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Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
BD5413EFV
No.10075EBT01
●Description
BD5413EFV is a 5W + 5W stereo class-D power amplifier specifically developed for low power consumption and low heat
generation applications like powered speakers. BD5413EFV employs the state-of-the-art BCD (Bipolar, CMOS and DMOS)
process technology to eliminate a turn-on resistance in the output power stage and an internal loss due to a wiring
resistance as much as possible, achieving a high performance of 80% (4W + 4W output with a load resistance of 8Ω). In
addition, BD5413EFV employs a compact power package which dissipates heat via the rear to achieve low power
consumption and low heat generation so that the need for connecting an external heat radiator can be eliminated up to a
total output of 12.8W. This product meets the needs for compact, thin sound generation systems and powerful, high-quality
sound reproduction.
●Features
1) Small output noise voltage capable of achieving a high S/N set
Input conversion noise voltage = 2.8μVrms
A bipolar differential is used for input amplifier to eliminate 1/f noise.
2) Support of power supply voltage ranging from 6V to 10.5V
A supply voltage range is supported that matches an AC adaptor or battery cell driven set.
When a set is battery driven, its operating time can be extended by means of a high performance class-D amplifier.
3) Support of low current consumption mode
A circuit current in shut-down mode is 1μA or less.
4) Built-in soft muting function for reducing pop at shut-down ON or OFF
When a signal is present, its smooth envelope waveform is realized owing to this function.
In addition, when no signal is present, pop generation is eliminated.
A transit time can be adjusted easily through the use of an external capacitor.
5) Realization of high efficiency and low heat generation
Efficiency = 80% (4W+4W (Vcc=9V, RL=8Ω) output can be made without using an external heat radiator.)
A compact power package HTSSOP-B24 (7.8mm x 7.6mm) is employed.
6) Built-in function for reducing pop generation at disconnection from the outlet
7) Support of function for sampling frequency selection
An internal PWM sampling frequency can be selected from three frequencies (200kHz, 250kHz and 300kHz).
Countermeasures against interference (beat noise) due to a switching power source can be taken as needed.
8) Realization of high reliability
Countermeasures against short-circuits due to output terminals shorted to VCC or ground can be taken
(support of automatic recovery).
A temperature protection circuit is incorporated (support of automatic recovery).
9) Support of ERROR pin
ERROR output takes place as a warning which indicates an error.
(short-circuits due to output terminals shorted to VCC or ground, or IC high temperature abnormality).
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© 2010 ROHM Co., Ltd. All rights reserved.
1/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Absolute maximum ratings
A circuit must be designed and evaluated not to exceed absolute maximum rating in any cases and even momentarily, to
prevent reduction in functional performances and thermal destruction of a semiconductor product and secure useful life and
reliability.
The following values assume Ta =25℃. For latest values, refer to delivery specifications.
Parameter
Supply voltage
Symbol
Ratings
Unit
VCC
+15
V
W
(Note 3)
2.8
W
(Note 4)
VIN
-0.2 to Vcc+0.2
V
Pin 23, 24 (Note 1)
VCONT
-0.2 to Vcc+0.2
V
Pin 14, 15 (Note 1)
Topr
-40 to +85
℃
Tstg
-55 to +150
℃
Tjmax
+150
℃
Pd
Input voltage for signal pin
Input voltage for control pin
Storage temperature range
Maximum junction temperature
Pin 3, 5, 10, 12, 16, 21 (Note 1,2)
1.1
Power dissipation
Operating temperature range
Conditions
(Note 1) A voltage that can be applied with reference to GND (pins 1, 7, 8, 13, 18 and 19)
(Note 2) Pd and Tjmax=150℃ must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mm FR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25℃ or higher, reduce 8.8 mW for increase of every 1℃. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mm FR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25℃ or higher, reduce 22.4 mW for increase of every 1℃. The board is provided with thermal via.
●Operating conditions
The temperature (Ta) is 25℃. For the latest temperature, refer to the delivery specifications.
Parameter
Symbol
Ratings
Unit
Conditions
Supply voltage
VCC
+6 to +10.5
V
Pin 3, 5, 10, 12, 16, 21
Load resistance
RL
6 to 16
Ω
(Note 5)
(Note 5) This value must not exceed Pd.
