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Datasheet
General-Purpose 6ch Electronic Volume with
Built-in Advanced Switch
BD3460FS
Key Specifications
General Description
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BD3460FS is a 6ch electronic volume which has the
best audio efficiency in the industry. It has a ground
isolation amplifier when connecting with external voice
inputs such as portable audio and car navigation. Also,
BD3460FS has a volume switching shock sound
prevention technique called “Advanced Switch,”
supporting the construction of high quality car audio
space by simple control.
Power Supply Voltage Range:
Circuit Current (no signal):
Total Harmonic Distortion:
Maximum Input Voltage:
Cross-talk Between Selectors:
Volume Control Range:
Output Noise Voltage:
Residual Output Noise Voltage:
Operating Temperature Range:
7.0V to 9.5V
25mA (Typ)
0.0004%(Typ)
2.35Vrms (Typ)
-105dB (Typ)
+23dB to -79dB
1.9µVrms(Typ)
1.6µVrms (Typ)
-40°C to +85°C
Features
■
■
■
■
■
Package
Reduce switching noise of volume by using
Advanced Switch circuit.
Built-in buffered stereo ground isolation amplifier
inputs, ideal for external input.
Energy-saving design resulting in low-current
consumption by utilizing the Bi-CMOS process. It
has the advantage in quality over scaling down
the power heat control of the internal regulators.
Arranges all I/O terminals together for easier PCB
layout and smaller PCB area.
I2C BUS can be controlled by 3.3V / 5V.
W(Typ) x D(Typ) x H(Max)
Applications
SSOP-A24
10.00mm x 7.80mm x 2.10mm
It is optimal for car audio. It can also be used for car
navigation, audio equipment of mini Compo, micro
Compo, DVD, TV, etc.
Typical Application Circuit
FIL
SDA
GND
SCL
CS
VCC
10μ
OUTF1 OUTF2 OUTR1 OUTR2 OUTS1 OUTS2
0.1μ
10μ
19
18
17
16
15
Volume★
20
Volume★
21
4.7μ
Volume★
22
23
4.7μ
Volume★
24
4.7μ
4.7μ
2.2K
4.7μ
14
4.7μ
13
VCC
VCC/2
GND
I2 C BUS LOGIC
1
100k
2
100k
100k
3
4
100k
5
100k
6
100k
7
100k
8
Volume★
BUFFERED
GND ISO AMP
BUFFERED
GND ISO AMP
100k
Volume★
■6 ch Volume
+23dB to -79dB / 1dBdB step,-∞
+23dB~-79dB/1
★: Advanced switch circuit
10
9
100k
100k
100k
11
Unit
R : [Ω]
12
C : [F]
1μ
INF1
1μ
INF2
1μ
INR1
○Product structure:Silicon monolithic integrated circuit
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TSZ22111・14・001
1μ
INR2
1μ
INS1
1μ
INS2
10μ
PIN2
10μ
4.7μ
4.7μ
10μ
NIN2 DIFFOUT2 DIFFOUT1 NIN1
10μ
PIN1
○This product has no designed protection against radioactive rays
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BD3460FS
Pin Configuration
TOP VIEW
INF1
1
24
FIL
INF2
2
23
GND
INR1
3
22
SDA
INR2
4
21
SCL
INS1
5
20
CS
INS2
6
19
VCC
PIN2
7
18
OUTF1
NIN2
8
17
OUTF2
DIFOUT2
9
16
OUTR1
10
15
OUTR2
NIN1
11
14
OUTS1
PIN1
12
13
OUTS2
DIFOUT1
Pin Descriptions
Pin No.
Pin
Name
Pin No.
