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SPBTLE-RF
Very low power module for Bluetooth® Smart v4.1
Datasheet - production data
Applications
 Watches
 Fitness, wellness and sports
 Consumer medical
 Security/proximity
 Remote control
 Home and industrial automation
 Assisted living
 Mobile phone peripherals
 PC peripherals
Features
Description
 Bluetooth v4.1 compliant
– Supports master and slave modes
– Multiple roles supported simultaneously
 Embedded Bluetooth low energy protocol stack
– GAP, GATT, SM, L2CAP, LL, RFPHY
 Bluetooth low energy profiles provided
separately
 Bluetooth radio performance:
– Embedded ST BlueNRG-MS
– Tx power: + 4 dBm
– Rx sensitivity: - 88 dBm
– Provides up to 92 dB link budget with
excellent link reliability
 Host interface
– SPI, IRQ, and RESET
– On-field stack upgrading available via SPI
 AES security co-processor
The SPBTLE-RF is an easy to use Bluetooth®
Smart master/slave network processor module,
compliant with Bluetooth v4.1. The SPBTLE-RF
B-SmarT module supports multiple roles
simultaneously, and can act at the same time as
Bluetooth Smart sensor and hub device.
The entire Bluetooth Smart stack and protocols
are embedded into SPBTLE-RF B-SmarT
module. The external host application processor,
where the application resides, is connected to the
SPBTLE-RF B-SmarT module through a standard
SPI interface.
The SPBTLE-RF B-SmarT module provides a
complete RF platform in a tiny form factor. Radio,
antenna, high frequency and LPO oscillators are
integrated to offer a certified solution to optimize
the time to market of the final applications.
The SPBTLE-RF can be powered directly with a
standard 3 V coin cell battery, a pair of AAA
batteries or any power source from 1.7 to 3.6 V.
 Certification
– CE qualified
– FCC, IC modular approval certified
– BQE qualified
 On-board chip antenna
 Operating supply voltage: from 1.7 to 3.6 V
 Operating temperature range: -40 °C to 85 °C
June 2016
This is information on a product in full production.
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www.st.com
Contents
SPBTLE-RF
Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1
4
5
Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.4
Current consumption comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.5
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.6
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1
6
Bluetooth firmware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1
6.2
FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1.1
Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1.2
Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.1
Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2.2
Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.3
CE certification for SPBTLE-RF module . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.4
Bluetooth certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8
ECOPACK®
9
Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2/23
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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SPBTLE-RF
1
General description
General description
The SPBTLE-RF is a single-mode Bluetooth low energy master/slave network processor
module compliant with Bluetooth® v4.1.
The SPBTLE-RF B-SmarT module integrates a 2.4 GHz RF radio the ST BlueNRG-MS on
which a complete power-optimized stack for Bluetooth single mode protocol runs, providing

Master, slave role support

GAP: central, peripheral, observer or broadcaster roles

ATT/GATT: client and server

SM: privacy, authentication and authorization

L2CAP

Link Layer: AES-128 encryption and decryption
The BlueNRG-MS radio embeds nonvolatile Flash memory allows on-field stack upgrading.
In addition, according the Bluetooth specification v4.1 the SPBTLE-RF B-SmarT module
provides:

