Datasheet Download

Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
No.10075EBT04
BD5424EFS
●Description
BD5424EFS is a 20W + 20W stereo class-D power amplifier IC, developed for space-saving and low heat-generation
applications such as low-profile TV sets. The IC employs state-of-the-art Bipolar, CMOS, and DMOS (BCD) process technology
that eliminates turn-on resistance in the output power stage and internal loss due to line resistances up to an ultimate level.
With this technology, the IC has achieved high efficiency of 91% (10W + 10W output with 8Ω load), which is the top class in
the industry. The IC, in addition, employs a compact back-surface heat radiation type power package to achieve low power
consumption and low heat generation and eliminates necessity of installing an external radiator, up to a total output of 40W.
This product satisfies both needs for drastic downsizing, low-profile structures and powerful, high-quality playback of the
sound system.
●Features
1) A high efficiency of 91% (10W + 10W output with 8Ω load), which is the highest grade in the industry and low heat-generation.
2) An output of 20W + 20W (17V, with 8Ω load) is allowed without an external heat radiator.
3) Driving a lowest rating load of 3.6Ω is allowed.
4) Pop noise upon turning power on/off and power interruption has been reduced.
5) High-quality audio muting is implemented by soft-switching technology.
6) An output power limiter function limits excessive output to speakers.
7) High-reliability design provided with built-in protection circuits against high temperatures, against VCC shorting and
GND shorting, against reduced-voltage, and against applying DC voltage to speaker.
8) A master/slave function allowing synchronization of multiple devices reduces beat noises.
9) Adjustment of internal PWM sampling clock frequencies (350kHz to 500kHz) allows easy protective measures
against unwanted radio emission to AM radio band.
10) A compact back-surface heat radiation type power package is employed.
HTSSOP-A44 (5mm × 7.5mm × 1.0mm, pitch 0.8mm)
●Absolute Maximum Ratings
A circuit must be designed and evaluated not to exceed absolute maximum rating in any cases and even momentarily, to prevent
reduction in functional performances and thermal destruction of a semiconductor product and secure useful life and reliability.
The following values assume Ta =25℃. For latest values, refer to delivery specifications.
Symbol
Ratings
Unit
VCC
+20
V
Power dissipation
Pd
2.0
4.5
W
W
Pin 7, 8, 15, 16, 29, 30, 37, 38, 40
(Note 1, 2)
(Note 3)
(Note 4)
Input voltage for signal pin
VIN
-0.2 ~ +7.2
V
Pin 1, 44 (Note 1)
Input voltage for control pin
VCONT
-0.2 ~ Vcc+0.2
V
Pin 20, 24 (Note 1)
Input voltage for clock pin
VOSC
-0.2 ~ +7.2
V
Pin 23 (Note 1)
Operating temperature range
Topr
-40 ~ +85
℃
Storage temperature range
Tstg
-55 ~ +150
℃
Maximum junction temperature
Tjmax
+150
℃
Parameter
Supply voltage
Conditions
(Note 1) A voltage that can be applied with reference to GND (pins 11, 12, 33, 34, and 43)
(Note 2) Pd and Tjmax=150℃ must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mm FR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25℃ or higher, reduce 16mW for increase of every 1℃. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mm FR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25℃ or higher, reduce 36mW for increase of every 1℃. The board is provided with thermal via.
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1/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Operating Conditions
The following values assume Ta =25℃. Check for latest values in delivery specifications.
Parameter
Supply voltage
Minimum load resistance
Symbol
Ratings
Unit
Conditions
VCC
+10 ~ +18
V
Pin 7, 8, 15, 16, 29, 30, 37, 38, 40
RL
3.6
Ω
(Note 5)
(Note 5) Pd should not be exceeded.
●Electrical Characteristics
Except otherwise specified Ta = 25℃, VCC = 12V, fIN = 1kHz, Rg = 0Ω, RL = 8Ω, MUTEX="H", MS="L", SDX="H".
For latest values, refer to delivery specifications.