Pin
Name
1
INF1
1ch Front input terminal
13
OUTS2
2ch Subwoofer output terminal
2
3
INF2
2ch Front input terminal
14
OUTS1
1ch Subwoofer output terminal
INR1
1ch Rear input terminal
15
OUTR2
2ch Rear output terminal
4
INR2
2ch Rear input terminal
16
OUTR1
1ch Rear output terminal
5
INS1
1ch Subwoofer input terminal
17
OUTF2
2ch Front output terminal
6
INS2
2ch Subwoofer input terminal
18
OUTF1
1ch Front output terminal
7
PIN2
2ch DIFF amp positive input terminal
19
VCC
8
NIN2
2ch DIFF amp negative input terminal
20
CS
Chip select terminal
Description
Description
Power supply terminal
9
DIFOUT2
2ch DIFF amp output terminal
21
SCL
I2C Communication clock terminal
10
DIFOUT1
1ch DIFF amp output terminal
22
SDA
I2C Communication data terminal
GND terminal
11
NIN1
1ch DIFF amp negative input terminal
23
GND
12
PIN1
1ch DIFF amp positive input terminal
24
FIL
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VCC/2 terminal
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BD3460FS
Block Diagram
19
18
17
16
15
Volume★
20
Volume★
21
Volume★
22
23
Volume★
24
14
13
VCC
VCC/2
GND
I2 C BUS LOGIC
1
100k
2
100k
100k
3
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4
100k
5
100k
6
100k
7
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100k
8
Volume★
BUFFERED
GND ISO AMP
BUFFERED
GND ISO AMP
100k
Volume★
■6 ch Volume
+23dB~-79dB/1
dB step,-∞
+23dB to -79dB / 1dB
★: Advanced switch circuit
9
100k
100k
100k
10
11
12
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BD3460FS
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
10.0V
V
Input Voltage
VIN
VCC+0.3 to GND-0.3
V
Power Dissipation
Pd
1 (Note 1)
W
Tstg
-55 to +150
°C
Storage Temperature
(Note 1) This value decreases 8mW/°C for Ta=25°C or more.
ROHM standard board shall be mounted. Thermal resistance θja = 125(°C/W).
ROHM standard board
Size : 70 x 70 x 1.6(mm3)
Material : FR4 grass epoxy board (3% or less of copper foil area)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
7.0 to 9.5
V
Temperature
Topr
-40 to +85
°C
Electrical Characteristics
DIFF
GENERAL
BLOCK
(Unless specified, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, INF1 input, Volume 0dB)
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Circuit Current (no signal)
IQ
-
25
40
mA
No signal
Voltage Gain
GV
-1.5
0
+1.5
dB
GV=20log(VOUT/VIN)
Channel Balance
CB
-1.5
0
+1.5
dB
Total Harmonic Distortion
THD
-
0.0004
0.05
%
Output Noise Voltage *
VNO
-
1.9
10
μVrms
CB=GV1-GV2
VOUT=1Vrms
BW=400Hz-30kHz
Rg=0Ω
BW=IHF-A
Residual Output Noise Voltage *
VNOR
-
1.6
10
μVrms
Cross-talk Between Channels *
CTC
-
-105
-90
dB
Ripple Rejection
RR
-
-80
-40
THD
Input Impedance
RIN_D
70
100
130
kΩ
CMRR
50
65
-
dB
Common Mode Rejection Ratio *
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Volume=-∞dB
Rg=0Ω
BW=IHF-A
Rg=0Ω
CTC=20log(VOUT/VIN)
BW=IHF-A
f=100Hz
VRR=100mVrms
RR=20log(VOUT/VCCIN)
PIN and NIN input
CMRR=20log10(VIN/VOUT)
BW=IHF-A
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BD3460FS
Electrical Characteristics – continued
BLOCK
(Unless specified, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, INF1 input, Volume 0dB)
Limit
Parameter
Unit
Conditions
Min
Typ
Max
RIN_V
70
100
130
kΩ
VIM
2
2.35
-
Vrms
Maximum Gain
GV_BST
21
23
25
dB
Maximum Attenuation *
GV_MIN
-
-109
-90
dB
Step Resolution
GV_STEP
-
1
-
dB
Gain Set Error
GV_ERR
-2
0
+2
dB
Volume=-∞dB
GV=20log(VOUT/VIN)
BW=IHF-A
GAIN&ATT=+23dB to
-79dB
Gain=+1dB to +23dB
Attenuation Set Error 1
GV_ERR1
-2
0
+2
dB
ATT=-1dB to -15dB
Attenuation Set Error 2
GV_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error 3
GV_ERR3
-4
0
+4
dB
ATT=-48dB to -79dB
Output Impedance
ROUT
-
-
50
Ω
Maximum Output Voltage
VOM
2
2.35
-
Vrms
VIN =100mVrms
THD+N=1%
BW=400Hz-30kHz
Input Impedance
