bd34602fs m e

Datasheet
Analog Sound Processor Series
6ch Sound Processor for High-Quality Audio
with Built-in Advanced Switch
BD34602FS-M
Description
Key Specifications
BD34602FS-M is a 6ch independent volume system. It
is designed to have high-quality sound by improving the
op-amp and optimizing the design layout. In addition, it
is compatible, same package and it has common control
with BD3461FS, therefore replacement from BD3461FS
is easy.







Features
 AEC-Q100 Qualified(Note 1)
 Advanced switch circuit can reduce the switching pop
noise during volume attenuation
 Built-in 6ch independent volume circuit available with
changing by 1dB/Step
 Built-in DIFF amplifier inputs, ideal for external input
 Built-in volume circuit for mixing external signal
available with changing by 1dB/Step
 Package is SSOP-A24. Putting input-terminals
together and output-terminals together can make
PCB layout easier and can makes area of PCB
smaller.
 It is possible to control by 3.3V for I2C-BUS
Controller
(Note1 : Grade 3)
Total harmonic distortion :
Maximum input voltage :
Maximum output voltage :
Output noise voltage :
Residual output noise voltage :
Ripple rejection :
Operating temperature range :
Package
SSOP-A24
Applications
0.0004%
2.35Vrms(Typ)
2.35Vrms(Typ)
1.3μVrms(Typ)
1.3μVrms(Typ)
80dB (Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
10.00mm x 7.80mm x 2.10mm
SSOP-A24
 Suitable for the Car Audio systems, Car Navigation
systems.
Typical Application Circuit
Figure 1. Application Circuit
○Product structure:Silicon monolithic integrated circuit
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Datasheet
BD34602FS-M
Pin Configuration
SSOP-A24
(TOP VIEW)
INF1 1
24 FIL
INF2 2
23 GND
INR1 3
22 SDA
INR2 4
21 SCL
INS1
5
20 CS
INS2
6
19 VCC
EXT1 7
18 OUTF1
EXT2 8
17 OUTF2
EXT3 9
16 OUTR1
DIFFOUT 10
15 OUTR2
NIN 11
14 OUTS1
PIN
13 OUTS2
12
Figure 2. Pin Configuration
Descriptions of terminal
Terminal
Terminal
Description
No.
Name
1
INF1
Front input terminal of 1ch
Terminal
No.
13
Terminal
Name
OUTS2
Subwoofer output terminal of 2ch
Description
2
INF2
Front input terminal of 2ch
14
OUTS1
Subwoofer output terminal of 1ch
3
INR1
Rear input terminal of 1ch
15
OUTR2
Rear output terminal of 2ch
4
INR2
Rear input terminal of 2ch
16
OUTR1
Rear output terminal of 1ch
5
INS1
Subwoofer input terminal of 1ch
17
OUTF2
Front output terminal of 2ch
6
INS2
Subwoofer input terminal of 2ch
18
OUTF1
Front output terminal of 1ch
7
EXT1
External input terminal of 1ch
19
VCC
8
EXT2
External input terminal of 2ch
20
CS
9
EXT3
External input terminal of 3ch
21
SCL
2
I C-BUS clock terminal
10
DIFFOUT
DIFF amp output terminal
22
SDA
2
I C-BUS data terminal
11
NIN
DIFF amp negative input terminal
23
GND
GND terminal
12
PIN
DIFF amp positive input terminal
24
FIL
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Power supply terminal
Chip select terminal
VCC/2 terminal
TSZ02201-0C2C0E100310-1-2
22.Oct.2015 Rev.001
Datasheet
BD34602FS-M
Block diagram
Volume★
Volume★
Volume★
Volume★
Volume★
Volume★
EXT
ATT
EXT
ATT
EXT
ATT
Figure 3. Block diagram
●The audible signal inputted from 1pin to 6pin are adjusted independently in volume block, and outputted from
13pin to 18pin.
●The audible signal inputted from 7pin to 9pin are adjusted independently in EXT ATT block, and added independently
to the audible signal inputted from 1pin to 6pin in EXT ON/OFF block, and outputted from 13pin to 18pin.
Absolute maximum ratings (Ta=25°C)
Item
Power supply Voltage
Input voltage
Input voltage
Operating Temperature
Storage Temperature
(Note 1)
(Note 2)
Caution:
Symbol
Ratings
Unit
VCC MAX
10
V
Pd
1.0
Vin
Topr
Tstg
(Note1)
W
GND-0.3 to VCC+0.3
-40 to +85
-55 to +150
V
°C
°C
SSOP-A24:Derating at 8.0mW/°C for operating above Ta≥25°C (mounted on 70×70×1.6mm ROHM standard board)
If it is within the operating voltage range, circuit functions and operation are guaranteed within this operating temperature.