Symbol
Limits
Unit
Circuit current 1 (Sampling mode)
ICC1
30
mA
With no signal
Circuit current 2 (Muting mode)
ICC2
12
mA
MUTEX = “L”
“H” level input voltage
VIH
2.3 ~ 12
V
SDX, MUTEX, MS
“L” level input voltage
VIL
0 ~ 0.8
V
SDX, MUTEX, MS
Voltage gain
GV
28
dB
PO = 1W
Maximum output power 1 (Note 6)
PO1
10
W
THD+N = 10%
Maximum output power 2 (Note 6)
PO2
20
W
Vcc=17V, THD+N = 10%
Total harmonic distortion (Note 6)
THD
0.1
%
PO = 1W, BW=20Hz ~ 20kHz
Crosstalk
CT
85
dB
PO = 1W, Rg = 0Ω, BW = IHF-A
Output noise voltage (Sampling mode)
VNO
80
µVrms
Rg = 0Ω, BW = IHF-A
Residual noise voltage (Muting mode)
VNOM
35
µVrms
Rg = 0Ω, BW = IHF-A, MUTEX = “L”
Mute Attenuation
Gvm
98
dB
Po =1W, BW =IHF-A, MUTEX = “L”
Internal sampling clock frequency
FOSC
350
kHz
MS = “L” (In master operation)
Parameter
Conditions
Whole circuit
Control circuit
Audio circuit
(Note 6) The rated values of items above indicate average performances of the device, which largely depend on circuit layouts, components,
and power supplies. The reference values are those applicable to the device and components directly installed on a board specified by us.
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2/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Electrical characteristic curves (Reference data)
(1) Under Stereo Operation (RL=8Ω)
100
100
Vcc=12V
RL=8Ω
BW=20~20kHz
10
THD+N (%)
THD+N (%)
10
6kHz
1
0.1
Vcc=12V
RL=8Ω
Po=1W
BW=20~20kHz
1kHz
1
0.1
100Hz
0.01
0.001
0.01
0.1
1
10
0.01
100
10
OUTPUT POWER (W)
100
1000
10000
100000
FREQUENCY (Hz)
Fig. 2 THD+N - Frequency
Fig. 1 THD+N - Output power
0
40
Vcc=12V
RL=8Ω
Po=1W
BW=20~20kHz
-20
30
25
CROSSTALK (dB)
VOLTAGE GAIN (dB)
35
Vcc=12V
RL=8Ω
Po=1W
L=33µH
C=0.47µF
Cg=0.1µF
20
15
10
5
-40
-60
-80
0
-100
10
100
1000
10000
100000
10
100
FREQUENCY (Hz)
Fig. 3 Voltage gain - Frequency
OUTPUT POWER (W)
CROSSTALK (dB)
100000
25
Vcc=12V
RL=8Ω
fin=1kHz
BW=20~20kHz
-40
-60
-80
-100
0.001
10000
Fig. 4 Crosstalk - Frequency
0
-20
1000
FREQUENCY (Hz)
RL=8Ω
fin=1kHz
20
THD=10%
15
THD=1%
10
5
0
0.01
0.1
1
10
8
100
Crosstalk - Output power
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12
14
16
18
20
VCC (V)
OUTPUT POWER (W)
Fig. 5
10
Fig. 6
3/17
Output power - Power supply voltage
2010.05 - Rev.B
Technical Note
BD5424EFS
100
90
80
70
60
50
40
30
20
10
0
Vcc=10V
RL=8Ω
fin=1kHz
0
5
10
15
100
90
80
70
60
50
40
30
20
10
0
EFFICIENCY (%)
EFFICIENCY (%)
●Electrical characteristic curves (Reference data) – Continued
20
Vcc=12V
RL=8Ω
fin=1kHz
0
OUTPUT POWER (W/ch)
20
Fig. 8 Efficiency - Output power
Vcc=18V
Vcc=12V
2
ICC (A)
EFFICIENCY (%)
15
3
100
90
80
70
60
50
40
30
20
10
0
Vcc=18V
RL=8Ω
fin=1kHz