Maximum Input Voltage
VOLUME
Symbol
VIM AT THD+N(VOUT)=1%
BW=400Hz-30kHz
Gain=23dB
VIN=100mVrms
GV=20log(VOUT/VIN)
VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
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BD3460FS
Typical Performance Curves
10
Total Harmonic Distortion : THD+N [%]
Quiescent Current : IQ [mA]
50
40
30
20
10
0
0
2
4
6
8
1
0.1
0.01
0.001
0.0001
0.001
10
Supply Voltage : VCC [V]
Figure 1. Quiescent Current vs Supply Voltage
0.1
1
10
Figure 2. Total Harmonic Distortion vs Output Voltage
5
30
4
25
Volume Gain : GV [dB]
3
Voltage Gain : GV [dB]
0.01
Output Voltage : VOUT [Vrms]
2
Gain=0dB
1
0
-1
-2
-3
20
15
10
5
0
-4
-5
-5
10
100
1k
10k
100k
10
Frequency : f [Hz]
1k
10k
100k
Frequency : f [Hz]
Figure 4. Volume Gain vs Frequency
(-0dB to +23dB)
Figure 3. Voltage Gain vs Frequency
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BD3460FS
Typical Performance Curves – continued
5
-30
Volume Attenuation : ATT [dB]
Volume Attenuation : ATT [dB]
0
-5
-10
-15
-20
-25
-30
-35
-40
-50
-60
-70
-80
-90
-100
-40
-45
-110
10
100
1k
10k
100k
10
100
Frequency : f [Hz]
10k
100k
Frequency : f [Hz]
Figure 5. Volume Gain vs Frequency 1
(+0dB to -40dB)
Figure 6. Volume Gain vs Frequency 2
(-41dB to -79dB)
0
0
Ripple Rejection Ratio : RR [dB]
Cross-talk Between Channels : CTC [dB]
1k
-20
-40
-60
-80
-100
-20
-40
-60
-80
-100
-120
10
100
1k
10k
10
100k
100
1k
10k
100k
Frequency : f [Hz]
Frequency : f [Hz]
Figure 7. Cross-talk Between Channels vs Frequency
Figure 8. Ripple Rejection Ratio vs Frequency
対
周波数特性
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BD3460FS
Typical Performance Curves – continued
Voltage Gain : GV [dB]
Output Noise : VNO [μVrms]
100
10
1
-40
-30
-20
-10
0
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
10
VCC=8.5V
VOUT=2Vrms
Volume=0dB
10
100
1k
10k
100k
Frequency : f [Hz]
Volume Attenuation : ATT [dB]
Figure 10. Volume Gain of Large Output Level vs
Frequency
Common Mode Rejection Ratio : CMRR [dB]
Figure 9. Output Noise vs Volume Attenuation
Total Harmonic Distortion : THD+N [dB]
1
0.1
0.01
0.001
0.0001
10
100
1k
10k
100k
0
-10
-20
-30
-40
-50
-60
-70
-80
10
100
1k
10k
100k
Frequency : f [Hz]
Frequency : f [Hz]
Figure 12. Common Mode Rejection Ratio vs
Frequency
Figure 11. Total Harmonic Distortion vs Frequency
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BD3460FS
Maximum Output Voltage: VOUT [Vrms]
Typical Performance Curves – continued
2.5
2.0
1.5
1.0
0.5
0.0
100
1000
10000
100000
Load Resistance : RL [Ω]
Figure 13. Maximum Output Voltage vs Load
Resistance
OUTF1
OUTF1
OUTF2
OUTF2
Figure 14. Advanced Switch 1
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Figure 15. Advanced Switch 2
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BD3460FS
Timing Chart
CONTROL SIGNAL SPECIFICATIONS
(1) Electrical Specifications and Timing for Bus Lines and I/O Stages
SDA
tBUF
tHD;STAT
tF
tR
tLOW
tSP
SCL
tHD;STA
P
tHD;DAT
tHIGH
tSU;DAT
tSU;STAT
tSU;STOT
Sr
S
P
Figure 16. I2C-bus Signal Timing Diagram
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices
(Unless specified, Ta=25°C, VCC=8.5V)
Parameter
1
2
3
4
5
6
7
8
9
Symbol
SCL clock frequency
Bus free time between a STOP and START condition
Hold time (repeated) START condition. After this period, the first clock
pulse is generated
LOW period of the SCL clock
HIGH period of the SCL clock
Set-up time for a repeated START condition
Data hold time
Data set-up time
Set-up time for STOP condition
fSCL
tBUF
Fast-mode I2C-bus
Min
Max
400
0
1.3
-
Unit
kHz
μS
tHD;STA
0.6
-
μS
tLOW
tHIGH
1.3
0.6
0.6
-
-
-
-
-
-
μS
μS
μS
μS
ns
μS
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
0 (Note)
100
0.6
All values referred to VIH Min and VIL Max Levels (see Table 2).