●Electrical characteristics
Unless otherwise stated, Ta=25℃, Vcc=9V, fIN=1kHz, Rg=0Ω, RL=8Ω, SDX="H" and FC="M (OPEN)"
are assumed. For the latest values, refer to the delivery specifications.
Parameter
Symbol
Limits
Unit
Conditions
Circuit current 1 (sampling mode)
ICC1
12
mA
No signal, no load
Circuit current 2 (mute mode)
ICC2
1
µA
SDX = “L”
Input voltage with SDX pin set to "H"
VIHSDX
2.5 to 9
V
Sampling state
Input voltage with SDX pin set to "L"
VILSDX
0 to 0.5
V
Shut-down state
Input voltage with FC pin set to "H"
VIHFC
8.2 to 9
V
Setting of Fs=300kHz
Input voltage with FC pin set to "M"
VIMFC
3.8 to 5.2
V
Setting of Fs=250kHz
Input voltage with FC pin set to "L"
VILFC
0 to 0.8
V
Setting of Fs=200kHz
Voltage gain
GV
30
dB
PO = 1W
Maximum output power 1 (Note 6)
PO1
4
W
THD+N = 10%, RL = 8Ω
Whole circuit
Control
Audio output
Maximum output power 2 (Note 6)
PO2
5
W
THD+N = 10%, RL = 6Ω
Total harmonic distortion ratio (Note 6)
THD
0.2
%
PO = 1W, BW=20Hz to 20kHz
CT
65
dB
PO = 1W, Rg = 0Ω, BW = IHF-A
VNO
90
µVrms
Rg = 0Ω, BW = IHF-A
VNOM
1
µVrms
Rg = 0Ω, BW = IHF-A, MUTEX = “L”
Crosstalk
Output noise voltage (sampling mode)
Residual noise voltage (mute mode)
200
Internal sampling clock frequency
FS
250
300
kHz
FC = L
FC = M(OPEN)
FC = H
(Note 6) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components,
and power supplies. The reference values are those applicable to the device and components directly installed on a board specified by us.
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2/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Electrical characteristic curves (Ta=25℃) (Reference data)
(1) Under Stereo Operation (RL=8Ω)
100
100
Vcc=9V
RL=8Ω
BW=20~20kHz
1
10
THD+N (%)
THD+N (%)
10
Vcc=9V
RL=8Ω
Po=1W
BW=20~20kHz
6kHz
1
1kHz
0.1
0.1
100Hz
0.01
0.001
0.01
0.01
0.1
1
10
10
100
1000
OUTPUT POWER (W)
10000
Fig. 1 THD+N - Output Power
Fig. 2 THD+N - Frequency
0
40
35
Vcc=9V
RL=8Ω
Po=1W
BW=20~20kHz
-20
CROSSTALK (dB)
VOLTAGE GAIN (dB)
30
25
20
Vcc=9V
RL=8Ω
Po=1W
L=33µH
C=0.47µF
Cg=0.1µF
15
10
5
-40
-60
-80
-100
0
10
100
1000
10000
10
100000
100
1000
Fig. 3 Voltage Gain - Frequency
Fig. 4
0
OUTPUT POWER (W)
10
-60
-80
0.01
0.1
1
6
THD=1%
4
2
4
5
6
7
8
9
10
11
12
VCC (V)
Fig. 6 Output Power - Supply Voltage
Fig. 5 Crosstalk - Output Power
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THD=10%
8
0
10
OUTPUT POWER (W)
© 2010 ROHM Co., Ltd. All rights reserved.
