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Datasheet
Sound Processor with Built-in 3-band Equalizer
BD37544FS
Key Specifications
General Description
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BD37544FS is a sound processor with built-in 3-band
equalizer for car audio. The functions are stereo input
selector (which can switch single and GND isolation),
input-gain control, main volume, super bass, 5ch fader
volume, LPF/HPF for subwoofer, and mixing input.
Moreover, “Advanced switch circuit”, which is an original
ROHM technology, can reduce various switching noise
(ex. No-signal, low frequency like 20Hz & large signal
inputs). Also, “Advanced switch” makes control of
microcomputer easier, and can construct a high quality
car audio system.
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Features
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Reduced switching noise of input gain control, mute,
main volume, fader volume, bass, middle, treble,
super bass, mixing by using advanced switch circuit.
Built-in differential input selector that can make
various combination of single-ended / differential
input.
Built-in ground isolation amplifier inputs, which is
ideal for external stereo input.
Built-in input gain controller reduces switching noise
for volume of a portable audio input.
Decreased number of external components due to
built-in 3-band equalizer filter, LPF for subwoofer,
and HPF. It is possible to control Q, GV, fO of 3-band
equalizer and fC of LPF/HPF through I2C BUS
control.
It is possible to adjust the gain of the bass, middle,
and treble up to ±20dB with 1 dB step gain
adjustment.
It is equipped with output terminals for Subwoofer.
Moreover, the stereo signal output of the front and
rear can also be chosen by the I2C BUS control.
Built-in mixing input and mixing attenuator.
Energy-saving design resulting in low-current
consumption is achieved by utilizing the Bi-CMOS
process. It has the advantage in quality over scaling
down the power heat control of the internal
regulators.
Input terminals and output terminals are organized
and separately laid out to keep the signal flow in one
direction which results in simpler and smaller PCB
layout.
It is possible to control the I2C BUS by 3.3V / 5V.
Power Supply Voltage Range:
Circuit Current (No Signal):
Total Harmonic Distortion:
THD+N1
THD+N2
Maximum Input Voltage:
Cross-talk Between Selectors:
Volume Control Range:
Output Noise Voltage:
VNO1
VNO2
Residual Output Noise Voltage:
Operating Temperature Range:
Package
7.0V to 9.5V
38mA (Typ)
0.001% (Typ)
0.002% (Typ)
2.3Vrms(Typ)
-100dB(Typ)
+15 dB to -79dB
3.8µVrms(Typ)
4.8µVrms(Typ)
1.8µVrms(Typ)
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
SSOP-A32
13.60 mm x 7.80mm x 2.01mm
.
.
Applications
It is optimal for car audio systems. It can also be used for
audio equipment of mini Compo, micro Compo, TV, etc.
〇Product structure : Silicon monolithic integrated circuit
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
〇This product has no designed protection against radioactive rays
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TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Typical Application Circuit
BD37544FS
単位
R : [Ω]
C : [F]
Pin Configuration
TOP VIEW
A1
1
32
FIL
A2
2
31
GND
B1
3
30
SDA
B2
4
29
SCL
C1
5
28
VCC
C2
6
27
OUTF1
DP1
7
26
OUTF2
DN
8
25
OUTR1
DP2
EP1
9
24
OUTR2
10
23
OUTS1
EN
11
22
OUTS2
EP2
12
21
N.C.
MIN
13
20
SBC2
SBC1
14
19
SBA2
SBA1
15
18
SBB2
SBB1
16
17
SBBIAS
Pin Descriptions
Pin No.
Pin Name
Description
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
A1
A2
B1
B2
C1
C2
DP1
DN
DP2
EP1
EN
EP2
MIN
SBC1
SBA1
A input terminal of 1ch
A input terminal of 2ch
B input terminal of 1ch
B input terminal of 2ch
C input terminal of 1ch
C input terminal of 2ch
D positive input terminal of 1ch
D negative input terminal
D positive input terminal of 2ch
E positive input terminal of 1ch
E negative input terminal
E positive input terminal of 2ch
Mixing input terminal
SuperBass setting terminal of 1ch
SuperBass setting terminal of 1ch
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Pin
Name
SBBIAS
SBB2
SBA2
SBC2
N.C.
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
VCC
SCL
SDA
GND
16
SBB1
SuperBass setting terminal of 1ch
32
FIL
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Description
SuperBass bias terminal
SuperBass setting terminal of 2ch
SuperBass setting terminal of 2ch
SuperBass setting terminal of 2ch
No connection
Subwoofer output terminal of 2ch
Subwoofer output terminal of 1ch
Rear output terminal of 2ch
Rear output terminal of 1ch
Front output terminal of 2ch
Front output terminal of 1ch
Power supply terminal
I2C Communication clock terminal
I2C Communication data terminal
GND terminal
VCC/2 terminal
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Block Diagram
32
31
VCC/2
GND
30
29
28
27
26
25
24
23
22
21
20
18
19
17
I2C BUS
LOGIC
VCC/2
ATT★
Fader★
Fader★
Fader★
Fader★
Fader★
Fader
■Fader
Gain:+15dB to -79dB/1dB step
step
Gain:+15dB~-79dB/1dB
★no pop noise
■LPF
fc=55/85/120/160Hz
■HPF
fc=55/85/120/160Hz
■ATT
Gain: +7dB to -79dB/1dBstep
step
Gain:+7dB~-79dB/1dB
★no pop noise
■Super Bass
★no pop noise
■3 Band P-EQ (Tone control)
Gain:
+20dB to -20dB/1dB step
Gain:+20dB~-20dB/1dB
step
★no pop noise
・Bass:f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble:f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain:
+15dB to -79dB/1dB step
Gain:+15dB~-79dB/1dB
step
★no pop noise
■Input Gain
Gain:+20dB~0dB/1dB
Gain:
+20dB to -0dB/1dBstep
step
★no pop noise
LPF
HPF
★Super Bass
★3 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (3 single-end and 2 stereo ISO)
BufferdGND
ISO amp
BufferdGND
ISO amp
1
2
3
4
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7
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9
BufferdGND
ISO amp
BufferdGND
ISO amp
10
11
12
13
14
15
16
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
10.0
V
Input Voltage
VIN
VCC+0.3 to GND-0.3
V
Power Dissipation
Pd
0.95 (Note 1)
W
Tstg
-55 to +150
°C
Storage Temperature
(Note 1) When mounted on the standard board (70 x 70 x 1.6 mm3), derate by 7.6mW/°C for Ta above 25°C.
