 8051
RAM and 2048 bytes on-chip XRAM)
• Power:
• 5 V-input LDO regulator
• Internal LDO regulator for CPU core voltage
• Power-on reset circuit and brownout detectors
• I/O: Up to 22 total multifunction I/O pins:
• All pins 5 V tolerant under bias
• Flexible peripheral crossbar for peripheral routing
• 5 mA source, 12.5 mA sink allows direct drive of LEDs
• Clock Sources:
• Internal 49 MHz oscillator with accuracy of ±1.5%
• Internal 24.5 MHz oscillator with ±2% accuracy
• Internal 80 kHz low-frequency oscillator
• External CMOS clock option
• Timers/Counters and PWM:
• 3-channel Programmable Counter Array (PCA) supporting
PWM, capture/compare, and frequency output modes
• 5 x 16-bit general-purpose timers
• Independent watchdog timer, clocked from the low frequency oscillator
• Communications and Digital Peripherals:
• 2 x UART, up to 3 Mbaud
• SPI™ Master / Slave, up to 12 Mbps
• SMBus™/I2C™ Master / Slave, up to 400 kbps
• I2C High-Speed Slave, up to 3.4 Mbps
•
•
•
•
•
•
• 16-bit CRC unit, supporting automatic CRC of flash at 256byte boundaries
Analog:
• 12-Bit Analog-to-Digital Converter (ADC)
• 2 x Low-current analog comparators with adjustable reference
On-Chip, Non-Intrusive Debugging
• Full memory and register inspection
• Four hardware breakpoints, single-stepping
Pre-loaded UART bootloader
Temperature range -40 to 85 ºC or -40 to 125 ºC
Single power supply of 2.2 to 3.6 V or 3.0 to 5.25 V
QFN28, QSOP24, and QFN20 packages
With on-chip power-on reset, voltage supply monitor, watchdog timer, and clock oscillator, the EFM8BB2 devices are truly standalone
system-on-a-chip solutions. The flash memory is reprogrammable in-circuit, providing nonvolatile data storage and allowing field upgrades of the firmware. The on-chip debugging interface (C2) allows non-intrusive (uses no on-chip resources), full speed, in-circuit
debugging using the production MCU installed in the final application. This debug logic supports inspection and modification of memory
and registers, setting breakpoints, single stepping, and run and halt commands. All analog and digital peripherals are fully functional
while debugging. Each device is specified for 2.2 to 3.6 V operation (or up to 5.25 V with the 5 V regulator option) and is available in 28pin QFN, 20-pin QFN, or 24-pin QSOP packages. All package options are lead-free and RoHS compliant.
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EFM8BB2 Data Sheet
Ordering Information
2. Ordering Information
EFM8 BB2 2 F 16 G – A – QFN28 R
Tape and Reel (Optional)
Package Type
Revision
Temperature Grade G (-40 to +85), I (-40 to +125)
Flash Memory Size – 16 KB
Memory Type (Flash)
Family Feature Set
Busy Bee 2 Family
Silicon Labs EFM8 Product Line
Figure 2.1. EFM8BB2 Part Numbering
All EFM8B2 family members have the following features:
• CIP-51 Core running up to 50 MHz
• Three Internal Oscillators (49 MHz, 24.5 MHz and 80 kHz)
• SMBus
• I2C Slave
• SPI
• 2 UARTs
• 3-Channel Programmable Counter Array (PWM, Clock Generation, Capture/Compare)
• 5 16-bit Timers
• 2 Analog Comparators
• 12-bit Analog-to-Digital Converter with integrated multiplexer, voltage reference, and temperature sensor
• 16-bit CRC Unit
In addition to these features, each part number in the EFM8BB2 family has a set of features that vary across the product line. The
product selection guide shows the features available on each family member.
RAM (Bytes)
Digital Port I/Os (Total)
ADC0 Channels
Comparator 0 Inputs
Comparator 1 Inputs
Pb-free (RoHS Compliant)
5-to-3.3 V Regulator
Temperature Range
Package
EFM8BB22F16G-C-QFN28
16
2304
22
20
10
12
Yes
Yes
-40 to +85 ºC
QFN28
EFM8BB21F16G-C-QSOP24
16
2304
21
20
10
12
Yes
—
-40 to +85 ºC
QSOP24
EFM8BB21F16G-C-QFN20
16
2304
16
15
10
7
Yes
—
-40 to +85 ºC
QFN20
EFM8BB22F16I-C-QFN28
16
2304
22
20
10
12
Yes
Yes
-40 to +125 ºC
QFN28
EFM8BB21F16I-C-QSOP24
16
2304
21
20
10
12
Yes
—
-40 to +125 ºC
QSOP24
EFM8BB21F16I-C-QFN20
16
2304
16
15
10
7
Yes
—
-40 to +125 ºC
QFN20
Ordering Part Number
Flash Memory (KB)
Table 2.1. Product Selection Guide
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EFM8BB2 Data Sheet
System Overview
3. System Overview
3.1 Introduction
C2D
C2CK/RSTb
Port I/O Configuration
Debug / Programming
Hardware
Reset
Power-On
Reset
Supply
Monitor
VREGIN
Power
Net
Voltage
Regulators
UART0
UART1
16 KB ISP Flash
Program Memory
Timers 0,
1, 2, 3, 4
I2C Slave
I2C /
SMBus
2048 Byte XRAM
P0.n
Port 1
Drivers
P1.n
Port 2
Drivers
P2.n
Port 3
Drivers
P3.n
SPI
GND
CRC
Independent
Watchdog Timer
System Clock
Configuration
49 MHz 1.5%
Oscillator
24.5 MHz 2%
Oscillator
Low-Freq.
Oscillator
EXTCLK
Port 0
Drivers
Priority
Crossbar
Decoder
3-ch PCA
256 Byte SRAM
CMOS Oscillator
Input
SYSCLK
SFR
Bus
Crossbar Control
Analog Peripherals
Internal
Reference
VDD
VREF
VDD
12/10 bit
ADC
AMUX
VDD
Digital Peripherals
CIP-51 8051 Controller
Core
Temp
Sensor
+
-+
2 Comparators
Figure 3.1. Detailed EFM8BB2 Block Diagram
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EFM8BB2 Data Sheet
System Overview
3.2 Power
All internal circuitry draws power from the VDD supply pin. External I/O pins are powered from the VIO supply voltage (or VDD on devices without a separate VIO connection), while most of the internal circuitry is supplied by an on-chip LDO regulator. Control over the
device power can be achieved by enabling/disabling individual peripherals as needed. Each analog peripheral can be disabled when
not in use and placed in low power mode. Digital peripherals, such as timers and serial buses, have their clocks gated off and draw little
power when they are not in use.
Table 3.1. Power Modes
Power Mode
Details
Mode Entry
Wake-Up Sources
Normal
Core and all peripherals clocked and fully operational
—
—
Set IDLE bit in PCON0
Any interrupt
Idle
• Core halted
• All peripherals clocked and fully operational
• Code resumes execution on wake event
Suspend
•
•
•
•
•
Core and peripheral clocks halted
HFOSC0 and HFOSC1 oscillators stopped
Regulators in normal bias mode for fast wake
Timer 3 and 4 may clock from LFOSC0
Code resumes execution on wake event
1. Switch SYSCLK to
HFOSC0
2. Set SUSPEND bit in
PCON1
Stop
•
•
•
•
•
All internal power nets shut down
5 V regulator remains active (if enabled)
Internal 1.8 V LDO on
Pins retain state
Exit on any reset source
1. Clear STOPCF bit in
REG0CN
2. Set STOP bit in
PCON0
Snooze
• Core and peripheral clocks halted
• HFOSC0 and HFOSC1 oscillators stopped
• Regulators in low bias current mode for energy savings
• Timer 3 and 4 may clock from LFOSC0
• Code resumes execution on wake event
1. Switch SYSCLK to
HFOSC0
2. Set SNOOZE bit in
PCON1
•
•
•
•
•
Shutdown
•
•
•
•
•
1. Set STOPCF bit in
REG0CN
2. Set STOP bit in
PCON0
• RSTb pin reset
• Power-on reset
All internal power nets shut down
5 V regulator remains active (if enabled)
Internal 1.8 V LDO off to save energy
Pins retain state
Exit on pin or power-on reset
•
•
•
•
•
Timer 4 Event
SPI0 Activity
I2C0 Slave Activity
Port Match Event
Comparator 0 Falling
Edge
Any reset source
Timer 4 Event
SPI0 Activity
I2C0 Slave Activity
Port Match Event
Comparator 0 Falling
Edge
3.3 I/O
Digital and analog resources are externally available on the device’s multi-purpose I/O pins. Port pins P0.0-P2.3 can be defined as general-purpose I/O (GPIO), assigned to one of the internal digital resources through the crossbar or dedicated channels, or assigned to an
analog function. Port pins P3.0 and P3.1 can be used as GPIO. Additionally, the C2 Interface Data signal (C2D) is shared with P3.0.
The port control block offers the following features:
• Up to 22 multi-functions I/O pins, supporting digital and analog functions.
