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Datasheet
Sound Processor with Built-in 2-band Equalizer
BD37515FS
Key Specifications
General Description
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BD37515FS is a sound processor with built-in 2-band
equalizer for car audio. The functions are 4ch stereo
input selector, input-gain control, main volume,
loudness, and 5ch fader volume. Moreover, its
“Advanced switch circuit”, which is an original ROHM
technology, can reduce various switching noise (ex.
No-signal, low frequency like 20Hz & large signal
inputs). “Advanced switch” makes control of
microcomputer easier, supporting the construction of a
high quality car audio system.
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Features
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Reduce switching noise of input gain control, mute,
main volume, fader volume, bass, treble, loudness
by using advanced switch circuit.
Built-in 1 differential input selector and 3
single-ended input selectors
Built-in ground isolation amplifier inputs, ideal for
external stereo input.
Built-in input gain controller reduces switching
noise for volume of a portable audio input.
Decrease the number of external components due
to built-in 2-band equalizer filter, LPF for
subwoofer, and loudness filter. Also, it is possible
to control Q, Gv, fo of 2-band equalizer, fc of LPF
for subwoofer and Gv of loudness using I2C BUS
control.
It is possible to adjust the gain of the bass and
treble up to ±20dB with 1 dB step gain adjustment.
It is equipped with output terminals of Subwoofer.
Energy-saving design resulting in low current
consumption, by utilizing the Bi-CMOS process. It
has the advantage in quality over scaling down the
power heat control of the internal regulators.
Input terminals and output terminals are organized
and separately laid out to keep the signal flow in
one direction which results in simpler and smaller
PCB layout.
It is possible to control the I2C BUS by 3.3V / 5V.
○Product structure:Silicon monolithic integrated circuit
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
Power Supply Voltage Range:
Circuit Current (No Signal):
Total harmonic Distortion 1:
(FRONT,REAR)
Total Harmonic Distortion 2:
(SUBWOOFER)
Maximum Input Voltage:
Cross-talk Between Selectors:
Volume Control Range:
Output Noise Voltage1:
(FRONT,REAR)
Output Noise Voltage2:
(SUBWOOFER)
Residual Output Noise voltage:
Operating Temperature Range:
Package
7.0V to 9.5V
38mA(Typ)
0.001%(Typ)
0.002% (Typ)
2.3Vrms (Typ)
-100dB (Typ)
+15dB to -79dB
3.8µVrms (Typ)
4.8µVrms (Typ)
1.8µVrms (Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
SSOP-A20
8.70mm x 7.80mm x 2.01mm
Applications
It is optimal for use in car audio systems. It can also be
used for audio equipment of mini Compo, micro Compo,
TV, etc.
○This product has no designed protection against radioactive rays
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TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Typical Application Circuit
BD37515FS
Unit
R : [Ω]
C : [F]
Pin Configuration
TOP VIEW
FIL 1
20 GND
A1 2
19 SDA
A2 3
18 SCL
B1 4
17 VCC
B2 5
16 OUTF1
C1 6
15 OUTF2
C2 7
14 OUTR1
DP1 8
13 OUTR2
DN 9
12 OUTS
DP2 10
11 MUTE
Pin Descriptions
1
Pin
Name
FIL
VCC/2 terminal
11
MUTE
External compulsory mute terminal
2
A1
A input terminal of 1ch
12
OUTS
Subwoofer output terminal
3
A2
A input terminal of 2ch
13
OUTR2
Rear output terminal of 2ch
4
B1
B input terminal of 1ch
14
OUTR1
Rear output terminal of 1ch
5
B2
B input terminal of 2ch
15
OUTF2
Front output terminal of 2ch
6
C1
C input terminal of 1ch
16
OUTF1
Front output terminal of 1ch
7
C2
C input terminal of 2ch
17
VCC
Power supply terminal
8
DP1
D positive input terminal of 1ch
18
SCL
I2C Communication clock terminal
9
DN
D negative input terminal
19
SDA
I2C Communication data terminal
10
DP2
D positive input terminal of 2ch
20
GND
GND terminal
Pin No.
Description
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TSZ22111・15・001
2/27
Pin No.