(Note) To avoid sending right after the fall-edge of SCL (VIHmin of the SCL signal), the transmitter sets a holding time of 300ns or more for the SDA signal.
About 7(tHD;DAT), 8(tSU;DAT), make it the setup which a margin is fully in .
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Parameter
10
11
12
13
14
Symbol
LOW level input voltage
HIGH level input voltage
Pulse width of spikes which must be suppressed by the input filter.
LOW level output voltage (open drain or open collector) at 3mA sink
current
Input current of each I/O pin with an input voltage between 0.4V and 4.5V
tHD;STA
tHD;STA
:2us
:2µs
tHD;DAT
tHD;DAT
:1us
:1µs
VIL
VIH
tSP
Fast-mode devices
Min
Max
-0.5
+1
2.3
-
0
50
Unit
V
V
ns
VOL1
0
0.4
V
II
-10
+10
μA
tSU;DAT
tSU;DAT
:1us
:1µs
tSU;STO
tSU;STO
:2us
:2µs
SCL
tBUF
tBUF
:4us
:4µs
tLOW
tLOW
:3us
:3µs
tHIGH
tHIGH
:1us
:1µs
SDA
SDA
SCL
: 250kHz
SCLclock
clockfrequency
frequency:250kHz
Figure 17. I2C Command Data Transmission Timing Diagram
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BD3460FS
(2) I2C BUS FORMAT
S
1bit
MSB
LSB
Slave Address
8bit
S
Slave Address
A
Select Address
Data
P
MSB
LSB
MSB
LSB
A
Select Address
A
Data
A
P
1bit
8bit
1bit
8bit
1bit 1bit
= Start condition (Recognition of start bit)
= Recognition of slave address. The first 7 bits correspond to the slave address.
The least significant bit is “L” which corresponds to write mode.
= ACKNOWLEDGE bit (Recognition of acknowledgement)
= Select address corresponding to volume, bass or treble.
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
(3) I2C BUS Interface Protocol
(a) Basic Format
S
Slave Address
MSB
LSB
A
Select Address
MSB
LSB
A
Data
MSB
LSB
A
P
(b) Automatic Increment (Select Address increases (+1) according to the number of data.)
S
Slave Address
A
Select Address
A
Data1
A
Data2
A ・・・・
MSB
(Example)
LSB
MSB
LSB
MSB
LSB
MSB LSB
① Data1 shall be set as data of address specified by Select Address.
② Data2 shall be set as data of address specified by Select Address +1.
③ DataN shall be set as data of address specified by Select Address +N-1.
DataN
MSB
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.)
S Slave Address A
Select Address1 A Data
A Select Address 2 A Data
A
MSB
LSB
MSB
LSB MSB LSB MSB
LSB MSB
LSB
(Note) If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
A
P
LSB
P
(4) Slave Address
Because the slave address can be changed by the setting of CS, it is possible to use two chips at the same time on
identical BUS.
MSB
LSB
SEL Voltage Condition
A6
A5
A4
A3
A2
A1
A0
R/W
GND to 0.2 x VCC
0
0
0
0
0
0
0
0.8 x VCC to VCC
1
0
Establish the CS voltage to define the setting.
