Datasheet Download

Class-AB Speaker Amplifiers
1.1W to1.5W
Monaural Speaker Amplifier
BD7830NUV
No.10077EAT03
●Description
The BD7830NUV is a monaural speaker amplifier that operates at low voltage and was developed for portable navigation
and mobile audio products. When in standby mode, its current consumption is 0 µA, and since it switches quickly and quietly
from standby to ON, it is especially well suited for applications where there is frequent switching between standby and ON.
●Features
1) BTL monaural audio power amplifier
2) High power 2.25W 4Ωat Vcc=5V
,THD+N=10%
High power 1.55W 8Ω at Vcc=5V
,THD+N=10%
High power 0.77W 8Ω at Vcc=3.6V ,THD+N=10%
3) Wide operating supply voltage range: 2.4~5.5V
4) Low standby current: 0µA
5) Fast turn on/off time: 46msec
6) Built-in Fade-in/out function
7) Built-in anti-pop function
8) Built-in thermal shutdown function
9) Very small package (VSON008V2030)
●Applications
Mobile phones, Mobile electronics applications
●Absolute Maximum Ratings(Ta=+25℃)
Parameter
Symbol
Ratings
Unit
Supply voltage
VCC
6.0
V
Power dissipation
Pd
530 *1
mW
Storage temperature range
Tstg
-55~+150
℃
STBY input range
VSTBY
-0.1~Vcc+0.1
V
*1 ROHM standard one layer board (70mm×70mm×1.6mmt) mounted, deratings is done at 4.24mW/℃ above Ta=+25℃.
●Operating Range
Parameter
Symbol
Ratings
Unit
Temperature range
Topr
-40~+85
℃
Supply voltage
VCC
+2.4~+5.5
V
※ This product is not designed for protection against radioactive rays.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Electrical characteristics
(Unless otherwise noted, Ta=+25℃, VCC=+3.0V, f=1kHz, RL=8Ω)
Limit
Monitor
Parameter
Symbol
Unit
pin
MIN.
TYP.
MAX.
Supply current
Condition
ICC
―
3.2
6.8
mA
6
Active mode
ISTBY
―
0
2
µA
6
Standby mode
PO
280
420
―
mW
5&8
BTL, THD+N=1% *1
THD+N
―
0.1
0.5
%
5&8
BTL, Po=150mW *1
Voltage gain1
AV1
-1
0
+1
dB
5
Vin=-20dBV, 1stAmp
Voltage gain2
AV2
-1
0
+1
dB
8
Vin=-20dBV, 2ndAmp
Power supply rejection ratio
PSRR
40
57
―
dB
5&8
BTL, Vripple=0.2Vpp *2
Mute attenuation
MUTE
60
80
―
dB
5&8
BTL, Vin=-20dBV
Vo
1.35
1.5
1.65
V
5&8
Vin=0V
Output offset voltage
ΔVo
-40
0
+40
mV
5&8
ΔVo=|Vo1-Vo2|
STBY release voltage
VSTBYH
1.4
―
Vcc+0.1
V
1
Active mode
STBY hold voltage
VSTBYL
-0.1
―
0.4
V
1
Standby mode
STBY input current H
ISTBYH
20
30
40
µA
1
VSTBY =3V
STBY input current L
ISTBYL
-2
0
―
µA
1
VSTBY =0V
Standby supply current
Output power
Total harmonic distortion
Output voltage
*1:B.W.=400~30kHz, *2:DIN AUDIO, SE:Single End, BTL:The voltage between 5pin and 8pin
●Application Circuit Example
OUT2
8
STB
H : ACTIVE
L : STBY
VCC
0.01uF
Audio
Input
1
BIAS
2
Bias
SOFT
3
SOFT
1μF
1
2
?
GND
7
2ndAmp
8Ω
V DD
6
1μF
IN-
4
0.1uF 20kΩ
OUT1
5
1stAmp
20kΩ
※3pin SOFT terminal
1 : Usually
2 : Enable to adjust fade in/out time
by external capacitor
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Outer dimension
D78
30
●Reference land pattern (adapt as necessary to suit conditions during actual design.)