Thermal resistance θja = 131.6(°C/W)
Material : A FR4 grass epoxy board(3% or less of copper foil area)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VCC
7.0
-
9.5
V
Temperature
Topr
-40
-
+85
°C
Electrical Characteristics
GENERAL
BLOCK
(Unless specified, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, A1 input, Input gain 0dB, Mute OFF,
Volume 0dB, Tone control 0dB, Loudness 0dB, LPF OFF, HPF OFF, Mixing OFF, Fader 0dB)
Limit
Parameter
Symbol
Typ
Max
Conditions
Circuit Current (No Signal)
IQ
-
38
48
mA
No signal
Voltage Gain
GV
-1.5
0
+1.5
dB
GV=20log(VOUT/VIN)
Channel Balance
CB
-1.5
0
+1.5
dB
CB = GV1-GV2
THD+N1
-
0.001
0.05
%
THD+N2
-
0.002
0.05
%
VNO1
-
3.8
15
μVrms
VNO2
-
4.8
15
μVrms
Residual Output Noise Voltage*
VNOR
-
1.8
10
μVrms
Cross-talk Between Channels *
CTC
-
-100
-90
dB
RR
-
-70
-40
dB
VOUT=1Vrms
BW=400Hz-30KHz
VOUT=1Vrms
BW=400Hz-30KHz
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
BW = IHF-A
Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
f=1kHz
VRR=100mVrms
RR=20log(VCC IN/VOUT)
Input Impedance(A, B,C)
RIN_S
70
100
130
kΩ
Input Impedance(D, E)
RIN_D
175
250
325
kΩ
Maximum Input Voltage
VIM
2.1
2.3
-
Vrms
Cross-talk Between Selectors *
CTS
-
-100
-90
dB
CMRR
50
65
-
dB
Total Harmonic Distortion 1
(FRONT,REAR)
Total Harmonic Distortion 2
(SUBWOOFER)
Output Noise Voltage 1
(FRONT,REAR) *
Output Noise Voltage 2
(SUBWOOFER) *
Ripple Rejection
INPUT SELECTOR
Unit
Min
Common
Ratio*
Mode
Rejection
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VIM at THD+N(VOUT)=1%
BW=400Hz-30KHz
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
XP1 and XN input
XP2 and XN input
CMRR=20log(VIN/VOUT)
BW = IHF-A,[*X…D,E]
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
MIXING
TREBLE
MIDDLE
BASS
VOLUME
MUTE
INPUT GAIN
BLOCK
Electrical Characteristics - continued
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Input gain 0dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Input gain 20dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Minimum Input Gain
GIN_MIN
-2
0
+2
dB
Maximum Input Gain
GIN_MAX
18
20
22
dB
Gain Set Error
GIN_ERR
-2
0
+2
dB
Mute Attenuation *
GMUTE
-
-105
-85
dB
Maximum Gain
GV_MAX
13
15
17
dB
Maximum Attenuation *
GV_MIN
-
-100
-85
dB
Attenuation Set Error 1
GV_ERR1
-2
0
+2
dB
GAIN & ATT=+15dB to -15dB
Attenuation Set Error 2
GV_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error 3
GV_ERR3
-4
0
+4
dB
ATT=-48dB to -79dB
Maximum Boost Gain
GB_BST
18
20
22
dB
Maximum Cut Gain
GB_CUT
-22
-20
-18
dB
Gain Set Error
GB_ERR
-2
0
+2
dB
Maximum Boost Gain
GM_BST
18
20
22
dB
Maximum Cut Gain
GM_CUT
-22
-20
-18
dB
Gain Set Error
GM_ERR
-2
0
+2
dB
Maximum Boost Gain
GT_BST
18
20
22
dB
Maximum Cut Gain
GT_CUT
-22
-20
-18
dB
Gain Set Error
GT_ERR
-2
0
+2
dB
Input Impedance
RIN_M
19
27
35
kΩ
Maximum Input Voltage
VIM_M
2.0
2.2
-
Vrms
Maximum Attenuation *
GMX_MIN
-
-100
-85
dB
Maximum Gain
GMX_MAX
5
7
9
dB
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GAIN=+20dB to +1dB
Mute ON
GMUTE=20log(VOUT/VIN)
BW = IHF-A
Volume = 15dB
VIN=100mVrms
GV=20log(VOUT/VIN)
Volume = -∞dB
GV=20log(V VOUT/VIN)
BW = IHF-A
Gain=+20dB f=100Hz
VIN=100mVrms
GB=20log (VOUT/VIN)
Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=100Hz
Gain=+20dB f=1kHz
VIN=100mVrms
GM=20log (VOUT/VIN)
Gain=-20dB f=1kHz
VIN=2Vrms
GM=20log (VOUT/VIN)
Gain=-20dB to +20dB f=1kHz
Gain=+20dB f=10kHz
VIN=100mVrms
GT=20log (VOUT/VIN)