Multiple roles simultaneously support

Support simultaneous advertising and scanning

Support being slave of up to two masters simultaneously

Privacy V1.1

Low duty cycle directed advertising

Connection parameters request procedure

LE Ping

32 bits UUIDs

L2CAP connection oriented channels
The SPBTLE-RF B-SmarT module is equipped with Bluetooth low energy profiles in C
source code, available for the ST radio BlueNRG-MS.
The external host application processor, where the application resides, is interfaced with the
SPBTLE-RF B-SmarT module through an application controller interface protocol, which is
based on a standard SPI interface.
The SPBTLE-RF B-Smart module enables wireless connectivity into electronic devices, not
requiring any RF experience or expertise for integration into the final product. The SPBTLERF B-Smart module provides a complete RF platform in a tiny form factor and being a
certified solution optimizes the time to market of the final applications.
The SPBTLE-RF B-SmarT module allows applications to meet of the tight advisable peak
current requirements imposed with the use of standard coin cell batteries. Optimized results
are obtained when the embedded high-efficiency DC-DC step-down converter is used.
SPBTLE-RF can be powered directly with a standard 3 V coin cell battery, a pair of AAA
batteries or any power source from 1.7 to 3.6 V.
ST may update the FW provided with the modules at any time. ST recommends that users
regularly check for documentation and the current FW version available at
www.st.com/bluemodules.
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Block diagram
2
SPBTLE-RF
Block diagram
Figure 1. HW block diagram
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SPBTLE-RF
Software architecture
3
Software architecture
3.1
Bluetooth firmware implementation
Figure 2. SPBTLE-RF application block diagram
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Hardware specifications
4
SPBTLE-RF
Hardware specifications
General conditions (VIN= 3.3 V and 25 °C)
4.1
Absolute maximum ratings
Table 1. Absolute maximum ratings
Rating
Min
Typ.
Max
Unit
Storage temperature range
-40
-
+85
°C
Supply voltage, VIN
-0.3
-
3.9
V
I/O pin Voltage (VIO five-volt tolerant pin)
-0.3
-
3.9
V
-
8
-
dBm
RF saturation input power
4.2
Recommended operating conditions
Table 2. Recommended operating conditions
Rating
Min
Typ.
Max
Unit
Storage temperature range
-40
-
+85
°C
Supply voltage, VIN
1.7
3.3
3.6
V
Signals & I/O pin voltage
(according supply voltage)
1.7
-
3.6
V
2402
-
2480
MHz
RF Frequency
4.3
Current consumption
Table 3. Current consumption summary
Symbol
IDD
6/23
Parameter
Test conditions
Typ.
Unit
Shutdown / STANDBY
1.98
µA
Peripheral in advertising (20 ms)
0.850
mA
Peripheral in advertising (80 ms)
0.250
mA
Peripheral in connection
0.103
mA
Central in scan mode
7.72
mA
Central in connection
0.105
mA
Supply current
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SPBTLE-RF
4.4
Hardware specifications
Current consumption comparison
The measured values reported in table 3 have been compared with the value calculated
with the “BlueNRG current consumption estimation tool”, available on ST.com at:
http://www.st.com/web/en/catalog/tools/PF260405
The comparison between measured and calculated values is reported in following Table 4.
Table 4. Current consumption comparison summary
Symbol
IDD
Parameter
Test conditions
Typ.
Peak
Calculated
Unit
Calculated
value reference
2
µA
BlueNRG-MS
Datasheet Table
7
Shutdown /
STANDBY
1.98
Peripheral in
advertising (20 ms)
0.850
11.5
0.985
mA
Screenshot
Figure 3
Peripheral in
Supply current advertising (80 ms)
0.250
15.7
0.247
mA
Screenshot
Figure 4
Peripheral in
connection
0.103
15
0.119
mA
Screenshot
Figure 5
Central in scan
mode
7.72
8.5
7.1 - 7.4
mA
Screenshot
Figure 6
Central in
connection
0.105
12.85
0.106
mA
Screenshot
Figure 7
For each calculated value refer to the following screenshot
Figure 3. Peripheral in advertising (20 ms)
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Hardware specifications
SPBTLE-RF
Figure 4. Peripheral in advertising (80 ms)
Figure 5. Peripheral in connection
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SPBTLE-RF
Hardware specifications
Figure 6. Central in scan mode
Figure 7. Central in connection
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Hardware specifications
4.5
SPBTLE-RF
Pin assignment
Figure 8. Pin connection
Table 5. Pin assignment
Name
Type
Pin #
Description
V max. Tolerant
SPI Interface
SPI_IRQ
O
4
SPI IRQ (SLAVE has data for
MASTER)
Vin
SPI_CLK
I
7
SPI CLOCK (Max. 8 MHz)
Vin
SPI_MISO
O
8
SPI MISO (MASTER in / SLAVE out)
Vin
SPI_MOSI
I
9
SPI MOSI (MASTER out SLAVE in)
Vin
SPI_CS
I
10
SPI “Chip select” (SPI slave select)
Vin
Power and ground
Vin
5
Vin
GND
6
GND
(1.7V - 3.6V max.)
Reset
BT_RESET
I
11
Reset input (active low < 0.35 Vin)
LPO
EXT_LPCLK
GPIO2
ANA TEST 0
10/23
I
1
Not connected
I/O
2
Not connected
I
3
Not connected
DocID027851 Rev 6
(1.7V - 3.6V max.)
SPBTLE-RF
4.6
Hardware specifications
Mechanical dimensions
Figure 9. Mechanical dimensions
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Hardware specifications
SPBTLE-RF
Figure 10. Recommend land pattern top view
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SPBTLE-RF
5
Hardware design
Hardware design
SPBTLE-RF module supports SPI hardware interfaces.
Note:
- All unused pins should be left floating; do not ground.
- All GND pins must be well grounded.
- The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the module antenna position, in all directions.
- Traces should not be routed underneath the module.
5.1
Reflow soldering
The SPBTLE-RF is a high temperature strength surface mount Bluetooth® module supplied
on a 11 pin, 4-layer PCB. The final assembly recommended reflow profiles are indicated
here below.