0
0
0
1
0
0
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84H
TSZ02201-0C2C0E100350-1-2
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BD3460FS
(5) Select Address & Data
Items to be set
Initial Setup 1
Volume 1ch Front
Volume 2ch Front
Volume 1ch Rear
Volume 2ch Rear
Volume 1ch Sub
Volume 2ch Sub
Test Mode
System Reset
Select
Address
(hex)
01
28
29
2A
2B
2C
2D
F0
FE
MSB
Data
D7
0
D6
0
D5
0
0
1
0
0
0
0
LSB
D4
D3
D2
0
0
0
Volume Gain / Attenuation
Volume Gain / Attenuation
Volume Gain / Attenuation
Volume Gain / Attenuation
Volume Gain / Attenuation
Volume Gain / Attenuation
0
0
0
0
0
0
D1
D0
0
0
0
0
0
1
Advanced Switch
(Note)
1. The Advanced Switch works in the latch part while changing from one function to another.
2. Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as shown
below.
→01→28→29→2A→2B→2C→2D
Select address 28, 29, 2A, 2B, 2C, 2D (hex)
MSB
Gain & ATT
D7
D6
0
0
0
0
Prohibition (Note)
:
:
0
1
23dB
0
1
22dB
0
1
21dB
0
1
Volume Gain/Attenuation
D5
D4
D3
D2
0
0
0
0
0
0
0
0
D1
0
0
LSB
D0
0
1
:
1
1
1
1
:
0
0
0
0
:
1
1
1
1
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
-78dB
-78dB
-79dB
:
1
1
1
1
:
1
1
1
1
:
0
0
0
0
:
0
0
0
1
:
1
1
1
0
:
1
1
1
0
:
1
1
1
0
:
0
0
1
0
Prohibition (Note)
:
1
1
:
1
1
:
1
1
:
1
1
:
1
1
:
1
1
:
1
1
:
0
1
-∞dB
(Note) Gain is set to “-∞dB” when sending “Prohibition data”.
(6) About Power ON Reset
Initialization inside IC is carried out at one of supply voltage circuits. Initial data is sent to all addresses at supply
voltage on. Mute is ON until this initial data is sent.
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Rise Time of VCC
tRISE
20
-
-
μsec
VCC Voltage of Release
Power ON Reset
VPOR
-
4.1
-
V
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Conditions
VCC rise time from 0V to 3V
TSZ02201-0C2C0E100350-1-2
16.Dec.2015 Rev.001
BD3460FS
Application Information
1.
Volume Gain/Attenuation of the details
(dB)
D7 D6 D5 D4 D3 D2 D1
+23
0
1
1
0
1
0
0
+22
0
1
1
0
1
0
1
+21
0
1
1
0
1
0
1
+20
0
1
1
0
1
1
0
+19
0
1
1
0
1
1
0
+18
0
1
1
0
1
1
1
+17
0
1
1
0
1
1
1
+16
0
1
1
1
0
0
0
+15
0
1
1
1
0
0
0
+14
0
1
1
1
0
0
1
+13
0
1
1
1
0
0
1
+12
0
1
1
1
0
1
0
+11
0
1
1
1
0
1
0
+10
0
1
1
1
0
1
1
+9
0
1
1
1
0
1
1
+8
0
1
1
1
1
0
0
+7
0
1
1
1
1
0
0
+6
0
1
1
1
1
0
1
+5
0
1
1
1
1
0
1
+4
0
1
1
1
1
1
0
+3
0
1
1
1
1
1
0
+2
0
1
1
1
1
1
1
+1
0
1
1
1
1
1
1
0
1
0
0
0
0
0
0
-1
1
0
0
0
0
0
0
-2
1
0
0
0
0
0
1
-3
1
0
0
0
0
0
1
-4
1
0
0
0
0
1
0
-5
1
0
0
0
0
1
0
-6
1
0
0
0
0
1
1
-7
1
0
0
0
0
1
1
-8
1
0
0
0
1
0
0
-9
1
0
0
0
1
0
0
-10
1
0
0
0
1
0
1
-11
1
0
0
0
1
0
1
-12
1
0
0
0
1
1
0
-13
1
0
0
0
1
1
0
-14
1
0
0
0
1
1
1
-15
1
0
0
0
1
1
1
-16
1
0
0
1
0
0
0
-17
1
0
0
1
0
0
0
-18
1
0
0
1
0
0
1
-19
1
0
0
1
0
0
1
-20
1
0
0
1
0
1
0
-21
1
0
0
1
0
1
0
-22
1
0
0
1
0
1
1
-23
1
0
0
1
0
1
1
-24
1
0
0
1
1
0
0
-25
1
0
0
1
1
0
0
-26
1
0
0
1
1
0
1
-27
1
0
0
1
1
0
1
-28
1
0
0
1
1
1
0
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
(dB)
-29
-30
-31
-32
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
D7
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D6
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
D5
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D4
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
D3
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
D2
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
D1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
D0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
: Initial condition
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BD3460FS
2.