Gain=-20dB f=10kHz
VIN=2Vrms
GT=20log (VOUT/VIN)
Gain=-20dB to +20dB
f=10kHz
VIM at THD+N(VOUT)=1%
BW=400Hz-30KHz
MIX=OFF
GMX=20log(VOUT/VIN)
BW=INF-A
ATT=+7dB
GMX=20log(VOUT/VIN)
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
FADER / SUBWOOFER
BLOCK
Electrical Characteristics - continued
Limit
Parameter
Symbol
Unit
Min
Typ
Max
Conditions
Fader=15dB
VIN=100mVrms
GF=20log(VOUT/VIN)
Fader = -∞dB
GF=20log(VOUT/VIN)
BW = IHF-A
Maximum Boost Gain
GF_BST
13
15
17
dB
Maximum Attenuation *
GF_MIN
-
-100
-90
dB
Gain Set Error
GF_ERR
-2
0
+2
dB
GAIN=+1dB to +15dB
Attenuation Set Error 1
GF_ERR1
-2
0
+2
dB
ATT=-1dB to -15dB
Attenuation Set Error 2
GF_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error 3
GF_ERR3
-4
0
+4
dB
ATT=-48dB to -79dB
Output Impedance
ROUT
-
-
50
Ω
VIN =100mVrms
Maximum Output Voltage
VOM
2
2.2
-
Vrms
THD+N=1%
BW=400Hz-30KHz
VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
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TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Typical Performance Curves
20
10
0
0
2
4
6
8
10
1
1kHz
100Hz
0.1
0.1
0.01
0.01
0.001
0.001
10
Power Supply Voltage : VCC [V]
VCC[V]
Gain (dB)
Bass Gain [dB]
3
Gain=0dB
1
0
-1
-2
-3
-4
100
1k
10k
100k
25
20
15
10
5
1
10
BASS GAIN : -20dB to +20dB
/1dB step
fO : 60Hz Q : 0.5
0
-5
-10
-15
-20
-25
10
Frequency (Hz)
100
1k
10k
100k
Frequency [Hz]
Figure 3. Gain vs Frequency
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TSZ22111・15・001
0.1
Figure 2. Total Harmonic Distortion vs Output Voltage
4
10
0.01
Vout (V)
5
-5
0.001
Output Voltage : VOUT [Vrms]
Figure 1. Circuit Current (No Signal) vs Power Supply
Voltage
2
1
10kHz
Figure 4. Bass Gain vs Frequency
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Vout
30
10
VIN [Vrms]
Total Harmonic Distortion : THD+N [%]
40
THD+N (%)
Iq[mA]
Circuit Current (No Signal) : IQ [mA]
50
BD37544FS
Typical Performance Curves – continued
fO : 60/80/100/120Hz
BASS GAIN : ±20dB
Q : 0.5
10
5
0
-5
-10
Gain [dB]
Gain [dB]
25
20
15
-15
-20
-25
10
100
1k
10k
25
20
15
10
5
Q : 0.5/1/1.5/2
BASS GAIN : ±20dB
fO : 60Hz
0
-5
-10
-15
-20
-25
100k
10
100
Frequency [Hz]
Middle Gain [dB]
Gain [dB]
fO : 500Hz
Q : 0.75
100
1k
10k
100k
25
20
15
10
5
0
-5
-10
-15
-20
-25
fO : 500/1k/1.5k/2.5kHz
MIDDLE GAIN :
±20dB
Q : 0.75
10
Frequency [Hz]
100
1k
10k
100k
Frequency [Hz]
Figure 7. Middle Gain vs Frequency
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TSZ22111・15・001
100k
Figure 6. Bass Q vs Frequency
MIDDLE GAIN :
-20dB to +20dB /1dB
step
10
10k
Frequency [Hz]
Figure 5. Bass fo vs Frequency
25
20
15
10
5
0
-5
-10
-15
-20
-25
1k
Figure 8. Middle fo vs Frequency
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BD37544FS
25
20
15
10
5
0
-5
-10
-15
-20
-25
25
Q : 0.75/1/1.25/1.5
15
10
5
0
-5
-10
MIDDLE GAIN :
±20dB
fO : 500Hz
10
100
1k
10k
TREBLE GAIN:-20dB to +20dB
/1dB step
fO : 7.5kHz Q : 0.75
20
Treble
Gain
[dB]
Gain
(dB)
Gain [dB]
Typical Performance Curves – continued
-15
-20
-25
100k
10
100
1k
10k
100k
Frequency [Hz]
Frequency [Hz]
Frequency (Hz)
Figure 9. Middle Q vs Frequency
Figure 10. Treble Gain vs Frequency
25
25
0
-5
-10
Gain [dB]
10
10
5
Gain (dB)
Gain [dB]
Q : 0.75/1.25
TREBLE GAIN : ±20dB
fO : 7.5kHz
20
15
fO : 7.5k/10k/12.5k/15kHz
TREBLE GAIN : ±20dB
Q : 0.75
20
15
5
0
-5
-10
-15
-15
-20
-20
-25
-25
10
100
1k
10k
10
100k
Frequency [Hz]
1k
10k
100k
Frequency [Hz]
Frequency
Figure 12.
