BCT013

BeRex
BCT013
1500-4000 MHz Medium Power Amplifier
Device Features
• 45.0 dBm Output IP3 at 13dBm/tone
• 15.0 dB Gain at 1900MHz
• 27.5 dBm P1dB at 1900 MHz
• Patented Over Voltage Protection Circuit
•Application: commercial
Target Device Performance (Ta = 25°C)
Symbols
Gain
S11
S22
OIP3
P1dB
NF
Ic
Vc
Rth
Parameters Test Conditions
1900MHz
2140MHz
2400MHz
3500MHz
1900MHz
2140MHz
2400MHz
3500MHz
1900MHz
2140MHz
2400MHz
3500MHz
1900MHz
2140MHz
2400MHz
3500MHz
1900MHz
2140MHz
2400MHz
3500MHz
1900MHz
2140MHz
2400MHz
3500MHz
Vc = 5.0V
Min
Typ
14.0
13.0
12.2
9.7
15.1
14.0
13.3
10.7
-17.3
-12.0
-12.8
-25.3
-12.8
-12.0
-12.9
-25.3
45.0
45.2
43.1
40.2
27.5
27.1
27.2
25.9
42
42
40
37
26.5
26.2
26.0
25.0
Max
dB
dB
dB
dBm
dBm
6.8
118
Thermal Resistance
138
5.0
50
Unit
dB
158
mA
V
°C/W
Test conditions unless otherwise noted.
1. T = 25°C, Vdevice = 5.0V, 50 ohm system.
2. OIP3 is measured on an eval-board with two tones separated by 1 MHz.
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BCT013
Absolute Maximum Ratings
Parameter
Rating
Operating Case temperature
Storage Temperature
Junction Temperature
Supply Voltage
Input RF Power
-40 to +85°C
-40 to +155°C
+250°C
7V
23dBm
Operation of this device above any of these parameters may result in permanent damage.
Typical Device Data
S-parameters (Vc=5V, Ic=138mA, T=25°C)
-25
-30
S12 [dB]
S(1,1)
-35
m2
freq=4.000GHz
m1
freq=50.00MHz
-40
-45
-50
-55
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency [GHz]
freq (50.00MHz to 4.000GHz)
14
12
m2
freq=4.000GHz
8
6
S(2,2)
S21 [dB]
10
4
2
m1
freq=50.00MHz
0
-2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency [GHz]
freq (50.00MHz to 4.000GHz)
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BCT013
S-parameter test circuit
Generic PF083 Evaluation Board
I-V Characteristics
PCB 31mil thick FR-4
• Current drop in between 5~6V is due to
patented protection circuit.
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BCT013
S-Parameter
(5V/135mA)
Freq
[MHz]
S11
[Mag]
S11
[Ang]
S21
[Mag]
S21
[Ang]
S12
[Mag]
S12
[Ang]
S22
[Mag]
S22
[Ang]
100
500
1000
1500
2000
2500
3000
3500
4000
-0.046
-0.952
-1.111
-0.928
-1.240
-1.390
-1.669
-1.989
-2.281
-30.149
-116.77
-162.01
157.99
129.31
104.6
82.694
60.455
37.752
2.219
6.737
13.26
10.718
9.181
8.334
6.491
6.124
5.024
-128.4
-174.18
161.56
121.35
101.55
81.201
66.725
51.795
33.795
-41.958
-32.703
-32.513
-30.171
-28.599
-26.76
-26.706
-25.792
-24.653
66.107
25.318
76.255
46.516
42.527
37.808
32.623
26.141
20.698
-3.497
-3.457
-7.557
-7.780
-7.262
-7.180
-7.38
-7.336
-6.823
165.97
162.64
117.5
127.17
116.25
97.537
74.648
50.666
32.131
Application Circuit: 1900 MHz
Schematic Diagram
BOM
Vcc
L1
C1
C2
C3
C1
Tolerance
100pF
±5%
C2 1000pF
±5%
C3
10uF
±15%
C4
22pF
±5%
C5
22pF
±5%
C6
3.0pF
±5%
C7
0.5pF
±5%
L1
100nH
±5%
BT013
RF In
C4
C5
C6
RF Out
C7
Note:
1. Chip is mounted on the PF083 open
PKG, and bonded with 2-wires at
both input and output.
2. PCB: 31mil thick FR4
3. Distance between the center of the
shunt cap(C6) and the input pin of
BT013 is 3.2mm
4. Distance between the center of the
shunt cap(C7) and the output pin of
BT03 is 8.3mm
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BCT013
Typical Performance
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BCT013
Application Circuit: 2100 MHz
Schematic Diagram
Vcc
L1
C1
C2
C3
BT013
RF In
C4
C5
C6
RF Out
C7
C1
BOM
100pF
Tolerance
±5%
C2 1000pF
±5%
C3
10uF
±15%
C4
24pF
±5%
C5
24pF
±5%
C6
3pF
±5%
C7
0.5pF
±5%
L1
33nH
±5%
Note:
1. Chip is mounted on the PF083 open
PKG, and bonded with 2-wires at
Both input and output.
2. PCB: 31mil thick FR4
3. Distance between the center of the
shunt cap(C6) and the input pin of
BT013 is 1.5mm
4. Distance between the center of the
shunt cap(C7) and the output pin of
BT03 is 6.4mm
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BCT013
Typical Performance
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BCT013
Application Circuit: 2400MHz
Schematic Diagram
BOM
C1
Tolerance
100pF
±5%
C2 1000pF
±5%
C3
10uF
±15%
C4
100pF
±5%
C5
100pF
±5%
C6
2pF
±5%
C7
0.5pF
±5%
L1
33nH
±5%
Note:
1. Chip is mounted on the PF083 open
PKG, and bonded with 2-wires at
Both input and output.
2 PCB: 31mil thick FR4
3 Distance between the center of the
shunt cap(C6) and the input pin of
BT013 is 0.7mm
4 Distance between the center of the
shunt cap(C7) and the output pin of
BT03 is 3.2mm
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BCT013
Typical Performance
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BCT013
Application Circuit: 3500MHz
Schematic Diagram
BOM
Tolerance
C1
22pF
±5%
C2
0.75pF
±5%
C3
0.5pF
±5%
C4
100pF
±5%
C5 1000pF
±5%
C6
10uF
±20%
C7
0.5pF
±5%
C8
22pF
±5%
L1
33nH
±5%
Note:
1. Chip is mounted on the PF083 open
PKG, and bonded with 2-wires at
both input and output.
2 PCB: 31mil thick FR4
3 Distance between the center of the
shunt cap(C2) and the input pin of
BT013 is 10mm
4 Distance between the center of the
series cap(C3) and the input pin of
BT013 is 4mm
5 Distance between the center of the
shunt cap(C7) and the output pin of
BT03 is 3mm
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BCT013
Typical Performance
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BCT013
Die Outline
NOTES:
1) DIE THICKNESS 100um
2) BONDPAD METAL
THICKNESS 2.8um
3) BACKSIDE METAL Au, 5um
4) DEVICE IS GROUNDED
THROUGH VIA HOLES
MSL / ESD Rating
ESD Rating
Value
Test
Standard
Class 1
Passes <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114B
MSL Rating
Standard
Level 1 at +265°C convection reflow
JEDEC Standard J-STD-020
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BeRex
BCT013
NATO CAGE code:
2
N
9
6
F
NOTICE
BeRex Corporation reserves the right to make changes of product specification or to
discontinue product at any time without notice.
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