PKG type
L2
VSON008V2030
Unit: mm
Land
Lead pitch
Gap
Length
Width
e
MD1
L2
b2
0.50
2.20
0.70
0.27
Central pad
D3
MD1
PKG type
VSON008V2030
Length Width
D3
E3
1.20
1.60
Thermal via
Pitch
Diameter
―
φ0.300
E3
※ This package is a non-lead type, so solderability of the lead ends and sides are
not guaranteed.
e
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
b2
Thermal via
3/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Measurement Circuit Diagram
VSTBY
STBY
1
A
BIAS
2
OUT2
8
GND
7
Bias
V
600
100μ
1μ
VCC
1
0.01μ
Vripple
2nd Amp
VCC
6
SOFT
2
IN-
4
0.1μ
Vin
SOFT
3
OUT1
5
20k
8
50
VCC
A
1μ
V
1st Amp
600
20k
※3pin SOFT terminal
1 : Usually
2 : Enable to adjust fade in/out time
by external capacitor
●Block diagram
●Pin assignment
STBY
1
OUT2
8
BIAS
GND
7
2
SOFT
3
Bias
2nd
SOFT
IN-
4
VCC
6
OUT1
5
1st Amp
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
4/17
PIN No.
PIN Name
1
STBY
2
BIAS
3
SOFT
4
IN-
5
OUT1
6
VCC
7
GND
8
OUT2
2010.06 - Rev.A
Technical Note
BD7830NUV
●Input/output equivalent circuit
PIN No.
1
PIN Name
STBY
PIN description
Equivalent circuit
STBY
Active/Standby
Control pin
STBY=H → Active
STBY=L → Standby
50k
1
100k
BIAS
2
BIAS
Bias capacitor
Connection pin
25k
600k
2
20k
SOFT
3
SOFT
IN-
100k
1k
1k
3
Fade-in/out
Adjustment pin
10k
IN-
4
100k
1k
4
Input pin
1k
OUT1
(OUT2)
5
8
OUT1
OUT2
5
Output pin
(8)
60k
VCC
6
VCC
Power supply pin
6
7
7
GND
GND
GND pin
Notes) The above numerical values are typical values for the design, which are not guaranteed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
5/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Description of operations
①ON/OFF operation by STBY pin
VCC
Standby
Active
Standby
STBY
BIAS
Delay
(internally
fixed
OUT
FADE IN
FADE OUT
Normal input
mode
Audio
Input
Once VCC = H, when STBY = L → H then BIAS and output (OUT) are activated.
Once BIAS has become stable (= 1/2 VCC), output (OUT) fades in (FADE IN).
Once STBY = H → L, output (OUT) starts to fade out (FADE OUT), and when fade-out ends, the BIAS falls.
②ON/OFF control by shorting of VCC and STBY pins
VCC
STBY
Under voltage
protection
1.78V (typ)
BIAS
Delay
(internally fixed)
OUT
Audio
Input
When VCC = STBY = L → H, BIAS is activated. During low power mode (VCC < 1.78 V) protection is used to keep output
(OUT) at low level, and FADE IN occurs when this protection is canceled. When VCC = STBY = H → L, output (OUT) falls
without FADE OUT.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
6/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●External components and cautions points
Setting of external components
STBY
STBY
OUT2
8
1
2
SPEAKER
GND
BIAS
7
Bias
Cb
3
1μ
2ndAmp
SOFT
8Ω
VCC
6
SOFT
Cs
SP_IN
IN-
OUT1
5
4
Ci
Ri
1stAmp
Rf
Cf
●Cb
This is a bypass capacitor, which is used for bias voltage stabilization.
When a larger capacitor is used, the efficiency of voltage ripple rejection can be improved.
When tuning, note with caution that Cb can affect the activation time.
Cb – Power Supply Ripple Rejection Ratio
Cb – Turn-on Time
Cb-PSRR
Vcc=3V, Vripple=200mVpp, RL=8Ω
Cb-ton
0
70
-20
60
Cb=0.1uF
-30
ton[ms]
Power Supply Rejection Ratio[dB]
80
-10
Cb=0.47uF
-40
Cb=1uF
50
40
30
-50
20
Cb=2.2uF
-60
10
-70
0
10
100
1k
Frequency[Hz]
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10k
100k
0
0.5
1
1.5
2
2.5
Cb[uF]
7/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Cs
This capacitor is for adjustment of the FADE IN/OUT times. The FADE IN/OUT functions soften the operation (IN and OUT)
of BTL output when switching between standby and active modes.
When a capacitor is connected to the SOFT pin (pin 3), the FADE IN/OUT functions are valid. When the capacitor
rating is increased, the FADE IN/OUT effect is also increased, but note with caution when setting this that it also affects the
activation time. If the FADE IN/OUT functions are not being used, connect the SOFT pin (pin 3) to VCC.