Crosstalk - Frequency
RL=8Ω
fin=1kHz
12
-40
-100
0.001
100000
14
Vcc=12V
RL=8Ω
fin=1kHz
BW=20~20kHz
-20
10000
FREQUENCY (Hz)
FREQUENCY (Hz)
CROSSTALK (dB)
100000
FREQUENCY (Hz)
3/14
2010.05 - Rev.B
Technical Note
BD5413EFV
100
100
90
90
80
80
70
70
EFFICIENCY (%)
EFFICIENCY (%)
●Electrical characteristic curves (Reference data) – Continued
60
50
40
30
20
60
50
40
30
20
Vcc=6V
RL=8Ω
fin=1kHz
10
Vcc=9V
RL=8Ω
fin=1kHz
10
0
0
0
2
4
OUTPUT POWER (W/ch)
Fig. 7
0
6
Efficiency - Output Power
2
4
OUTPUT POWER (W/ch)
Fig. 8
100
6
Efficiency - Output Power
2
90
70
60
ICC (A)
EFFICIENCY (%)
80
50
40
Vcc=9V
Vcc=10.5V
1
Vcc=6V
30
Vcc=10.5V
RL=8Ω
fin=1kHz
20
10
RL=8Ω
fin=1kHz
0
0
0
2
4
OUTPUT POWER (W/ch)
6
0
Fig. 9 Efficiency - Output Power
5
10
TOTAL OUTPUT POWER (W)
Fig. 10 Current Consumption - Output Power
50
-10
RL =8Ω
No signal
40
15
Vcc=9V
RL=8Ω
No signal
Gain=29.6dB
-30
-50
NOISE FFT (dBV)
ICC(mA)
30
20
Sampling
10
0
6
8
10
100
1000
10000
100000
FREQUENCY (Hz)
VCC(V)
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-110
-150
10
12
Fig. 11 50 Current Consumption - Supply Voltage
© 2010 ROHM Co., Ltd. All rights reserved.
-90
-130
ShutDown
4
-70
4/14
Fig. 12 Output Noise Voltage FFT
2010.05 - Rev.B
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
Vcc=9V
R L =8Ω
Po=500mW
fin=100Hz
SDX
Pin14
Vcc=9V
R L=8Ω
Po=500mW
fin= 100Hz
SDX
Pin14
5V/div
5V/div
TS
Pin22
TS
Pin22
2V/div
2V/div
2V/div
Speaker
Output
2V/div
Speaker
Output
200msec/div
200msec/div
Fig. 13
Waveform at Soft Mute Reset
VCCA
5V/div
FIL
Pin2
Fig. 14 Waveform at Soft Mute
Vcc=9V
RL =8Ω
Po=500mW
fin=1kHz
2V/div
Speaker
Output
20msec/div
Fig. 15 Waveform at Instantaneous Power
Interruption (20msec/div)
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© 2010 ROHM Co., Ltd. All rights reserved.
5/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
(2) Under Stereo Operation (RL=16 Ω)
100
10
100
RL=16Ω
fin=1kHz
90
90
80
70
6
60
EFFICIENCY (%)
EFFICIENCY
OUTPUT
POWER(%)(W)
80
8
THD=10%
50
4
40
30
2
20
Vcc=6V
RL=8Ω
fin=1kHz
10
6
8
2
4 10
VCC
(V) (W/ch)
OUTPUT
POWER
50
40
30
Vcc=6V
RL=16Ω
fin=1kHz
10
0
126
0
Output Power - Supply Voltage
Fig. 17
100
100
90
90
80
80
70
70
60
50
40
30
Vcc=9V
RL=16Ω
fin=1kHz
20
10
2
4
OUTPUT POWER (W/ch)
EFFICIENCY (%)
EFFICIENCY (%)
Fig. 16
60
20
00
40
70
Efficiency - Output Power
60
50
40
30
Vcc=10.5V
RL=16Ω
fin=1kHz
20
10
0
0
0
2
4
0
2
OUTPUT POWER (W/ch)
Fig. 18
4
OUTPUT POWER (W/ch)
Efficiency - Output Power
Fig. 19
Efficiency - Output Power
2
ICC(A)
1.5
1
Vcc=9V
Vcc=10.5V
Vcc=6V
0.5
RL =16Ω
fin=1kHz
0
0
2
4
6
8
TOTAL OUTPUT POWER (W)
Fig. 20 Current Consumption - Output Power
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© 2010 ROHM Co., Ltd. All rights reserved.
6/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Electrical characteristic curves (Reference data) – Continued
(3) Under Stereo Operation (RL=6Ω)
90
80
80
70
70
EFFICIENCY (%)
100
90
EFFICIENCY (%)
100
60
50
40
30
Vcc=9V
RL=6Ω
fin=1kHz
20
10
60
50
40
30
Vcc=10.5V
RL=6Ω
fin=1kHz
20
10
0
0
0
2
4
6
0
2
OUTPUT POWER (W/ch)
Fig. 21 Output Power - Supply Voltage
Fig. 22
Efficiency - Output Power
90
12
80
10
EFFICIENCY (%)
OUTPUT POWER (W)
6
100
RL=6Ω
fin=1kHz
14
4
OUTPUT POWER (W/ch)
THD=10%
8
6
4
70
60
50
40
30
Vcc=6V
RL=6Ω
fin=1kHz
20
2
10
0
0
4
6
8
10
12
0
2
VCC (V)
Fig. 23
4
6
OUTPUT POWER (W/ch)
Efficiency - Output Power
Fig. 24
Efficiency - Output Power
2
Vcc=9V
Vcc=10.5V
ICC (A)
Vcc=6V
1
RL=6Ω
fin=1kHz
0
0
5
10
15
TOTAL OUTPUT POWER (W)
Fig. 25 Current Consumption - Output Power
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© 2010 ROHM Co., Ltd. All rights reserved.