Operating the IC over the absolute maximum ratings may damage the IC. The damage can
either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore,
it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Operating Range
Item
Power Supply
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Symbol
VCC
MIN
7.0
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TYP
8.5
MAX
9.5
Unit
V
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22.Oct.2015 Rev.001
Datasheet
BD34602FS-M
Electrical characteristic
GENERAL
BLOCK
(Unless otherwise specified, Ta=25°C, VCC=8.5V, f=1kHz, Vin=1Vrms, RL=10kΩ, INF1, INF2 Input, Volume=0dB)
Item
Symbol
Circuit Current upon no signal
Limit
Unit
Typ
Max
IQ
-
35
50
mA
No signal
Voltage gain
GV
-0.5
0
0.5
dB
GV=20log(VOUT/VIN)
Channel balance
CB
-0.5
0
0.5
dB
CB=GV1CH-GV2CH
-
0.0004
0.05
%
-
0.002
0.05
%
Total harmonic distortion
+ Noise
THD+N
1k
THD+N
10k
VNO
-
1.3
9
μVrms
Residual output noise voltage
VNOR
-
1.3
9
μVrms
CTC1k
-
-109
-90
dB
CTC10k
-
-103
-90
dB
Ripple rejection
RR
55
80
-
dB
Input impedance
RIN V
70
100
130
kΩ
VIM1k
2
2.35
-
Vrms
VIM10k
2
2.35
-
Vrms
GV BST
22
23
24
dB
GV MIN1k
-
-109
-90
dB
GV MIN10k
-
-103
-90
dB
Gain set error
GV ERR
-1.0
0
1.0
dB
Gain=+1~+23dB
Attenuation set error 1
GV ERR1
-0.5
0
0.5
dB
ATT=-1~-15dB
Attenuation set error 2
GV ERR2
-1.0
0
1.0
dB
ATT=-16~-47dB
Attenuation set error 3
GV ERR3
-2.0
0
2.0
dB
ATT=-48~-79dB
R OUT
70
100
130
Ω
Vin=100mVrms
VOM1k
2
2.35
-
Vrms
VOM10k
2
2.35
-
Vrms
RIN M
70
100
130
kΩ
GM MIN
-
-90
-80
dB
RIN D
70
100
130
kΩ
CMRR
50
65
-
dB
Maximum input voltage
Maximum gain
VOLUME
Maximum attenuation
Output impedance
Maximum output voltage
EXT
ATT
VOUT=1Vrms, f=1kHz
BW=400-30kHz
VOUT=1Vrms, f=10kHz
BW=400-80kHz
Output noise voltage
Cross-talk between channels
DIFF
Conditions
Min
Input impedance
Maximum attenuation
Input impedance
Common mode rejection ratio
Rg=0Ω, BW=IHF-A*
Volume=-∞
Rg=0, BW=IHF-A*
Rg=0Ω, BW=IHF-A*
CTC1k=20log(VOUT/VIN)
f=1kHz
Rg=0Ω, BW=400-80kHz
CTC10k=20log(VOUT/VIN)
f=10kHz
f=100Hz, VCCIN=100mVrms
RR=20log(VCCIN/VOUT)
VIM at THD+N(VOUT)=1%
BW=400-30kHz, f=1kHz
VIM at THD+N(VOUT)=1%
BW=400-80kHz, f=10kHz
Gain=23dB, VIN=100mVrms
GV BST=20log(VOUT/VIN)
Volume=-∞
GV MIN1k=20log(VOUT/VIN)
BW=IHF-A*, f=1kHz
Volume=-∞
GV MIN10k=20log(VOUT/VIN)
BW=400-80kHz, f=10kHz
THD+N=1%
BW=400-30kHz, f=1kHz
THD+N=1%
BW=400-80kHz, f=10kHz
GM MIN=20log(VOUT/VIN)
BW=IHF-A*, ATT=-∞
PIN and NIN input
CMRR=20log10(VIN/VOUT)
BW=IHF-A*
Phase between input / output is same
*VP-9690(Average value detection, effective value display) filter by Panasonic is used for * measurement.
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Datasheet
BD34602FS-M
Typical Performance Curve(s)
10
8
45
6
4
40
Gain [dB]
Circuit Current upon no signal [mA]aa
50
35
30
2
0
-2
-4
-6
25
-8
-10
20
7.0
7.5
8.0
8.5
9.0
10
9.5
100
100
1k
1000
10k
10000
100k
100000
Frequency [Hz]
VCC [V]
Figure 4. VCC vs Circuit Current upon no signal
1
Figure 5. Gain vs Frequency
24
10
22
20
10kHz
0.1
100Hz
18
1
1 kHz
0.1
0.001
0.01
Volume Gain [dB]
0.01
Vo [Vrms]
THD+N [%]
16
14
12
10
8
6
4
2
0
0.0001
0.001
0.001
0.01
0.1
1
10
10
10
Vin [Vrms]
100
1000
1k
10000
10k
100000
100k
Frequency[Hz]
Figure 7. Volume Gain vs Frequency
(Volume Gain = +23dB ~ 0dB)
Figure 6. THD+N vs VIN / VO
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Datasheet
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
-32
-34
-36
-38
-40
-42
Volume Gain [dB]
Volume Gain [dB]
BD34602FS-M
10
10
100
1k
1000
10k
10000
-38
-40
-42
-44
-46
-48
-50
-52
-54
-56
-58
-60
-62
-64
-66
-68
-70
-72
-74
-76
-78
-80
-82
100k
100000
10
10
100
Frequency[Hz]
EXT ATT Gain [dB]
EXT ATT Gain [dB]
1k
1000
100k
100000
Figure 9. Volume Gain vs Frequency
(Volume Gain = -40dB ~ -79dB)
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
-32
-34
-36
-38
-40
-42
100
100
10k
10000
Frequency[Hz]
Figure 8. Volume Gain vs Frequency
(Volume Gain = 0dB ~ -40dB)
10
10
1k
1000
10k
10000
-38
-40
-42
-44
-46
-48
-50
-52
-54
-56
-58
-60
-62
-64
-66
-68
-70
-72
-74
-76
-78
-80
-82
100k
100000
10
10
100
100
1k
1000
10k
10000
100k
100000
Frequency[Hz]
Frequency[Hz]
Figure 11. EXT ATT Gain vs Frequency
(EXT ATT Gain = -40dB ~ -79dB)
Figure 10. EXT ATT Gain vs Frequency
(EXT ATT Gain = 0dB ~ -40dB)
(Note) The measurement results of Figure 7 to Figure 11 used by 80kHz LPF.