Treble Q (Hz)
vs Frequency
Figure 11. Treble fo vs Frequency
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16.Dec.2015 Rev.001
BD37544FS
Typical Performance Curves – continued
1000
Din-Audio
Output Noise [µVrms]
出力雑音電圧
[uVrms]
出力雑音電圧[uVrms]
Output Noise [µVrms]
1000
IHF-A
100
10
1
DIN-Audio
100
10
1
-80 -70 -60 -50 -40 -30 -20 -10 0
10 20
-20 -15 -10 -5
Volume
Volume Gain[dB]
Gain [dB]
0
5
10 15 20
Bass Gain
Gain [dB]
Bass
[dB]
Figure 14. Output Noise vs Bass Gain
Figure 13. Output Noise vs Volume Gain
1000
DIN-Audio
IHF-A
100
10
Output Noise [µVrms]
出力雑音電圧
[uVrms]
1000
出力雑音電圧
[uVrms]
Output Noise [µVrms]
IHF-A
DIN-Audio
IHF-A
100
10
1
1
-20 -15 -10 -5 0 5 10 15 20
Treble Gain
Treble
Gain[dB]
[dB]
-20 -15 -10 -5 0 5 10 15 20
Middle
Gain[dB]
[dB]
Middle Gain
Figure 16. Output Noise vs Treble Gain
Figure 15. Output Noise vs Middle Gain
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BD37544FS
Typical Performance Curves – continued
2.5
0
Output
Voltage : VOUT [Vrms]
最大出力[Vrms]
Gain [dB]
Gain (dB)
-10
-20
-30
-40
-50
-60
2.0
1.5
1.0
0.5
0.0
-70
10
100
1k
10k
100k
Frequency [Hz]
100
1000
10000
RLOAD [ohm]
出力負荷[ohm]
100000
FigureFrequency
17. CMRR vs(Hz)
Frequency
Figure 18. Output Voltage vs RLOAD
Figure 19. Advanced Switch 1
Figure 20. Advanced Switch 2
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TSZ02201-0C2C0E100590-1-2
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BD37544FS
Timing Chart
CONTROL SIGNAL SPECIFICATION
(1) Electrical Specifications and Timing for Bus Lines and I/O Stages
SDA
tBUF
tLOW
tHD;STAT
tF
tR
tSP
SCL
tHD;STA
P
tHD;DAT
tHIGH
tSU;DAT
tSU;STAT
tSU;STOT
Sr
S
P
Figure 21. I2C-bus Signal Timing Diagram
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices (Ta=25°C, VCC=8.5V)
Parameter
Symbol
SCL clock frequency
Bus free time between a STOP and START condition
Hold time (repeated) START condition. After this period, the first clock
3
pulse is generated
4
LOW period of the SCL clock
5
HIGH period of the SCL clock
6
Set-up time for a repeated START condition
7
Data hold time:
8
Data set-up time
9
Set-up time for STOP condition
All values refer to VIH Min and VIL Max Levels (see Table 2).
fSCL
tBUF
1
2
Fast-mode I2C-bus
Min
Max
400
0
1.3
-
Unit
kHz
μS
tHD;STA
0.6
-
μS
tLOW
tHIGH
1.3
0.6
0.6
0.06 (Note)
120
0.6
-
-
-
-
-
-
μS
μS
μS
μS
ns
μS
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
(Note) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH Min of the SCL signal) in order to bridge the
undefined region of the falling edge of SCL.
For 7(tHD;DAT), 8(tSU;DAT), make the setup in which the margin is full.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Parameter
10
11
12
13
14
Symbol
LOW level input voltage:
HIGH level input voltage:
Pulse width of spikes which must be suppressed by the input filter.
LOW level output voltage: at 3mA sink current
Input current each I/O pin with an input voltage between 0.4V and 4.5V.
tHD;STA
tHD;STA
:2µs
:2us
tHD;DAT
tHD;DAT
:1µs
:1us
VIL
VIH
tSP
VOL1
II
tSU;DAT
tSU;DAT
:1µs
:1us
Fast-mode devices
Min
Max
-0.3
+1
2.3
5
0
50
0
0.4
-10
+10
Unit
V
V
ns
V
μA
tSU;STO
tSU;STO
:2µs
:2us
SCL
SCL
tBUF
tBUF
:4us
:4µs
tLOW
tLOW
:3us
:3µs
tHIGH
tHIGH
:1us
:1µs
SDA
SDA
SCL clock
clock frequency
: 250kHz
SCL
frequency:250kHz
Figure 22. A Command Timing Example in the I2C Data Transmission
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TSZ02201-0C2C0E100590-1-2
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BD37544FS
(2) I2C BUS FORMAT
S
1bit
MSB
LSB
Slave Address
8bit
S
Slave Address
A
Select Address
Data
P
MSB
LSB
MSB
LSB
A
Select Address
A
Data
A
P
1bit
8bit
1bit
8bit
1bit 1bit
= Start condition (Recognition of start bit)
= Recognition of slave address. The first 7 bits correspond to the slave address.
The least significant bit is “L” which corresponds to write mode.
= ACKNOWLEDGE bit (Recognition of acknowledgement)
= Select address corresponding to volume, bass or treble.
= Data on every volume and tone.
= Stop condition (Recognition of stop bit)
(3) I2C BUS Interface Protocol
(a) Basic Format
S
Slave Address
A
Select Address
MSB
LSB
MSB
LSB
A
Data
A
MSB
LSB
P
(b) Automatic Increment (Select Address increases (+1) according to the number of data.)
S
Slave Address
A
Select Address
A
Data1
A
Data2
A
・・・・
MSB
LSB
MSB
LSB MSB
LSB
MSB
LSB
(Example)
① Data1 shall be set as data of address specified by Select Address.
② Data2 shall be set as data of address specified by Select Address +1.
③ DataN shall be set as data of address specified by Select Address +N-1.
DataN
MSB
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.)