• Flexible priority crossbar decoder for digital peripheral assignment.
• Two drive strength settings for each port.
• Two direct-pin interrupt sources with dedicated interrupt vectors (INT0 and INT1).
• Up to 20 direct-pin interrupt sources with shared interrupt vector (Port Match).
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EFM8BB2 Data Sheet
System Overview
3.4 Clocking
The CPU core and peripheral subsystem may be clocked by both internal and external oscillator resources. By default, the system
clock comes up running from the 24.5 MHz oscillator divided by 8.
The clock control system offers the following features:
• Provides clock to core and peripherals.
• 24.5 MHz internal oscillator (HFOSC0), accurate to ±2% over supply and temperature corners.
• 49 MHz internal oscillator (HFOSC1), accurate to ±1.5% over supply and temperature corners.
• 80 kHz low-frequency oscillator (LFOSC0).
• External CMOS clock input (EXTCLK).
• Clock divider with eight settings for flexible clock scaling:
• Divide the selected clock source by 1, 2, 4, 8, 16, 32, 64, or 128.
• HFOSC0 and HFOSC1 include 1.5x pre-scalers for further flexibility.
3.5 Counters/Timers and PWM
Programmable Counter Array (PCA0)
The programmable counter array (PCA) provides multiple channels of enhanced timer and PWM functionality while requiring less CPU
intervention than standard counter/timers. The PCA consists of a dedicated 16-bit counter/timer and one 16-bit capture/compare module for each channel. The counter/timer is driven by a programmable timebase that has flexible external and internal clocking options.
Each capture/compare module may be configured to operate independently in one of five modes: Edge-Triggered Capture, Software
Timer, High-Speed Output, Frequency Output, or Pulse-Width Modulated (PWM) Output. Each capture/compare module has its own
associated I/O line (CEXn) which is routed through the crossbar to port I/O when enabled.
•
•
•
•
•
•
•
•
•
•
16-bit time base
Programmable clock divisor and clock source selection
Up to three independently-configurable channels
8, 9, 10, 11 and 16-bit PWM modes (center or edge-aligned operation)
Output polarity control
Frequency output mode
Capture on rising, falling or any edge
Compare function for arbitrary waveform generation
Software timer (internal compare) mode
Can accept hardware “kill” signal from comparator 0
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EFM8BB2 Data Sheet
System Overview
Timers (Timer 0, Timer 1, Timer 2, Timer 3, and Timer 4)
Several counter/timers are included in the device: two are 16-bit counter/timers compatible with those found in the standard 8051, and
the rest are 16-bit auto-reload timers for timing peripherals or for general purpose use. These timers can be used to measure time intervals, count external events and generate periodic interrupt requests. Timer 0 and Timer 1 are nearly identical and have four primary
modes of operation. The other timers offer both 16-bit and split 8-bit timer functionality with auto-reload and capture capabilities.
Timer 0 and Timer 1 include the following features:
• Standard 8051 timers, supporting backwards-compatibility with firmware and hardware.
• Clock sources include SYSCLK, SYSCLK divided by 12, 4, or 48, the External Clock divided by 8, or an external pin.
• 8-bit auto-reload counter/timer mode
• 13-bit counter/timer mode
• 16-bit counter/timer mode
• Dual 8-bit counter/timer mode (Timer 0)
Timer 2, Timer 3 and Timer 4 are 16-bit timers including the following features:
• Clock sources for all timers include SYSCLK, SYSCLK divided by 12, or the External Clock divided by 8.
• LFOSC0 divided by 8 may be used to clock Timer 3 and Timer 4 in active or suspend/snooze power modes.
• Timer 4 is a low-power wake source, and can be chained together with Timer 3
• 16-bit auto-reload timer mode
• Dual 8-bit auto-reload timer mode
• External pin capture
• LFOSC0 capture
• Comparator 0 capture
Watchdog Timer (WDT0)
The device includes a programmable watchdog timer (WDT) running off the low-frequency oscillator. A WDT overflow forces the MCU
into the reset state. To prevent the reset, the WDT must be restarted by application software before overflow. If the system experiences
a software or hardware malfunction preventing the software from restarting the WDT, the WDT overflows and causes a reset. Following
a reset, the WDT is automatically enabled and running with the default maximum time interval. If needed, the WDT can be disabled by
system software or locked on to prevent accidental disabling. Once locked, the WDT cannot be disabled until the next system reset.
The state of the RST pin is unaffected by this reset.
The Watchdog Timer has the following features:
• Programmable timeout interval
• Runs from the low-frequency oscillator
• Lock-out feature to prevent any modification until a system reset
3.6 Communications and Other Digital Peripherals
Universal Asynchronous Receiver/Transmitter (UART0)
UART0 is an asynchronous, full duplex serial port offering modes 1 and 3 of the standard 8051 UART. Enhanced baud rate support
allows a wide range of clock sources to generate standard baud rates. Received data buffering allows UART0 to start reception of a
second incoming data byte before software has finished reading the previous data byte.
The UART module provides the following features:
• Asynchronous transmissions and receptions.
• Baud rates up to SYSCLK/2 (transmit) or SYSCLK/8 (receive).
• 8- or 9-bit data.
• Automatic start and stop generation.
• Single-byte buffer on transmit and receive.
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EFM8BB2 Data Sheet
System Overview
Universal Asynchronous Receiver/Transmitter (UART1)
UART1 is an asynchronous, full duplex serial port offering a variety of data formatting options. A dedicated baud rate generator with a
16-bit timer and selectable prescaler is included, which can generate a wide range of baud rates. A received data FIFO allows UART1
to receive multiple bytes before data is lost and an overflow occurs.
UART1 provides the following features:
• Asynchronous transmissions and receptions.
• Dedicated baud rate generator supports baud rates up to SYSCLK/2 (transmit) or SYSCLK/8 (receive).
• 5, 6, 7, 8, or 9 bit data.
• Automatic start and stop generation.
• Automatic parity generation and checking.
• Four byte FIFO on transmit and receive.
• Auto-baud detection.
• LIN break and sync field detection.
• CTS / RTS hardware flow control.
Serial Peripheral Interface (SPI0)
The serial peripheral interface (SPI) module provides access to a flexible, full-duplex synchronous serial bus. The SPI can operate as a
master or slave device in both 3-wire or 4-wire modes, and supports multiple masters and slaves on a single SPI bus. The slave-select
(NSS) signal can be configured as an input to select the SPI in slave mode, or to disable master mode operation in a multi-master
environment, avoiding contention on the SPI bus when more than one master attempts simultaneous data transfers. NSS can also be
configured as a firmware-controlled chip-select output in master mode, or disabled to reduce the number of pins required. Additional
general purpose port I/O pins can be used to select multiple slave devices in master mode.
•
•
•
•
•
•
•
•
Supports 3- or 4-wire master or slave modes.
Supports external clock frequencies up to 12 Mbps in master or slave mode.
Support for all clock phase and polarity modes.
8-bit programmable clock rate (master).
Programmable receive timeout (slave).
Four byte FIFO on transmit and receive.
Can operate in suspend or snooze modes and wake the CPU on reception of a byte.
Support for multiple masters on the same data lines.
System Management Bus / I2C (SMB0)
The SMBus I/O interface is a two-wire, bi-directional serial bus. The SMBus is compliant with the System Management Bus Specification, version 1.1, and compatible with the I2C serial bus.
The SMBus module includes the following features:
• Standard (up to 100 kbps) and Fast (400 kbps) transfer speeds
• Support for master, slave, and multi-master modes
• Hardware synchronization and arbitration for multi-master mode
• Clock low extending (clock stretching) to interface with faster masters
• Hardware support for 7-bit slave and general call address recognition
• Firmware support for 10-bit slave address decoding
• Ability to inhibit all slave states
• Programmable data setup/hold times
• Transmit and receive buffers to help increase throughput in faster applications
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EFM8BB2 Data Sheet
System Overview
I2C Slave (I2CSLAVE0)
The I2C Slave interface is a 2-wire, bidirectional serial bus that is compatible with the I2C Bus Specification 3.0. It is capable of transferring in high-speed mode (HS-mode) at speeds of up to 3.4 Mbps. Firmware can write to the I2C interface, and the I2C interface can
autonomously control the serial transfer of data. The interface also supports clock stretching for cases where the core may be temporarily prohibited from transmitting a byte or processing a received byte during an I2C transaction. This module operates only as an I2C
slave device.
The I2C module includes the following features:
• Standard (up to 100 kbps), Fast (400 kbps), Fast Plus (1 Mbps), and High-speed (3.4 Mbps) transfer speeds
• Support for slave mode only
• Clock low extending (clock stretching) to interface with faster masters
• Hardware support for 7-bit slave address recognition
16-bit CRC (CRC0)
The cyclic redundancy check (CRC) module performs a CRC using a 16-bit polynomial. CRC0 accepts a stream of 8-bit data and posts
the 16-bit result to an internal register. In addition to using the CRC block for data manipulation, hardware can automatically CRC the
flash contents of the device.