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Datasheet
BD34602FS-M
CONTROL SIGNAL SPECIFICATION
(1) Electrical specifications and timing for bus lines and I/O stages
0.7VDD
=2.3V
SDA
0.3V DD
=1V
t
BUF
t
HD;STA
t
t
SP
LOW
SCL
t
t
HD;STA
P
t
t
HD;DAT
SU;DAT
HIGH
t
SU;STA
t
SU;STO
Sr
Repetition
START condition
S
STOP condition START condition
P
STOP condition
2
Figure 12. Definition of timing on the I C-BUS
Table 1 Characteristics of the SDA and SCL bus lines for I2C-BUS devices
Item
Fast-mode I2C-BUS)
Min
Max
400
0
Symbol
Unit
kHz
1
SCL clock frequency
fSCL
2
Bus free time between a STOP and START condition
tBUF
1.3
-
μs
3
Hold time (repeated) START condition. After this period, the first clock
pulse is generated
tHD;STA
0.6
-
μs
4
5
LOW period of the SCL clock
HIGH period of the SCL clock
tLOW
tHIGH
1.3
0.6
-
-
μs
μs
6
Set-up time for a repeated START condition
tSU;STA
0.6
-
μs
7
Data hold time
tHD;DAT
0
-
μs
8
Data set-up time
tSU;DAT
100
-
ns
9
Set-up time for STOP condition
tSU;STO
0.6
-
μs
All values referred to VIH min. and VIL max. Levels (see Table 2).
Table 2
Input/Output Characteristics of the SDA and SCL terminal for I2C-BUS devices
Item
Symbol
Fast-mode I2C-BUS)
Min
Max
-0.5
1
Unit
10
LOW level input voltage
VIL
11
HIGH level input voltage
VIH
2.3
-
V
12
Pulse width of spikes which must be suppressed by the input filter.
tSP
0
50
ns
13
LOW level output voltage : At 3mA sink current
VOL1
0
0.4
V
14
Input current each I/O pin with an input voltage between 0.4V and 4.5
VDDmax.
Ii
-10
10
μA
Table 3 Input Characteristics of the CS terminal (Slave Address can be changed by the setting of CS terminal)
Item
Symbol
Min
Max
V
Unit
1
CS = Low:Slave Address 80 hex
VCSL
-0.5
1
V
2
CS = High:Slave Address 84 hex
VCSH
2.3
VCC
V
tHD;STA
:2us
tHD;DAT
:1us
tSU;DAT
:1us
tSU;STO
:2us
SCL
tBUF
:4us
tLOW
:3us
tHIGH
:1us
SDA
Figure 13.
A command timing example in
the I2C-BUS data transmission
SCL clock frequency:250kHz
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Datasheet
BD34602FS-M
(2) I2C-BUS FORMAT
MSB
S
LSB
Slave Address
1bit
MSB
A
LSB
MSB
Select Address
LSB
A
Data
A
P
8bit
S
Slave Address
1bit
8bit
1bit
8bit
1bit 1bit
= Start conditions (Recognition of start bit)
= Recognition of Slave Address. 7 bits in upper order are voluntary.
The least significant bit is “L” due to writing.
A
Select Address
Data
P
= ACKNOWLEDGE bit (Recognition of acknowledgement)
= Select every of volume, bass and treble.
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
(3) I2C-BUS Interface Protocol
1)Basic form
S
Slave Address
MSB
A
LSB
Select Address
MSB
A
LSB
Data
MSB
A
P
LSB
2)Automatic increment (For an assigned Select Address increases (+1) according to the number of data.)
S
Slave Address
MSB
A
LSB
Select Address
MSB
A
LSB
Data1
MSB
A
Data2
LSB MSB
A
DataN
・・・・
LSB
A
MSB
P
LSB
No.1. Data1 is set as data of address specified by Select Address.
No.2. Data2 is set as data of next address from the address specified by No.1.
No.3. DataN is set as data of address incremented N-1 times from the address specified by No.1.
The Select Address is circulated by the automatic increment function, as shown below (hex).
→01→28→29→2A→2B→2C→2D→30→31→32→33→34→35
3)Configuration unavailable for transmission (In this case, only Select Address1 is set.
S
Slave Address
MSB
LSB
A
Select Address1
MSB
LSB
A
Data
A
MSB LSB
Select Address 2
MSB
LSB
A
Data
A P
MSB LSB
(Note)If any data is transmitted as Select Address 2 next to data,
it is recognized as data, not as Select Address 2.
(4) Slave Address
Because the Slave Address can be changed by the setting of CS, it is possible to use two chips
at the same time on identical BUS.
CS Terminal Voltage Condition
A6
A5
A4
A3
A2
CS = Low : -0.5V to 1.0V
1
0
0
0
0
CS = High : 2.3V to VCC
1
0
0
0
0
Establish the voltage of CS terminal in the condition to have been defined.