S Slave Address A
Select Address1 A Data
A Select Address 2 A Data
A
MSB
LSB MSB
LSB MSB LSB MSB
LSB MSB LSB
A
P
LSB
P
(Note) If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
(4) Slave Address
MSB
A6
1
A5
0
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TSZ22111・15・001
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0
A3
0
A2
0
13/37
A1
0
A0
0
LSB
R/W
0
80H
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
(5) Select Address & Data
Select
Address
(hex)
Items
MSB
D7
Data
D6
D5
D4
Initial setup 1
01
Advanced
switch
ON/OFF
0
Advanced switch time of
Input Gain/Volume
Tone/Fader/Super Bass
Mixing
Initial setup 2
02
LPF
Phase
0
Subwoofer Output
Select
Initial setup 3
03
Front HPF
Pass
Rear HPF
Pass
Input Selector
05
Input gain
06
Volume gain
Fader 1ch Front
Fader 2ch Front
Fader 1ch Rear
Fader 2ch Rear
Fader Subwoofer
Mixing
Bass setup
Middle setup
Treble setup
20
28
29
2A
2B
2C
30
41
44
47
Bass gain
51
Middle gain
54
Treble gain
57
Super Bass Gain
System Reset
75
FE
Full-diff
Type
Mute
ON/OFF
0
0
0
Bass
Boost/
Cut
Middle
Boost/
Cut
Treble
Boost/
Cut
0
1
LSB
D3
D2
0
1
0
D1
Advanced switch time
of Mute
Subwoofer LPF fC
Front / Rear HPF fC
0
1
0
0
Input selector
0
0
Input Gain
Volume Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Fader Gain / Attenuation
Mixing Gain / Attenuation
Bass fO
0
Middle fO
0
Treble fO
0
0
0
0
0
0
0
0
Bass Gain
0
0
Middle Gain
0
0
Treble Gain
0
0
0
0
0
0
Bass Q
Middle Q
0
Treble Q
0
0
D0
Super Bass Gain
0
0
1
Advanced switch
Note
1.
The Advanced Switch works in the latch part while changing from one function to another.
2.
Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as
shown below.
→01→02→03→05→06→20→28→29→2A→2B→2C
→30→41→44→47→51→54→57→75
.
3.
Advanced switch is not used for the function of input selector and subwoofer output select, etc. Therefore, please
apply mute on the side when changing these settings.
4.
When using mute function of this IC at the time of changing input selector, please switch mute ON/OFF for waiting
advanced-mute time.
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TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Select address 01 (hex)
Time
MSB
D7
0.6msec
1.0msec
1.4msec
3.2msec
Advanced
Switch
ON/OFF
Time
MSB
D7
4.7 msec
7.1 msec
11.2 msec
14.4 msec
Advanced
Switch
ON/OFF
Mode
MSB
D7
OFF
0
Advanced switch time of Mute
D6
D5
D4
D3
D2
D1
0
Advanced switch time
0
of Input gain/Volume
0
0
1
Tone/Fader/Super
1
Bass/Mixing
1
Advanced switch time of Input
gain/Volume/Tone/Fader/
LSB
Super Bass/Mixing
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
Advanced switch
0
0
1
Time of Mute
1
0
1
1
D6
0
ON
LSB
D0
0
1
0
1
1
Advanced switch ON/OFF
D5
D4
D3
D2
D1
Advanced switch time
of Input gain/Volume
Tone/Fader/Super
Bass/Mixing
0
1
LSB
D0
Advanced switch
Time of Mute
Select address 02(hex)
fC
MSB
D7
OFF
55Hz
85Hz
120Hz
160Hz
Prohibition
LPF
Phase
Mode
MSB
D7
LPF
Front
Rear
Prohibition
LPF
Phase
Phase
MSB
D7
0°
0
180°
1
D6
0
D6
0
D6
0
Subwoofer LPF fC
D5
D4
D3
D2
0
0
0
Subwoofer Output
0
Select
0
1
D1
0
0
1
1
0
Other setting
LSB
D0
0
1
0
1
0
Subwoofer Output Select
LSB
D5
D4
D3
D2
D1
D0
0
0
0
1
0
Subwoofer LPF fC
1
0
1
1
D5
LPF Phase
D4
D3
Subwoofer output
select
0
D2
D1
LSB
D0
Subwoofer LPF fC
: Initial condition
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TSZ22111・15・001
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TSZ02201-0C2C0E100590-1-2
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BD37544FS
Select address 03(hex)
Front/Rear
D5
D4
0
0
0
0
1
1
0
1
Other setting
MSB
Mode
55Hz
85Hz
120Hz
160Hz
Prohibition
D7
D6
Front
HPF
Pass
Rear
HPF
Pass
MSB
Mode
D7
Front
HPF
Pass
pass
NOT pass
D6
0
D5
pass
D7
0
NOT pass
1
Rear HPF
D4
D3
Front/Rear HPF fC
1
MSB
Mode
HPF fC
D3
D2
0
1
0
0
0
D6
Rear
HPF
Pass
D5
Front HPF
D4
D3
Front/Rear HPF fC
LSB
D1
D0
1
0
LSB
D2
D1
D0
0
1
0
D2
D1
D0
0
1
0
LSB
Select address 05(hex)
LSB
Input Selector
D4
D3
D2
D1
D0
A
A1
A2
0
0
0
0
0
B
B1
B2
0
0
0
0
1
C
C1
C2
0
0
0
1
0
D single
DP1
DP2
0
0
0
1
1
FullE single
EP1
EP2
0
0
1
0
0
diff bias
A diff
A1
B1
0
0
0
1
1
1
1
type
C diff
B2
C2
1
0
0
0
0
select
D diff
DP1
DP2
0
0
1
1
0
E diff
EP1
EP2
0
0
1
1
1
Input SHORT
0
1
0
0
1
Prohibition
Other setting
Input SHORT : The input impedance of each input terminal is lowered from 100kΩ(Typ) to 6 kΩ(Typ).
(For quick charge of coupling capacitor)
: Initial condition
Mode
MSB
OUTF1
OUTF2
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TSZ22111・15・001
D7
D6
D5
16/37
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Select address 05(hex)
Mode
MSB
D7
0
1
Negative Input
Bias
D6
Full-diff Bias Type Select
D5
D4
D3
D2
0
0
D0
Input Selector
EP1
1ch
Negative input type
LSB
D1
10
1ch signal input
1ch
Differential
EN1
For Ground –isolation type.
