BCG13D

BeRex
BCG13D
5-4000 MHz Cascadeable InGaP HBT Gain Block
Device Features
• 33 dBm Output IP3 at 5dBm/tone
• 24.9 dB Gain at 900 MHz
• 18 dBm P1dB
• Highly Reliable InGaP/GaAs HBT Technology
• 50 ohm Cascadeable
• Application: commercial wireless system
Target Device Performance (Ta = 25°C)
Symbols
Test Conditions
Gain
S11
S22
OIP3
P1dB
Ic
Vc
dG/dT
Rth
Min
5
23.9
22.0
20.6
Frequency Range
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
900 MHz
1900 MHz
2450 MHz
Vc = 5.0V
31.0
30.7
29.5
17.3
17.2
16.4
59
Thermal Resistance
Typ
24.9
23.0
21.6
-11.7
-10.4
-11.9
-7.6
-13.4
-12.0
33.0
32.7
31.5
18.3
18.2
17.4
69
5.0
-0.007
85
Max
Unit
4000
25.9
24.0
22.6
MHz
dB
dB
dBm
dBm
79
Test conditions unless otherwise noted.
1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system
2. OIP3 measured with two tones at an output power of 5 dBm/tone separated by 1 MHz.
Absolute Maximum Ratings
Parameter
Rating
Operating Case temperature
Storage Temperature
Operating Voltage
Supply Current
Input RF Power
-40 to +85°C
-40 to +155°C
+5.5V
150 mA
23dBm
Operation of this device above any of these parameters may result in permanent damage.
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dB
mA
V
dB/°C
°C/W
BeRex
BCG13D
S-parameter test circuit
Chip attachment on PF083
Generic PF083 Evaluation Board
(31mil thick FR4)
I-V characteristics
Application Circuit: 5-4000 MHz
Typical Performance (Vc = 5V, Ic = 69mA, T = 25°C)
Freq
S21
S11
S22
P1
OIP3
MHz
dB
dB
dB
dBm
dBm
900
24.9
-11.7
-7.6
19.0
32.0
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1900
23.0
-10.4
-13.4
19.0
32.0
2450
22.5
-11.9
-12.0
19.0
31.0
BeRex
BCG13D
Schematic Diagram
BOM
Tolerance
C1
100pF
±5%
C2
100pF
±5%
C3
100pF
±5%
C4
1000pF
±5%
C5
10uF
±20%
L1*
39nH
5%
*Note:
1. Chip is mounted on the PF083 open PKG, and bonded with 2-wires at both input and
output.
2. Less than 20nH improves RF performance at frequencies over 1.9GHz.
3. 40nH or higher value L1 improves RF performance at frequencies under 500MHz.
4. Optimum value of L1 may vary with board design.
Typical Device Data
S-parameters (Vc=5V, Ic=65mA, T=25°C)
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BeRex
BCG13D
Device Performance
P1dB-Gain
P1
Gain
OIP3
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BeRex
BCG13D
ACPR
S-Parameter
(Vdevice = 5.0V, Icc = 69mA, T = 25 °C, calibrated to device leads)
Freq
[MHz]
S11
[dB]
S11
[Ang]
S21
[dB]
S21
[Ang]
S12
[dB]
S12
[Ang]
S22
[dB]
S22
[Ang]
100
500
1000
1500
2000
2500
3000
3500
4000
-4.678
-11.610
-12.057
-13.053
-9.849
-12.146
-13.490
-9.805
-11.035
-25.54
-16.90
-12.98
16.38
17.27
-27.86
-123.12
-167.89
-160.29
25.672
25.427
24.828
23.968
22.767
21.639
20.413
19.346
18.256
176.84
159.35
141.93
124.40
109.52
96.24
84.08
73.06
63.61
-35.909
-30.250
-29.445
-30.025
-29.185
-28.649
-29.741
-28.948
-24.947
77.16
-25.07
50.31
-114.05
-159.59
158.92
116.90
77.73
32.85
-1.418
-6.267
-8.236
-12.494
-12.806
-11.873
-9.756
-8.579
-14.089
173.59
29.56
-7.08
-26.17
-17.49
-64.24
-130.88
-170.03
-165.34
* Note : S-parameter includes 1 mil thick and 16-mil long Au wire
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BeRex
BCG13D
Die Outline
NOTES:
1) DIE THICKNESS 100um
2) BONDPAD METAL
THICKNESS 2.8um
3) BACKSIDE METAL Au, 5um
4) DEVICE IS GROUNDED
THROUGH VIA HOLES
ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes <2000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114B
NATO CAGE code:
2
N
9
6
F
NOTICE
BeRex Corporation reserves the right to make changes of product specification or to
discontinue product at any time without notice.
http: //www.berex.com
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