The CRC module is designed to provide hardware calculations for flash memory verification and communications protocols. The CRC
module supports the standard CCITT-16 16-bit polynomial (0x1021), and includes the following features:
• Support for CCITT-16 polynomial
• Byte-level bit reversal
• Automatic CRC of flash contents on one or more 256-byte blocks
• Initial seed selection of 0x0000 or 0xFFFF
3.7 Analog
12-Bit Analog-to-Digital Converter (ADC0)
The ADC is a successive-approximation-register (SAR) ADC with 12-, 10-, and 8-bit modes, integrated track-and hold and a programmable window detector. The ADC is fully configurable under software control via several registers. The ADC may be configured to
measure different signals using the analog multiplexer. The voltage reference for the ADC is selectable between internal and external
reference sources.
•
•
•
•
•
•
•
•
•
•
•
Up to 20 external inputs.
Single-ended 12-bit and 10-bit modes.
Supports an output update rate of 200 ksps samples per second in 12-bit mode or 800 ksps samples per second in 10-bit mode.
Operation in low power modes at lower conversion speeds.
Asynchronous hardware conversion trigger, selectable between software, external I/O and internal timer sources.
Output data window comparator allows automatic range checking.
Support for burst mode, which produces one set of accumulated data per conversion-start trigger with programmable power-on settling and tracking time.
Conversion complete and window compare interrupts supported.
Flexible output data formatting.
Includes an internal fast-settling reference with two levels (1.65 V and 2.4 V) and support for external reference and signal ground.
Integrated temperature sensor.
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EFM8BB2 Data Sheet
System Overview
Low Current Comparators (CMP0, CMP1)
Analog comparators are used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher.
External input connections to device I/O pins and internal connections are available through separate multiplexers on the positive and
negative inputs. Hysteresis, response time, and current consumption may be programmed to suit the specific needs of the application.
The comparator includes the following features:
• Up to 10 (CMP0) or 12 (CMP1) external positive inputs
• Up to 10 (CMP0) or 12 (CMP1) external negative inputs
• Additional input options:
• Internal connection to LDO output
• Direct connection to GND
• Direct connection to VDD
• Dedicated 6-bit reference DAC
• Synchronous and asynchronous outputs can be routed to pins via crossbar
• Programmable hysteresis between 0 and ±20 mV
• Programmable response time
• Interrupts generated on rising, falling, or both edges
• PWM output kill feature
3.8 Reset Sources
Reset circuitry allows the controller to be easily placed in a predefined default condition. On entry to this reset state, the following occur:
• The core halts program execution.
• Module registers are initialized to their defined reset values unless the bits reset only with a power-on reset.
• External port pins are forced to a known state.
• Interrupts and timers are disabled.
All registers are reset to the predefined values noted in the register descriptions unless the bits only reset with a power-on reset. The
contents of RAM are unaffected during a reset; any previously stored data is preserved as long as power is not lost. The Port I/O latches are reset to 1 in open-drain mode. Weak pullups are enabled during and after the reset. For Supply Monitor and power-on resets,
the RSTb pin is driven low until the device exits the reset state. On exit from the reset state, the program counter (PC) is reset, and the
system clock defaults to an internal oscillator. The Watchdog Timer is enabled, and program execution begins at location 0x0000.
Reset sources on the device include the following:
• Power-on reset
• External reset pin
• Comparator reset
• Software-triggered reset
• Supply monitor reset (monitors VDD supply)
• Watchdog timer reset
• Missing clock detector reset
• Flash error reset
3.9 Debugging
The EFM8BB2 devices include an on-chip Silicon Labs 2-Wire (C2) debug interface to allow flash programming and in-system debugging with the production part installed in the end application. The C2 interface uses a clock signal (C2CK) and a bi-directional C2 data
signal (C2D) to transfer information between the device and a host system. See the C2 Interface Specification for details on the C2
protocol.
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EFM8BB2 Data Sheet
System Overview
3.10 Bootloader
All devices come pre-programmed with a UART bootloader. This bootloader resides in the code security page and last page of code
flash; it can be erased if it is not needed.
The byte before the Lock Byte is the Bootloader Signature Byte. Setting this byte to a value of 0xA5 indicates the presence of the bootloader in the system. Any other value in this location indicates that the bootloader is not present in flash.
When a bootloader is present, the device will jump to the bootloader vector after any reset, allowing the bootloader to run. The bootloader then determines if the device should stay in bootload mode or jump to the reset vector located at 0x0000. When the bootloader
is not present, the device will jump to the reset vector of 0x0000 after any reset.
More information about the bootloader protocol and usage can be found in AN945: EFM8 Factory Bootloader User Guide. Application
notes can be found on the Silicon Labs website (www.silabs.com/8bit-appnotes) or within Simplicity Studio by using the [Application
Notes] tile.
0xFFFF
Read-Only
0xFFC0
0xFFBF
0xFBFF
Lock Byte
0xFBFE
Bootloader Signature Byte
Code Security Page
0xF800
0xF7FF
0x4000
0x3FFF
64 Bytes
Bootloader Vector
Nonvolatile Data
Reserved
Bootloader
0xFBC0
0xFBBF
Bootloader
Reserved
0xFC00
16 KB Code
(32 x 512 Byte pages)
0x0000
Reset Vector
Figure 3.2. Flash Memory Map with Bootloader—16 KB Devices
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EFM8BB2 Data Sheet
Electrical Characteristics
4. Electrical Characteristics
4.1 Electrical Characteristics
All electrical parameters in all tables are specified under the conditions listed in Table 4.1 Recommended Operating Conditions on page
11, unless stated otherwise.
4.1.1 Recommended Operating Conditions
Table 4.1. Recommended Operating Conditions
Parameter
Operating Supply Voltage on VDD
Symbol
Test Condition
Min
Typ
Max
Unit
2.2
—
3.6
V
3.0
—
5.25
V
0
—
50
MHz
G-grade devices
-40
—
85
°C
I-grade devices
-40
—
125
°C
VDD
Operating Supply Voltage on VRE- VREGIN
GIN
System Clock Frequency
fSYSCLK
Operating Ambient Temperature
TA
Note:
1. All voltages with respect to GND.
2. GPIO levels are undefined whenever VDD is less than 1 V.
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EFM8BB2 Data Sheet
Electrical Characteristics
4.1.2 Power Consumption
Table 4.2. Power Consumption
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
FSYSCLK = 49 MHz (HFOSC1)2
—
9.1
9.7
mA
FSYSCLK = 24.5 MHz (HFOSC0)2
—
4.3
4.85
mA
FSYSCLK = 1.53 MHz (HFOSC0)2
—
600
900
μA
FSYSCLK = 80 kHz3
—
145
410
μA
FSYSCLK = 49 MHz (HFOSC1)2
—
6.15
6.6
mA
FSYSCLK = 24.5 MHz (HFOSC0)2
—
2.8
3.2
mA
FSYSCLK = 1.53 MHz (HFOSC0)2
—
440
750
μA
FSYSCLK = 80 kHz3
—
130
420
μA
LFO Running
—
125
400
μA
LFO Stopped
—
120
390
μA
LFO Running
—
25
300
μA
LFO Stopped
—
20
290
μA
Digital Core Supply Current (G-grade devices, -40 °C to +85 °C)
Normal Mode-Full speed with code IDD
executing from flash
Idle Mode-Core halted with peripherals running
IDD
Suspend Mode-Core halted and
high frequency clocks stopped,
Supply monitor off.
IDD
Snooze Mode-Core halted and
high frequency clocks stopped.
Regulator in low-power state, Supply monitor off.
IDD
Stop Mode—Core halted and all
clocks stopped,Internal LDO On,
Supply monitor off.
IDD
—
120
390
μA
Shutdown Mode—Core halted and
all clocks stopped,Internal LDO
Off, Supply monitor off.
IDD
—
0.2
3
μA
FSYSCLK = 49 MHz (HFOSC1)2
—
9.1
10.47
mA
FSYSCLK = 24.5 MHz (HFOSC0)2
—
4.3
5.49
mA
FSYSCLK = 1.53 MHz (HFOSC0)2
—
600
1555
μA
FSYSCLK = 80 kHz3
—
145
1070
μA
FSYSCLK = 49 MHz (HFOSC1)2
—
6.15
7.3
mA
FSYSCLK = 24.5 MHz (HFOSC0)2
—
2.8
3.86
mA
FSYSCLK = 1.53 MHz (HFOSC0)2
—
440
1400
μA
FSYSCLK = 80 kHz3
—
130
1050
μA
LFO Running
—
125
1050
μA
LFO Stopped
—
120
1045
μA
LFO Running
—
25
950
μA
LFO Stopped
—
20
940
μA
Digital Core Supply Current (I-grade devices, -40 °C to +125 °C)
Normal Mode-Full speed with code IDD
executing from flash
Idle Mode-Core halted with peripherals running
IDD
Suspend Mode-Core halted and
high frequency clocks stopped,
Supply monitor off.
IDD
Snooze Mode-Core halted and
high frequency clocks stopped.
Regulator in low-power state, Supply monitor off.