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A1
0
1
A0
0
0
R/W
0
0
Hex
80
84
TSZ02201-0C2C0E100310-1-2
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Datasheet
BD34602FS-M
(5) Select Address & Data
Items to be set
EXT ATT 1dB/Step
Enable
Advanced Switch
Time of
EXT ON/OFF
Volume Gain
Front 1ch (F1)
Volume Gain
Front 2ch (F2)
Volume Gain
Rear 1ch (R1)
Volume Gain
Rear 2ch (R2)
Volume Gain
Subwoofer 1ch (S1)
Volume Gain
Subwoofer 2ch (S2)
Select
Address
(hex)
MSB
D7
D6
D5
D4
01
0
0
0
0
02
0
Data
Advanced Switch
Time of
EXT ON/OFF 2
LSB
D3
D2
EXT ATT
1
1dB/Step
Enable
Advanced Switch
Time of
EXT ON/OFF 1
28
Volume Gain (F1)
29
Volume Gain (F2)
2A
Volume Gain (R1)
2B
Volume Gain (R2)
2C
Volume Gain (S1)
2D
Volume Gain (S2)
EXT1 ON/OFF
30
EXT2 ON/OFF
31
EXT3 ON/OFF
32
EXT 1 ATT Gain
EXT 2 ATT Gain
EXT 3 ATT Gain
Test Mode
System Reset
33
34
35
F0
FE
EXT1
S2
EXT2
S2
EXT3
S2
EXT1
S1
EXT2
S1
EXT3
S1
EXT1
R2
EXT2
R2
EXT3
R2
0
1
0
0
0
0
EXT1
EXT1
R1
F2
EXT2
EXT2
R1
F2
EXT3
EXT3
R1
F2
EXT1 ATT Gain
EXT2 ATT Gain
EXT3 ATT Gain
0
0
0
0
D1
D0
0
0
0
0
EXT1
F1
EXT2
F1
EXT3
F1
0
0
0
0
0
0
0
0
0
0
0
1
Advanced switch
Note(Please be sure to follow the instructions)
It is written with “0”, “1” by the above table, please set “0”, “1” in the same way as above table.
In case of different settings, there is possibility of cause unintended behavior.
Instructions of the data format
1.
In function changing of the hatching part, it works Advanced switch(In detail, please refer p13).
2.
Upon continuous data transfer, the Select Address is circulated by the automatic increment function, as shown
below(hex).
→01→28→29→2A→2B→2C→2D→30→31→32→33→34→35
※Select Address 02(hex) is not included in the automatic increment to keep BD3461FS software compatible.
3.
When changing “EXT = ON/OFF”, it is not corresponded for advance switch. Therefore, please do the measure that
applies mute on the side of a set at the time of these setting changes
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Datasheet
BD34602FS-M
Explanation of each Select Address
FIL
GND
SDA
SCL
CS
VCC
OUTF1
OUTF2
OUTR1
OUTR2
OUTS1
OUTS2
24
23
22
21
20
19
18
17
16
15
14
13
VCC/2
GND
Volume
Volume
Volume
Volume
Volume
I2C-BUS LOGIC
1. EXT ON/OFF②
(Select Address 02,30,31,32hex)
Volume
2. Volume (+23dB ~ -79dB, -∞)
(Select Address 28,29,2A,2B,2C,2Dhex)
3. EXT ON/OFF①
(Select Address 30,31,32hex)
4. EXT ATT (0dB ~ -79dB, -∞)
(Select Address 01,33,34,35hex)
100k
100k
EXT
ATT
100k
EXT
ATT
100k
EXT
ATT
100k
- +
100k
100k
100k
100k
100k
1
2
3
4
5
6
7
8
9
INF1
INF2
INR1
INR2
INS1
INS2
EXT1
EXT2
EXT3
10
DIFFOUT
100k
11
12
NIN
PIN
Figure.14 Block diagram
It is able to control to 1 to 4 in block diagram by each Select Address. About detail explanation is Follow as.
●The audible signal inputted from 1pin to 6pin are adjusted independently in volume block(2 in block diagram).
< Select Address 28, 29, 2A, 2B, 2C 2D(hex):Volume >
It is able to select adjustment of audible signal in volume block(+23dB to -79dB, -∞).
●The audible signal inputted from 7pin to 9pin are adjusted independently in EXT ATT block(4 in block diagram),
and added independently to the audible signal inputted from 1pin to 6pin in EXT ON/OFF block.
(EXT ON/OFF① block (3 in block diagram) : path select, EXT ON/OFF② block (1 in block diagram) : add)
< Select Address 01(hex):EXT ATT 1dB/Step Enable >
About adjustment of audible signal in EXT ATT block (4 in block diagram), it is able to select 1dB/Step mode ON/OFF.
< Select Address 02(hex):Advanced Switch Time of EXT ON/OFF >
Advanced Switch function is applied to EXT ON/OFF for prevention switching pop-noise. (About Advanced Switch,
refer to 15page) It is able to select switching time of Advanced Switch by Select Address 02(hex).
< Select Address 30, 31, 32(hex):EXT ON/OFF >
The audible signal inputted from 7pin to 9pin is added to the audible signal inputted from 1pin to 6pin.
It is able to select path of above combination (1 and 3 in block diagram).
< Select Address 33, 34, 35(hex):EXT ATT >
It is able to select adjustment (0dB to -79dB, -∞) of audible signal in EXT ATT block (3 in block diagram).