Pin Name
Description
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Block Diagram
17
16
15
14
13
Fader★
18
Fader★
19
Fader★
20
12
11
VCC
GND
I2C BUS LOGIC
Fader★
Fader★
■Fader
Gain:+15dB
to -79dB/1dB step
Gain:+15dB~-79dB/1dB
step
★no pop noise
■LPF
fc=55/85/120/160Hz
■Loudness
20dB
to 0dB/1dB step
20dB~0dB/1dB
step
★no pop noise
・f0=800
・Hicut1/2/3/4
■2 Band P-EQ (Tone control)
Gain:+20dB~-20dB/1dB
Gain:+20dB
to -20dB/1dB
★no pop noise
・Bass:f0=60/80/100/120Hz,
Q=0.5/1.0/1.5/2.0
・Treble:f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain+15dB
to -79dB/1dB step
Gain:+15dB~-79dB/1dB
step
★no pop noise
■Input Gain
Gain:+20dB
to 0dB/1dB step
Gain:+20dB~0dB/1dB
step
★no pop noise
LPF
★Loudness
★2 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (3 single-end and 1 stereo ISO)
GND
ISO amp
VCC/2
1
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
100k
2
100k
3
100k
4
100k
5
3/27
250k
6
250k
7
GND
ISO amp
250k
8
250k
250k
9
10
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
Symbol
VCC
VIN
Pd
Tstg
Rating
10.0
VCC+0.3 to GND-0.3
0.94 (Note)
-55 to +150
Unit
V
V
W
°C
(Note) This value derates by 7.5mW/°C for Ta=25°C or more when ROHM standard board is used.
Thermal resistance θja = 133.3(°C/W)
ROHM Standard board
Size : 70 x 70 x 1.6(mm3)
Material : A FR4 grass epoxy board(3% or less of copper foil area)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Temperature
Symbol
VCC
Topr
Min
7.0
-40
Typ
-
Max
9.5
+85
Unit
V
V
Electrical Characteristics
GENERAL
BLOCK
(Unless specified otherwise, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, A input, Input gain 0dB,
Mute OFF, Volume 0dB, Tone control 0dB, Loudness 0dB, LPF OFF, Fader 0dB)
Limit
Parameter
Symbol
Unit
Conditions
Typ
Min
Max
Circuit Current
IQ
-
38
48
mA
No signal
Voltage Gain
Channel Balance
Total Harmonic Distortion 1
(FRONT,REAR)
Total Harmonic Distortion 2
(SUBWOOFER)
Output Noise Voltage 1
(FRONT,REAR) *
Output Noise Voltage 2
(SUBWOOFER) *
GV
CB
-1.5
-1.5
0
0
+1.5
+1.5
dB
dB
THD+N1
-
0.001
0.05
%
THD+N2
-
0.002
0.05
%
VNO1
-
3.8
15
μVrms
VNO2
-
4.8
15
μVrms
Residual Output Noise Voltage *
VNOR
-
1.8
10
μVrms
Cross-talk Between Channels *
CTC
-
-100
-90
dB
RR
-
-70
-40
dB
GV=20log(VOUT/VIN)
CB = GV1-GV2
VOUT=1Vrms
BW=400Hz-30KHz
VOUT=1Vrms
BW=400Hz-30KHz
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
BW = IHF-A
Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
f=1KHz
VRR=100mVrms
RR=20log(VCC IN/VOUT)
Input Impedance(A,B)
Input Impedance (C,D)
RIN_S
RIN_D
70
175
100
250
130
325
kΩ
kΩ
Maximum Input Voltage
VIM
2.1
2.3
-
Vrms
Cross-talk Between Selectors *
CTS
-
-100
-90
dB
Common Mode Rejection Ratio *
CMRR
50
65
-
dB
Minimum Input Gain
GIN_MIN
-2
0
+2
dB
Maximum Input Gain
GIN_MAX
+18
+20
+22
dB
Gain Set Error
GIN_ERR
-2
0
+2
dB
INPUT GAIN
INPUT SELECTOR
Ripple Rejection
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TSZ22111・15・001
4/27
VIM at THD+N(VOUT)=1%
BW=400Hz-30KHz
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
DP1 and DN input
DP2 and DN input
CMRR=20log(VIN/VOUT)
BW = IHF-A
Input gain 0dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Input gain 20dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
GAIN=+1dB to +20dB
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Electrical Characteristics - continued
LOUDNESS
FADER / SUBWOOFER
TREBLE
BASS
VOLUME
MUTE
BLOCK
(Unless specified otherwise, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, A input, Input gain 0dB,
Mute OFF, Volume 0dB, Tone control 0dB, Loudness 0dB, LPF OFF, Fader 0dB)
Limit
Parameter
Symbol
Unit
Conditions
Typ
Min
Max
Mute ON
GMUTE=20log(VOUT/VIN)
BW = IHF-A
Mute Attenuation*