IDD
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EFM8BB2 Data Sheet
Electrical Characteristics
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Stop Mode—Core halted and all
clocks stopped,Internal LDO On,
Supply monitor off.
IDD
—
120
1045
μA
Shutdown Mode—Core halted and
all clocks stopped,Internal LDO
Off, Supply monitor off.
IDD
—
0.2
15
μA
—
105
—
μA
—
865
—
μA
—
4
—
μA
—
820
1200
μA
—
405
580
μA
200 ksps, VDD = 3.0 V
—
370
—
μA
100 ksps, VDD = 3.0 V
—
185
—
μA
10 ksps, VDD = 3.0 V
—
20
—
μA
200 ksps, VDD = 3.0 V
—
485
—
μA
100 ksps, VDD = 3.0 V
—
245
—
μA
10 ksps, VDD = 3.0 V
—
25
—
μA
100 ksps, VDD = 3.0 V
—
505
—
μA
50 ksps, VDD = 3.0 V
—
255
—
μA
10 ksps, VDD = 3.0 V
—
50
—
μA
100 ksps, VDD = 3.0 V,
—
950
—
μA
—
415
—
μA
—
80
—
μA
Normal Power Mode
—
680
790
μA
Low Power Mode
—
160
210
μA
Analog Peripheral Supply Currents (-40 °C to +125 °C)
High-Frequency Oscillator 0
IHFOSC0
Operating at 24.5 MHz,
TA = 25 °C
High-Frequency Oscillator 1
IHFOSC1
Operating at 49 MHz,
TA = 25 °C
Low-Frequency Oscillator
ILFOSC
Operating at 80 kHz,
TA = 25 °C
ADC0 Always-on4
IADC
800 ksps, 10-bit conversions or
200 ksps, 12-bit conversions
Normal bias settings
VDD = 3.0 V
250 ksps, 10-bit conversions or
62.5 ksps 12-bit conversions
Low power bias settings
VDD = 3.0 V
ADC0 Burst Mode, 10-bit single
conversions, external reference
ADC0 Burst Mode, 10-bit single
conversions, internal reference,
Low power bias settings
ADC0 Burst Mode, 12-bit single
conversions, external reference
ADC0 Burst Mode, 12-bit single
conversions, internal reference
IADC
IADC
IADC
IADC
Normal bias
50 ksps, VDD = 3.0 V,
Low power bias
10 ksps, VDD = 3.0 V,
Low power bias
Internal ADC0 Reference, Alwayson5
IVREFFS
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EFM8BB2 Data Sheet
Electrical Characteristics
Parameter
Symbol
Temperature Sensor
ITSENSE
Comparator 0 (CMP0, CMP1)
ICMP
Test Condition
Min
Typ
Max
Unit
—
70
120
μA
CPMD = 11
—
0.5
—
μA
CPMD = 10
—
3
—
μA
CPMD = 01
—
8.5
—
μA
CPMD = 00
—
22.5
—
μA
Comparator Reference
ICPREF
—
1.2
—
μA
Voltage Supply Monitor (VMON0)
IVMON
—
15
20
μA
5V Regulator
IVREG
—
245
340
μA
—
60
100
μA
—
2.5
10
μA
—
2.5
—
nA
Normal Mode
(SUSEN = 0, BIASENB = 0)
Suspend Mode
(SUSEN = 1, BIASENB = 0)
Bias Disabled
(BIASENB = 1)
Disabled
(BIASENB = 1, REG1ENB = 1)
Note:
1. Currents are additive. For example, where IDD is specified and the mode is not mutually exclusive, enabling the functions increases supply current by the specified amount.
2. Includes supply current from internal LDO regulator, supply monitor, and High Frequency Oscillator.
3. Includes supply current from internal LDO regulator, supply monitor, and Low Frequency Oscillator.
4. ADC0 always-on power excludes internal reference supply current.
5. The internal reference is enabled as-needed when operating the ADC in burst mode to save power.
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Rev. 1.2 | 14
EFM8BB2 Data Sheet
Electrical Characteristics
4.1.3 Reset and Supply Monitor
Table 4.3. Reset and Supply Monitor
Parameter
Symbol
VDD Supply Monitor Threshold
VVDDM
Power-On Reset (POR) Threshold
VPOR
Test Condition
Min
Typ
Max
Unit
1.95
2.05
2.15
V
Rising Voltage on VDD
—
1.2
—
V
Falling Voltage on VDD
0.75
—
1.36
V
VDD Ramp Time
tRMP
Time to VDD > 2.2 V
10
—
—
μs
Reset Delay from POR
tPOR
Relative to VDD > VPOR
3
10
31
ms
Time between release of reset
source and code execution
—
50
—
μs
15
—
—
μs
—
0.625
1.2
ms
Reset Delay from non-POR source tRST
RST Low Time to Generate Reset
tRSTL
Missing Clock Detector Response
Time (final rising edge to reset)
tMCD
Missing Clock Detector Trigger
Frequency
FMCD
—
7.5
13.5
kHz
VDD Supply Monitor Turn-On Time tMON
—
2
—
μs
Min
Typ
Max
Units
19
20
21
μs
5.2
5.35
5.5
ms
VDD Voltage During Programming3 VPROG
2.2
—
3.6
V
Endurance (Write/Erase Cycles)
20k
100k
—
Cycles
FSYSCLK >1 MHz
4.1.4 Flash Memory
Table 4.4. Flash Memory
Parameter
Write Time1 ,2
Symbol
tWRITE
Test Condition
One Byte,
FSYSCLK = 24.5 MHz
Erase Time1 ,2
tERASE
One Page,
FSYSCLK = 24.5 MHz
NWE
Note:
1. Does not include sequencing time before and after the write/erase operation, which may be multiple SYSCLK cycles.
2. The internal High-Frequency Oscillator 0 has a programmable output frequency, which is factory programmed to 24.5 MHz. If
user firmware adjusts the oscillator speed, it must be between 22 and 25 MHz during any flash write or erase operation. It is
recommended to write the HFO0CAL register back to its reset value when writing or erasing flash.
3. Flash can be safely programmed at any voltage above the supply monitor threshold (VVDDM).
4. Data Retention Information is published in the Quarterly Quality and Reliability Report.
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Rev. 1.2 | 15
EFM8BB2 Data Sheet
Electrical Characteristics
4.1.5 Power Management Timing
Table 4.5. Power Management Timing
Parameter
Idle Mode Wake-up Time
Suspend Mode Wake-up Time
Snooze Mode Wake-up Time
Symbol
Test Condition
tIDLEWK
tSUS-
SYSCLK = HFOSC0
PENDWK
CLKDIV = 0x00
tSLEEPWK
SYSCLK = HFOSC0
Min
Typ
Max
Units
2
—
3
SYSCLKs
—
170
—
ns
—
12
—
µs
Min
Typ
Max
Unit
CLKDIV = 0x00
4.1.6 Internal Oscillators
Table 4.6. Internal Oscillators
Parameter
Symbol
Test Condition
High Frequency Oscillator 0 (24.5 MHz)
Oscillator Frequency
fHFOSC0
Full Temperature and Supply
Range
24
24.5
25
MHz
Power Supply Sensitivity
PSSHFOS
TA = 25 °C
—
0.5
—
%/V
—
40
—
ppm/°C
48.25
49
49.75
MHz
—
0.02
—
%/V
TSHFOSC1 VDD = 3.0 V
—
45
—
ppm/°C
Oscillator Frequency
fLFOSC
75
80
85
kHz
Power Supply Sensitivity
PSSLFOSC TA = 25 °C
—
0.05
—
%/V
Temperature Sensitivity
TSLFOSC
—
65
—
ppm/°C
C0
Temperature Sensitivity
TSHFOSC0 VDD = 3.0 V
High Frequency Oscillator 1 (49 MHz)
Oscillator Frequency
fHFOSC1
Full Temperature and Supply
Range
Power Supply Sensitivity
PSSHFOS
TA = 25 °C
C1
Temperature Sensitivity
Low Frequency Oscillator (80 kHz)
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Full Temperature and Supply
Range
VDD = 3.0 V
Rev. 1.2 | 16
EFM8BB2 Data Sheet
Electrical Characteristics
4.1.7 External Clock Input
Table 4.7. External Clock Input
Parameter
External Input CMOS Clock
Symbol
Test Condition
Min
Typ
Max
Unit
fCMOS
0
—
50
MHz
tCMOSH
9
—
—
ns
9
—
—
ns
Frequency (at EXTCLK pin)
External Input CMOS Clock High
Time
External Input CMOS Clock Low
Time
tCMOSL
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EFM8BB2 Data Sheet
Electrical Characteristics
4.1.8 ADC
Table 4.8. ADC
Parameter
Resolution
Throughput Rate
Symbol
Nbits
fS
(High Speed Mode)
Throughput Rate
fS
(Low Power Mode)
Tracking Time
tTRK
Power-On Time
tPWR
SAR Clock Frequency
fSAR
Test Condition
Min
Typ
Max
Unit
12 Bit Mode
12
Bits
10 Bit Mode
10
Bits
12 Bit Mode
—
—
200
ksps
10 Bit Mode
—
—
800
ksps
12 Bit Mode
—
—
62.5
ksps
10 Bit Mode
—
—
250
ksps
High Speed Mode
230
—
—
ns
Low Power Mode
450
—
—
ns
1.2
—
—
μs
—
—
6.25
MHz
—
—
12.5
MHz
—
—
4
MHz
High Speed Mode,
Reference is 2.4 V internal
High Speed Mode,
Reference is not 2.4 V internal
Low Power Mode
Conversion Time
tCNV
10-Bit Conversion,
1.1
μs
SAR Clock = 12.25 MHz,
System Clock = 24.5 MHz.