Application Circuit Diagram
FIL
SDA
GND
SCL
CS
VCC
10μ
OUTF1 OUTF2 OUTR1 OUTR2 OUTS1 OUTS2
0.1μ
10μ
19
18
17
16
15
Volume★
20
Volume★
21
4.7μ
Volume★
22
23
4.7μ
Volume★
24
4.7μ
4.7μ
2.2K
4.7μ
14
4.7μ
13
VCC
VCC/2
GND
I2 C BUS LOGIC
1
100k
2
1μ
INF1
3
1μ
INF2
100k
100k
4
1μ
INR1
100k
5
1μ
INR2
100k
6
1μ
INS1
100k
7
1μ
INS2
100k
8
10μ
PIN2
10
4.7μ
4.7μ
11
12
10μ
10μ
NIN2 DIFFOUT2 DIFFOUT1 NIN1
Figure 18. Application Circuit Diagram
100k
100k
100k
9
10μ
Volume★
BUFFERED
GND ISO AMP
BUFFERED
GND ISO AMP
100k
Volume★
■6 ch Volume
+23dB~-79dB/1
dB step,-∞
+23dB to -79dB / 1dB
★: Advanced switch circuit
PIN1
Unit
R : [Ω]
C : [F]
Notes on wiring
①Please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to GND.
②Lines of GND shall be one-point connected.
③Wiring pattern of Digital shall be away from that of analog unit and cross-talk shall not be acceptable.
④Lines of SCL and SDA of I2C BUS shall not be parallel if possible.
The lines shall be shielded, if they are adjacent to each other.
⑤Lines of analog input shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other.
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BD3460FS
Power Dissipation
About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute
maximum ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the
two standpoints of immediate damage and long-term reliability of operation.
Reference data
SSOP-A24
Power Dissipation : Pd (W)
1.5
Measurement condition: ROHM Standard board
board Size : 70 x 70 x 1.6(mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
1.0W
1.0
θja = 125°C/W
0.5
0.0
0
25
50
75
85
100
125
150
Ambient Temperature : Ta (°C)
Figure 19. Temperature Derating Curve (SSOP-A24)
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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BD3460FS
I/O Equivalent Circuits
Terminal
No.
Terminal
Voltage
Equivalent Circuit
Signal input terminal.
The input impedance is 100kΩ (typ).
VCC
INF1
INF2
INR1
INR2
INS1
INS2
PIN2
NIN2
NIN1
PIN1
Terminal Description
4.25
100KΩ
GND
Fader output terminal.
VCC
DIFOUT2
DIFOUT1
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
4.25
GND
Slave address selection terminal.
“CS” is “High” to slave address “84 H”
“CS” is “Low” to slave address “80 H”
VCC
CS
-
GND
The values in the input/output equivalent circuits are reference values only and are not guaranteed.
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BD3460FS
I/O Equivalent Circuits – continued
Terminal
Name
VCC
Terminal
Voltage
Equivalent Circuit
Terminal Description
Power supply terminal.
8.5
Clock input terminal of I2C BUS communication.
VCC
Vcc
SCL
-
1.65V
1.65V
GND
GND
Data input of I2C BUS communication.
VCC
Vcc
SDA
-
1.65V
1.65V
GND
GND
GND
Ground terminal.