GMUTE
-
-105
-85
dB
Maximum Gain
GV_MAX
+13
+15
+17
dB
Maximum Attenuation*
GV_MIN
-
-100
-85
dB
Attenuation Set Error 1
Attenuation Set Error 2
Attenuation Set Error 3
GV_ERR1
GV_ERR2
GV_ERR3
-2
-3
-4
0
0
0
+2
+3
+4
dB
dB
dB
Maximum Boost Gain
GB_BST
+18
+20
+22
dB
Maximum Cut Gain
GB_CUT
-22
-20
-18
dB
Gain Set Error
GB_ERR
-2
0
+2
dB
Maximum Boost Gain
GT_BST
+18
+20
+22
dB
Maximum Cut Gain
GT_CUT
-23
-20
-17
dB
Gain Set Error
GT_ERR
-2
0
+2
dB
Maximum Boost Gain
GF_BST
+13
+15
+17
dB
Maximum Attenuation*
GF_MIN
-
-100
-90
dB
Gain Set Error
Attenuation Set Error 1
Attenuation Set Error 2
Attenuation Set Error 3
GF_ERR
GF_ERR1
GF_ERR2
GF_ERR3
-2
-2
-3
-4
0
0
0
0
+2
+2
+3
+4
dB
dB
dB
dB
Fader = -∞dB
GF=20log(VOUT/VIN)
BW = IHF-A
Gain=+1dB to +15dB
ATT=0dB to -15dB
ATT=-16dB to -47dB
ATT=-48dB to -79dB
Output Impedance
ROUT
-
-
50
Ω
VIN =100mVrms
Maximum Output Voltage
VOM
2
2.2
-
Vrms
Maximum Gain
GL_MAX
+17
+20
+23
dB
Gain Set Error
GL_ERR
-2
0
+2
dB
Volume = 15dB
VIN=100mVrms
GV=20log(VOUT/VIN)
Volume = -∞dB
GV=20log(VOUT/VIN)
BW = IHF-A
GAIN & ATT=+15dB to -15dB
ATT=-16dB to -47dB
ATT=-48dB to -79dB
GAIN=+20dB f=100Hz
VIN=100mVrms
GB=20log (VOUT/VIN)
Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain=+20dB to -20dB f=100Hz
Gain=+20dB f=10kHz
VIN=100mVrms
GT=20log (VOUT/VIN)
GAIN=-20dB f=10kHz
VIN=2Vrms
GT=20log (VOUT/VIN)
Gain=+20dB to -20dB f=10kHz
Fader=15dB
VIN=100mVrms
GF=20log(VOUT/VIN)
THD+N=1%
BW=400Hz-30KHz
Gain 20dB
VIN=100mVrms
GL=20log(VOUT/VIN)
GAIN=+20dB to +1dB
VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
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TSZ22111・15・001
5/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Typical Performance Curves
10
20
10
0
0
2
4
6
8
1kHz
100Hz
0.1
0.1
0.01
0.01
0.001
0.001
10
0.1
1
10
Vout (V)
Figure 2. Total Harmonic Distortion vs Output Voltage
Figure 1. Quiescent Current vs Supply Voltage
5
4
25
BASS GAIN : -20dB to +20dB
/1dB step
fo : 60Hz Q : 0.5
20
15
Gain=0dB
Gain [dB]
Gain (dB)
0.001
0.01
Output Voltage : VOUT [Vrms]
SupplyVCC[V]
Voltage : VCC [V]
3
2
1
0
-1
-2
-3
-4
-5
1
10kHz
Vout
Iq[mA]
30
1
THD+N [%]
THD+N (%)
40
10
VIN [Vrms]
Quiescent Current : IQ [mA]
50
10
5
0
-5
-10
-15
-20
10
100
1k
10k
-25
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency [Hz]
Figure 3. Gain vs Frequency
Figure 4. Bass Gain vs Frequency
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TSZ22111・15・001
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TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
25
20
15
fo : 60/80/100/120Hz
BASS GAIN : ±20dB
Q : 0.5
Gain [dB]
Gain [dB]
Typical Performance Curves - continued
10
5
0
-5
-10
-15
-20
-25
10
100
1k
10k
Frequency [Hz]
25
20
15
10
5
0
-5
-10
-15
-20
-25
10
100k
Figure 5. Bass fo vs Frequency
(Bass fo is Changeable)
20
Gain [dB]
(dB)
Gain
15
10
100
1k
10k
Frequency [Hz]
100k
Figure 6. B Bass Q vs Frequency
(Bass Q is Changeable)
25
TREBLE GAIN:-20dB to +20dB
/1dB step
fo : 7.5kHz Q : 0.75
fo : 7.5k/10k/12.5k/15kHz
TREBLE GAIN : ±20dB
Q : 0.75
20
15
Gain [dB]
25
Q : 0.5/1/1.5/2
BASS GAIN : ±20dB
fo : 60Hz
5
0
-5
-10
10
5
0
-5
-10
-15
-15
-20
-25
-20
-25
10
100
1k
10k
10
100k
1k
10k
100k
Frequency [Hz]
Frequency [Hz]
Frequency (Hz)
Figure 7. Treble Gain vs Frequency
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TSZ22111・15・001
100
Figure 8. Treble fo vs Frequency
(Treble fo is Changeable)
7/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Typical Performance Curves - continued
1000
25
出力雑音電圧[uVrms]
Q : 0.75/1.25
TREBLE GAIN : ±20dB
fo : 7.5kHz
Output Noise [µVrms]
20
15
Gain [dB]
Gain (dB)
10
5
0
-5
-10
-15
-20
-25
Din-Audio
