AP65454

AP65454
4A, 18V, 650kHz ADAPTIVE COT STEP-DOWN CONVERTER
Description
Pin Assignments
The AP65454 is an adaptive constant on-time mode synchronous
buck converter providing high efficiency, excellent transient response
and high DC output accuracy for low-voltage regulation in digital TVs
and monitors.
( Top View )
The constant-on-time control scheme handles wide input/output
voltage ratios and provides low external component count. The
internal proprietary circuit enables the device to adopt both low
equivalent series resistance (ESR) output capacitors, such as
SP-CAP or POSCAP as well as ultra-low ESR ceramic capacitors.
EN
1
8
VIN
FB
2
7
BS
VREG5
3
6
SW
SS
4
5
GND
SO-8EP
The AP65454 also features programmable soft-start, UVLO, OTP and
OCP to protect the circuit. This IC is available in SO-8EP package.
AP65454 operates in continuous conduction mode (CCM) in light-load
conditions for better EMI performance. AP65453 and AP65455 are
the options for light-load efficiency enhancement.
Features
Applications

Fixed Frequency Emulated Constant On-Time Control

Good Stability Independent of the Output Capacitor ESR

Fast Load Transient Response

Synchronous Rectification: 90mΩ Internal High-Side Switch and
57mΩ Internal Low-Side Switch

