TPS658642 www.ti.com SLVSB94 – MAY 2012 Advanced Power Management Unit Check for Samples: TPS658642 1 INTRODUCTION 1.1 MAIN FEATURES 1 • INTEGRATED POWER SUPPLIES – 3 Programmable Step-Down converters • Software Controlled Enable/Forced PWM Mode • Automatic Power Saving Mode • Maximum 1.5A Outputs (SM0 and SM2) • Maximum 2.A Output (SM1) – 11 Programmable General Purpose LDOs • 7 With Output Voltages of 1.20V to 3.3V • 2 With Output Voltages of 0.80V to 1.5V • 1 “Always On” With Output Voltages of 2.5V to 3.3V • 1 With Output Voltage of 1.7V–2.50V • DISPLAY SUPPORT FUNCTIONS – 3 PWM Outputs With Programmable Frequency and Duty Cycle – Dual RGB LED Drivers • HOST INTERFACE – I2C Bus – Interrupt Controller With Maskable Interrupts – GPIO Control (4) • SYSTEM MANAGEMENT – Power Good Monitoring on all Supply Outputs – Software Reset Function – Hardware On/Off and Reboot Control – Real Time Counter – 11 Channel ADC With 3 Operating Modes 1.3 • • • 1.2 • • • • • Single Conversion Peak Detection Averaging APPLICATIONS Tablet PCs Netbooks SmartPhones Portable Navigation Devices Portable Media Players DESCRIPTION The TPS658642 provides an easy to use, fully integrated solution for handheld devices, integrating multiple regulated power supplies, system management and display functions in a small package. The I2C interface enables control of a wide range of subsystem parameters. Internal registers have a complete set of status information, enabling easy diagnostics and host-controlled handling of fault conditions. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated To request a full data sheet, please send an email to: [email protected]. PACKAGE OPTION ADDENDUM www.ti.com 30-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS658642ZQZR ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TPS658642ZQZT ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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