IHF-A
100
10
1
-80 -70 -60 -50 -40 -30 -20 -10 0
10
100
1k
10k
10 20
Volume Gain[dB]
Volume
Gain [db]
100k
Frequency [Hz]
Frequency (Hz)
Figure 10. Output Noise vs Volume Gain
Figure 9. Treble Q vs Frequency
(Treble Q is Changeable)
1000
DIN-Audio
IHF-A
Output
Noise [µVrms]
出力雑音電圧
[uVrms]
Output
Noise [µVrms]
出力雑音電圧
[uVrms]
1000
100
10
DIN-Audio
IHF-A
100
10
1
1
-20 -15 -10 -5
0
5
-20 -15 -10 -5 0 5 10 15 20
Treble
[dB]
TrebleGain
Gain
[db]
10 15 20
BassGain
Gain[db]
[dB]
Bass
Figure 11. Output Noise vs Bass Gain
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TSZ22111・15・001
Figure 12. Output Noise vs Treble Gain
8/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Typical Performance Curves - continued
2.5
0
Output Voltage
: VOUT [Vrms]
最大出力[Vrms]
Gain[dB]
(dB)
Gain
-10
-20
-30
-40
-50
-60
-70
10
100
1k
10k
Frequency [Hz]
100k
2.0
1.5
1.0
0.5
0.0
100
1000
10000
RLOAD [ohm]
出力負荷[ohm]
100000
Frequency (Hz)
Figure 13. CMRR vs Frequency
Figure 14. Output Voltage vs RLOAD
Figure 15. Advanced Switch 1
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TSZ22111・15・001
Figure 16. Advanced Switch 2
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TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Timing Chart
Control Signal Specification
(1) Electrical Specifications and Timing for Bus Lines and I/O Stage
SDA
tBUF
tLOW
tHD;STAT
tF
tR
tSP
SCL
tHD;STA
P
tHD;DAT
tSU;DAT
tHIGH
tSU;STAT
tSU;STOT
Sr
S
P
Figure 17. I2C-bus Signal Timing Diagram
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices
(Unless specified otherwise, Ta=25°C, VCC=8.5V)
Parameter
1
2
3
4
5
6
7
8
9
Symbol
SCL clock frequency
Bus free time between a STOP and START condition
Hold time (repeated) START condition. After this period, the first clock
pulse is generated
LOW period of the SCL clock
HIGH period of the SCL clock
Set-up time for a repeated START condition
Data hold time:
Data set-up time
Set-up time for STOP condition
fSCL
tBUF
Fast-mode I2C-bus
Min
Max
400
0
1.3
-
Unit
kHz
μS
tHD;STA
0.6
-
μS
tLOW
tHIGH
1.3
0.6
0.6
0.06 (Note)
120
0.6
-
-
-
-
-
-
μS
μS
μS
μS
ns
μS
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
All values referred to VIH Min and VIL Max Levels (see Table 2).
(Note) To avoid sending right after the fall-edge of SCL (VIH min of the SCL signal), the transmitting device should set a hold time of 300ns or more for the SDA
signal.
For 7(tHD;DAT), 8(tSU;DAT), make the setup in which the margin is fully in.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Parameter
10
11
12
13
14
Symbol
LOW level input voltage:
HIGH level input voltage:
Pulse width of spikes which must be suppressed by the input filter.
LOW level output voltage: at 3mA sink current
Input current of each I/O pin with an input voltage between 0.4V and 4.5V.
tHD;STA
tHD;STA
:2µs
:2us
tHD;DAT
tHD;DAT
:1µs
:1us
VIL
VIH
tSP
VOL1
II
tSU;DAT
tSU;DAT
:1µs
:1us
Fast-mode devices
Min
Max
-0.3
+1
2.3
5
0
50
0
0.4
-10
+10
Unit
V
V
ns
V
μA
tSU;STO
tSU;STO
:2µs
:2us
SCL
SCL
tBUF
tBUF
:4µs
:4us
tLOW
tLOW
:3µs
:3us
tHIGH
tHIGH
:1µs
:1us
SDA
SDA
SCL
: 250kHz
SCLclock
clockfrequency
frequency:250kHz
Figure 18. I2C Data Transmission Command Timing Diagram
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TSZ22111・15・001
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TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
(2) I2C BUS FORMAT
S
1bit
MSB
LSB
Slave Address
8bit
S
Slave Address
A
Select Address
Data
P
MSB
LSB
MSB
LSB
A
Select Address
A
Data
A
P
1bit
8bit
1bit
8bit
1bit 1bit
= Start condition (Recognition of start bit)
= Recognition of slave address. The first 7 bits correspond to the slave address.
