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Datasheet
Small-sized Class-D Speaker Amplifiers
Filter-Less Class-D
Monaural Speaker Amplifier
BD27400GUL
General Description
Key Specifications

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BD27400GUL is a low voltage drive class-D monaural
speaker amplifier that was developed for cellular
telephones, mobile audio products and the others.
The LC filter of the speaker output is unnecessary and
the external part can compose a speaker amplifier at
three.
Because the efficiency is high and is low consumption
power with the class-D operation, it is the optimal for the
application of the battery drive.
Also Current consumption of 0μA when standby and fast
transitions from standby to active with little pop noise
make it is suitable for applications that switch repeatedly
between suspended and active.
Operating voltage Range:
Circuit current(No signal):
Circuit current(Stand by):
Output Power(RL=8Ω):
Output Power(RL=4Ω):
Start-up time:
Operating Temperature Range:
Package(s)
2.5V to 5.5V
2.9mA(Typ)
0.1μA(Typ)
0.85W(Typ)
2.5W(Typ)
3.0msec(Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
1.50mm x 1.50mm x 0.55mm
VCSP50L1
Features


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High output power
2.5W typ.(VDD=5V, RL=4Ω, THD+N=10%, BTL)
Very small package 9-Pin WL-CSP
Gain selectable by external resistor
LC Filter less
Protection circuitry
(Short protection, Thermal shutdown,
Under voltage lockout)
Analogue differential input / PWM digital output
Pop noise suppression circuitry
VCSP50L1
Applications
 Mobile phone, Smart phone, Digital video camera
+VBAT
Typical Application Circuit(s)
CS
VDD B1
STBY
C2
Ri
IN+
A1
Ri
INC1
Bias
B2 PVDD
OSC
OUTA3
PWM
GND A2
HBridge
OUT+
C3
B3 PGND
Figure 1. Application circuit
〇Product structure : Silicon monolithic integrated circuit
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Datasheet
BD27400GUL
Pin Configuration(s)
Bottom View
C
IN-
STBY
OUT+
B
VDD
PVDD
PGND
A
IN+
GND
OUT-
1
2
3
Figure.2 Pin configuration
Pin Description(s)
No.
Name
I/O
Function
A1
IN+
I
Positive input terminal
A2
GND
P
GND terminal
(Connect to PGND terminal)
A3
OUT-
O
Negative output terminal
B1
VDD
P
B2
PVDD
P
B3
PGND
P
C1
IN-
I
Negative input terminal
C2
STBY
I
Stand by control terminal
C3
OUT+
O
Positive output terminal
Power supply terminal
(Connect to PVDD terminal)
Power supply terminal
(Connect to VDD terminal)
Power GND terminal
(Connect to GND terminal)
※Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply.
VDD B1
Block Diagram(s)
B2 PVDD
STBY
C2
Bias
OSC
OUTA3
IN+
A1
PWM
INC1
GND A2
HBridge
OUT+
C3
B3 PGND
Figure.3 Block diagram
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Datasheet
BD27400GUL
Absolute Maximum Ratings(Ta = 25°C)
Parameter
Power Supply Voltage
Power Dissipation
Symbol
Rating
Unit
VDDmax
7.0
V
Pd
0.69
(Note 1)
W
Vstby
-0.3 to VDD+0.3
V
IN+, IN- Terminal Voltage Range
Vin
-0.3 to VDD+0.3
V
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum Junction Temperature
Tjmax
150
°C
Operating Temperature Range
Topr
-40 to +85
°C
STBY Terminal Input Voltage Range
(Note 1) Derating in done 5.52 mW/°C for operating above Ta≧25°C (Mount on 1-layer 50.0mm x 58.0mm x 1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions(Ta= -40°C to +85°C)
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VDD
2.5
3.6
5.5
V
Common Mode Input Voltage Range
VIC
+0.5
-
VDD-0.8
V
Electrical Characteristics(Unless otherwise specified Ta=25°C.VDD=3.6V.RL=8Ω.BTL Connection)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Circuit current (No signal)
ICC
-
2.9
5.4
mA
Active mode, No load
Circuit current (Standby)
ISTBY
-
0.1
-
µA
Standby mode
Output power 1
PO1
450
680
-
mW
8 Ω, f=1kHz, THD+N=1% *1
Output power 2
PO2
550
850
-
mW
8 Ω, f=1kHz, THD+N=10% *1
Output power 3
PO3
Gain
THD+N
2.5
300kΩ
Ri
0.18
315kΩ
Ri
-
W
V
V
%
4 Ω, f=1kHz, THD+N=10% *1
Voltage gain
285kΩ
Ri
-
Total harmonic distortion
Output noise voltage
BTL, RL=100kΩ
8 Ω, f=1kHz,0.4W
Vno
-
40
-
µVrms
Power supply ripple rejection ratio
PSRR
-
64
-
dB
A-weighting
0.1Vp-p, f=217Hz
Common mode rejection ratio
CMRR
-
55
-
dB
0.1Vp-p, f=217Hz
Input impedance
Zin
-
150
-
kΩ
Switching Frequency
fOSC
200
250
300
kHz
-
-
Start-up time
STBY
High level
threshold
Low level
voltage
STBY input impedance
Ton
1
3
5
msec
VSTBYH
1.4
-
VDD
V
Active mode
VSTBYL
0
-
0.4
V
Stand by mode
RSTBY
210
300
390
kΩ
*1: Band-width = 400~30kHz, BTL=Bridge Tied Load (Voltage between A3-C3.)