Vcc=10V
1
RL=8Ω
fin=1kHz
0
0
5
10
15
20
0
25
5 10 15 20 25 30 35 40 45 50
TOTAL OUTPUT POWER (W)
OUTPUT POWER (W/ch)
Fig. 9 Efficiency - Output power
Fig. 10 Current consumption - Output power
0
RL=8Ω
Vcc=12V
RL=8Ω
Without
signal
無信号時
BW=20~20kHz
-20
Without
signal
無信号時
NOISE FFT (dBV)
ICC (mA)
10
OUTPUT POWER (W/ch)
Fig. 7 Efficiency - Output power
100
90
80
70
60
50
40
30
20
10
0
5
Sampling
Mute
-40
-60
-80
-100
-120
-140
8
10
12
14
16
18
10
VCC (V)
1000
10000
100000
FREQUENCY (Hz)
Fig. 11 Current consumption - Power supply voltage
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100
4/17
Fig. 12 FFT of Output Noise Voltage
2010.05 - Rev.B
Technical Note
BD5424EFS
●Electrical characteristic curves (Reference data) – Continued
MUTEX
Pin 20
10V/div
TM
Pin 26
5V/div
Vcc=12V MUTEX
Pin 20
RL =8 Ω
Po=500m W
fin=500Hz
TM
Pin 26
2V/div
Speaker
output
10V/div
5V/div
Vcc=12V
RL =8 Ω
Po=500mW
fin=500Hz
2V/div
Speaker
output
10msec/div
10msec/div
Fig. 13 Wave form when Releasing Soft-mute
Fig. 14 Wave form when Activating Soft-mute
VCCA
VCCA
VHOLD
Pin 27
5V/div
VHOLD
Pin 27
TM
Pin 26
5V/div
Vcc=12V
RL =8 Ω
Po=500mW
TM
fin=3kHz
Pin 26
2V/div
Speaker
output
Vcc=12V
RL =8 Ω
Po=500mW
fin=3kHz
5V/div
2V/div
Speaker
output
20msec/div
2msec/div
Fig. 15 Wave form on Instantaneous Power Interruption
(20msec / div)
5V/div
Soft Clip
5V/div
Speaker
output
Fig. 16 Wave form on Instantaneous Power Interruption
(2msec / div)
Vcc=12V
RL =8 Ω
Po=5W
THD+n=10%
fin=1kHz
R2=91k Ω
R3=22k Ω
Soft Clip
200μsec/div
Fig. 17 Wave form on Output Power Limiter function
(Po = 5W)
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5/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Electrical characteristic curves (Reference data) – Continued
(2)Under Stereo Operation (RL=6Ω)
OUTPUT POWER (W)
30
R L=6Ω
fin=1kHz
25
THD=10%
20
15
10
5
0
8
10
12
14
16
18
20
VCC (V)
100
90
80
70
60
50
40
30
20
10
0
Vcc=10V
RL=6Ω
fin=1kHz
0
5
10
15
20
100
90
80
70
60
50
40
30
20
10
0
Vcc=12V
RL=6Ω
fin=1kHz
0
25
5
10
15
20
OUTPUT POWER (W/ch)
OUTPUT POWER (W/ch)
Fig. 19 Efficiency - Output power
Fig. 20 Efficiency - Output power
100
90
80
70
60
50
40
30
20
10
0
4
Vcc=18V
RL=6Ω
fin=1kHz
25
Vcc=18V
3
ICC (A)
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
Fig. 18 Output power - Power supply voltage
Vcc=12V
Vcc=10V
2
1
RL=6Ω
fin=1kHz
0
0
5
10
15
20
25
30
0
OUTPUT POWER (W/ch)
5 10 15 20 25 30 35 40 45 50 55 60
TOTAL OUTPUT POWER (W)
Fig. 21 Efficiency - Output power
Fig. 22 Current consumption - Output power
Dotted lines of the graphs indicate continuous output power to be obtained on musical signal source or by installing
additional heat sinks.