・ Fade-in/out waveforms
Active →
Standby → Active
Standby
STBY
2V/div
Ton
Toff
BTL output
0.5V/div
Cs - Fade-in/out Time
Cs-ton,toff
140
ton,toff[ms]
120
100
ton
80
60
40
toff
20
0
0
0.02
0.04
0.06
0.08
0.1
Cs[uF]
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
8/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Ci
This is a DC cut-off input coupling capacitor for the amp input pin.
This includes an Ri and a high-pass filter. The cut-off frequency is calculated as follows.
1
[Hz]
fCL = 2π×Ri×Ci
Ci – Low Frequency Characteristics
Ci-Frequency characteristic
4
2
Gain [dB]
0
-2
-4
Ci:0.047uF
-6
Ci:0.1uF
Ci:0.22uF
-8
-10
10
100
1k
Frequency[Hz]
10k
100k
Capacitors of a certain size are required for coupling without attenuation of low frequencies, but in most cases of speakers
used in portable equipment, it is nearly impossible to reproduce signals in the 100 to 200 Hz range or below. Even when a
larger capacitor is used instead, it may not improve system performance. Also, pop sounds can affect the capacitance (Ci) of
the capacitor. A larger coupling capacitor requires a greater charge to reach the bias DC voltage (normally 1/2 VCC).
Because this charge current is supplied from the output due to routing of feedback, pop sounds occur easily at startup.
Consequently, pop sounds can be minimized by selecting the smallest capacitor that still has the required low-frequency
response.
●Ri
This is inverting input resistance, which sets the closed loop gain in conjunction with Rf.
●Rf
This is feedback resistance, which sets closed loop gain in conjunction with Rf. The amp gain is set using the following
formula.
Gain = 20log
Rf
Ri
[dB]
●Cf
This is a feedback capacitor, which is used to cut high frequencies.
This includes Rf and a low-pass filter. The cut-off frequency is calculated as follows.
fCL=
1
2π×Ri×Ci
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
[Hz]
9/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Selection of external components
①Setting gain from desired output
Output Po is determined via the following formula, from which the required gain Av can also be obtained.
2
Po [W] = Vo [Vrms] / RL [Ω]
Vo = Av ・ Vin
Av ≧ Po・RL / Vin
②Setting input resistance and feedback resistance from gain
Gain Av is determined via the following formula, from which input resistance Rin and feedback resistance Rf can be set.
Av = (Rf / Rin) ・ 2
Rin is set with the input side's drive capacity taken into account.
③Setting input coupling capacitor from low-range cut-off frequency
Low-range cut-off frequency fc is determined via the following formula, from which input coupling capacitor Cin can be set.
fc [Hz] = 1 / (2π ・ Rin ・ Cin)
Cin ≧ 1 / (2π ・ Rin ・ fc)
④Setting bias capacitor and SOFT capacitor to minimize pops
It is recommended that the capacitance of the bias capacitor CB be set to at least 10 times that of the input coupling
capacitor Cin, in order to soften the rise of the bias voltage while improving the Cin following ability.
Also, when a higher gain is used, the capacitance of the SOFT capacitor Cs can be raised to control pop sounds.
Av = 2 (6 dB at BTL)
→ Cs ・ (80 / fc) ≧ 0.01 µF
Av = 4 (12 dB at BTL) → Cs ・ (80 / fc) ≧ 0.022 µF
Av = 8 (18 dB at BTL) → Cs ・ (80 / fc) ≧ 0.033 µF
Av = 20 (26 dB at BTL) → Cs ・ (80 / fc) ≧ 0.068 µF
●Use when VCC = STBY short
Since this IC is designed on the assumption that it will be used to switch standby mode ON and OFF while the power supply
remains ON, normally STBY should be switched from H to L and the SOFT voltage should be discharged before powering
down. When used while VCC = STBY short, pop sounds may occur if the IC's power supply is reduced prior to discharging
the SOFT voltage.
To prevent pop sounds, you must ① set STBY = H→L before setting VCC = H→L, and ② forcibly discharge the SOFT
voltage.
A sample circuit in which VCC = STBY short is used is shown below.
・Sample circuit configuration when VCC = STBY short
①
STBY = H → L at
power-off
STBY
1
BIAS
2
OUT2
8
GND
7
Bias
1μ
SOFT
3
②
Fast discharge of
SOFT voltage at
power-off
2nd Amp
SOFT
CD
VCC
6
CS
VCC
IN-
4
Cin
Rin
OUT1
5
1st Amp
Slow power-off of IC itself
Rf
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Mechanism of pop sounds
Cin is low
Gain is low
(Rf)
STBY
BIAS
BIAS
IN-
IN-
About 25
0.6 VCC
SOFT
No pops
OUT
Cin is high
Gain is high
(Rf)
STBY
BIAS
BIAS
IN-
When SOFT voltage reaches 0.6 VCC, if there
is a potential difference between BIAS and IN-,
pop sounds will occur.