Wide Input Voltage Range: 4.5V to 18V

Output Voltage Range: 0.76V to 6V

4A Continuous Output Current










650kHz Switching Frequency

Built-in Overcurrent Limit

Built-in Thermal Shutdown Protection

Programmable Soft-Start

Pre-Biased Start-Up

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
Gaming Consoles
Flat Screen TV Sets and Monitors
Set-Top Boxes
Distributed Power Systems
Home Audio
Consumer Electronics
Network Systems
FPGA, DSP and ASIC Supplies
Green Electronics
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP65454
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AP65454
Typical Applications Circuit
INPUT
VIN
12V
7
BST
8
IN
ON
OFF
1
EN
6
SW
L1
C5
0.1µF 1.5μH
AP65454
R1
8.25kΩ
R2
22.1kΩ
2
FB
C1
20μF
4
SS
C4
8.2nF
5
GND
3
VREG5
OUTPUT
VOUT
1.05V
C2
44μF
C3
1µF
Figure 1. Typical Application Circuit
Pin Descriptions
Pin
Name
Pin Number
Function
EN
1
Enable input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the regulator, drive it low
to turn off. It can be safely connected to VIN directly for automatic startup.
FB
2
Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistive voltage divider connected
to it from the output voltage.
VREG5
3
Internal power supply output pin to connect an additional capacitor. Connect a 1μF (typical) capacitor as close as
possible to the VREG5 and GND. This pin is not active when EN is low.
SS
4
Soft-start control input pin. SS controls the soft start period. Connect a capacitor from SS to GND to set the soft-start
period.
GND
5
Ground pin is the main power ground for the switching circuit.
SW
6
Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC filter
from SW to the output load. Note that a capacitor is required from SW to BS to power the high-side switch.
BS
7
Bootstrap pin. A bootstrap capacitor is connected between the BS pin and SW pin. The voltage across the bootstrap
capacitor drives the internal high-side NMOS switch. A 0.1μF (typical) capacitor is required for proper operation
VIN
8
Supply input pin. A capacitor should be connected between the VIN pin and GND pin to keep the DC input voltage
constant.
EP
9
Connect the exposed thermal pad to GND on the PCB.
SO-8EP
AP65454
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AP65454
Functional Block Diagram
Figure 2. Functional Block Diagram
Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Supply Voltage
Unit
V
VREG5
VREG5 Pin Voltage
-0.3V to +6.0
V
VSW
Switch Node Voltage
-1.0 to VIN +0.3
V
VBS
Bootstrap Voltage
-0.3 to VSW +6.0
V
VFB
Feedback Voltage
-0.3V to +6.0
V
VEN
Enable/UVLO Voltage
-0.3V to VIN
V
VSS
Soft-Start PIN
-0.3V to +6.0
V
GND Pin Voltage
-0.3 to 0.3
V
TST
Storage Temperature
-65 to +150
°C
TJ
Junction Temperature
+160
°C
Lead Temperature
+260
°C
2
200
kV
V
VGND
TL
ESD Susceptibility (Note 5)
HBM
Human Body Model
MM
Machine Model
Notes:
Rating
-0.3 to 20
4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices
AP65454
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AP65454
Thermal Resistance (Note 6)
Symbol
Note:
Parameter
Rating
Unit
JA
Junction to Ambient
SO-8EP
38.56
°C/W
JC
Junction to Case
SO-8EP
6.85
°C/W
6. Test condition: SO-8: Device mounted on 2" x 2" FR-4 substrate PCB, 2oz. copper, with minimum recommended pad layout.
Recommended Operating Conditions (Note 7) (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Unit
VIN
Supply Voltage
4.5
18.0
V
TJ
Operating Junction Temperature Range
-40
+125
°C
TA
Operating Ambient Temperature Range
-40
+85
°C
Note:
7. The device function is not guaranteed outside of the recommended operating conditions.
Electrical Characteristics
Parameter
SUPPLY VOLTAGE (VIN PIN)
Input Voltage
Quiescent Current
Shutdown Supply Current
UNDERVOLTAGE LOCKOUT
(@TA = +25°C, VIN = 12V, unless otherwise specified.)
Symbol
Conditions
Min
Typ
Max
Unit
VIN
IQ
VFB=0.85V
VEN=0V
4.5
-
0.6
1
18
0.75
10
V
mA
μA
3.6
3.85
4.1
V
0.16
0.35
0.47
V
ISHDN
UVLO Threshold
VUVLO
UVLO Hysteresis
VHYS
VIN Rising Test VREG5
Voltage
VIN Falling Test VREG5
Voltage
ENABLE (EN PIN)
EN High-Level Input Voltage
EN Low-Level Input Voltage
VOLTAGE REFERENCE (FB PIN)
Feedback Voltage