≪Gain adjustment≫
Please use a gain adjustment below 26dB (Input Resistor Ri≥15kΩ)
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BD27400GUL
Typical Performance Curves
Figure.5
Figure.4
Figure.7
Figure.6
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BD27400GUL
Typical Performance Curves
- continued
Figure.9
Figure.8
Figure.10
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Figure.11
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BD27400GUL
Typical Performance Curves
- continued
Figure.12
Figure.13
Figure.14
Figure.15
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BD27400GUL
Typical Performance Curves
- continued
Figure.16
Figure.17
Figure.19
Figure.18
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BD27400GUL
Typical Performance Curves
- continued
Figure.20
Figure.21
Figure.22
Figure.23
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BD27400GUL
Typical Performance Curves
- continued
Figure.25
Figure.24
Figure.27
Figure.26
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BD27400GUL
Typical Performance Curves
- continued
Figure.28
Figure.29
Figure.30
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Figure.31
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BD27400GUL
Typical Performance Curves
- continued
Figure.32
Figure.33
Figure.34
Figure.35
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BD27400GUL
Application Example(s)
Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply.
(1)Differential input
+VBAT
CS
VDD B1
H:Active
L:STBY
STBY
C2
STBY
control
+
Ri
IN+
A1
Ri
INC1
Bias
B2 PVDD
OSC
OUTA3
-
HBridge
PWM
Differential
Input
+
OUT+
C3
-
GND A2
Figure.36
B3 PGND
Differential input for mobile phone
+VBAT
CS
VDD B1
H:Active
STBY
C2
STBY
control
L:STBY
+
Ci
Ri
Bias
OSC
OUTA3
IN+
A1
Differential
Input
PWM
+
Ci
Ri
B2 PVDD
INC1
HBridge
OUT+
C3
-
GND A2
Figure.37
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B3 PGND
Differential input with coupling input capacitors
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BD27400GUL
(2)Single-Ended input
+VBAT
CS
VDD B1
H:Active
L:STBY
Single End
Input
STBY
C2
STBY
control
Ci
Ri
Bias
OSC
OUTA3
IN+
A1
PWM
Ci
Ri
B2 PVDD
INC1
GND A2
HBridge
OUT+
C3
B3 PGND
Figure.38 Single-Ended input
・It is possible to input audio signal from IN+ terminal, or IN- terminal when single-end mode.
・Don't make the input terminal (no input terminal, C1 terminal in above figure) open.
Pop noise may be caused when the power supply starts up or the standby is released, if input terminal is opened.
・Connect non signal input side(C1 in above figure)to GND through Ci, and make the value of Ri, Ci of non signal input side
same as the value of signal input side (A1 in above figure).
Pop noise may be caused if each values of Ci, Ri are different, because the values of Ci, Ri decide the rise of Input terminal
DC voltage when start-up. Difference of input terminal DC voltages may make pop noise.
・Make the value of Ri, Ci of non signal input side same as the value of signal input side when making LPF(Low Pass Filter) at
previous stage of Ci.
・Put external input resistor Ri as close as possible to this IC.
Selection of Components Externally Connected
・Description of External components
① Input coupling capacitor (Ci) and input resistor (Ri).
It makes an Input coupling capacitor 0.1uF. Input impedance is 150kΩ.
It sets cutoff frequency fc by the following formula by input coupling capacitor Ci and input impedance Ri.
fc 
1
[Hz]
2π  Ri  Ci
In case of Ri=150kΩ, Ci=0.1uF, it becomes fc = about 10 Hz.
② Power decoupling capacitor (CS)
It makes a power decoupling capacitor 10 μF.
When making capacitance of the power decoupling capacitor, there is an influence in the Audio characteristic.
When making small, careful for the Audio characteristic at the actual application.
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BD27400GUL
Power Dissipation
Power dissipation Pd(mW)
690
(*1) ROHM standard board mounted. Board size 50mm×58mm,1layer
Material: FR4 glass-epoxy (copper foil area: not more than 3%)
derating in done at 5.52mW/°C above Ta=+25°C.
0
25
50
75
100
125
150
Ambient Temperature [°C]
I/O equivalence circuits
Pin name
IN+
IN-
Pin No.
A1
C1
VDD
150k
IN+
IN-
+
GND
OUT+
OUT-
C3
A3
VDD
OUT+
OUT-
GND
STBY
C2
VDD
STBY
300k
GND
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BD27400GUL
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 50mm×58mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD27400GUL
Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 39. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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Datasheet
BD27400GUL
Ordering Information
B
D
2
7
4
0
0
G
Part Number
U
L
Package
GUL:VCSP50L1
(WL-CSP)
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
Vcsp50L1(TOP VIEW)
Part Number Marking
2
7
0
0
LOT Number
1PIN MARK
Part Number Marking
2700
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Package
VCSP50L1
Orderable Part Number
BD27400GUL-E2
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Datasheet
BD27400GUL
Physical Dimension Tape and Reel Information
Package Name
VCSP50L1(BD27400GUL)
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
3000pcs
Direction of feed
E2
The direction is the pin 1 of product is at the upper left when you
hold reel on the left hand and you pull out the tape on the right hand
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BD27400GUL
Revision History
Date
Revision
05.Apr.2012
05.Nov.2012
001
002
23.Apr.2014
003
Changes
New Release
All. Change to a new format
p.3. Change unit of a Output Power3 mW -> W
Change the value of PSRR 56dB->64dB
p.17 Change Part Number Marking
p.18 Change to a new format at Physical Dimension Tape and Reel Information
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
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Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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