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6/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Electrical characteristic curves (Reference data) – Continued
(3)Under Stereo Operation (RL=4Ω)
OUTPUT POWER (W)
30
RL=4Ω
fin=1kHz
25
THD=10%
20
15
10
5
0
8
10
12
14
16
18
VCC (V)
100
90
80
70
60
50
40
30
20
10
0
EFFICIENCY (%)
EFFICIENCY (%)
Fig. 23 Output power - Power supply voltage
Vcc=10V
RL=4Ω
fin=1kHz
0
5
10
15
100
90
80
70
60
50
40
30
20
10
0
20
Vcc=12V
RL=4Ω
fin=1kHz
0
5
OUTPUT POWER (W/ch)
20
Fig. 25 Efficiency - Output power
6
5
4
ICC (A)
EFFICIENCY (%)
15
OUTPUT POWER (W/ch)
Fig. 24 Efficiency - Output power
100
90
80
70
60
50
40
30
20
10
0
10
Vcc=10V
Vcc=12V
3
Vcc=18V
2
Vcc=18V
RL=4Ω
fin=1kHz
0
5
10
15
20
25
30
35
RL=4Ω
fin=1kHz
1
0
40
0
10
20
30
40
50
60
70
80
TOTAL OUTPUT POWER (W)
OUTPUT POWER (W/ch)
Fig. 27 Current consumption - Output power
Fig. 26 Efficiency - Output power
Dotted lines of the graphs indicate continuous output power to be obtained on musical signal source or by installing
additional heat sinks.
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7/17
2010.05 - Rev.B
1.0 MAX
0.85
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© 2010 ROHM Co., Ltd. All rights reserved.
7
8
V CCP1P
V CCP1P
(MAX 18.85 include BURR)
(6.0)
44
1
8/17
BD5424EFS
21
SDX
Control
SD
Control
M ute
ERROR
N.C. 22 N.C.
20
19
ERROR
M UTEX
18
17
BSP1N
W A RNING
16
14
OUT1N
Output DC V oltage Protection
Output Short Protection
High Temperature Protection
Under V oltage Protection
Protections & L ogic
DRIV ER
1N
V CCP1N
13
OUT1N
DRI V ER
1P
15
12
GNDP1
PW M 2
DRIV ER
2N
V CCP1N
11
GNDP1
W A RNING
6
BSP1P
PW M 1
DRI V ER
2P
(5.0)
5
PL M T4
10
4
PL M T3
OUT1P
3
PL M T2
9
L imit
2
PL M T1
OUT1P
Power
1
IN1
Clock
Control
Ramp
Generator
Soft M ute
Power- off
Detector
23 OSC
24 M S
25 ROSC
26 TM
27 V HOL D
28 BSP2N
29 V CCP2N
30 V CCP2N
31 OUT2N
32 OUT2N
33 GNDP2
34 GNDP2
35 OUT2P
36 OUT2P
37 V CCP2P
38 V CCP2P
39 BSP2P
40 V CCA
41 FIL P
FIL P
V CCA
42 FIL A
43 GNDA
FIL A
GNDA
44 IN2
BD5424EFS
Technical Note
●Pin Assignment
Top View
Fig. 28 Pin Assignment Diagram
●Outer Dimensions and Inscriptions
18.5±0.1
TYPE
23
1PIN MARK
22
Lot No.
(Unit: mm)
Fig. 29 Outer Dimensions and Inscriptions of HTSSOP-A44 Package
2010.05 - Rev.B
Technical Note
BD5424EFS
●Explanation of Pin Functions (Provided pin voltages are typical values.)
No.
Symbol
Pin voltage
Pin description
1
44
IN1
IN2
3.5V
Internal equalizing circuit
ch1 Analog signal input pin
ch2 Analog signal input pin
Input audio signal via a capacitor.
2
PLMT1
3.5V
Voltage-to-current conversion pin for
output power limiter function
Connect a register.