11
EN2
12
2ch
2ch
Differential
EP2
2ch signal input
13
Bias type
EP1
10
For differential amplifier type
1ch
1ch
Differential
EN1
1ch signal input
11
EN2
12
2ch
EP2
2ch signal input
13
2ch
Differential
Select address 06 (hex)
Gain
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
MSB
D7
Mute
ON/OFF
D6
D5
0
0
Input Gain
D4
D3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
1
:
1
Prohibition
:
1
D2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
0
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
:
1
:
1
: Initial condition
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TSZ02201-0C2C0E100590-1-2
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BD37544FS
Select address 06 (hex)
Mode
OFF
ON
MSB
D7
0
1
D6
D5
0
0
Mute ON/OFF
D4
D3
D2
D1
Input Gain
Select address 20, 28, 29, 2A, 2B, 2C (hex)
MSB
Vol, Fader Gain / Attenuation
Gain & ATT
D7
D6
D5
D4
D3
D2
D1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Prohibition
:
:
:
:
:
:
:
0
1
1
1
0
0
0
15dB
0
1
1
1
0
0
0
14dB
0
1
1
1
0
0
1
13dB
0
1
1
1
0
0
1
:
:
:
:
:
:
:
:
-77dB
1
1
0
0
1
1
0
-78dB
1
1
0
0
1
1
1
-79dB
1
1
0
0
1
1
1
1
1
0
1
0
0
0
Prohibition
-∞dB
:
1
1
:
1
1
LSB
D0
:
1
1
:
1
1
:
1
1
:
1
1
LSB
D0
0
1
:
0
1
0
1
:
1
0
1
0
:
1
1
:
0
1
Select address 30(hex)
Gain & ATT
Prohibition
7dB
6dB
5dB
:
-77dB
-78dB
-79dB
MSB
Mixing Gain / Attenuation
D5
D4
D3
D2
0
0
0
0
0
0
0
0
D7
0
0
D6
0
0
:
0
0
0
0
:
1
1
1
1
:
1
1
1
1
:
1
1
1
1
:
1
1
1
1
:
1
1
1
1
:
1
1
1
1
:
0
0
0
0
:
0
0
0
1
:
1
1
:
1
1
:
:
1
1
MIX OFF
1
1
(Note) See the precaution on P30 together, too.
Prohibition
LSB
D1
0
0
D0
0
1
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1
1
1
0
:
1
1
1
0
:
0
1
1
0
:
1
0
1
0
:
1
1
:
1
1
:
1
1
:
0
1
: Initial condition
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TSZ22111・15・001
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TSZ02201-0C2C0E100590-1-2
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BD37544FS
Select address 41(hex)
Q factor
0.5
1.0
1.5
2.0
fO
60Hz
80Hz
100Hz
120Hz
MSB
D7
0
MSB
D7
0
D6
D5
0
D6
0
Bass
D4
Q factor
D3
D2
Bass fO
0
Bass
D4
0
1
0
1
D5
0
0
1
1
fO
D3
0
0
D2
D1
0
0
1
1
LSB
D0
0
1
0
1
D1
LSB
D0
Bass
Q factor
0
Select address 44(hex)
Q factor
0.75
1.0
1.25
1.5
fO
500Hz
1kHz
1.5kHz
2.5kHz
MSB
D7
0
MSB
D7
0
D6
0
D6
0
D5
Middle
D4
Middle fO
D5
0
0
1
1
Q factor
D3
D2
0
Middle
fO
D4
D3
0
1
0
0
1
0
D2
D1
0
0
1
1
D1
LSB
D0
0
1
0
1
LSB
D0
Middle
Q factor
0
Select address 47 (hex)
Q factor
0.75
1.25
fO
7.5kHz
10kHz
12.5kHz
15kHz
MSB
D7
0
MSB
D7
0
D6
Treble
D5
D4
0
D6
0
Treble fO
D5
0
0
1
1
Q factor
D3
D2
0
Treble
fO
D4
D3
0
1
0
0
1
0
D1
0
D2
D1
0
0
LSB
D0
0
1
LSB
D0
Treble
Q factor
: Initial condition
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TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Select address 51, 54, 57 (hex)
MSB
Gain
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
Bass/
11dB
Middle/
12dB
Treble
13dB
Boost
14dB
/cut
15dB
16dB
17dB
18dB
19dB
20dB
D6
0
Bass/Middle/Treble Gain
D5
D4
D3
D2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
1
0
0
1
1
0
1
1
0
1
1
1
0
0
1
0
0
1
0
0
1
0
0
1
0
1
1
0
1
:
1
1
Prohibition
Mode
Boost
Cut
MSB
D7
0
1
:
1
1
:
1
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
1
:
0
1
Bass/Middle/Treble Boost/Cut
D6
D5
D4
D3
D2
D1
0
0
LSB
D0
Bass/Middle/Treble Gain
: Initial condition
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TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Select address 75 (hex)
Gain
MSB
D7
0dB
1dB
2dB
3dB
4dB
5dB
6dB
7dB
8dB
9dB
10dB
11dB
12dB
13dB
14dB
15dB
16dB
17dB
18dB
19dB
20dB
Super Bass Gain
D5
D4
D3
D2
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0
1
0
0
1
0
1
0
0
1
0
0
1
0
0
1
0
0
0
1
1
0
1
1
0
1
1
0
1
1
1
0
0
1
0
0
1
0
0
1
0
0
1
0
1
1
0
1
D6
0
0
:
1
Prohibition
:
1
:
1
D1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
LSB
D0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
:
1
:
1
(Note) About Super Bass, the above Gain is for in indication purposes. Actual Gain (=20log (VOUT/VIN)) is different.
Refer to P31 to P34 for the details.
: Initial condition
(6) About Power ON Reset
Built-in IC initialization is made during power ON of the supply voltage. Please send initial data to all
addresses at supply voltage on. And please turn ON mute until this initial data is sent.
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Max
Rise Time of VCC
tRISE
33
-
-
µsec
VCC Voltage of
Release Power ON
Reset
VPOR
-
4.1
-
V
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VCC rise time from 0V to 5V
TSZ02201-0C2C0E100590-1-2
16.Dec.2015 Rev.001
BD37544FS
Application Information
1.