0
Voltage terminal for reference bias of analog
signal system. The simple pre-charge circuit
and simple discharge circuit for an external
capacitor are built in.
VCC
50k
FIL
4.25
50k
GND
The values in the input/output equivalent circuits are reference values only and are not guaranteed.
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BD3460FS
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD3460FS
Operational Notes – continued
12.
Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 20. Example of monolithic IC structure
13.
About a Signal Input Part
About Input Coupling Capacitor Constant Value
The constant value of input coupling capacitor C(F) is decided with respect to the input impedance RIN(Ω) at
the input signal terminal of the IC. The first HPF characteristic of RC is composed.
G〔dB〕
C〔F〕
0
RIN
A(f)
〔Ω〕
SSH
f〔Hz〕
INPUT
A f  
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2 fCRIN 2
2
1  2 fCRIN 
TSZ02201-0C2C0E100350-1-2
16.Dec.2015 Rev.001
BD3460FS
Operational Notes – continued
14.
About Output Load Characteristics
The usages of output load are below (reference). Please use more than 10[kΩ](TYP) load.
Output pin on target
Pin Name
Pin name
OUTF1
OUTR1
OUTF2
OUTR2
Pin name
OUTS1
OUTS2
Pin name
DIFOUT1
DIFOUT2
2.5
Output Voltage [Vrms]
2
1.5
1
VCC=8.5V
THD+n=1%
BW=400Hz to 30kHz
0.5
0
100
1k
10k
100k
(Load) [Ω]
Output Load Characteristic at VCC=8.5V (Reference)
15.
Frequency Characteristic at Large Output Level
High slew-rate amplifiers are used for high quality sound. This IC corresponds to “192kHz sampling on DVD-Audio”
which is highest quality. Output level is “2Vrms, 192kHz flat (typ)”.
(See the below graph (reference)).
Gain vs Frequency (Volume=0dB setting)
2
1
0
-1
Gain[dB]
-2
-3
-4
-5
-6
-7
-8
-9
-10
10
100
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1k
10k
Frequency [Hz]
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100k
1000k
TSZ02201-0C2C0E100350-1-2
16.Dec.2015 Rev.001
BD3460FS
Operational Notes – continued
16.
Oscillation Countermeasure for GND Isolation Amplifier Outputs
Using higher capacitor than 10pF at GND isolation amplifier outputs (DIFOUT1, DIFOUT2) may cause oscillation.
As oscillation countermeasure, insert resistor in series to terminal directly as below.
Capacitance
Resistor in series to terminal directly
C<10pF
10<C<100pF
Not necessary
220Ω
Resistor for oscillation countermeasure
Coupling capacitor
Output
Capacitive load
(Included PCB capacitance etc)
17.
Oscillation Countermeasure for Volume Outputs at Power Supply ON/OFF
If using higher capacitor than 22pF at volume outputs, oscillation may occur for a moment when turning ON/OFF
power supply (when VCC is about 3V to 4V). As oscillation countermeasure, insert resistor in series to terminal
directly as below, and set volume output mute outside this device when turning ON/OFF power supply.
Resistor for oscillation countermeasure
Capacitance
Resistor in series to terminal directly
C<22pF
22<C<220pF
Not necessary
220Ω
Coupling capacitor
Output
18.
Capacitive load
(Included PCB capacitance etc.)
I2C BUS Transferring Data
[1] Types of Data Transfer
1-1. The data transfer without Advanced Switch (data transfer without data latching format) does not have
regulations on transferring data.
1-2. The data transfer with Advanced Switch (data transfer with data latching format) does not have
regulations on transferring data too. But Advanced Switch data transfer follows the order in [2]
[2] Advanced Switch Data Transfer
2-1. The timing chart of Advanced Switch data transfer is as follows.
 Data transfer example 1
slave select
(VolumeF1 0dB)
I2C BUS
80
28
AKS
data
80
(VolumeR1 0dB)
80
2A
80
(VolumeS1 0dB)
80
2C
80
It starts after the
Advanced switch of VolumeF1
Advanced switch timing
VolumeF1
changing time
VolumeF1 output
VolumeF2
changing time
VolumeR1
changing time
VolumeR1 output
VolumeR2
changing time
It starts after the
Advanced switch of VolumeR1.