The least significant bit is “L” which corresponds to write mode.
= ACKNOWLEDGE bit (Recognition of acknowledgement)
= Select address corresponding to volume, bass or treble.
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
(3) I2C BUS Interface Protocol
(a) Basic format
S
Slave Address
A
Select Address
A
Data
A
MSB
LSB
MSB
LSB
MSB
LSB
P
(b) Automatic Increment (Select Address increases (+1) according to the number of data.)
S
Slave Address
A
Select Address
A
Data1
A
Data2
A ・・・・
MSB
LSB
MSB
LSB
MSB
LSB MSB
LSB
(Example) ① Data1 shall be set as data of address specified by Select Address.
② Data2 shall be set as data of address specified by Select Address +1.
③ DataN shall be set as data of address specified by Select Address +N-1.
DataN
MSB
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.)
S Slave Address A
Select Address1 A Data
A Select Address 2 A Data
A
MSB
LSB
MSB
LSB MSB LSB
MSB
LSB MSB LSB
(Note) If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
A
P
LSB
P
(4) Slave Address
MSB
A6
1
A5
0
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
A4
0
A3
0
A2
0
11/27
A1
0
A0
0
LSB
R/W
0
80H
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
(5) Select Address & Data
Select
Address
(hex)
Items
Initial setup 1
01
Initial setup 2
02
Initial setup 3
Input Selector
03
05
Input gain
06
Volume gain
Fader 1ch Front
Fader 2ch Front
Fader 1ch Rear
Fader 2ch Rear
Fader Subwoofer
Bass setup
Test mode 1
Treble setup
20
28
29
2A
2B
2C
41
44
47
Bass gain
51
Test mode 2
54
Treble gain
57
Loudness Gain
System Reset
75
FE
MSB
D7
Advance
d switch
ON/OFF
LPF
Phase
0 ゚/180 ゚
0
0
Mute
ON/OFF
0
0
0
Bass
Boost/
Cut
1
Treble
Boost/
Cut
0
1
Data
D6
0
D5
D4
Advanced switch time
of Input Gain/Volume
Tone/Fader/Loudness
LSB
D3
D2
0
0
Advanced switch
time of Mute
Subwoofer LPF fc
0
0
0
0
0
0
0
0
0
1
0
0
Input selector
0
0
0
0
0
Volume Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Bass fo
0
0
0
0
Treble fo
0
0
0
0
0
0
0
Loudness Hicut
0
0
D1
D0
0
1
Input Gain
0
0
0
Bass Q
0
0
0
Treble Q
0
0
Loudness Gain
0
0
1
Bass Gain
0
0
0
Treble Gain
0
0
Advanced switch
Note
1. The Advanced Switch works in the latch part while changing from one function to another.
2. Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as
shown below.
→01→02→03→05→06→20→28→29→2A→2B→2C
→41→44→47→51→54→57→75
3. For the function of Input Selector etc, Advanced Switch is not used. Therefore, please apply mute on the set side
when changing these settings.
4. When using mute function of this IC at the time of changing input selector, please switch mute ON/OFF while
waiting for advanced-mute time.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Select address 01 (hex)
Time
MSB
D7
0.6msec
1.0msec
1.4msec
3.2msec
Advanced
Switch
ON/OFF
Time
D6
0
MSB
D7
D6
4.7 msec
7.1 msec
11.2 msec
14.4 msec
Advanced
Switch
ON/OFF
0
Mode
MSB
D7
OFF
0
ON
1
D6
0
Advanced switch time of Mute
D4
D3
D2
D5
Advanced switch time
of Input gain/Volume
Tone/Fader/Loudness
0
0
Advanced switch time of
Input gain/Volume/Tone/Fader/Loudness
D5
D4
D3
D2
0
0
0
1
0
0
1
0
1
1
Advanced switch ON/OFF
D5
D4
D3
Advanced switch time
of Input gain/Volume
0
Tone/Fader/Loudness
D2
0
LSB
D0
0
1
0
1
D1
0
0
1
1
LSB
D1
D0
Advanced switch
Time of Mute
LSB
D0
D1
Advanced switch
Time of Mute
Select address 02(hex)
fc
MSB
D7
OFF
55Hz
85Hz
120Hz
160Hz
Prohibition
LPF
Phase
Phase
0°
180°
MSB
D7
0
1
D6
D5
0
0
D6
D5
0
0
Subwoofer LPF fc
D4
D3
0
0
LPF Phase
D4
D3
0
0
D2
0
0
0
0
1
D1
0
0
1
1
0
Other setting
D2
D1
LSB
D0
0
1
0
1
0
LSB
D0
Subwoofer LPF fc
Select address 05(hex)
Mode
MSB
D7
D6
D5
Initial
A
B
C
D diff
Input SHORT
Prohibition
0
0
0
Input Selector
D4
D3
0
0
0
0
0
0
1
D2
D1
0
0
0
0
0
1
0
1
1
1
0
0
Other setting
LSB
D0
0
1
0
1
1
1
Input SHORT : The input impedance of each input terminal is lowered from 100kΩ(TYP) to 6 kΩ(TYP).