3
PLMT2
-
Current-to-voltage conversion pin for
output power limiter function
Connect a register.
4
PLMT3
-
Current-to-voltage conversion pin for
output power limiter function
Connect a register.
Bias pin for output power limiter function
5
PLMT4
3.5V
Connect a register and a capacitor.
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9/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Explanation of Pin Functions - Continued
No.
Symbol
Pin voltage
6
BSP1P
-
7, 8
VCCP1P
Vcc
9, 10
OUT1P
Vcc ~ 0V
11, 12
GNDP1
0V
13, 14
OUT1N
Vcc ~ 0V
15, 16
VCCP1N
Vcc
17
BSP1N
-
Pin description
Internal equalizing circuit
ch1 positive bootstrap pin
Connect a capacitor.
ch1 positive power system power supply
pin
ch1 positive PWM signal output pin
Connect with output LPF.
ch1 power system GND pin
ch1 negative PWM signal output pin
Connect with output LPF.
ch1 negative power system power supply
pin
ch1 negative bootstrap pin
Connect a capacitor.
Warning output pin
18
WARNING
H: 5V
L: 0V
Pin to notify operation warning.
H: Under warning
L: Normal operation
Error output pin
19
ERROR
H: 5V
L: 0V
A pin for notifying operation errors.
H: Error
L: Normal operation
Audio mute control pin
20
MUTEX
-
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H: Mute off
L: Mute on
10/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Explanation of Pin Functions - Continued
No.
Symbol
Pin voltage
Pin description
Internal equalizing circuit
Shutdown control pin
21
SDX
-
22
N.C.
-
H: Shutdown off
L: Shutdown on
N.C. pin
Nothing is connected with IC internal
circuit.
Sampling clock signal input/output pin
23
OSC
-
When using two or more sampling clocks,
connect via a capacitor.
Master/Slave switching pin
24
MS
-
Switching of master/slave functions on a
sampling clock signal.
H: Slave operation
L: Master operation
Internal PWM sampling clock frequency
setting pin
25
ROSC
5.6V
26
TM
0 ~ 5V
Usually the pin is used open.
To adjust an internal sampling clock
frequency, connect a resister.
Audio muting constant setting pin
Connect a capacitor.
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11/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Explanation of Pin Functions - Continued
No.
Symbol
Pin voltage
Pin description
Internal equalizing circuit
Instantaneous power interruption
detecting voltage setting pin
27
HOLD
0.68×Vcc
28
BSP2N
-
29, 30
VCCP2N
Vcc
31, 32
OUT2N
Vcc ~ 0V
33, 34
GNDP2
0V
35, 36
OUT2P
Vcc ~ 0V
37, 38
VCCP2P
Vcc
39
BSP2P
-
ch2 positive bootstrap pin
Connect a capacitor.
40
VCCA
Vcc
Analog system power pin
41
FILP
Vcc+35
12
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© 2010 ROHM Co., Ltd. All rights reserved.
Connect a capacitor.
To adjust a detecting voltage, connect a
resister.
ch2 negative bootstrap pin
Connect a capacitor.
ch2 negative power system power supply
pin
ch2 negative PWM signal output pin
Connect an output LPF.
ch2 power system GND pin
ch2 positive PWM signal output pin
Connect an output LPF.
ch2 positive power system power supply
pin
PWM system bias pin
Connect a capacitor.
12/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Explanation of Pin Functions - Continued
No.
Symbol
Pin voltage
Pin description
Internal equalizing circuit
Analog signal system bias pin
42
FILA
3.5V
Connect a capacitor.
43
GNDA
0V
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Analog system power supply pin
13/17
2010.05 - Rev.B
SP 1ch
(4Ω)
R3
22kΩ
WARNING
DRIVER
1P
DRIVER
2P
39
40
C6
1µF
GNDA
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© 2010 ROHM Co., Ltd. All rights reserved.