Sample/Hold Capacitor
CSAR
Gain = 1
—
5
—
pF
Gain = 0.5
—
2.5
—
pF
Input Pin Capacitance
CIN
—
20
—
pF
Input Mux Impedance
RMUX
—
550
—
Ω
Voltage Reference Range
VREF
1
—
VDD
V
Input Voltage Range1
VIN
Gain = 1
0
—
VREF
V
Gain = 0.5
0
—
2xVREF
V
—
70
—
dB
12 Bit Mode
—
±1
±2.3
LSB
10 Bit Mode
—
±0.2
±0.6
LSB
12 Bit Mode
-1
±0.7
1.9
LSB
10 Bit Mode
—
±0.2
±0.6
LSB
12 Bit Mode, VREF = 1.65 V
-3
0
3
LSB
10 Bit Mode, VREF = 1.65 V
-2
0
2
LSB
—
0.004
—
LSB/°C
Power Supply Rejection Ratio
PSRRADC
DC Performance
Integral Nonlinearity
INL
Differential Nonlinearity (Guaranteed Monotonic)
DNL
Offset Error
EOFF
Offset Temperature Coefficient
TCOFF
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EFM8BB2 Data Sheet
Electrical Characteristics
Parameter
Slope Error
Symbol
EM
Test Condition
Min
Typ
Max
Unit
12 Bit Mode
—
±0.02
±0.1
%
10 Bit Mode
—
±0.06
±0.24
%
Dynamic Performance 10 kHz Sine Wave Input 1 dB below full scale, Max throughput, using AGND pin
Signal-to-Noise
Signal-to-Noise Plus Distortion
SNR
SNDR
Total Harmonic Distortion (Up to
5th Harmonic)
THD
Spurious-Free Dynamic Range
SFDR
12 Bit Mode
61
66
—
dB
10 Bit Mode
53
60
—
dB
12 Bit Mode
61
66
—
dB
10 Bit Mode
53
60
—
dB
12 Bit Mode
—
71
—
dB
10 Bit Mode
—
70
—
dB
12 Bit Mode
—
-79
—
dB
10 Bit Mode
—
-70
—
dB
Min
Typ
Max
Unit
1.65 V Setting
1.62
1.65
1.68
V
2.4 V Setting, VDD > 2.6 V
2.35
2.4
2.45
V
Note:
1. Absolute input pin voltage is limited by the VDD supply.
4.1.9 Voltage Reference
Table 4.9. Voltage Reference
Parameter
Symbol
Test Condition
Internal Fast Settling Reference
Output Voltage
VREFFS
(Full Temperature and Supply
Range)
Temperature Coefficient
TCREFFS
—
50
—
ppm/°C
Turn-on Time
tREFFS
—
—
1.5
μs
Power Supply Rejection
PSRRREF
—
400
—
ppm/V
—
8
—
μA
FS
External Reference
Input Current
IEXTREF
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Rev. 1.2 | 19
EFM8BB2 Data Sheet
Electrical Characteristics
4.1.10 Temperature Sensor
Table 4.10. Temperature Sensor
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Offset
VOFF
TA = 0 °C
—
757
—
mV
Offset Error1
EOFF
TA = 0 °C
—
17
—
mV
Slope
M
—
2.85
—
mV/°C
Slope Error1
EM
—
70
—
μV/°
Linearity
—
0.5
—
°C
Turn-on Time
—
1.8
—
μs
Min
Typ
Max
Unit
3.0
—
5.25
V
3.1
3.3
3.6
V
—
VREGIN –
VDROPOUT
—
V
Note:
1. Represents one standard deviation from the mean.
4.1.11 5 V Voltage Regulator
Table 4.11. 5V Voltage Regulator
Parameter
Symbol
Input Voltage Range1
VREGIN
Output Voltage on VDD2
VREGOUT
Test Condition
Output Current = 1 to 100 mA
Regulation range (VREGIN ≥ 4.1
V)
Output Current = 1 to 100 mA
Dropout range (VREGIN < 4.1 V)
Output Current2
IREGOUT
—
—
100
mA
Dropout Voltage
VDROPOUT Output Current = 100 mA
—
—
0.8
V
Note:
1. Input range to meet the Output Voltage on VDD specification. If the 5V voltage regulator is not used, VREGIN should be tied to
VDD.
2. Output current is total regulator output, including any current required by the device.
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EFM8BB2 Data Sheet
Electrical Characteristics
4.1.12 Comparators
Table 4.12. Comparators
Parameter
Test Condition
Min
Typ
Max
Unit
+100 mV Differential, VCM = 1.65 V
—
110
—
ns
-100 mV Differential, VCM = 1.65 V
—
160
—
ns
Response Time, CPMD = 11 (Low- tRESP3
est Power)
+100 mV Differential, VCM = 1.65 V
—
1.2
—
μs
-100 mV Differential, VCM = 1.65 V
—
4.5
—
μs
Positive Hysteresis
CPHYP = 00
—
0.4
—
mV
CPHYP = 01
—
8
—
mV
CPHYP = 10
—
16
—
mV
CPHYP = 11
—
32
—
mV
CPHYN = 00
—
-0.4
—
mV
CPHYN = 01
—
-8
—
mV
CPHYN = 10
—
-16
—
mV
CPHYN = 11
—
-32
—
mV
CPHYP = 00
—
1.5
—
mV
CPHYP = 01
—
4
—
mV
CPHYP = 10
—
8
—
mV
CPHYP = 11
—
16
—
mV
CPHYN = 00
—
-1.5
—
mV
CPHYN = 01
—
-4
—
mV
CPHYN = 10
—
-8
—
mV
CPHYN = 11
—
-16
—
mV
Response Time, CPMD = 00
(Highest Speed)
Symbol
tRESP0
HYSCP+
Mode 0 (CPMD = 00)
Negative Hysteresis
HYSCP-
Mode 0 (CPMD = 00)
Positive Hysteresis
HYSCP+
Mode 3 (CPMD = 11)
Negative Hysteresis
HYSCP-
Mode 3 (CPMD = 11)
Input Range (CP+ or CP-)
VIN
-0.25
—
VDD+0.25
V
Input Pin Capacitance
CCP
—
7.5
—
pF
Internal Reference DAC Resolution Nbits
6
bits
Common-Mode Rejection Ratio
CMRRCP
—
70
—
dB
Power Supply Rejection Ratio
PSRRCP
—
72
—
dB
Input Offset Voltage
VOFF
-10
0
10
mV
Input Offset Tempco
TCOFF
—
3.5
—
μV/°
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Rev. 1.2 | 21
EFM8BB2 Data Sheet
Electrical Characteristics
4.1.13 Port I/O
Table 4.13. Port I/O
Parameter
Output High Voltage (High Drive)
Output Low Voltage (High Drive)
Output High Voltage (Low Drive)
Output Low Voltage (Low Drive)
Symbol
VOH
VOL
VOH
VOL
Test Condition
Min
Typ
Max
Unit
IOH = -7 mA, VDD ≥ 3.0 V
VDD - 0.7
—
—
V
IOH = -3.3 mA, 2.2 V ≤ VDD < 3.0 V
VDD x 0.8
—
—
V
IOL = 13.5 mA, VDD ≥ 3.0 V
—
—
0.6
V
IOL = 7 mA, 2.2 V ≤ VDD < 3.0 V
—
—
VDD x 0.2
V
IOH = -4.75 mA, VDD ≥ 3.0 V
VDD - 0.7
—
—
V
IOH = -2.25 mA, 2.2 V ≤ VDD < 3.0
V
VDD x 0.8
—
—
V
IOL = 6.5 mA, VDD ≥ 3.0 V
—
—
0.6
V
IOL = 3.5 mA, 2.2 V ≤ VDD < 3.0 V
—
—
VDD x 0.2
V
Input High Voltage
VIH
VDD - 0.6
—
—
V
Input Low Voltage
VIL
—
—
0.6
V
Pin Capacitance
CIO
—
7
—
pF
Weak Pull-Up Current
IPU
VDD = 3.6
-30
-20
-10
μA
Input Leakage (Pullups off or Analog)
ILK
GND < VIN < VDD
-1.1
—
1.1
μA
Input Leakage Current with VIN
above VDD
ILK
VDD < VIN < VDD+2.0 V
0
5
150
μA
Min
Typ
Max
Unit
QFN-20 Packages
─
60
─
°C/W
QFN-28 Packages
─
26
─
°C/W
QSOP-24 Packages
─
65
─
°C/W
(VIN = 0 V)
4.2 Thermal Conditions
Table 4.14. Thermal Conditions
Parameter
Thermal Resistance
Symbol
θJA
Test Condition
Note:
1. Thermal resistance assumes a multi-layer PCB with any exposed pad soldered to a PCB pad.
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EFM8BB2 Data Sheet
Electrical Characteristics
4.3 Absolute Maximum Ratings
Stresses above those listed in Table 4.15 Absolute Maximum Ratings on page 23 may cause permanent damage to the device. This
is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation
listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For
more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/
support/quality/pages/default.aspx.