7/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Pin Assignment Diagram
Top View
GNDA
1
FIL
2
VCCA
3
TEST
4
VCCP1P
5
OUT1P
6
GNDP1
7
GNDP1
8
OUT1N
9
VCCP1N
10
ERR
11
VCCD
12
FIL
Soft
Shutdown
PWM1
N.C.
PWM2
DRIVER
2P
DRIVER
1P
DRIVER
2N
DRIVER
1N
Sampling
Frequency
Control
ERROR
Shutdown
Control
Protections & Logic
Power - off Detector
Output Short Protection
High Temperature Protection
24
IN1
23
IN2
22
TS
21
VCCP 2P
20
OUT 2P
19
GNDP 2
18
GNDP 2
17
OUT2N
16
VCCP 2N
15
FC
14
SDX
13
GNDD
Fig. 26 Pin Assignment
●Outer Dimensions and Inscriptions
(Maximum size including burr: 6.15) (5.0)
Type
D5413EFV
Lot No.
Fig. 27 Outer Dimensions and Inscriptions of the HTSSOP-B24 Package
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© 2010 ROHM Co., Ltd. All rights reserved.
8/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Pin configuration (Pin Voltage: Typical Value)
No.
Symbol
Pin voltage
Pin description
Internal equalizing circuit
3
24
23
IN1
IN2
1/2VCC
ch1: Analog signal input pin
ch2: Analog signal input pin
20k
23/24
Input an audio signal via a capacitor.
1
5
VCCP1P
Vcc
6
OUT1P
Vcc to 0V
7, 8
GNDP1
0V
ch1: Positive power system power supply pin
5
ch1: Positive PWM signal output pin
Make connection to the output LPF.
6
7,8
ch1: Power GND pin
10
9
10
OUT1N
VCCP1N
Vcc to 0V
Vcc
ch1: Negative PWM signal output pin
Make connection to the output LPF.
9
ch1: Negative power system power supply pin
7,8
12
Error output pin
11
ERROR
H: 5V
L: 0V
Pin for notifying an operation error
H: Error
L: Normal operation
11
100
ON /OFF
300k
13
12
VCCD
VCC
Control power supply pin
13
GNDD
0V
Control GND pin
12
Shut-down control pin
SDX
-
H: Shut-down OFF
L: Shut-down ON
175k
14
225k
14
13
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© 2010 ROHM Co., Ltd. All rights reserved.
9/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Pin configuration - Continued
No.
Symbol
Pin voltage
4
TEST
VCC
Pin description
Internal equalizing circuit
Do not use the TEST pin.
Keep this pin open or connect it to VCC for
regular use.
12
22
TS
0 to 4V
Shut-down ON/OFF
Constant setting pin
1 00
22
Connect a capacitor.
13
16
VCCP2N
Vcc
17
OUT2N
Vcc to 0V
18,
19
ch2: Negative power system power supply pin
16
ch2: Negative PWM signal output pin
Make connection to the output LPF.
17
18 , 19
GNDP2
0V
ch2: Power GND pin
21
ch2: Positive PWM signal output pin
Make connection to the output LPF.
20
OUT2P
Vcc to 0V
21
VCCP2P
Vcc
ch2: Positive power system power supply pin
3
VCCA
Vcc
Analog system power supply pin
20
18 , 19
3
2
FILA
1/2VCC
Analog signal system bias pin
2
Connect a capacitor.
1
1
GNDA
0V
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© 2010 ROHM Co., Ltd. All rights reserved.