VolumeS1
changing time
VolumeS2
changing time
VolumeS1 output
It is the same even if it transfers data in auto increment mode.
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BD3460FS
Operational Notes – continued
There are no timing regulations in I2C BUS transferring data. But the changing time starts after the end of the
present change. In addition, the timing of Advanced Switch is not dependent on transferring data turn.
Instead, it follows the following turn.
Group①
Group②
Group③
VolumeF1
VolumeR1
VolumeS1
28h
2Ah
2Ch
VolumeF2
VolumeR2
VolumeS2
29h
2Bh
2Dh
Select address
Advanced Switch Start Turn
(Note) The block in the same group can start the Advanced Switch at the same time.
 Data Transfer Example 2
The data transfer turn differs from the actual change turn as shown below.
(VolumeR1 0dB)
(VolumeS1 0dB)
I2C BUS
80
2C
80
80
2A
(VolumeF1 0dB)
80
80
28
80
VolumeS1
Changing time
Advanced switch timing
VolumeF1
Changing time
VolumeR1
Changing time
Please transfer data after the present Advanced Switch, if it wants to make a transferring data turn
and Advanced Switch turn the same.
 Data Transfer Example 3
Priority is given to the data of the same select address when it is transferred to the timing which
Advanced Switch has not ended. In addition, when two or more data are transferred to the same
select address, the end transferred data is effective.
VolumeF1 Only the last of the data transmitted during
the VolumeF1 change is effective.
The data which have become invalid as a result
(VolumeF1 0dB)
I2C BUS
80
28
80
(VolumeF1 +1dB)
80
28
(VolumeF1 -1dB)
80
28
81
VolumeF1
Changing time
Advanced switch timing

7F
VolumeF1
Changing time
Data Transfer Example 4
Refresh data is the same as the present setup data, therefore Advanced Switch does not change.
The gain change data of other channels are transferred after refresh data as shown below.
(VolumeF1 0dB)
I2C BUS
80
28
VolumeF1 0dB)
80
80
28
80
VolumeR1 dB)
80
2A
80
Refresh data
Advanced switch timing
VolumeF1
changing time
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VolumeR1
changing time
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16.Dec.2015 Rev.001
BD3460FS
Operational Notes – continued
[3] Attention of Transferring Data
BD3460FS cannot set the data transfer from a microcomputer correctly on very rare occasions. In such
cases, the following phenomenon may occur.
1. Volume gain does not change.
2. Volume gain changes to MUTE.
Therefore, the data transfer from a microcomputer should send data as shown in the following conditions.
①
When the Volume change data send, please send the same data twice as below.
slave select
AKS
data
slave select
AKS
data
Original Data
2
80
I C BUS
28
80
80
80
80
Refresh Data
80
80
80
28
80
80
80
80
80
80
under 1.6msec
under 1.6msec
Output wave
If Refresh data can’t be sent like ①timing, the output wave may be mute momentarily.
slave select
AKS
data
slave select
AKS
data
Original Data
2
80
I C BUS
28
80
80
80
80
Refresh Data
80
80
80
28
80
80
80
80
80
80
over 1.6msec
over 1.6msec
Output wave
Output wave may not change the gain or may be mute until refresh data reception.
②
If Volume change data can send over 94.08msec interval transferring data, there is no need to send Refresh data.
slave select
AKS
data
slave select
AKS
data
data1
2
I C BUS
80
28
80
80
80
80
data2
80
80
80
28
82
82
82
82
82
82
over 94.08msec
over 94.08msec
Output wave
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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16.Dec.2015 Rev.001
BD3460FS
Ordering Information
B
D
3
4
6
Part Number
0
F
S
-
Package
FS: SSOP-A24
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-A24 (TOP VIEW)
Part Number Marking
BD3460FS
LOT Number
1PIN MARK
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© 2015 ROHM Co., Ltd. All rights reserved.
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16.Dec.2015 Rev.001
BD3460FS
Physical Dimension, Tape and Reel Information
Package Name
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
SSOP-A24
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16.Dec.2015 Rev.001
BD3460FS
Revision History
Date
Revision
16.Dec.2015
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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