Feedback Bias Current
VREG5 OUTPUT
VREG5 Output Voltage
Source Current Capability
Load Regulation
Line Regulation
MOSFET
High-Side Switch On-Resistance
VVREG5
-
6.0V<VIN<18V 0<IVREG5<5mA
VIN=6V, VVREG5=4V
0<IVREG5<5mA
RDSONH
Low-Side Switch On-Resistance
RDSONL
CURRENT LIMIT
High-Level Current Limit
ON-TIME TIMER
On Time
Minimum Off Time
THERMAL SHUTDOWN
Thermal Shutdown
Thermal Shutdown Hysteresis
SOFT START (SS PIN)
Soft-Start Source Current
Soft-Start Discharge Current
OVERVOLTAGE PROTECTION
OVP Trip Threshold
AP65454
Document number: DS38483 Rev. 1 - 2
VENH
VENL
-
1.25
-
-
18
0.85
V
V
VFB
IFB
VOUT=1.05V
VFB=0.8V
0.753
-0.1
0.765
0
0.777
0.1
V
μA
4.8
-
5.1
100
-
5.4
100
20
V
mA
mV
mV
-
-
0.090
-
Ω
-
-
0.057
-
Ω
4.6
5.6
6.9
A
ILIM-H
6.0V<VIN<18V IVREG5=5mA
L=1.5μH
tON
tOFF-MIN
VIN=12V, VOUT=1.05V
VFB=0.7V
-
150
260
310
ns
ns
TOTSD
THYS
-
-
+150
+25
-
°C
°C
VSS=1.0V
VSS=0.5V
4.2
0.1
6.0
0.2
7.8
-
μA
mA
—
115
120
125
%
ISS-SOURCE
ISS-DISCHARGE
—
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AP65454
Typical Performance Characteristics (@TA = +25°C, VIN = 12V, VOUT = 1.05V, unless otherwise specified.)
85˚C
25˚C
-40˚C
85˚C
25˚C
-40˚C
VIN=18V
IO=0mA
VIN=12V
IO=1A
VIN=4.5V
AP65454
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AP65454
Typical Performance Characteristics (cont.) (@TA = +25°C, VIN = 12V, VOUT = 1.05V, unless otherwise specified.)
VO=3.3V
VO=2.5V
VO=1.05V
Vo=1.05V
Vo=1.2V
Vo=1.8V
Vo=2.5V
Vo=3.3V
Vo=5V
VO=5.0V
VO=1.5V
VO=1.05V
VO=1.2V
AP65454
Document number: DS38483 Rev. 1 - 2
VO=1.8V
VO=2.5V
VO=3.3V
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AP65454
Typical Performance Characteristics (cont.)
(@TA = +25°C, VIN = 12V, VOUT = 1.05V, L = 1.5µH, C1 = 20µF, C2 = 44µF, unless otherwise specified.)
Startup Through VEN 4A Load
Startup Through VIN 4A Load
Short Circuit Test
VOUT (500mV/DIV)
VEN (5V/DIV)
VIN (12V/DIV)
VOUT (1V/DIV)
VOUT (1V/DIV)
IOUT (4A/DIV)
IOUT (4A/DIV)
SW (10V/DIV)
SW (10V/DIV)
Time-500µs/div
Shutdown Through VEN 4A Load
VEN (5V/DIV)
IOUT (2A/DIV)
Time-500µs/div
Time-200µs/div
Shutdown Through VIN 4A Load
Short Circuit Recovery
VIN (12V/DIV)
VOUT (500mV/DIV)
VOUT (1V/DIV)
VOUT (1V/DIV)
IOUT (4A/DIV)
IOUT (4A/DIV)
SW (10V/DIV)
SW (10V/DIV)
IOUT (2A/DIV)
Time-20µs/div
Time-200µs/div
Load Transient Response (0 to 4A)
Load Transient Response (2 to 4A)
VOUT_AC (50mV/DIV)
Time-1ms/div
Switching State 4A Load
VOUT_AC (50mV/DIV)
SW (5V/DIV)
IOUT (2A/DIV)
IOUT (2A/DIV)
IL (2A/DIV)
Time-100µs/div
Time-100µs/div
Time-1µs/div
Startup with VREG5
Voltage Ripple at Output (IO=4A)
Voltage Ripple at Input (IO=4A)
VOUT_AC (50mV/DIV)
EN (5V/DIV)
VIN_AC (200mV/DIV)
VREG5 (5V/DIV)
VOUT (500mV/DIV)
SW (5V/DIV)
Time-1ms/div
AP65454
Document number: DS38483 Rev. 1 - 2
SW (5V/DIV)
Time-400ns/div
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Time-400ns/div
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AP65454
Application Information
VIN
EN
1
R1
VOUT
EN
VIN
BS
FB
3
R2
22.1KΩ
C7
4
C5
1µF
VREG5
SW
SS
C4
8.2nF
8
C2
10µF
C6
AP65454
2
8.25KΩ
C1
10µF
GND
7
6
0.1µF
VOUT
1.5µH
L1
5
EP
C8
22µF
C9
22µF
Figure 3. Typical Application of AP65454 evaluation board
PWM Operation and Adaptive On-time Control
The AP65454 is a synchronous step-down converter with internal power MOSFETs. Adaptive constant on time (COT) control is employed to
provide fast transient response and easy loop stabilization. At the beginning of each cycle, the high-side MOSFET is turned on. This MOSFET is
turned off after an internal one shot timer expires. This one shot is set by the converter input voltage (VIN), and the output voltage (VOUT) to
maintain a pseudo-fixed frequency over the input voltage range, hence it is called adaptive on-time control. The output voltage variation is sensed
by FB voltage. The one-shot timer is reset and the high-side MOSFET is turned on again when FB voltage falls below the 0.76V.
AP65454 uses an adaptive on-time control scheme and does not have a dedicated in board oscillator. It runs with a pseudo-constant frequency of
650kHz by using the input voltage and output voltage to set the on-time one-shot timer. The on-time is inversely proportional to the input voltage