(For quick charge of coupling capacitor)
: Initial condition
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Select address 06 (hex)
Gain
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
MSB
D7
Mute
ON/OFF
D6
D5
0
0
Input Gain
D3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
1
:
:
1
1
D4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
Prohibition
Mode
OFF
ON
MSB
D7
0
1
D6
D5
0
0
Select address 20, 28, 29, 2A, 2B, 2C (hex)
MSB
Gain & ATT
D7
D6
0
0
0
0
Prohibition
:
:
0
1
15dB
0
1
14dB
0
1
13dB
0
1
:
:
:
D5
0
0
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
:
1
:
1
D2
D1
LSB
D0
D1
0
0
LSB
D0
0
1
Input Gain
Vol. Fader Gain / Attenuation
D4
D3
D2
0
0
0
0
0
0
:
1
1
1
1
:
1
1
1
1
:
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
0
0
0
1
:
1
1
1
0
:
1
1
1
0
:
0
1
1
0
:
1
0
1
0
:
1
1
:
1
1
:
1
1
:
1
1
:
0
1
-77dB
-78dB
-79dB
1
1
1
1
1
1
1
1
:
0
0
0
0
Prohibition
:
1
1
:
1
1
:
1
1
-∞dB
Mute ON/OFF
D4
D3
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
: Initial condition
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Select address 41(hex)
Q factor
MSB
D7
D6
0.5
1.0
1.5
2.0
0
0
fo
MSB
D7
D6
60Hz
80Hz
100Hz
120Hz
0
0
Bass Q Factor
D4
D3
D5
Bass fo
D2
0
0
D3
D2
0
0
LSB
D0
0
1
0
1
D1
0
0
1
1
Bass fo
D5
0
0
1
1
D4
0
1
0
1
LSB
D0
D1
Bass
Q factor
Select address 47 (hex)
Q factor
MSB
D7
D6
0.75
1.25
0
0
fo
MSB
D7
D6
7.5kHz
10kHz
12.5kHz
15kHz
0
0
Treble Q Factor
D4
D3
D5
Treble fo
0
Treble fo
D4
D3
0
1
0
0
1
D5
0
0
1
1
D2
D1
0
0
D2
D1
0
0
LSB
D0
0
1
LSB
D0
Treble
Q factor
: Initial condition
Select address 51, 57 (hex)
MSB
Gain
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
Bass/
11dB
Treble
12dB
Boost
13dB
/cut
14dB
15dB
16dB
17dB
18dB
19dB
20dB
D6
D5
0
0
Bass/ Treble Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
0
:
1
1
Prohibition
Mode
Boost
Cut
MSB
D7
0
1
D6
D5
0
0
:
1
1
Bass/ Treble Boost/Cut
D4
D3
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
1
:
1
1
:
0
1
D2
D1
LSB
D0
Bass/Treble Gain
: Initial condition
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Select address 75 (hex)
Mode
MSB
D7
Hicut1
Hicut2
Hicut3
Hicut4
0
Gain
MSB
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
0
D6
0
0
1
1
D5
0
1
0
1
D6
D5
Loudness Hicut
D4
D3
D1
LSB
D0
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
:
1
:
1
D2
Loudness Gain
Loudness Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
0
Loudness Hicut
:
1
Prohibition
:
1
: Initial condition
(6) About Power ON Reset
Built-in IC initialization is made during power ON of the supply voltage. Please send initial data to all
addresses at supply voltage on. And please turn ON mute at the set side until this initial data is sent.
Parameter
Rise Time of VCC
VCC Voltage of Release
Power ON Reset
Limit
Symbol
Min
Typ
Max
Unit
tRISE
33
-
-
µsec
VPOR
-
4.1
-
V
Conditions
VCC rise time from 0V to 5V
(7) About External Compulsory Mute Terminal
It is possible to force mute externally by setting an input voltage to the MUTE terminal.