Analog signal system GND pin
10/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Application Circuit Diagram
(1)Application Circuit Diagram with a Load of 8Ω for Stereo Operation
・Vcc=6V to 10.5V
GNDA
1
C1
47µ
C2
10µ
C3
0.1µ
2
24
FIL
23
Soft
Shutdown
3
VCC
4
TEST
PWM1
PWM2
22
C19
0.47µ
C18
0.47µ
21
C5
L1 10µ
33µH
C4
DRIVER
2P
+ 0.1µ
DRIVER
1P
6
C6
0.1µ
SP ch1
(8Ω)
C8
0.1µ
GNDP1
L2
33µH
DRIVER
2N
8
DRIVER
1N
9
VCC
11
12
ERROR
L4
10µ 33µH
C15
0.1µ
17
C14
0.47µ
GNDP2
C13
0.1µ
SP ch2
(8Ω)
L3
33µH
C11
0.1µ
16
10
ERROR OUTPUT
C16 C12
0.1µ +
20
18
C9
0.1µ
GNDD
VCCP2
19
7
C7
0.47µ
INPUT
ch-2
C17
2.2µ
VCCP1
5
INPUT
ch-1
Protections & Logic
Power-off Detector
Output Short Protection
High Temperature Protection
Sampling
Frequency
Control
15
Shutdown
Control
14
13
300kHz
250kHz
200kHz
SHUTDOWN
GNDD
0.1µ
C10
Fig.28 Circuit Diagram with a Load of 8Ω for Stereo Operation
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11/14
2010.05 - Rev.B
Technical Note
BD5413EFV
(2)BOMs of Boards for Stereo Operation
Table 1 BOMs of Boards with Loads of 8Ω, 6Ω and 16Ω for Stereo Operation
Configuration
No.
Item
Part Number
Vendor
Value
mm
ROHM
inch
Tolerance
1
IC
BD5413EFV
2
C
GRM32EB31A476KE20
3
C
GRM21BB31C106KE15
MURATA
2012
0805
4
C
GRM188B11C104KA01
MURATA
1608
0603
5
C
GRM188B30J225KE18
MURATA
1608
0603
2.2µF
6.3V
±10%
6
C
GRM188B11C474KA87
MURATA
1608
0603
0.47µF
16V
±10%
7
C
EMZA350ADA100ME61G
10µF
35V
±20%
Value
Rated
voltage
MURATA
CHEM1-00N
HTSSOP-B24
Rated
voltage
3225
1210
5.3×5.3
Temperature
characteristics
Quantity
Reference
-
-
-
-
1
IC1
47µF
10V
±10%
±10%
1
C1
10µF
16V
±10%
±10%
1
C2
0.1µF
16V
±10%
±10%
6
C3, C4, C9, C10, C11, C16
±10%
1
C17
±10%
2
C18, C19
+20%, -25%
2
C5, C12
Tolerance
Temperature
characteristics
Quantity
BOM of Board with a Load Resistance of 8Ω
Configuration
No.
Item
Part Number
Vendor
mm
inch
Reference
8
C
GRM188B11C104KA01
MURATA
1608
0603
0.1µF
16V
±10%
±10%
4
C6, C8, C13, C15
9
C
GRM188B11C474KA87
MURATA
1608
0603
0.47µF
16V
±10%
±10%
2
C7, C14
No.
Item
Value
Tolerance
DC
Resistance
Rated
DC Current
Quantity
33µH
±10%
92mΩmax
1.4A max
4
Value
Rated
voltage
Tolerance
Temperature
characteristics
Quantity
Configuration
Part Number
Vendor
mm
10
L
TSL0808RA-330K1R4-PF
TDK
Ф8.5,8.3
Reference
L1, L2, L3, L4
BOM of Board with a Load Resistance of 6Ω
Configuration
No.
Item
Part Number
Vendor
mm
inch
Reference
8
C
GRM188B11C474KA87
MURATA
1608
0603
0.47µF
16V
±10%
±10%
4
C6, C8, C13, C15
9
C
GRM188B11C474KA87
MURATA
1608
0603
0.47µF
16V
±10%
±10%
2
C7, C14
No.
Item
Value
Tolerance
DC
Resistance
Rated
DC Current
Quantity
22µH
±10%
70mΩmax
1.7A max
4
Value
Rated
voltage
Tolerance
Temperature
characteristics
Quantity
Configuration
Part Number
Vendor
mm
10
L
TSL0808RA-220K1R7-PF
TDK
Ф8.5,8.3
Reference
L1, L2, L3, L4
BOM of Board with a Load Resistance of 16Ω
Configuration
No.