C7
0.1µF
C8
10µF
0.15µF
C9
14/17
Protections & Logic
Power-off
Detector
19
20
21
ERROR
OUTPUT
MUTE
SD
Clock
Control
Ramp
Generator
SOFT MUTE
23
24
25
26
C26
C23
0.1µF
SLAVE
MASTER
CLK I/O
0.1µF
C27
3.3µF
22kΩ
R25
C42
10µF
SD
Control
Mute
Control
Output Short Protection
Output DC Voltage Protection
27
C28
1µF
ERROR
Under Voltage Protection
High Temperature Protection
GNDP
22 N.C.
18
C15
0.1µF
28
C29
0.1µF
17
29
C37
0.1µF
16
10µF
30
L31
10µH
0.15µF
15
C38
GNDP
L35
10µH
C31
0.15µF
31
13
DRIVER
2N
32
DRIVER
1N
33
12
+
VCCP
C35
14
34
35
36
11
10
9
+
INPUT 2ch
C32
WARNING
OUTPUT
C5
0.1µF
37
VCCA
C39
1µF
GNDP
R4
22kΩ
8
PWM2
41
FILP
C41
1µF
38
PWM1
42
FILA
43
C40 0.1µF
7
6
5
4
Power
Limit
GNDA
C44
1µF
VCCA
L13
10µH
GNDA
3
2
44
C43
10µF
VCCP
R2
22kΩ
1
GNDA
+
L9
10µH
INPUT 1ch
C1
1µF
SP 2ch
(4Ω)
BD5424EFS
Technical Note
●Application Circuit Diagram
・Vcc=10V ~ 18V
0.68µF
C17
1µF
C13
0.15µF
C10
0.68µF
Fig. 30 Circuit Diagram of Stereo Operation with 4Ω Load
2010.05 - Rev.B
Technical Note
BD5424EFS
Table 1 BOM List of Stereo Operation with 4Ω Load
Configuration
No. Item
Part Number
Vendor
mm
Value
Rated
voltage
Tolerance
-
-
-
-
1
inch
HTSSOP-A44
Temperature
Quantity
characteristics
Reference
1
IC
BD5424EFS
ROHM
IC1
2
C
GRM21BB31H105KA12
MURATA
2012
0805
1µF
50V
±10%
±10%
4
C6, C17, C28, C39
3
C
GRM188R11H104KA93
MURATA
1608
0603
0.1µF
50V
±10%
±10%
5
C7, C15, C29, C37, C40
4
C
GRM21BB31H154KA88
MURATA
2012
0805
0.15µF
50V
±10%
±10%
4
C9, C13, C31, C35
5
C
GRM188B31C105KA92
MURATA
1608
0603
1µF
16V
±10%
±10%
2
C1, C44
6
C
GRM31MR71H684KA88
MURATA
3216
1206
0.68µF
50V
±10%
±15%
2
C10, C32
7
C
GRM21BB31E335KA75
MURATA
2012
0805
3.3µF
25V
±10%
±10%
1
C27
8
C
GRM188B11E104KA01
MURATA
1608
0603
0.1µF
25V
±10%
±10%
3
C5, C23, C26
9
C
GRM21BB11C105KA
MURATA
2012
0805
1µF
16V
±10%
±10%
1
C41
10
C
GRM21BB31C106KE15
MURATA
2012
0805
10µF
16V
±10%
±10%
1
C42
11
C
25SVPD10M
SANYO
6666
2626
10µF
25V
±20%
±25%
3
C8, C38, C43
12
R
MCR01MZPF2202
ROHM
1005
0402
22kΩ
50V
±1%
±200ppm/℃
3
R2, R3, R4,R25
Part Number
Vendor
Value
Tolerance
DC
Resistance
Rated
DC Current
Quantity
Reference
10µH
±20%
30mΩmax.
5.09A max.
4
L9, L13, L31, L35
Configuration
No. Item
mm
13
L
A7502BY-100M
TOKO
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© 2010 ROHM Co., Ltd. All rights reserved.