Mute Voltage Condition
GND to 1.0V
2.3V to VCC
Mode
MUTE ON
MUTE OFF
Establish the voltage of MUTE in the condition to be defined.
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
Application Information
1. Function and Specifications
Function
Input selector
Input gain
Mute
Volume
Bass
Treble
Fader
Loudness
LPF
Specifications
・Stereo 3 input
・Differential 1 input
・+20dB to 0dB (1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
・Possible to use “Advanced switch” for prevention of switching noise.
・+15dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・ +20dB to -20dB (1dB step)
・Q=0.5, 1, 1.5, 2
・Possible to use “Advanced switch” at changing gain
・fo=60, 80, 100, 120Hz
・ +20dB to -20dB (1dB step)
・Q=0.75, 1.25
・Possible to use “Advanced switch” at changing gain
・fo=7.5k, 10k, 12.5k, 15kHz
・+15dB to -79dB(1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・20dB to 0dB(1dB step)
・fo=800Hz
・Possible to use “Advanced switch” for prevention of switching noise.
・fc=55/85/120/160Hz, pass
・Phase shift (0°/180°)
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/27
TSZ02201-0C2C0E100450-1-2
16.Dec.2015 Rev.001
BD37515FS
2. Volume / Fader Volume Attenuation Data
(dB)
D7 D6 D5 D4 D3 D2
+15
0
1
1
1
0
0
+14
0
1
1
1
0
0
+13
0
1
1
1
0
0
+12
0
1
1
1
0
1
+11
0
1
1
1
0
1
+10
0
1
1
1
0
1
+9
0
1
1
1
0
1
+8
0
1
1
1
1
0
+7
0
1
1
1
1
0
+6
0
1
1
1
1
0
+5
0
1
1
1
1
0
+4
0
1
1
1
1
1
+3
0
1
1
1
1
1
+2
0
1
1
1
1
1
+1
0
1
1
1
1
1
0
1
0
0
0
0
0
-1
1
0
0
0
0
0
-2
1
0
0
0
0
0
-3
1
0
0
0
0
0
-4
1
0
0
0
0
1
-5
1
0
0
0
0
1
-6
1
0
0
0
0
1
-7
1
0
0
0
0
1
-8
1
0
0
0
1
0
-9
1
0
0
0
1
0
-10
1
0
0
0
1
0
-11
1
0
0
0
1
0
-12
1
0
0
0
1
1
-13
1
0
0
0
1
1
-14
1
0
0
0
1
1
-15
1
0
0
0
1
1
-16
1
0
0
1
0
0
-17
1
0
0
1
0
0
-18
1
0
0
1
0
0
-19
1
0
0
1
0
0
-20
1
0
0
1
0
1
-21
1
0
0
1
0
1
-22
1
0
0
1
0
1
-23
1
0
0
1
0
1
-24
1
0
0
1
1
0
-25
1
0
0
1
1
0
-26
1
0
0
1
1
0
-27
1
0
0
1
1
0
-28
1
0
0
1
1
1
-29
1
0
0
1
1
1
-30
1
0
0
1
1
1
-31
1
0
0
1
1
1
-32
1
0
1
0
0
0
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
(dB)
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
D7
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D5
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D3
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
D2
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
:Initial condition
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BD37515FS
3.
Application Circuit
SDA
GND
OUTF1 OUTF2 OUTR1 OUTR2
VCC
SCL
14
13
2.2K
11
Fader★
Fader★
12
15
Fader★
16
17
18
19
MUTE
10μ
10μ
10μ
10μ
10μ
20
OUTS
0.1μ
10μ
VCC
GND
I2C BUS LOGIC
Fader★
Fader★
■Fader
Gain:+15dB
to -79dB/1dB step
step
Gain:+15dB~-79dB/1dB
★no pop noise
■LPF
fc=55/85/120/160Hz
■Loudness
20dB
to 0dB/1dB step
step
20dB~0dB/1dB
★no pop noise
・f0=800
・Hicut1/2/3/4
■2 Band P-EQ (Tone control)
Gain:+20dB~-20dB/1dB
Gain:+20dB
to -20dB/1dB
★no pop noise
・Bass:f0=60/80/100/120Hz,
Q=0.5/1.0/1.5/2.0
・Treble:f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain+15dB
to -79dB/1dB step
step
Gain:+15dB~-79dB/1dB
★no pop noise
■Input Gain
Gain:+20dB
to 0dB/1dB step
step
Gain:+20dB~0dB/1dB
★no pop noise
LPF
★Loudness
★2 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (3 single-end and 1 stereo ISO)
GND
ISO amp
GND
ISO amp
VCC/2
100k
10μ
2.2μ
2.2μ
2.2μ
2.2μ
2.2μ
2.2μ
2.2μ
250k
250k
10
9
8
7
6
5
4
3
2
1
250k
250k
250k
100k
100k
100k
10μ
2.2μ
FIL
Single1
Single2
Single3
Diff
Unit
R : [Ω]
C : [F]
Notes on wiring
① Please connect the decoupling capacitor of the power supply in the shortest possible distance to GND.