Item
Part Number
Vendor
mm
inch
Reference
8
C
GRM188B11C104KA01
MURATA
1608
0603
0.01µF
16V
±10%
±10%
4
C6, C8, C13, C15
9
C
GRM188B11C224KA01
MURATA
1608
0603
0.22µF
16V
±10%
±10%
2
C7, C14
No.
Item
Value
Tolerance
DC
Resistance
Rated
DC Current
Quantity
68µH
±10%
160mΩmax
1A max
4
Configuration
Part Number
Vendor
mm
10
L
TSL0808RA-680K1R0-PF
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© 2010 ROHM Co., Ltd. All rights reserved.
TDK
Ф8.5,8.3
12/14
Reference
L1, L2, L3, L4
2010.05 - Rev.B
Technical Note
BD5413EFV
●Notes for use
1. About absolute maximum ratings
If an applied voltage or an operating temperature exceeds an absolute maximum rating, it may cause destruction of a
device. A result of destruction, whether it is short mode or open mode, is not predictable. Therefore, provide a physical
safety measure such as fuse, against a special mode that may violate conditions of absolute maximum ratings.
2. About power supply line
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
3. Potential of GND (1, 7, 8, 13, 18 and 19 pins)
Potential of the GND terminal must be the lowest under any operating conditions.
4. About thermal design
Perform thermal design with sufficient margins, in consideration of maximum power dissipation Pd under actual operating
conditions. This product has an exposed frame on the back of the package, and it is assumed that the frame is used with
measures to improve efficiency of heat dissipation. In addition to front surface of board, provide a heat dissipation pattern
as widely as possible on the back also.
A class-D power amplifier has heat dissipation efficiency far higher than that of conventional analog power amplifier and
generates less heat. However, extra attention must be paid in thermal design so that a power dissipation Pdiss should not
exceed the maximum power dissipation Pd.
Tjmax- Ta
〔 W〕
θ ja
Maximum power dissipation
Pd  Po
Power dissipation
1

Pdiss  PO  - 1  〔 W 〕
η 
Tjmax: Maximum temperature junction = 150[℃]
Ta: Operating ambient temperature [℃]
θja: Package thermal resistance [℃/W]
Po: Output power [W]
η: Efficiency
5. About operations in strong electric field
Note that the device may malfunction in a strong electric field.
6. Thermal shutdown (TSD) circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃, and is not intended to
protect and secure an electrical appliance. Accordingly, do not use this circuit function to protect a customer's electrical
appliance.
7. About shorting between pins and installation failure
Be careful about direction and displacement of an IC when installing it onto the board. Faulty installation may destroy the
IC when the device is energized. In addition, a foreign matter getting in between IC pins, pins and power supply, and
pins and GND may cause shorting and destruction of the IC.
8. About power-on or power-off sequence
Set the SDX pin (pin 14) to “L” level before initiating the power-on sequence. Similarly, set the SDX pin (pin 14) to “L”
level before initiating the power-off sequence. If such a setting is made, pop reduction is achieved at power-on or poweroff sequence. In addition, note that all power supply pins shall be made active or inactive at the same time.
9. About error output pin (pin 11)
When a high temperature protection function or VCC/GND shorting protection function is activated, an error flag is output
via an error output pin. Because the error output pin is primarily intended to indicate the state of BD5413EFV and is
available only to protect BD5413EFV, it cannot be used for any other purposes.
10. About TEST pin (pin 4)
Do not use the TEST pin. Keep this pin open or connect it to VCC for regular use.
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© 2010 ROHM Co., Ltd. All rights reserved.
13/14
2010.05 - Rev.B
Technical Note
BD5413EFV
●Ordering part number
B
D
5
Part No
BD.
4
1
3
Part No.
5413
E
F
-
V
Package
EFV:HTSSOP-B24
E
2
Packaging and forming specification
E2: Embossed tape and reel
HTSSOP-B24
<Tape and Reel information>
7.8±0.1
(MAX 8.15 include BURR)
(5.0)
1.0±0.2
0.53±0.15
(3.4)
1
0.325
Tape
Embossed carrier tape (with dry pack)
Quantity
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
12
1PIN MARK
+0.05
0.17 -0.03
S
0.08±0.05
0.85±0.05
1.0MAX
+6°
4° −4°
13
5.6±0.1
7.6±0.2
24
0.65
0.08 S
+0.05
0.24 -0.04
0.08
1pin
M
Reel
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
14/14
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.05 - Rev.B
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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