Function and Specifications
Function
Specifications
・Stereo input
・Single-End/Differential
Input selector
Input gain
Mute
Volume
(Possible to set the number of single-end/ differential as follows )
Single-End
Differential
Mode 1
0
4
Mode 2
1
3
Mode 3
3
2
Mode 4
4
1
Mode 5
5
0
Table.1 Combination of input selector
・+20dB to 0dB (1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
・Possible to use “Advanced switch” for prevention of switching noise.
・+15dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Bass
・Q=0.5, 1, 1.5, 2
・fO=60, 80, 100, 120Hz
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Middle
・Q=0.75, 1, 1.25, 1.5
・fO=500, 1k, 1.5k 2.5kHz
・Possible to use “Advanced switch” for prevention of switching noise.
・+20dB to -20dB (1dB step)
Treble
・Q=0.75, 1.25
・fO=7.5k, 10k, 12.5k, 15kHz
・Possible to use “Advanced switch” for prevention of switching noise.
Fader
LPF
HPF
・+15dB to -79dB(1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
・fC=55/85/120/160Hz, pass
・Phase shift (0°/180°)
・fC=55/85/120/160Hz, pass
・Monaural input
Mixing
・+7dBdB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
Super Bass
・+20dB to 0dB (1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
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BD37544FS
2.
Volume / Fader Volume / Mixing ATT Attenuation Data
(dB)
D7
D6
D5
D4
D3
D2
D1
D0
(dB)
D7
D6
D5
D4
D3
D2
D1
D0
+15
+14
+13
+12
+11
+10
+9
+8
+7
+6
+5
+4
+3
+2
+1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
-11
-12
-13
-14
-15
-16
-17
-18
-19
-20
-21
-22
-23
-24
-25
-26
-27
-28
-29
-30
-31
-32
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
-33
-34
-35
-36
-37
-38
-39
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-51
-52
-53
-54
-55
-56
-57
-58
-59
-60
-61
-62
-63
-64
-65
-66
-67
-68
-69
-70
-71
-72
-73
-74
-75
-76
-77
-78
-79
-∞
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
Adjustable range of mixing ATT is +7dB to -∞dB.
:Initial condition
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BD37544FS
3.
Application Circuit
FIL
GND
SDA
SCL
10μ
VCC
OUTF1 OUTF2 OUTR1 OUTR2 OUTS1 OUTS2
0.1μ
10μ
10μ
10μ
10μ
10μ
10μ
10μ
32
31
VCC/2
GND
30
29
28
27
26
25
24
23
22
20
21
19
18
17
I2C BUS
LOGIC
VCC/2
ATT★
Fader★
Fader★
Fader★
Fader★
Fader★
■Fader
Fader
Gain:+15dB
to -79dB/1dB step
Gain:+15dB~-79dB/1dB
step
★no pop noise
■LPF
fc=55/85/120/160Hz
■HPF
fc=55/85/120/160Hz
■ATT
Gain:
+7dB to -79dB/1dB step
Gain:+7dB~-79dB/1dB
step
★no pop noise
■Super Bass
★no pop noise
■3 Band P-EQ (Tone control)
Gain:
+20dB to -20dB/1dB step
Gain:+20dB~-20dB/1dB
step
★no pop noise
・Bass:f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble:f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain:
+15dB to -79dB/1dB step
Gain:+15dB~-79dB/1dB
step
★no pop noise
■Input Gain
Gain:
+20dB to -0dB/1dB step
Gain:+20dB~0dB/1dB
step
★no pop noise
LPF
HPF
★Super Bass
★3 Band P-EQ
(Tone control)
★Volume/Mute
★Input Gain
Input selector (3 single-end and 2 stereo ISO)
BufferdGND
ISO amp
BufferdGND
ISO amp
1
2
2.2μ
3
2.2μ
Single1
4
2.2μ
5
2.2μ
Single2
GND Isolation3
6
2.2μ
Single3
GND Isolation4
7
2.2μ
8
2.2μ
10
9
10μ
2.2μ
GND Isolation1 or
Single4
BufferdGND
ISO amp
BufferdGND
ISO amp
11
2.2μ
12
10μ
13
2.2μ
GND Isolation2 or
Single5
14
15
16
2.2μ
MIN
※GND Isolation1, GND Isolation2はSingle4,5に切換可能
※Single1~3はGND
Isolation3,4に切換可能
(About GND Isolation1
Isolation2,
it isIsolation2,
possibleit is possible to change from
to 3 it is possible
※About single
input 11~3,
to change from single input to GND
※About and
GNDGND
Isolation1
and GND
(About
differentialinput
inputtoto
single
input
44~5.
to4,5.)
5.
Isolation input
3,4. single input 1~3, it is possible to change from to change from differential
single
input
single input to differential input 3,4.)
Unit
R : [Ω]
C : [F]
Figure 23. BD37544FS
Notes on wiring
①Please connect the decoupling capacitor of the power supply in the shortest possible distance to GND.
②GND lines should be one-point connected.
③Wiring pattern of Digital should be away from that of Analog unit and cross-talk should not be acceptable.
④SCL and SDA lines of I2C BUS should not be parallel if possible.
The lines should be shielded, if they are adjacent to each other.
⑤Analog input lines should not be parallel if possible. The lines should be shielded, if they are adjacent.
⑥Please short Pins 15-16, and Pins 18-19 if the Super Bass is not used.
in the SuperBass un-use.
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BD37544FS
Power Dissipation
About the thermal design of the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Reference data
SSOP-A32
Power Dissipation : Pd (W)
1.5
measurement Condition : ROHM Standard board
board Size : 70 x 70 x 1.6(mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
0.95W
1.0
θja = 131.6°C/W
0.5
0.0
0
25
50
75
85
100
125
150
Ambient Temperature : Ta (°C)
Figure 24. Temperature Derating Curve
(Note) Values are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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BD37544FS
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
A1
2
A2
3
B1
4
B2
5
C1
6
C2
4.25
100KΩ
GND
Input terminal available to ingle/Differential
mode.