② GND lines should be one-point connected.
③ Wiring pattern of Digital should be away from that of Analog unit and cross-talk should not be acceptable.
④ SCL and SDA lines of I2C BUS should not be parallel if possible.
The lines should be shielded, if they are adjacent to each other.
⑤ Analog input lines should not be parallel if possible. The lines should be shielded, if they are adjacent to each other.
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BD37515FS
Power Dissipation
About the thermal design of the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy the device. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Reference data
SSOP-A20
Power Dissipation : Pd (W)
1.5
Measurement condition: ROHM Standard board
board Size : 70 x 70 x 1.6(mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
0.94W
1.0
θja = 133.3°C/W
0.5
0.0
0
25
50
75
85
100
125
150
Ambient Temperature : Ta (°C)
Figure 19. Temperature Derating Curve
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted
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BD37515FS
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
Terminal
voltage
2
A1
4.25
3
A2
4
B1
5
B2
Equivalent Circuit
Terminal Description
A terminal for signal input.
The input impedance is 100kΩ(typ).
VCC
100k
GND
6
C1
7
C2
4.25
VCC
A terminal for signal input.
The input impedance is 250kΩ(typ).
250k
GND
8
DP1
9
DN
10
DP2
4.25
Input terminal available to Single/Differential
mode.
The input impedance is 250kΩ(typ).
VCC
250k
GND
11
MUTE
―
A terminal for external compulsory mute.
If terminal voltage is High level, the mute is
OFF. And if the terminal voltage is Low level,
the mute is on.
VCC
1.65V
GND
12
OUTS
13
OUTR2
14
OUTR1
15
OUTF2
16
OUTF1
4.25
A terminal for fader and Subwoofer output.
VCC
GND
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
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BD37515FS
I/O Equivalent Circuits - continued
Terminal
No.
Terminal
Name
Terminal
voltage
17
VCC
8.5
18
SCL
-
Equivalent Circuit
Terminal
Description
Power supply terminal.
VCC
A terminal for clock input of I2C BUS
communication.
1.65V
GND
19
SDA
-
VCC
A terminal for data input of I2C BUS
communication.
1.65V
GND
20
GND
0
1
FIL
4.25
Ground terminal.
1/2 VCC terminal.
VCC
Voltage for reference bias of analog signal
system. The simple precharge circuit and
simple discharge circuit for an external
capacitor are built in.
50k
50k
GND
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD37515FS
Operational Notes – continued
12.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 20. Example of monolithic IC structure
13.
About a Signal Input Part
(a) About Input Coupling Capacitor Constant Value
In the input signal terminal, please decide the constant value of the input coupling capacitor C(F) that would be
sufficient to form an RC characterized HPF with input impedance R IN(Ω) inside the IC.
G〔dB〕
C〔F〕
0
RIN
〔Ω〕
A(f)
SSH
f〔Hz〕
INPUT
A f  
2 fCRIN 2
2
1  2 fCRIN 
(b) About the Input Selector SHORT
SHORT mode is the command which makes switch SSH =ON of input selector part so that the input impedance
RIN of all terminals becomes small. Switch SSH is OFF when SHORT command is not selected.
The constant time brought about by the small resistance inside and the capacitor outside the LSI becomes
small when this command is used. The charge time of the capacitor becomes short. Since SHORT mode turns
ON the switch of SSH and makes it low impedance, please use it at no signal condition.
14.
About Mute Terminal(Pin 11) when power supply is OFF
There should be no applied voltage across the Mute terminal (Pin 11) when power-supply is OFF.
A resistor (about 2.2kΩ) should be connected in series to Mute terminal in case a voltage is supplied to Mute terminal.
(Please refer Application Circuit Diagram.)
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BD37515FS
Ordering Information
B
D
3
7
5
1
5
Part Number
F
S
-
Package
FS: SSOP-A20
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-A20(TOP VIEW)
Part Number Marking
BD37515FS
LOT Number
1PIN MARK
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BD37515FS
Physical Dimension, Tape and Reel Information
Package Name
SSOP-A20
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SSOP-A20
Drawing No. : EX132-5001
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BD37515FS
Revision History
Date
16.Dec.2015
Revision
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Rev.001
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