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Datasheet
BD34602FS-M
Select Address 01(hex) EXT ATT 1dB/Step Enable
MSB
MODE
D7
D6
D5
OFF
0
0
0
ON
EXT ATT 1dB/Step Enable
D4
D3
0
0
1
D2
D1
LSB
D0
0
0
0
D1
LSB
D0
0
0
D1
LSB
D0
0
0
D1
0
0
:
0
0
1
1
:
0
1
1
0
:
1
1
LSB
D0
0
1
:
0
1
0
1
:
1
0
1
0
:
0
1
Select Address 02(hex) Advanced Switch Time of EXT ON/OFF
MSB
Advanced Switch Time of EXT ON/OFF 1
MODE
D7
D6
D5
D4
D3
D2
0
0
11.2msec
0
1
4.7msec
Advanced Switch
0
Time of EXT ON/OFF 2
1
0
7.2msec
1
1
14.4msec
Select Address 02(hex) Advanced Switch Time of EXT ON/OFF
MSB
Advanced Switch Time of EXT ON/OFF 2
MODE
D7
D6
D5
D4
D3
D2
0
0
0
x1
0
0
1
x2
0
1
0
x3
Advanced Switch
0
1
1
x4
Time of
0
1
0
0
x5
EXT ON/OFF 1
1
0
1
x6
1
1
0
x7
1
1
1
x8
Select Address 28, 29, 2A, 2B, 2C 2D(hex)
MSB
Gain & ATT
D7
D6
0
0
0
0
Prohibition ※
:
:
0
1
23dB
0
1
22dB
0
1
21dB
0
1
:
:
:
-77dB
1
1
-78dB
1
1
-79dB
1
1
1
1
:
:
Prohibition ※
1
1
-∞dB
1
1
Volume
D5
0
0
:
1
1
1
1
:
0
0
0
0
:
1
1
Volume Gain/Attenuation
D4
D3
0
0
0
0
:
:
0
1
0
1
0
1
0
1
:
:
0
1
0
1
0
1
1
0
:
:
1
1
1
1
D2
0
0
:
0
0
0
0
:
1
1
1
0
:
1
1
: Initial condition
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Datasheet
BD34602FS-M
Select Address 30, 31, 32(hex)
MSB
MODE
D7
OFF
EXT
S2
ON
MODE
OFF
ON
MODE
OFF
ON
MODE
OFF
ON
MODE
OFF
ON
MODE
OFF
ON
EXT ON/OFF
D6
EXT
S1
D5
EXT
R2
EXT F1
D4
D3
EXT
EXT
R1
F2
D2
0
1
D1
LSB
D0
0
0
MSB
D7
EXT
S2
D6
EXT
S1
D5
EXT
R2
EXT F2
D4
D3
0
EXT
R1
1
D2
EXT
F1
D1
LSB
D0
0
0
MSB
D7
EXT
S2
D6
EXT
S1
D5
EXT
R2
D3
EXT
F2
D2
EXT
F1
D1
LSB
D0
0
0
MSB
D7
EXT
S2
D6
EXT
S1
D5
0
1
EXT R2
D4
D3
EXT
EXT
R1
F2
D2
EXT
F1
D1
LSB
D0
0
0
MSB
D7
EXT
S2
D6
0
1
D5
EXT
R2
D4
EXT
R1
D3
EXT
F2
D2
EXT
F1
D1
LSB
D0
0
0
MSB
D7
0
1
D6
EXT
S1
D5
EXT
R2
EXT S2
D4
D3
EXT
EXT
R1
F2
D2
EXT
F1
D1
LSB
D0
0
0
EXT R1
D4
0
1
EXT S1
Select Address 33, 34, 35(hex) EXT ATT ※Select Address 01(hex), D3 = 0, (EXT 1dB Enable = OFF)
MSB
EXT Attenuation
Gain
D7
D6
D5
D4
D3
D2
D1
0dB
0
0
LSB
D0
0
-8dB
0
0
1
-16dB
0
1
0
0
1
1
1
0
0
1
0
1
-24dB
-32dB
0
0
0
0
-48dB
0
-64dB
1
1
0
-∞dB
1
1
1
Select Address 33, 34, 35(hex) EXT ATT ※Select Address 01(hex), D3 = 1, (EXT 1dB Enable = ON)
MSB
EXT Attenuation
Gain & ATT
D7
D6
D5
D4
D3
D2
D1
0dB
1
0
0
0
0
0
0
-1dB
1
0
0
0
0
0
0
-2dB
1
0
0
0
0
0
1
:
:
:
:
:
:
:
:
-77dB
1
1
0
0
1
1
1
-78dB
1
1
0
0
1
1
1
-79dB
1
1
0
0
1
1
1
1
1
0
1
0
0
0
:
:
:
:
:
:
:
Prohibition ※
1
1
1
1
1
1
1
-∞
1
1
1
1
1
1
1
LSB
D0
0
1
0
:
0
0
1
0
:
0
1
: Initial condition
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Datasheet
BD34602FS-M
(6) About power on reset
At on of supply voltage circuit made initialization inside IC is built-in. Please send data to all address as initial data
at supply voltage on. And please supply mute at set side until this initial data is sent.
Item
Symbol
Rise time of VCC
Trise
Min
33
VCC voltage of release
power on reset
Vpor
-
Limit
Typ
-
Max
-
μsec
4.1
-
V
Unit
Condition
VCC rise time from 0V to 5V
(7) About start-up and power off sequence on IC
In power supply off, please set a register state of the IC as follows.