φ13×16.0
15/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Notes for use Notes for use
1. About absolute maximum ratings
If an applied voltage or an operating temperature exceeds an absolute maximum rating, it may cause destruction of a
device. A result of destruction, whether it is short mode or open mode, is not predictable. Therefore, provide a physical
safety measure such as fuse, against a special mode that may violate conditions of absolute maximum ratings.
2. About power supply line
As return of current regenerated by back EMF of output coil happens, take steps such as putting capacitor between
power supply and GND as a electric pathway for the regenerated current. Be sure that there is no problem with each
property such as emptied capacity at lower temperature regarding electrolytic capacitor to decide capacity value. If the
connected power supply does not have sufficient current absorption capacity, regenerative current will cause the voltage
on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute
maximum ratings. It is recommended to implement a physical safety measure such as the insertion of a voltage clamp
diode between the power supply and GND pins.
3. Potential of GND (11, 12, 33, 34, and 43 pins)
Potential of the GND terminal must be the lowest under any operating conditions.
4. About thermal design
Perform thermal design with sufficient margins, in consideration of maximum power dissipation Pd under actual operating
conditions. This product has an exposed frame on the back of the package, and it is assumed that the frame is used with
measures to improve efficiency of heat dissipation. In addition to front surface of board, provide a heat dissipation pattern
as widely as possible on the back also.
A class-D power amplifier has heat dissipation efficiency far higher than that of conventional analog power amplifier and
generates less heat. However, extra attention must be paid in thermal design so that a power dissipation Pdiss should not
exceed the maximum power dissipation Pd.
Tjmax - Ta
θ ja
Maximum power dissipation
Pd 
Power dissipation

1


Pdiss  PO - 1

η


W 
W 
Tjmax: Maximum temperature junction = 150[℃]
Ta: Operating ambient temperature [℃]
θja: Package thermal resistance [℃/W]
Po: Output power [W]
η: Efficiency
5. About operations in strong electric field
Note that the device may malfunction in a strong electric field.
6. Thermal shutdown (TSD) circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shut down the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = 150℃.
7. About shorting between pins and installation failure
Be careful about direction and displacement of an LSI when installing it onto the board. Faulty installation may destroy
the LSI when the device is energized. In addition, a foreign matter getting in between LSI pins, pins and power supply,
and pins and GND may cause shorting and destruction of the LSI.
8. About power supply startup and shutdown
When starting up a power supply, be sure to place the MUTEX pin (pin 20) and SDX pin (pin 21), at “L” level. When
shutting down a power supply also, be sure to place the pin at “L” level. Those processes reduce pop noises generated
upon turning on and off the power supply. In addition, all power supply pins must be started up and shut down at the
same time.
9. About WARNING output pin (pin 18) and ERROR output pin (pin 19)
A WARNING flag is output from the WARNING output pin upon operation of the high-temperature protection function and
under-voltage protection function. And an ERROR flag is output from the ERROR output pin upon operation of VCC/GND
shorting protection function and speaker DC voltage applying protection function. These flags are the function which the
condition of this product is shown in. The use which aimed at the protection except for this product is prohibition.
10. About N.C. pins (pin 22)
The N.C. (Non connection) pins are not connected with an internal circuit. Leave the pins open or connect them to GND.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
16/17
2010.05 - Rev.B
Technical Note
BD5424EFS
●Ordering part number
B
D
5
Part No.
4
2
4
Part No.
E
F
-
S
Package
EFS:HTSSOP-44
E
2
Packaging and forming specification
E2: Embossed tape and reel
HTSSOP-A44
<Tape and Reel information>
18.5±0.1
(MAX 18.85 include BURR)
(6.0)
0.85
0.5±0.15
(5.0)
1
1.0±0.2
23
7.5±0.1
9.5±0.2
44
+6°
4° −4°
Tape
Embossed carrier tape (with dry pack)
Quantity
1500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
22
1PIN MARK
+0.05
0.17 -0.03
1.0MAX
S
0.08±0.05
0.85±0.05
0.08 S
0.8
+0.05
0.37 -0.04
0.08
M
1pin
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.05 - Rev.B
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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