Soldering phase has to be executed with care: in order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on following
recommendations.
Table 6. Soldering
Profile feature
Average ramp up rate (TSMAX to Tp)
PB-free assembly
3°C/ sec max
Preheat
Temperature min (TS mn)
Temperature max (TS max)
Time (tS min to tS max) (tS)
150 °C
200 °C
60-100 sec
Time maintained above:
Temperature TL
Time tL
217 °C
60-70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
10-20 sec
Ramp down rate
6 °C/sec
Time from 25 °C to peak temperature
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8 minutes max
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Hardware design
SPBTLE-RF
Figure 11. Soldering profiles
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SPBTLE-RF
Regulatory compliance
6
Regulatory compliance
6.1
FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits
are designed to provide reasonable protection against harmful interference in approved
installations. This equipment generates, uses, and can radiate radio frequency energy and,
if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
1.
This device may not cause harmful interference,
and
2.
this device must accept any interference received, including interference that may
cause undesired operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
FCC ID: S9NSPBTLERF
In accordance with FCC part 15, the SPBTLE-RF is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with colocation and RF exposure requirements in accordance with
FCC multi-transmitter product procedures. Collocated transmitters operating in portable RF
Exposure conditions (e.g. <20 cm from persons including but not limited to body worn and
hand held devices) may require separate approval.
6.1.1
Labeling instructions
When integrating the SPBTLE-RF into the final product, the OEM must ensure that the FCC
labeling requirements are satisfied. A statement must be included on the exterior of the final
product which indicates the product includes a certified module. The label should state the
following (or similar wording that conveys the same meaning):
Contains FCC ID: S9NSPBTLERF
OR
This product contains FCC ID: S9NSPBTLERF
The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
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Regulatory compliance
1.
SPBTLE-RF
this device may not cause harmful interference,
and
2.
6.1.2
this device must accept any interference received, including any interference that may
cause undesired operation.
Product manual instructions
This section applies to OEM final products containing the SPBTLE-RF module, subject to
FCC compliance. The final product manual must contain the following statement (or a
similar statement that conveys the same meaning):
Warning:
Changes or modifications not expressly approved by the
party responsible for compliance could void the user's
authority to operate the equipment. (Part. 15.21)
In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.
In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his expense.
6.2
IC certification
The SPBTLE-RF module has been tested and found compliant with the IC RSS-210 rules.
These limits are designed to provide reasonable protection against harmful interference in
16/23
DocID027851 Rev 6
SPBTLE-RF
Regulatory compliance
approved installations. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-210 of the IC rules. Operation is subject to the following two
conditions:
1.
this device may not cause harmful interference,
and
2.
this device must accept any interference received, including interference that may
cause undesired operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics
may render void the user's authority to operate this equipment.
Modular approval
IC: 8976C-SPBTLERF
In accordance with IC RSS-210, the SPBTLE-RF is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with colocation and RF exposure requirements in accordance with
IC multi-transmitter product procedures. Collocated transmitters operating in portable RF
Exposure conditions (e.g. <20cm from persons including but not limited to body worn and
hand held devices) may require separate approval.
6.2.1
Labeling instructions
When integrating the SPBTLE-RF into the final product, the OEM must ensure that the IC
labeling requirements are satisfied. A statement must be included on the exterior of the final
product which indicates that the product includes a certified module. The label should state
the following (or similar wording that conveys the same meaning):
Contains IC: 8976C-SPBTLERF
OR
This product contains IC: 8976C-SPBTLERF
The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with RSS-210 of the IC Rules. Operation is subject to the following two
conditions:
1.
this device may not cause harmful interference,
and
2.
this device must accept any interference received, including any interference that may
cause undesired operation.
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Regulatory compliance
6.2.2
SPBTLE-RF
Product manual instructions
This section applies to OEM final products containing the SPBTLE-RF module, subject to IC
compliance. The final product manual must contain the following statement (or a similar
statement that conveys the same meaning):
Warning:
Changes or modifications not expressly approved by the
party responsible for compliance could void the user's
authority to operate the equipment. (RSS-210)
In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
Note:
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.
In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
Note:
18/23
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his expense.
DocID027851 Rev 6
SPBTLE-RF
6.3
Regulatory compliance
CE certification for SPBTLE-RF module
The SPBTLE-RF module has been certified according to the following standards:

EN 60950-1:2006 + A11:2009 + A12:2011 + A1:2010 + A2:2013 + AC:2011

ETSI EN 301 489-1 V1.9.2:2011

ETSI EN 301 489-17 V2.2.1

ETSI EN 300 328 V1.8.1:2012

ETSI EN 300 328 V1.9.1 (2015)

EN62479:2010
CE Expert opinion: 0561-ARSP00053
The module is CE certified:
6.4
Bluetooth certification
The module with embedded stack and profile has been qualified in accordance with SIG
qualification rules:

Declaration ID: D028766

Qualified design ID: 71984

Product type: End Product

Core spec version: 4.1

Product description: Bluetooth Smart v4.1 module
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Ordering information
7
SPBTLE-RF
Ordering information
Table 7. Ordering information
20/23
Order code
Description
Packing
MOQ
SPBTLE-RF
Bluetooth® V4.1 smart module
JEDEC tray
2448 pcs
DocID027851 Rev 6
ECOPACK®
SPBTLE-RF
8
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
9
Traceability
Each module is univocally identified by serial number stored in a 2D data matrix laser
marked on the bottom side of the module itself.
The serial number has the following format:
Table 8. Traceability information
Letter
Meaning
WW
Week
YY
Year
D
Product ID family
FF
Production panel coordinate identification
NNN
Progressive serial number.
Each module bulk is identified by a bulk ID.
BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
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Revision history
10
SPBTLE-RF
Revision history
Table 9. Document revision history
22/23
Date
Revision
Changes
07-May-2015
1
Initial release.
09-Jul-2015
2
Inserted: Section 4.3 and Section 4.4.
03-Nov-2015
3
– Document status promoted from preliminary data to
production data.
– Added Section 6.4: Bluetooth certification.
17-Dec-2015
4
Updated figure on the cover page.
11-Jan-2016
5
Updated BQE feature on the cover page.
08-Jun-2016
6
Added paragraph regarding firmware update in
Section 1: General description.
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SPBTLE-RF
IMPORTANT NOTICE – PLEASE READ CAREFULLY
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
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acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics – All rights reserved
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