・Volume Gain /Attenuation = MINF (SelectAddress28,29,2A,2B,2C,2D(hex), Data = FF(hex))
・EXT1,2,3 ON/OFF = OFF (SelectAddress30,31,32(hex), Data = 00(hex))
Figure 15. The sequence of power supply ON/OFF
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Datasheet
BD34602FS-M
・Select Address 28, 29, 2A, 2B, 2C 2D(hex) Volume (Gain = +23dB ~ -79dB, -∞)
・Select Address 33, 34, 35(hex) EXT ATT (Gain = 0dB ~ -79dB, -∞)
※Select Address 01(hex), D3 = 1, (EXT 1dB Enable = ON)
Volume gain attenuation
(dB)
D7 D6 D5
+23
0
1
1
+22
0
1
1
+21
0
1
1
+20
0
1
1
+19
0
1
1
+18
0
1
1
+17
0
1
1
+16
0
1
1
+15
0
1
1
+14
0
1
1
+13
0
1
1
+12
0
1
1
+11
0
1
1
+10
0
1
1
+9
0
1
1
+8
0
1
1
+7
0
1
1
+6
0
1
1
+5
0
1
1
+4
0
1
1
+3
0
1
1
+2
0
1
1
+1
0
1
1
0
1
0
0
-1
1
0
0
-2
1
0
0
-3
1
0
0
-4
1
0
0
-5
1
0
0
-6
1
0
0
-7
1
0
0
-8
1
0
0
-9
1
0
0
-10
1
0
0
-11
1
0
0
-12
1
0
0
-13
1
0
0
-14
1
0
0
-15
1
0
0
-16
1
0
0
-17
1
0
0
-18
1
0
0
-19
1
0
0
-20
1
0
0
-21
1
0
0
-22
1
0
0
-23
1
0
0
-24
1
0
0
-25
1
0
0
-26
1
0
0
-27
1
0
0
-28
1
0
0
D4
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
D3
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
D2
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
(dB)
-29
-30
-31
-32
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
D7
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D5
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D4
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D3
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
D2
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
:Initial condition
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Datasheet
BD34602FS-M
About advanced switch circuit
【1】Advanced switch technology
1-1. Advanced switch effects
Advanced switch technology is Rohm original switching pop noise prevention technology. The audible signal is
discontinuous during the gain switching instantly which cause the noise to occur. This Advanced switch circuit will prevent
this discontinuous signal by completing the signal waveform and will significantly reduce the noise.
Figure 16. Advanced switch wave
This Advanced switch technology will start the switching when received the signal sent from the micon.
At any constant time, the switching waveform is shown as above figure. This IC will optimally operate by internally
processing the data sent from the micon to prevent the switching shock.
However, sometimes the switching waveform is not like the intended form depends on the transmission timing.
Therefore, below is the example of the relationship between the transmission timing and actual switching time. Please
consider this relationship for the setting.
1-2. The kind of the Transferring Data
・Data setting other than Advanced switch supported items
( P.9 Select Address and data Data format without hatching)
There is no particular rule about transferring data.
・Advanced switch supported items data setting
(P.9 Select Address and data Data format with hatching)
There is no particular rule about transferring data, but Advanced switch must follow the switching sequence as
mentioned in【2】.
※
Advanced switch supported blocks are “Volume” and ”EXT ON/OFF”(In detail, please refer p9).
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Datasheet
BD34602FS-M
【2】Data transmission of Advanced switch supported items
2-1. Switching time of Advanced switch
Switching time includes [Twait(Wait time)], [Tsft(A→B switching time)] and [Tsft(B→A switching time)].
25msec is needed per 1 switching. (Tsoft = Twait + 2 * Tsft, Twait=2.3msec, Tsft=11.2msec)
[wait time]
=Twait
Current XdB
Send YdB
[A→B switching time]
=Tsft
[B→A switching time]
=Tsft
A→B
B→A
Change YdB
W
Advanced Switch Time (Tsoft)
Figure 17. About Advanced switching time
In Figure 8, Start/Stop state is expressed as “A” and temporary state is expressed as “B”.
The switching sequence of Advance switch will be, A(start)→B→A(stop), thus switching will not stop at B state.
In other words, switching is performed from A(Initial gain)→B(set gain→A(set gain) when switching from initial gain to set
gain.
It is possible to change the switching time of Advanced switch time by setting the EXT Advanced switch multi sel and
Advanced Switch Time of EXT at select Address2.
If only EXT ON/OFF is performed in all Advanced switch operation, the switching time of Advanced switch is determined
by EXT Advanced switch multi sel and Advanced Switch Time of EXT.
For example
EXT Advanced switch multi sel is set to x8 and Advanced Switch Time of EXT is set to 14.4msec
In this case, the switching time of Advanced switch is determined as below.
EXT Advanced switch multi sel
This is equal to switching time of
x Advanced Switch Time of EXT
= 115.2msec
A→B or B→A(Tsft).
As mentioned in Figure 11 (Start sequence of Advanced switch), each ch(6channels) volume and EXT ON/OFF switch at
the same timing. When each ch(6channels) volume switches at the same time EXT ON/OFF operation is performed,
switching time of each ch(6channels) volume will be the same as EXT ON/OFF switching set by calculation above. In other
words, switching time of EXT ON/OFF has higher priority than that of the 6channels volume
Even if switching time of EXT ON/OFF is set by calculation above, when EXT ON/OFF switching is not being performed,
switching time of each ch(6channels) volume is determined as Tsft=11.2msec. Please exercise caution when setting the
switching time of Advanced switch.
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Datasheet
BD34602FS-M
2-2. Explanation on data transmission’s timing and switching operation.
The following examples show the time chart from the time a data is transmitted until the switching starts.
■ Transmission example 1
This is an example when transmitting data in same block with enough transmission interval.
