PRODUCTS TYPE Semiconductor PAGE Jisso Information for SQFP 1/4 - Jisso Information - Package : SQFP < A tablie of contents > 1. Structure 2. Tape and Reel information 3. Storage conditions 4. Marking lot number 5. Footprint dimensions 6. Soldering conditions 1/4 page 1/4 to 3/4 page 3/4 page 3/4 page 3/4 page 3/4 to 4/4 page 1. Structure 6 5 3 4 1 2 Compositional element No. 1 Lead (External lead : Pb free solder plating) 2 Die Pad 3 Die 4 Die Attach 5 Bonding Wire 6 Molding Resin Fig. 1 Structure 2. Tape and Reel information 2. 1. Packing specification SQFP56 : Tray SQFP80/100/160C SQFP-T52/T64/T80/T80C/T100 Tape Quantity Tray (with dry pack) See the table on page 4/4 2.2.Tray Dimension and Pin#1/ Tray Orientation See the table on Page 4/4 ex. SQFP56,80,100,160C ex. SQFP-T52,T64,T80,T80C,T100 Out going inspection Product No. Quantity Lot number BA1234KS Product No. Quantity 1,000pcs．0124 A5110F BA1234KS Marking lot number Internal product code Out going inspection K.YAMADA Lot number MNo. 124 023 pcs. MNo. 124 024 pcs. BA1234KS2 1,000pcs．0124 A5110F BA1234KS2 Marking lot number Internal product code Pb Free Mark K.YAMADA MNo. 124 023 pcs. MNo. 124 024 pcs. Pb Free Mark Fig. 2 Label example REV. H TSZ22111・05・002 2014.12.12 SPECIFICATION No.:TSZ02201-SQFP-4 PRODUCTS TYPE Semiconductor PAGE 2/4 Jisso Information for SQFP unit box 2.4.Packing style SQFP56 tray tape silicagel C A SQFP80,100,160C, SQFP-T52,T64,T80, dry pack T80C,T100 B label Fig. 3 Packing style 2.5.Shipping style Shipping box dimensions are as follows; SQFP56,SQFP-T52,T64 （all dimensions in mm） SQFP80,100,SQFP-T80,T80C,T100 165 230 310 579 SQFP160C 395 355 136 164 215 Fig. 4 Shippong style 2.6.Packing materials Package Item SQFP56 SQFP80,100,160C, SQFP-T52,T64,T80, T80C,T100 Tray Desiccant Envelope Unit box Shipping box PS - - Cardboard Cardboard Silicagel AluminumeCardboard laminated Cardboard PPE (Heat resistive) 3.Storage conditions 3. 1.Storage environment Recommended storage conditions are as follows : -Temperature : 5~30 -Humidity : 40°C~70%RH 3.2.Storage period -Specified storage period : 1year 3.3.Specified storage period until soldering Regarding the dry packed packages , assemble package within 168hours , after dry pack is opened . If the storage period has expired , the products must be baked 125°C for 24hours. Maximum 2times baking for keeping solderbility. 4.Marking lot number SQFP56,SQFP80,SQFP100,SQFP160C,SQFP-T52,SQFP-T64,SQFP-T80,SQFP-T80C,SQFP-T100 Production lot number Production week code Production year code REV. H TSZ22111・05・002 SPECIFICATION No.:TSZ02201-SQFP-4 PRODUCTS TYPE Semiconductor PAGE 3/4 Jisso Information for SQFP 5. Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) (all dimensions in mm) e b2 MIE e l2 Package l2 MID Land space Land pitch Land length Land width MID MIE ≧l2 b2 SQFP56 0.65 10.60 10.60 1.20 0.35 SQFP80 0.65 14.60 14.60 1.20 0.35 SQFP100 0.65 20.80 14.80 1.90 0.35 SQFP160C 0.65 28.80 28.80 1.50 0.35 SQFP-T52 0.65 10.20 10.20 1.20 0.35 SQFP-T64 0.65 12.20 12.20 1.20 0.35 SQFP-T80 0.65 14.20 14.20 1.20 0.35 SQFP-T80C 0.65 14.20 14.20 1.20 0.35 SQFP-T100 0.65 20.80 14.80 1.90 0.35 6. Soldering conditions Package surface temperature 6. 1. Recommended temperature profile for reflow 260°C MAX Preheating temperature ; 130°C to 190°C Preheating zone ; 120sec MAX 255°C Soldering temperature ; 220°C to 230°C Soldering zone ; 60sec MAX Soldering temperature 1 to 4°C/sec (Notice) Maximum 2-times soldering Preheating temperature Time 10sec MAX Preheating zone Soldering zone 6. 2. Recommended condition for wave soldering Process Conditions Temperature Time Preheating 120°C to 150°C 60sec MAX Soldering 260°C ± 3°C 12sec MAX (Notice) Soldering time is provided for total soldering time in case of dual wave soldering. 6. 2. 1. Notes for wave soldering (1) Do not use other soldering methods with wave soldering. (2) Recommend to clean the board to eliminate flux, solder waste, and other impurities for reliability, after soldering. (3) Optimize soldering condition to prevent solder bridging. 6. 3. Recommended condition for solder iron Recommended condition for solder iron -Solder iron temperature : 380°C or less -Mounting time : 4sec or less REV. H TSZ22111・05・002 SPECIFICATION No.:TSZ02201-SQFP-4 PRODUCTS TYPE Semiconductor Jisso Information for SQFP < Shipping box dimensions > Quantity (pcs) Pakcage Dehydrated weight dimensions ing SQFP56 1000 130 510 0.53 500 3 2 70 SQFP80 75 500 2 75 290 290 1.26 SQFP100 200 200 SQFP160C SQFP-T52 SQFP-T64 240 1000 1000 5 75 140 338 1.85 5.68 3 3 70 70 130 130 510 510 0.36 0.51 SQFP-T80 500 2 75 200 290 0.68 SQFP-T80C 500 2 75 200 290 SQFP-T100 500 2 75 200 290 0.69 1.49 (SQFP-T52,T64) 216.5 Ｐ=20.0×9 = 180.0 18.0 216.0 Ｐ=20.0×9 = 180.0 (SQFP80,-T80,T80C) 5.4 5.4 116.0 1pin 116.3 Ｐ=20.0×4 = 80.018.0 18.0 (all dimensions in mm) Ｐ=20.0×4 = 80.018.0 (SQFP56) (SQFP100,-T100) 256.0 20.0 256.0 P=24.0×9＝216.0 6.0 6.0 166.0 P=30.0×4 = 120.0 23.0 1pin P=24.0×9 = 216.0 166.0 P=30.0×4 = 120.0 23.0 1pin 20.0 (SQFP160C) 322.6 315.0 P=37.02×7 = 259.14 7.62 P=37.02×2 =74.0430.93 135.9 1pin 27.93 REV. H TSZ22111・05・002 4/4 < Dehydrated weight > box dimensions Max.Shipping Shipping (all dimension in mm) Quantity A B C (box) 〈 Tray Dimension and Pin#1/ Tray Orientation > 1pin PAGE SPECIFICATION No.:TSZ02201-SQFP-4 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. 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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001