Table 4.15. Absolute Maximum Ratings
Parameter
Symbol
Test Condition
Min
Max
Unit
Ambient Temperature Under Bias
TBIAS
-55
125
°C
Storage Temperature
TSTG
-65
150
°C
Voltage on VDD
VDD
GND-0.3
4.2
V
Voltage on VREGIN
VREGIN
GND-0.3
5.8
V
Voltage on I/O pins or RSTb
VIN
VDD > 3.3 V
GND-0.3
5.8
V
VDD < 3.3 V
GND-0.3
VDD+2.5
V
Total Current Sunk into Supply Pin
IVDD
─
200
mA
Total Current Sourced out of Ground
Pin
IGND
200
─
mA
Current Sourced or Sunk by any I/O
Pin or RSTb
IIO
-100
100
mA
Operating Junction Temperature
TJ
TA = -40 °C to 85 °C
–40
105
°C
TA = -40 °C to 125 °C (I-grade parts
only)
-40
130
°C
Note:
1. Exposure to maximum rating conditions for extended periods may affect device reliability.
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Rev. 1.2 | 23
EFM8BB2 Data Sheet
Electrical Characteristics
4.4 Typical Performance Curves
Figure 4.1. Typical Operating Supply Current using HFOSC0
Figure 4.2. Typical Operating Supply Current using HFOSC1
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EFM8BB2 Data Sheet
Electrical Characteristics
Figure 4.3. Typical Operating Supply Current using LFOSC
Figure 4.4. Typical ADC0 and Internal Reference Supply Current in Burst Mode
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EFM8BB2 Data Sheet
Electrical Characteristics
Figure 4.5. Typical ADC0 Supply Current in Normal (always-on) Mode
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EFM8BB2 Data Sheet
Electrical Characteristics
Figure 4.6. Typical VOH Curves
Figure 4.7. Typical VOL Curves
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EFM8BB2 Data Sheet
Typical Connection Diagrams
5. Typical Connection Diagrams
5.1 Power
Figure 5.1 Connection Diagram with Voltage Regulator Used on page 28 shows a typical connection diagram for the power pins of
the EFM8BB2 devices when the 5 V-to-3.3 V regulator is in use.
EFM8BB2 Device
2.7-5.25 V (in)
3.3 V (out)
Voltage
Regulator
VREGIN
4.7 µF and 0.1 µF bypass
capacitors required for
each power pin placed as
close to the pins as
possible.
VDD
GND
Figure 5.1. Connection Diagram with Voltage Regulator Used
Figure 5.2 Connection Diagram with Voltage Regulator Not Used on page 28 shows a typical connection diagram for the power pins
of the EFM8BB2 devices when the internal 5 V-to-3.3 V regulator is not used.
EFM8BB2 Device
2.2-3.6 V (in)
VREGIN
4.7 µF and 0.1 µF bypass
capacitors required for
each power pin placed as
close to the pins as
possible.
Voltage
Regulator
VDD
GND
Figure 5.2. Connection Diagram with Voltage Regulator Not Used
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EFM8BB2 Data Sheet
Typical Connection Diagrams
5.2 Debug
The diagram below shows a typical connection diagram for the debug connections pins. The pin sharing resistors are only required if
the functionality on the C2D (a GPIO pin) and the C2CK (RSTb) is routed to external circuitry. For example, if the RSTb pin is connected to an external switch with debouncing filter or if the GPIO sharing with the C2D pin is connected to an external circuit, the pin sharing resistors and connections to the debug adapter must be placed on the hardware. Otherwise, these components and connections
can be omitted.
For more information on debug connections, see the example schematics and information available in AN127: "Pin Sharing Techniques
for the C2 Interface." Application notes can be found on the Silicon Labs website (http://www.silabs.com/8bit-appnotes) or in Simplicity
Studio.
VDD
EFM8BB2 Device
C2CK
1k
1k
External
System
1k
(if pin sharing)
C2D
(if pin sharing)
1k
1k
GND
Debug Adapter
Figure 5.3. Debug Connection Diagram
5.3 Other Connections
Other components or connections may be required to meet the system-level requirements. Application note, "AN203: 8-bit MCU Printed
Circuit Board Design Notes", contains detailed information on these connections. Application Notes can be accessed on the Silicon
Labs website (www.silabs.com/8bit-appnotes).
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EFM8BB2 Data Sheet
Pin Definitions
6. Pin Definitions
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P1.0
28
27
26
25
24
23
22
6.1 EFM8BB2x-QFN28 Pin Definitions
P0.1
1
21
P1.1
P0.0
2
20
P1.2
GND
3
19
P1.3
N/C
4
18
P1.4
N/C
5
17
P1.5
VDD
6
16
P1.6
VREGIN
7
15
P1.7
28 pin QFN
(Top View)
9
10
11
12
13
14
RSTb / C2CK
P3.0 / C2D
P2.3
P2.2
P2.1
P2.0
P3.1
8
GND
Figure 6.1. EFM8BB2x-QFN28 Pinout
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EFM8BB2 Data Sheet
Pin Definitions
Table 6.1. Pin Definitions for EFM8BB2x-QFN28
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P0.1
Multifunction I/O
Yes
P0MAT.1
ADC0.1
INT0.1
CMP0P.1
INT1.1
CMP0N.1
Number
1
AGND
2
P0.0
Multifunction I/O
Yes
P0MAT.0
ADC0.0
INT0.0
CMP0P.0
INT1.0
CMP0N.0
VREF
3
GND
Ground
4
N/C
No Connection
5
N/C
No Connection
6
VDD
Supply Power Input /
5V Regulator Output
7
VREGIN
5V Regulator Input
8
P3.1
Multifunction I/O
9
RST /
Active-low Reset /
C2CK
C2 Debug Clock
P3.0 /
Multifunction I/O /
C2D
C2 Debug Data
P2.3
Multifunction I/O
10
11
Yes
P2MAT.3
ADC0.23
CP1P.12
CP1N.12
12
P2.2
Multifunction I/O
Yes
P2MAT.2
ADC0.22
CP1P.11
CP1N.11
13
P2.1
Multifunction I/O
Yes
P2MAT.1
ADC0.21
CP1P.10
CP1N.10
14
P2.0
Multifunction I/O
Yes
P2MAT.0
ADC0.20
CP1P.9
CP1N.9
15
P1.7
Multifunction I/O
Yes
P1MAT.7
ADC0.15
CP1P.7
CP1N.7
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EFM8BB2 Data Sheet
Pin Definitions
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P1.6
Multifunction I/O
Yes
P1MAT.6
ADC0.14
I2C0_SCL
CP1P.6
Number
16
CP1N.6
17
P1.5
Multifunction I/O
Yes
P1MAT.5
ADC0.13
I2C0_SDA
CP1P.5
CP1N.5
18
P1.4
Multifunction I/O
Yes
P1MAT.4
ADC0.12
CP1P.4
CP1N.4
19
P1.3
Multifunction I/O
Yes
P1MAT.3
ADC0.11
CP1P.3
CP1N.3
20
P1.2
Multifunction I/O
Yes
P1MAT.2
ADC0.10
CP1P.2
CP1N.2
21
P1.1
Multifunction I/O
Yes
P1MAT.1
ADC0.9
CP1P.1
CP1N.1
CMP0P.10
CMP0N.10
22
P1.0
Multifunction I/O
Yes
P1MAT.0
ADC0.8
CP1P.0
CP1N.0
CMP0P.9
CMP0N.9
23
24
P0.7
P0.6
Multifunction I/O
Multifunction I/O
Yes
Yes
P0MAT.7
ADC0.7
INT0.7
CMP0P.7
INT1.7
CMP0N.7
P0MAT.6
ADC0.6
CNVSTR
CMP0P.6
INT0.6
CMP0N.6
INT1.6
25
P0.5
Multifunction I/O
Yes
P0MAT.5
ADC0.5
INT0.5
CMP0P.5
INT1.5
CMP0N.5
UART0_RX
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EFM8BB2 Data Sheet