This enough interval refers to the tolerance margin time of Tsoft multiplied by 1.4.
slave
I2C-BUS
select
80
data
ack
28 80
(F1 0dB)
80 28 FF
(F1 -∞dB)
Tsoft * 1.4 msec
W
Advanced Switch time
A→B
B→A
W
A→B
B→A
F1 output
■
Transmission example 2
This is an example when the transmission interval is not enough (smaller than transmission example 1).
When the data is transmitted during the first switching operation, the second data transmission will continue after
complete the first switching. In this case, there is no wait time (Twait) before the second switching.
slave
I2C-BUS
select
80
data
ack
28 80
(F1 0dB)
80 28 FF
(F1 -∞dB)
W
Advanced Switch time
A→B
B→A
A→B
B→A
F1 output
■
Transmission example 3
This is an example when transmission interval is even smaller (smaller than transmission example 2).
When the data is transmitted during the first switching, and it is during A→B switching operation, if the transmitted
data is volume, switching of new data is performed at B→A timing
slave
I2C-BUS
select
80
data
ack
28 80
(F1 0dB)
80 28 FF
(F1 -∞dB)
W
Advanced Switch time
A→B
B→A
F1 output
If the transmitted data is EXT ON/OFF switching, when other switching data is sent during A→B switching, switching’s
will be the same as Transmission example 2
slave
I2C-BUS
select
data
80 30 04
(EXT1 F1 ON)
Advanced Switch time
ack
80 31 04
(EXT2 F1 ON)
W
A→B
B→A
A→B
B→A
F1 output
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Datasheet
BD34602FS-M
About data transmission to multi-channels, there is a caution. It is possible that Lch and Rch in same block(Front/Rear/Sub)
can be switched at the same timing. For example, when the data transmission is set as the figure below, it is possible that
OUTF1 and OUTF2 can be switched at the same timing(Data is sent for FL (Lch) and data is sent for FR (Rch)).
Please take note that Twait is wait time for starting switching and designed to 2.3msec. (Considering fluctuation of element,
Twait may change from 1.2msec (Min.) to 4.6msec (Max.).
80
28
xx
80
29
xx
① ②
I2C-BUS
T②-① < Twait
W
Advanced Switch time
A→B
B→A
Output F1
Initial
Initial → ①
①
Output F2
Initial
Initial → ②
②
Figure 18. The operation during multi-channels (1ch, 2ch) data transmission (smaller than Twait interval).
Next, when data is not transmitted during the Twait, the switching operation is as following figure.
80
28
xx
80
①
29
xx
②
I2C-BUS
T②-① > Twait
W
Advanced Switch time
Output F1
Initial
Output F2
Initial
A→B
B→A
Initial → ①
①
A→B
B→A
Initial → ②
②
Figure 19. The operation during multi-channels (1ch, 2ch) data transmission (larger than Twait interval).
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2-3. Multi-blocks data transmission timing and switching operation.
In case the data is transmitted to the multi-blocks, the processing is performed internally by BS unit.
Micro step volume starting order is determined by BS unit.
■Transmission example 1
slave
I2C-BUS
select
80
data
28 80
(F1 0dB)
ack
80
2A 80
(R1 0dB)
80
2C 80
(S1 0dB)
F1 Advanced Switch
Advanced Switch time
W
A→B
R1 Advanced Switch
B→A
A→B
B→A
S1 Advanced Switch
A→B
B→A
F1 output
R1 output
S1 output
※It is the same even if it transfers data in auto increment mode.
There are no timing regulations of I2C-BUS transferring data. But the timing of a change start after the end of the present
change. In addition, the timing of Advanced switch is not depended of a transferring data turn, but conforms in turn of the
following figure.
Figure 20. The turn of Advanced switch start
※The block in the same group can start the Advanced switch in the same time.
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■Transmission example 2
In case of the transmission order is different with actual switching order.
80
①
xx
ex:①F1 -6dB
②F1 -20dB
③S1 -6dB
④R1 -6dB
xx
② ③ ④
I2C-BUS
F1 Advanced Switch
Advanced Switch time
W
A→B
R1 Advanced Switch
B→A
Output F1
Initial Initial → ①
Output R1
Initial
Output S1
Initial
A→B
S1 Advanced Switch
B→A
A→B
F1 Advanced Switch
B→A
①
Initial → ④
A→B
B→A
①→②
②
④
Initial → ③
③
During Front switching, in case of Front/Rear/SW continuously received, Rear and SW switching are the priority.
If you want the switching starts as the data transmission order, please transmit the next data after current switching is
ended.
■Transmission example 3
For Refresh data, the IC will internally judge that there is no difference with the current data setting and therefore gain
switching operation will not start.
Continuing the Refresh data and transmit the other block data.
slave
I2C-BUS
select
80
data
ack
28 80
(F1 0dB)
80
28 80
(F1 0dB)
80
2A 80
(R1 0dB)
Refresh Data
F1 Advanced Switch
Advanced Switch time
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A→B
B→A
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Datasheet
BD34602FS-M
Application Circuit Diagram
Figure 21. Application Circuit Diagram
UNIT
RESISTANCE: Ω
CAPACITANCE: F
Notes on wiring
①Please connect the decoupling capacitor of the power supply in the shortest distance as much as possible to VCC and
GND, VEE.
②Lines of GND shall be one-point connected.
③Wiring pattern of Dagital shall be away from the analog unit and cross-talk is not acceptable.
2
④Lines of SCL and SDA of I C BUS shall not be parallel if possible. The lines shall be shielded, if they are adjacent to
each other.