and proportional to the output voltage. It can be calculated using the following equation:
TON 
VOUT
VIN  f
VOUT is the output voltage
VIN is the input voltage
f is the switching frequency
After an ON-time period, the AP65454 goes into the OFF-time period. The OFF-time period length depends on VFB in most case. It will end when
the FB voltage decreases and below 0.76V then the ON-time periods is triggered. If the OFF-time period is less than the minimum OFF time, the
minimum OFF time will be applied, which is about 260ns typical.
Enable
Above the ‘EN high-level input voltage’, the internal regulator is turned on and the quiescent current can be measured above this threshold. The
enable (EN) input allows the user to control turning on or off the regulator. To enable the AP65454, EN must be pulled above the ‘EN high-level
input voltage.’ To disable the AP65454, EN must be pulled below ‘EN low-level input voltage.’
In Figure 3, EN is a high voltage input that can be safely connected to VIN (up to 18V) for automatic start-up.
AP65454
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AP65454
Application Information (cont.)
Soft-Start
The soft-start time of the AP65454 is programmable by selecting different CSS value. When the EN pin becomes high, the CSS is charged by a 6μA
current source, generating a ramp signal fed into non-inverting input of the error comparator. Reference voltage VREF or the internal soft-start
voltage SS whichever is smaller dominates the behavior of the non-inverting inputs of the error amplifier. Accordingly, the output voltage will
follow the SS signal and ramp up smoothly to its target level. The capacitor value required for a given soft-start ramp time can be expressed as:
t SS 
CSS  VFB
I SS
Where CSS is the required capacitor between SS pin and GND, tSS is the desired soft-start time and VFB is the feedback voltage.
Overcurrent Protection (OCP)
Figure 4 shows the overcurrent protection (OCP) scheme of AP65454. In each switching cycle, the inductor current is sensed by monitoring the
low-side MOSFET in the OFF period. When the voltage between GND pin and SW pin is smaller than the overcurrent trip level, the OCP will be
triggered and the controller keeps the OFF state. A new switching cycle will begin when the measured voltage is larger than limit voltage. The
internal counter is incremented when OCP is triggered. After 16 sequential cycles, the internal OCL (Overcurrent Logic) threshold is set to a lower
level, reducing the available output current. When a switching cycle occurs where the switch current is below the lower OCL threshold, the counter
is reset and OCL limit is returned to higher value.
Because the RDS(ON) of MOSFET increases with temperature, VLimit has xppm/°C temperature coefficient to compensate this temperature
dependency of RDS(ON).
R
S
Q1
Q
-266mV
OC
COMPARATOR
Q2
Figure 4. Overcurrent Protection Scheme
Undervoltage Lockout
The AP65454 provides an undervoltage lockout circuit to prevent it from undefined status when startup. The UVLO circuit shuts down the device
when VIN drops below 3.45V. The UVLO circuit has 320mV hysteresis, which means the device starts up again when V REG rise to 3.75V (nonlatch).
Thermal Shutdown
If the junction temperature of the device reaches the thermal shutdown limit of +160°C, the AP65454 shuts itself off, and both HMOS and LMOS
will be turned off. The output is discharge with the internal transistor. When the junction cools to the required level (+130°C nominal), the device
initiates soft-start as during a normal power-up cycle.
Setting the Output Voltage
The output voltage can be adjusted from 1.000 to 5V using an external resistor divider. Table 1 shows a list of resistor selection for common
output voltages. Resistor R1 is selected based on a design tradeoff between efficiency and output voltage accuracy. For high values of R1 there
is less current consumption in the feedback network. However the trade off is output voltage accuracy due to the bias current in the error
amplifier. R1 can be determined by the following equation:
V