Pin Definitions
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P0.4
Multifunction I/O
Yes
P0MAT.4
ADC0.4
INT0.4
CMP0P.4
INT1.4
CMP0N.4
Number
26
UART0_TX
27
P0.3
Multifunction I/O
Yes
P0MAT.3
ADC0.3
EXTCLK
CMP0P.3
INT0.3
CMP0N.3
INT1.3
28
Center
P0.2
GND
Multifunction I/O
Yes
P0MAT.2
ADC0.2
INT0.2
CMP0P.2
INT1.2
CMP0N.2
Ground
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EFM8BB2 Data Sheet
Pin Definitions
6.2 EFM8BB2x-QSOP24 Pin Definitions
P0.3
1
24
P0.4
P0.2
2
23
P0.5
P0.1
3
22
P0.6
P0.0
4
21
P0.7
GND
5
20
P1.0
VDD
6
19
P1.1
RSTb / C2CK
7
18
P1.2
P3.0 / C2D
8
17
P1.3
P2.3
9
16
P1.4
P2.2
10
15
P1.5
P2.1
11
14
P1.6
P2.0
12
13
P1.7
24 pin QSOP
(Top View)
Figure 6.2. EFM8BB2x-QSOP24 Pinout
Table 6.2. Pin Definitions for EFM8BB2x-QSOP24
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P0.3
Multifunction I/O
Yes
P0MAT.3
ADC0.3
EXTCLK
CMP0P.3
INT0.3
CMP0N.3
Number
1
INT1.3
2
P0.2
Multifunction I/O
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Yes
P0MAT.2
ADC0.2
INT0.2
CMP0P.2
INT1.2
CMP0N.2
Rev. 1.2 | 34
EFM8BB2 Data Sheet
Pin Definitions
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P0.1
Multifunction I/O
Yes
P0MAT.1
ADC0.1
INT0.1
CMP0P.1
INT1.1
CMP0N.1
Number
3
AGND
4
P0.0
Multifunction I/O
Yes
P0MAT.0
ADC0.0
INT0.0
CMP0P.0
INT1.0
CMP0N.0
VREF
5
GND
Ground
6
VDD
Supply Power Input
7
RSTb /
Active-low Reset /
C2CK
C2 Debug Clock
P3.0 /
Multifunction I/O /
C2D
C2 Debug Data
P2.3
Multifunction I/O
8
9
Yes
P2MAT.3
ADC0.23
CMP1P.12
CMP1N.12
10
P2.2
Multifunction I/O
Yes
P2MAT.2
ADC0.22
CMP1P.11
CMP1N.11
11
P2.1
Multifunction I/O
Yes
P2MAT.1
ADC0.21
CMP1P.10
CMP1N.10
12
P2.0
Multifunction I/O
Yes
P2MAT.0
ADC0.20
CMP1P.9
CMP1N.9
13
P1.7
Multifunction I/O
Yes
P1MAT.7
ADC0.15
CMP1P.7
CMP1N.7
14
P1.6
Multifunction I/O
Yes
P1MAT.6
ADC0.14
I2C0_SCL
CMP1P.6
CMP1N.6
15
P1.5
Multifunction I/O
Yes
P1MAT.5
ADC0.13
I2C0_SDA
CMP1P.5
CMP1N.5
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EFM8BB2 Data Sheet
Pin Definitions
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P1.4
Multifunction I/O
Yes
P1MAT.4
ADC0.12
Number
16
CMP1P.4
CMP1N.4
17
P1.3
Multifunction I/O
Yes
P1MAT.3
ADC0.11
CMP1P.3
CMP1N.3
18
P1.2
Multifunction I/O
Yes
P1MAT.2
ADC0.10
CMP1P.2
CMP1N.2
19
P1.1
Multifunction I/O
Yes
P1MAT.1
ADC0.9
CMP1P.1
CMP1N.1
CMP0P.10
CMP0N.10
20
P1.0
Multifunction I/O
Yes
P1MAT.0
ADC0.8
CMP1P.0
CMP1N.0
CMP0P.9
CMP0N.9
21
22
P0.7
P0.6
Multifunction I/O
Multifunction I/O
Yes
Yes
P0MAT.7
ADC0.7
INT0.7
CMP0P.7
INT1.7
CMP0N.7
P0MAT.6
ADC0.6
CNVSTR
CMP0P.6
INT0.6
CMP0N.6
INT1.6
23
P0.5
Multifunction I/O
Yes
P0MAT.5
ADC0.5
INT0.5
CMP0P.5
INT1.5
CMP0N.5
UART0_RX
24
P0.4
Multifunction I/O
Yes
P0MAT.4
ADC0.4
INT0.4
CMP0P.4
INT1.4
CMP0N.4
UART0_TX
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EFM8BB2 Data Sheet
Pin Definitions
RSTb / C2CK
5
P0.3
P0.4
P0.5
19
18
17
GND
6
P1.6
P2.0 / C2D
(Top View)
10
4
P1.3
VDD
16
20 pin QFN
9
3
P1.4
GND
8
2
P1.5
P0.0
P0.2
1
7
P0.1
20
6.3 EFM8BB2x-QFN20 Pin Definitions
P0.6
15
P0.7
14
P1.0
13
P1.1
12
GND
11
P1.2
Figure 6.3. EFM8BB2x-QFN20 Pinout
Table 6.3. Pin Definitions for EFM8BB2x-QFN20
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P0.1
Multifunction I/O
Yes
P0MAT.1
ADC0.1
INT0.1
CMP0P.1
INT1.1
CMP0N.1
Number
1
AGND
2
P0.0
Multifunction I/O
Yes
P0MAT.0
ADC0.0
INT0.0
CMP0P.0
INT1.0
CMP0N.0
VREF
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EFM8BB2 Data Sheet
Pin Definitions
Pin
Pin Name
Description
3
GND
Ground
4
VDD
Supply Power Input
5
RSTb /
Active-low Reset /
C2CK
C2 Debug Clock
P2.0 /
Multifunction I/O /
C2D
C2 Debug Data
P1.6
Multifunction I/O
Crossbar Capability
Number
6
7
Additional Digital
Functions
Analog Functions
P1MAT.6
ADC0.14
Yes
Yes
CMP1P.6
CMP1N.6
8
P1.5
Multifunction I/O
Yes
P1MAT.5
ADC0.13
CMP1P.5
CMP1N.5
9
P1.4
Multifunction I/O
Yes
P1MAT.4
ADC0.12
CMP1P.4
CMP1N.4
10
P1.3
Multifunction I/O
Yes
P1MAT.3
ADC0.11
I2C0_SCL
CMP1P.3
CMP1N.3
11
P1.2
Multifunction I/O
Yes
P1MAT.2
ADC0.10
I2C0_SDA
CMP1P.2
CMP1N.2
12
GND
Ground
13
P1.1
Multifunction I/O
Yes
P1MAT.1
ADC0.9
CMP1P.1
CMP1N.1
CMP0P.10
CMP0N.10
14
P1.0
Multifunction I/O
Yes
P1MAT.0
ADC0.8
CMP1P.0
CMP1N.0
CMP0P.9
CMP0N.9
15
P0.7
Multifunction I/O
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Yes
P0MAT.7
ADC0.7
INT0.7
CMP0P.7
INT1.7
CMP0N.7
Rev. 1.2 | 38
EFM8BB2 Data Sheet
Pin Definitions
Pin
Pin Name
Description
Crossbar Capability
Additional Digital
Functions
Analog Functions
P0.6
Multifunction I/O
Yes
P0MAT.6
ADC0.6
CNVSTR
CMP0P.6
INT0.6
CMP0N.6
Number
16
INT1.6
17
P0.5
Multifunction I/O
Yes
P0MAT.5
ADC0.5
INT0.5
CMP0P.5
INT1.5
CMP0N.5
UART0_RX
18
P0.4
Multifunction I/O
Yes
P0MAT.4
ADC0.4
INT0.4
CMP0P.4
INT1.4
CMP0N.4
UART0_TX
19
P0.3
Multifunction I/O
Yes
P0MAT.3
ADC0.3
EXTCLK
CMP0P.3
INT0.3
CMP0N.3
INT1.3
20
Center
P0.2
GND
Multifunction I/O
Yes
P0MAT.2
ADC0.2
INT0.2
CMP0P.2
INT1.2
CMP0N.2
Ground
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EFM8BB2 Data Sheet
QFN28 Package Specifications
7. QFN28 Package Specifications
7.1 QFN28 Package Dimensions
Figure 7.1. QFN28 Package Drawing
Table 7.1. QFN28 Package Dimensions
Dimension
Min
Typ
Max
A
0.70
0.75
0.80
A1
0.00
—
0.05
A3
0.20 REF
b
0.20
0.25
0.30
D
4.90
5.00
5.10
D2
3.15
3.25
3.35
e
0.50 BSC
E
4.90
5.00
5.10
E2
3.15
3.25
3.35
L
0.45
0.55
0.65
aaa
0.15
bbb
0.10
ddd
0.05
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EFM8BB2 Data Sheet
QFN28 Package Specifications
Dimension
eee
Min
Typ
Max
0.08
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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EFM8BB2 Data Sheet
QFN28 Package Specifications
7.2 QFN28 PCB Land Pattern
X1
C2
Y2
Y1
C0.35
E
X2
C1
Figure 7.2. QFN28 PCB Land Pattern Drawing
Table 7.2. QFN28 PCB Land Pattern Dimensions
Dimension
Min
Max
C1
4.80
C2
4.80
E
0.50
X1
0.30
X2
3.35
Y1
0.95
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EFM8BB2 Data Sheet
QFN28 Package Specifications
Dimension
Min
Y2
Max
3.35
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2 x 2 array of 1.2 mm square openings on a 1.5 mm pitch should be used for the center pad.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
7.3 QFN28 Package Marking
EFM8
PPPPPPPP
TTTTTT
YYWW #
Figure 7.3. QFN28 Package Marking
The package marking consists of:
• PPPPPPPP – The part number designation.