⑤Lines of analog input shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other.
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Power Dissipation
Thermal design for the IC
Temperature has great influence to the IC characteristics, and exceeding the absolute maximum ratings may degrade
and damage the IC. A proper consideration must be given from two points, immediate damage and long-term reliability
of operation.
SSOP-A24
Power Dissipation Pd (W)
1.5
Measurement condition: ROHM Standard board
Board Size:70×70×1.6(㎣)
Material:A FR4 grass epoxy board
(3% or less of copper foil area)
1.0W
1.0
θja = 125°C /W
0.5
0.0
0
25
50
75
85
100
125
150
Ambient Temperature Ta(°C)
Figure 22. Temperature Derating Curve
Note) Values mentioned above are based on actual measurement, and not guaranteed.
Note) Power dissipation value varies depending to the board on which the IC is mounted.
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BD34602FS-M
Terminal Equivalent Circuit and Description
Terminal
No.
1
2
3
4
5
6
7
8
9
11
12
Terminal
Name
INF1
INF2
INR1
INR2
INS1
INS2
EXT1
EXT2
EXT3
NIN
PIN
Terminal
Voltage
10
13
14
15
16
17
18
DIFFOUT
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
4.25V
22
SCL
-
4.25V
Equivalent Circuit
Terminal Description
A terminal for signal input.
The input impedance is 100kΩ(typ).
VCC
100K Ω
GND
A terminal for fader output.
A terminal for clock input of I2C-BUS.
VCC
SCL
1.65V
GND
23
SDA
-
A terminal for data input of I2C-BUS.
VCC
SDA
1.65V
GND
20
CS
-
CS Input Terminal.
A terminal for Slave Address selection.
“CS” is “High”→Slave Address “84 H”
“CS” is “Low”→ Slave Address “80 H”
VCC
CS
1.65V
GND
The figure in the pin explanation and input/output equivalent circuit is reference value, it’s doesn’t guarantee the value.
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BD34602FS-M
Terminal
No.
Terminal
Name
Terminal
Voltage
19
VCC
8.5V
23
GND
0V
24
FIL
4.25V
Equivalent Circuit
Terminal Description
Power supply terminal.
Ground terminal.
1/2 VCC terminal.
Voltage for reference bias of analog signal
system. The simple precharge circuit and
simple discharge circuit for an external
capacitor are built in.
VCC
50kΩ
FIL
50kΩ
GND
The figure in the pin explanation and input/output equivalent circuit is reference value, it’s doesn’t guarantee the value.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Because the input impedance of the terminal becomes 100kΩ when the signal input terminal makes a terminal open,
the plunge noise from outside sometimes becomes a problem.
About unused input pin, please connect to GND through capacitor, or please set that channel MUTE.
About unused output pin, it is no problem to set to open.
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Operational Notes – continued 1
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 23. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. About power ON/OFF
At power ON/OFF, a pop sound will be generated and, therefore, use MUTE on the set.
15. About EXT ATT(Select Address 33, 34, 35(hex)) switching
When switching EXT ATT, please set EXT OFF.
16. About Volume gain switching, EXT ON/OFF switching
In case of the boost of the volume when changing to the high gain which exceeds +12dB especially, the switching
pop noise sometimes becomes big. (For example, in case gain of the power amplifier is set to +26dB, and switching
time is set to 11.2msec)
In this case, countermeasures as below are recommended to decrease this pop noise.
・Switching gain by only 1dB/Step
・Increase switching time (In detail, please refer p9.)
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BD34602FS-M
Operational Notes – continued 2
16. About output load characteristics
The usage of load for output are below (reference). Please use the load more than 10[kΩ](TYP).
Output terminal
Terminal
Terminal
No.
Name
18
OUTF1
17
OUTF2
Terminal
No.
16
15
Terminal
Name
OUTR1
OUTR2
Terminal
No.
14
13
Terminal
Name
OUTS1
OUTS2
Terminal
No.
10
Terminal
Name
DIFFOUT
Output voltage [Vrms]
2.5
2
1.5
1
VCC=8.5V
THD+N=1%
BW=400 to 30kHz
0.5
0
100
1k
10k
100k
Load [Ω]
Figure 24. Output load characteristic VCC=8.5V (Reference)
17. About constant set up of input coupling capacitor
In the signal input terminal, the constant setting of input coupling capacitor C(F) be sufficient input impedance
RIN(from 70 to 130kΩ) inside IC and please decide. The first HPF characteristic of RC is composed.
G [ dB ]
C[F]
RIN[Ω]
0dB
-3dB
f [ Hz ]
Figure 25. Input equivalent circuit
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BD34602FS-M
Ordering Information
B
D
3
4
6
0
2
F
S
-
ME 2
Package
FS: SSOP-A24
Part Number
Product Rank
M : for Automotive
Packaging and forming specification
E2 : Embossed tape and reel
(SSOP-A24)
Physical Dimension, Tape and Reel Information
SSOP-A24
10 ± 0.2
(MAX 10.35 include BURR)
0.8
0.1
1.2±0.15
7.8±0.3
0.5±0.2
12
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
+0.1
0.17 −0.05
1.8±0.1
1
0.1±0.1
<Tape and Reel information>
13
5.4±0.2
24
+6°
4° −4°
1pin
0.38±0.1
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
Marking Diagrams
SSOP-A24(TOP VIEW)
Part Number Marking
BD34602FS
LOT Number
1PIN MARK
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Revision History
Date
Revision
22.Oct.2015
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Rev.001
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