The input impedance is 250kΩ(Typ).
VCC
7
DP1
8
DN
9
DP2
10
EP1
11
EN
12
EP2
4.25
250KΩ
GND
An input terminal for Super Bass
VCC
16
SBB1
18
SBB2
Description
A terminal for signal input.
The input impedance is 100kΩ(Typ).
VCC
1
Terminal
-
GND
15
SBA1
17
SBBIAS
19
SBA2
22
OUTS2
23
OUTS1
24
OUTR2
25
OUTR1
26
OUTF2
27
OUTF1
A terminal for Super Bass and fader,
Subwoofer output.
VCC
4.25
GND
An output terminal for Super Bass.
VCC
14
SBC1
20
SBC2
4.25
3KΩ
GND
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
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BD37544FS
I/O Equivalent Circuits – continued
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal
Description
Power supply terminal.
28
VCC
8.5
A terminal for clock input of I2C BUS
communication.
VCC
29
SCL
-
1.65V
GND
A terminal for data input of I2C BUS
communication.
VCC
30
SDA
-
1.65
V
GND
Ground terminal.
31
GND
0
1/2 VCC terminal.
Voltage for reference bias of analog signal
system. The simple precharge circuit and
simple discharge circuit for an external
capacitor are built in.
VCC
50k
32
FIL
4.25
50k
GND
A terminal for signal input.
The input impedance is 27kΩ(typ).
VCC
13
MIN
4.25
27KΩ
GND
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 25. Example of monolithic IC structure
13. About Signal Input
(a) About Input Coupling Capacitor Constant Value
The constant value of input coupling capacitor C(F) is decided with respect to the input impedance R IN(Ω) at
the input signal terminal of the IC. The first HPF characteristic of RC is composed.
G〔dB〕
C〔F〕
0
RIN
〔Ω〕
A(f)
SSH
f〔Hz〕
INPUT
A f  
2 fCRIN 2
2
1  2 fCRIN 
(b) About the Input Selector SHORT
SHORT mode is the command which makes switch SSH =ON of input selector part so that the input impedance
RIN of all terminals becomes small. Switch SSH is OFF when SHORT command is not selected.
The constant time brought about by the small resistance inside and the capacitor outside the LSI becomes
small when this command is used. The charge time of the capacitor becomes short. Since SHORT mode turns
ON the switch of SSH and makes it low impedance, please use it at no signal condition.
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BD37544FS
Operational Notes – continued
14. About MIX
(1)
About Specification of Fader -∞ at MIX ON.
Mix_signal is added to Main_signal after Fader_Gain(+15dB to -79dB) like the figure. When Fader is set at -∞,
the signal after a MIX signal is added is done with MUTE because the -∞ circuit of Fader is in the step after
the addition circuit.
+15dB to -79dB
+7dB to -79dB
Figure 26. About Front Fader and MIX
(2)
About Advanced Switching of MIX_Gain/ATT
When advanced switching of MIX_Gain/ATT works, MIX goes a switching movement that it passes through the
state of MIX_OFF like in B figure below (from current settingof MIX_Gain/ATT to MIX_OFF to a target setting of
MIX_Gain/ATT).
A
Fader_Gain/ATT 0dB to -6dB
advanced switching
B
MIX_Gain/ATT 0dB to -6dB
advanced switching
Figure 27. Advanced Switching Movement when MIX_Gain/ATT is Changed
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Operational Notes – continued
15. About Super Bass Circuit
The (the following Super Bass) which strengthens a low band like the graph below a can be realized by composing
an external circuit with the pin 14 to 20 as shown in Figure 28.
C1
C2
R2
R2
C2
C1
Figure 28. Super Bass circuit
Figure 29. Super Bass Gain vs Frequency
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(a) Gain Step Width becomes a Logarithm
When a setup of Gain is made 0,1,2,3,5,7,11,20dB, it becomes the following (bottom right) character.
(C1=0.047µF, C2=0.1µF, R1=3kΩ, R2=560kΩ)
Expansion
0dB to 20dB
Figure 27. About Gain step of Super Bass
Figure 30. About Gain step of Super Bass
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(b) You must take level diagram into consideration so that output may not do a clip
Example (C1=0.047µF, C2=0.1µF, R2=560kohm, VCC=8.5V)
To prevent output clipping due to amplification when Super Bass is used, adjust the level diagram with
volume until the Tone output level becomes less than 0.2Vrms.
C1
C2
Please adjust so that the maximum
R2
R2
C2
C1
level of the Tone output becomes less than 0.2Vrms. (at VCC=8.5V)
Figure 31. Super Bass Level Diagram
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(c) About fO and Gain of Super Bass
fO and Gain of Super Bass deviates due to the deviation of the value of C1, C2, R2 (Components with the
outside),
R1 (the resistance built in IC).
Example:Super Bass Gain – frequency characteristic at Dispersion condition of C1,C2,R2±5%, R1±30%
(C1=0.047µF, C2=0.1µF, R1=3kohm, R2=560kohm, Super Bass Gain=20dB)
Dispersion of fo: About ±20%
Dispersion of Gain: About ±2dB
Figure 32. Dispersion of fo and Gain of Super Bass
(d) How to Deal with Pins of Super Bass when not used
Short Pins 15 to 16, Pins 18 to 19 as shown in Figure 33 when the Super Bass function is not used.
Short Pin 15 to 16, Pin 18 to 19
Figure 33. How to Deal with Pins of Super Bass when not used
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Ordering Information
B
D
3
7
5
Part Number
4
4
F
S
Package
FS: SSOP-A32
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-A32 (TOP VIEW)
Part Number Marking
BD35744FS
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
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Revision History
Date
Revision
16.Dec.2015
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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