R1  R 2   OUT  1
 0.765 
AP65454
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AP65454
Application Information (cont.)
Output Voltage (V)
R1 (kΩ)
R2 (kΩ)
Figure 5 Feedback Divider Network
1
6.81
22.1
1.05
8.25
22.1
1.2
12.7
22.1
1.5
21.5
22.1
1.8
30.1
22.1
2.5
49.9
22.1
3.3
73.2
22.1
5
124
22.1
Table 1 Resistor Selection for Common Output
Voltages
Inductor
Calculating the inductor value is a critical factor in designing a buck converter. For most designs, the following equation can be used to calculate
the inductor value:
L
VOUT  (VIN  VOUT )
VIN  ΔIL  fSW
Where ΔIL is the inductor ripple current and fSW is the buck converter switching frequency.
Choose the inductor ripple current to be 30% of the maximum load current. The maximum inductor peak current is calculated from:
IL(MAX)  ILOAD 
ΔIL
2
Peak current determines the required saturation current rating, which influences the size of the inductor. Saturating the inductor decreases the
converter efficiency while increasing the temperatures of the inductor and the internal MOSFETs. Hence choosing an inductor with appropriate
saturation current rating is important.
A 1µH to 3.3µH inductor with a DC current rating of at least 25% higher than the maximum load current is recommended for most applications.
For highest efficiency, the inductor’s DC resistance should be less than 100mΩ. Use a larger inductance for improved efficiency under light load
conditions.
The phase boost can be achieved by adding an additional feed forward capacitor (C7) in parallel with R1.
Output Voltage (V)
C7(pF)
L1(µH)
1
—
1.0-1.5
1.05
—
1.0-1.5
1.2
—
1.0-1.5
1.5
—
1.5
1.8
5-22
1.5
2.5
5-22
2.2
3.3
5-22
2.2
5
5-22
3.3
Table 2 Recommended Component Selection
C8+C9(µF)
22-68
22-68
22-68
22-68
22-68
22-68
22-68
22-68
Input Capacitor
The input capacitor reduces the surge current drawn from the input supply and the switching noise from the device. The input capacitor has to
sustain the ripple current produced during the on time on the upper MOSFET. It must have a low ESR to minimize the losses.
The RMS current rating of the input capacitor is a critical parameter that must be higher than the RMS input current. As a rule of thumb, select an
input capacitor which has an RMs rating that is greater than half of the maximum load current.
Due to large dI/dt through the input capacitors, electrolytic or ceramics should be used. If a tantalum must be used, it must be surge protected.
Otherwise, capacitor failure could occur. For most applications, greater than 10µF ceramic capacitor is sufficient.
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AP65454
Application Information (cont.)
Output Capacitor
The output capacitor keeps the output voltage ripple small, ensures feedback loop stability and reduces the overshoot of the output voltage. The
output capacitor is a basic component for the fast response of the power supply. In fact, during load transient, for the first few microseconds it
supplies the current to the load. The converter recognizes the load transient and sets the duty cycle to maximum, but the current slope is limited
by the inductor value.
Maximum capacitance required can be calculated from the following equation:
ESR of the output capacitor dominates the output voltage ripple. The amount of ripple can be calculated from the equation below:
Vout capacitor  ΔIinductor * ESR
An output capacitor with ample capacitance and low ESR is the best option. For most applications, a 22µF to 68µF ceramic capacitor will be
sufficient.
ΔIinductor 2
)
2
Co 
2
2
(Δ V  Vout )  Vout
L(I out 
Where ΔV is the maximum output voltage overshoot.
Bootstrap Capacitor
To ensure the proper operation, a ceramic capacitor must be connected between the VBST and SW pin. A 0.1µF ceramic capacitor is sufficient.
External Bootstrap Diode
It is recommended to add an external bootstrap diode between an external 5V and the BS pin for efficiency improvement when input voltage is
lower than 5.5V. The bootstrap diode can be a low cost one such as 1N4148 or BAT54. The external 5V can be a 5V fixed input from system or a
5V output of the AP65454. Note that the external bootstrap voltage must be lower than 5.5V.
Figure 6 External Bootstrap Diode
VREG5 Capacitor
To ensure the proper operation, a ceramic capacitor must be connected between the VREG5 and GND pin. A 1µF ceramic capacitor is sufficient.
PC Board Layout
1.
2.
3.
4.
5.
6.
7.
The AP65454 works at 4A load current, heat dissipation is a major concern in layout the PCB. A 2oz Copper in both top and bottom
layer is recommended.
Provide sufficient vias in the thermal exposed pad for heat dissipate to the bottom layer.
Provide sufficient vias in the Output capacitor GND side to dissipate heat to the bottom layer.
Make the bottom layer under the device as GND layer for heat dissipation. The GND layer should be as large as possible to provide
better thermal effect.
Make the Vin capacitors as close to the device as possible.
Make the VREG5 capacitor as close to the device as possible.
The thermal pad of the device should be soldered directly to the PCB exposed copper plane to work as a heatsink. The thermal vias in
the exposed copper plane increase the heat transfer to the bottom layer.
Figure 7 PC Board Layout
AP65454
Document number: DS38483 Rev. 1 - 2
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AP65454
Ordering Information
AP65454 XX - 13
Package
Packing
SP : SO-8EP
13 : Tape & Reel
Part Number
Package Code
Part Marking
Identification Code
AP65454SP-13
SP
SO-8EP
-
Tape and Reel
Quantity
Part Number Suffix
2,500
-13
Marking Information
SO-8EP
( Top View )
5
8
Logo
Part No
YY : Year : 14,15,16~
WW : Week : 01~52; 52
represents 52 and 53 week
X X : Internal Code
AP65454
YY WW X X E
E : SO-8EP
1
4
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
EXPOSED PAD
H
E1
F
1
b
E
e)
45°
7°
N
C
ll sid
Q
9° (A
4°±3°
A
1
0.
e
A1
R
Gauge Plane
Seating Plane
D
AP65454
Document number: DS38483 Rev. 1 - 2
L
E0
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SO-8EP
Dim Min Max Typ
A
1.40 1.50 1.45
A1 0.00 0.13
b
0.30 0.50 0.40
C
0.15 0.25 0.20
D
4.85 4.95 4.90
E
3.80 3.90 3.85
E0 3.85 3.95 3.90
E1 5.90 6.10 6.00
e
1.27
F
2.75 3.35 3.05
H
2.11 2.71 2.41
L
0.62 0.82 0.72
N
0.35
Q
0.60 0.70 0.65
All Dimensions in mm
December 2015
© Diodes Incorporated
AP65454
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X2
Dimensions Value(in mm)
C
1.270
X
0.802
X1
3.502
X2
4.612
Y
1.505
Y1
2.613
Y2
6.500
Y1
Y2
X1
Y
C
X
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
AP65454
Document number: DS38483 Rev. 1 - 2
13 of 13
www.diodes.com
December 2015
© Diodes Incorporated
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