• TTTTTT – A trace or manufacturing code.
• YY – The last 2 digits of the assembly year.
• WW – The 2-digit workweek when the device was assembled.
• # – The device revision (A, B, etc.).
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EFM8BB2 Data Sheet
QSOP24 Package Specifications
8. QSOP24 Package Specifications
8.1 QSOP24 Package Dimensions
Figure 8.1. QSOP24 Package Drawing
Table 8.1. QSOP24 Package Dimensions
Dimension
Min
Typ
Max
A
—
—
1.75
A1
0.10
—
0.25
b
0.20
—
0.30
c
0.10
—
0.25
D
8.65 BSC
E
6.00 BSC
E1
3.90 BSC
e
0.635 BSC
L
theta
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0.40
—
1.27
0º
—
8º
Rev. 1.2 | 44
EFM8BB2 Data Sheet
QSOP24 Package Specifications
Dimension
Min
Typ
aaa
0.20
bbb
0.18
ccc
0.10
ddd
0.10
Max
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC outline MO-137, variation AE.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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EFM8BB2 Data Sheet
QSOP24 Package Specifications
8.2 QSOP24 PCB Land Pattern
Figure 8.2. QSOP24 PCB Land Pattern Drawing
Table 8.2. QSOP24 PCB Land Pattern Dimensions
Dimension
Min
Max
C
5.20
5.30
E
0.635 BSC
X
0.30
0.40
Y
1.50
1.60
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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EFM8BB2 Data Sheet
QSOP24 Package Specifications
8.3 QSOP24 Package Marking
EFM8
PPPPPPPP #
TTTTTTYYWW
Figure 8.3. QSOP24 Package Marking
The package marking consists of:
• PPPPPPPP – The part number designation.
• TTTTTT – A trace or manufacturing code.
• YY – The last 2 digits of the assembly year.
• WW – The 2-digit workweek when the device was assembled.
• # – The device revision (A, B, etc.).
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EFM8BB2 Data Sheet
QFN20 Package Specifications
9. QFN20 Package Specifications
9.1 QFN20 Package Dimensions
Figure 9.1. QFN20 Package Drawing
Table 9.1. QFN20 Package Dimensions
Dimension
Min
Typ
Max
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A3
0.20 REF
b
0.18
0.25
0.30
c
0.25
0.30
0.35
D
D2
e
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3.00 BSC
1.6
1.70
1.80
0.50 BSC
Rev. 1.2 | 48
EFM8BB2 Data Sheet
QFN20 Package Specifications
Dimension
Min
E
E2
1.60
1.70
1.80
2.50 BSC
0.30
K
R
Max
3.00 BSC
f
L
Typ
0.40
0.50
0.25 REF
0.09
0.125
aaa
0.15
bbb
0.10
ccc
0.10
ddd
0.05
eee
0.08
fff
0.10
0.15
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. The drawing complies with JEDEC MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Rev. 1.2 | 49
EFM8BB2 Data Sheet
QFN20 Package Specifications
9.2 QFN20 PCB Land Pattern
Figure 9.2. QFN20 PCB Land Pattern Drawing
Table 9.2. QFN20 PCB Land Pattern Dimensions
Dimension
Min
Max
C1
3.10
C2
3.10
C3
2.50
C4
2.50
E
0.50
X1
0.30
X2
0.25
0.35
X3
1.80
Y1
0.90
Y2
Y3
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0.25
0.35
1.80
Rev. 1.2 | 50
EFM8BB2 Data Sheet
QFN20 Package Specifications
Dimension
Min
Max
Note:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
8. A 2 x 2 array of 0.75 mm openings on a 0.95 mm pitch should be used for the center pad to assure proper paste volume.
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
9.3 QFN20 Package Marking
PPPP
PPPP
TTTTTT
YYWW #
Figure 9.3. QFN20 Package Marking
The package marking consists of:
• PPPPPPPP – The part number designation.
• TTTTTT – A trace or manufacturing code.
• YY – The last 2 digits of the assembly year.
• WW – The 2-digit workweek when the device was assembled.
• # – The device revision (A, B, etc.).
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Rev. 1.2 | 51
EFM8BB2 Data Sheet
Revision History
10. Revision History
10.1 Revision 1.2
February 10, 2016
Updated Figure 5.3 Debug Connection Diagram on page 29 to move the pull-up resistor on C2D / RSTb to after the series resistor
instead of before.
Added a reference to AN945: EFM8 Factory Bootloader User Guide in 3.10 Bootloader.
Added I-grade parts.
Adjusted and added maximum specifications in 4.1.2 Power Consumption for G-grade devices and added a note on which high frequency oscillator is used for the specification.
Adjusted the Total Current Sunk into Supply Pin and Total Current Sourced out of Ground Pin specifications in 4.3 Absolute Maximum
Ratings.
10.2 Revision 1.1
December 16, 2015
Updated 3.2 Power to properly reflect that a comparator falling edge wakes the device from Suspend and Snooze.
Added Note 2 to Table 4.1 Recommended Operating Conditions on page 11.
Added 5.2 Debug.
10.3 Revision 1.0
Updated any TBD numbers in and adjusted various specifications.
Updated VOH and VOL graphs in Figure 4.6 Typical VOH Curves on page 27 and Figure 4.7 Typical VOL Curves on page 27 and updated the VOH and VOL specifications in Table 4.13 Port I/O on page 22.
Added more information to 3.10 Bootloader.
Updated part numbers to Revision C.
10.4 Revision 0.3
Updated QFN20 packaging and landing diagram dimensions.
Updated QFN28 D and E minimum value.
Updated some characterization TBD values.
Updated the 5 V-to-3.3 V regulator Electrical Characteristics table.
Added Stop mode to the Power Modes table in 3.2 Power.
10.5 Revision 0.2
Initial release.
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Rev. 1.2 | 52
Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 Introduction.
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. 3
3.2 Power
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3.3 I/O.
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. 4
3.4 Clocking .
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. 5
3.5 Counters/Timers and PWM .
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. 5
3.6 Communications and Other Digital Peripherals .
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. 6
3.7 Analog .
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3.8 Reset Sources
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. 9
3.9 Debugging .
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. 9
3.10 Bootloader
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.10
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
11
4.1 Electrical Characteristics . . . . .
4.1.1 Recommended Operating Conditions
4.1.2 Power Consumption . . . . . .
4.1.3 Reset and Supply Monitor . . . .
4.1.4 Flash Memory . . . . . . . .
4.1.5 Power Management Timing . . .
4.1.6 Internal Oscillators. . . . . . .
4.1.7 External Clock Input . . . . . .
4.1.8 ADC . . . . . . . . . . .
4.1.9 Voltage Reference. . . . . . .
4.1.10 Temperature Sensor . . . . .
4.1.11 5 V Voltage Regulator . . . . .
4.1.12 Comparators . . . . . . . .
4.1.13 Port I/O . . . . . . . . . .
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.11
.11
.12
.15
.15
.16
.16
.17
.18
.19
.20
.20
.21
.22
4.2 Thermal Conditions .
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.22
4.3 Absolute Maximum Ratings .
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.23
4.4 Typical Performance Curves .
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.24
5. Typical Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . .
28
5.1 Power
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.28
5.2 Debug
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.29
5.3 Other Connections .
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.29
6. Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30
6.1 EFM8BB2x-QFN28 Pin Definitions .
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.30
6.2 EFM8BB2x-QSOP24 Pin Definitions .
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.34
Table of Contents
53
6.3 EFM8BB2x-QFN20 Pin Definitions .
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.37
7. QFN28 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . .
40
7.1 QFN28 Package Dimensions
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.40
7.2 QFN28 PCB Land Pattern
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.42
7.3 QFN28 Package Marking .
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.43
8. QSOP24 Package Specifications . . . . . . . . . . . . . . . . . . . . . . .
44
8.1 QSOP24 Package Dimensions .
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.44
8.2 QSOP24 PCB Land Pattern .
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.46
8.3 QSOP24 Package Marking .
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.47
9. QFN20 Package Specifications. . . . . . . . . . . . . . . . . . . . . . . .
48
9.1 QFN20 Package Dimensions
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.48
9.2 QFN20 PCB Land Pattern
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.50
9.3 QFN20 Package Marking .
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.51
10. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
52
10.1 Revision 1.2 .
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.52
10.2 Revision 1.1 .
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.52
10.3 Revision 1.0 .
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.52
10.4 Revision 0.3 .
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.52
10.5 Revision 0.2 .
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.52
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
53
Table of Contents
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