Potential
difference
At startup, the input coupling Cin is charged
from output OUT via the feedback resistance
Rf, so when
Cin and Rf are high, charging takes longer and
pop sounds can easily occur.
IN-
About
The rise of the SOFT voltage is changed by CS,
so pop sounds an be reduced by setting CS
high.
25 ms
SOFT
0.6 VCC
OUT
POP sounds
STBY
OUT2
8
1
GND
BIAS
2
Bias
7
1μ
SOFT
3
2nd Amp
SOFT
1μ
CS
VCC
IN-
Cin
OUT1
5
4
600
RL
VCC
6
Ri
1st Amp
Rf
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
11/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Bass boost function
External components can be added to this chip to provide a bass boost function.
BIAS
OUT
IN-
5
4
Ci
Ri
Rfb
Rf
Cfb
Gain
fC2 
1
2  Cfb  Rf
[Hz]
fC1 
1
2  Cfb  (Rf // Rfb )
[Hz]
Low frequency gain up
GC1
GC2
fC1
fC2
f
GC1  20 log
Rf  Rfb
Ri
[dB]
GC2  20 log
Rf (normal use)
Ri
[dB]
●Thermal shutdown function
When the chip exceeds the Tjmax (150°C) temperature by reaching a temperature of 180℃ or above, the protection
function is activated. High impedance is for OUT1 and OUT2 during protected mode. Protection is canceled and normal
operation is resumed when the chip's temperature falls to 120℃ or below.
180°C
120°C
Chip
Protection start temperature: 180°C (typ) or more
Protection cancels temperature: 120°C (typ) or
less
Output
Normal
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
Protected
operation
Normal
12/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Thermal design of chip
The characteristics of the IC vary greatly depending on the use temperature, and when the maximum allowable junction
temperature is exceeded, components may deteriorate or become damaged. Thermal considerations are needed for this
chip from two standpoints: preventing instantaneous damage and improving long-term reliability. Note the following points
with caution.
The absolute maximum ratings for each chip include the maximum junction temperature (TjMAX) and operating temperature
rate (Topr), and these values should be referred to when using the Pd-Ta characteristics (thermal dissipation curve).
Since the IC itself is designed with full consideration of thermal balance, there are no problems in terms of circuit operations,
but even when a more-than-adequate thermal design is implemented in order to get full use of the IC's performance features,
some moderation is often required for the sake of practical usage.
If there is an excessive input signal due to insufficient thermal dissipation, a TSD (thermal shutdown) operation may occur.
Thermal Dissipation Curve
Reference data
VSON008V2030
① When mounted on ROHM standard 1-layer board
Size: 70 mm × 70 mm × 1.6 mmt
No copper heat sink (only mounting pattern)
1.0
0.85W
② When mounted on 4-layer board
Size: 76.2 mm × 76.2 mm × 1.6 mmt
Layers 2 & 3 Copper foil
No connection via thermal via
Allowable loss Pd (W)
②
0.53W
0.5
①
0
0
25
50
75
100
125
150
Ambient temperature Ta (°C)
(Note) These are measured values. They are not guaranteed.
The allowable loss value varies depending on the type of board used for mounting. When this chip is mounted on a
multi-layer board that is designed for thermal dissipation, the allowable loss becomes greater than shown in the above figure.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
13/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Typical Characteristics (1)
BD7830NUV f-THD+N
VCC=3V,Ta=25℃,Po=150mW,RL=8Ω
10
10
1
1
THD+N[%]
THD+N[%]
BD7830NUV f-THD+N
VCC=5V,Ta=25℃,Po=150mW,RL=8Ω
0.1
0.1
0.01
0.01
10
100
1k
10k
10
100k
100
1k
10k
100k
f[Hz]
f[Hz]
BD7830NUV VCC-Po
Ta=25℃ f=1kHz 400~30kBPF THD+N=1.0%
BD7830NUV Po-THD
Ta=25℃,f=1kHz,RL=8Ω
10
10000
RL=4Ω
1
VCC=3V
Po[mW]
THD[%]
RL=8Ω
1000
VCC=5V
0.1
RL=16Ω
0.01
0.01
100
0.1
1
10
2
3
Po[W]
5
6
BD7830NUV frequency characteristic
VCC=3V,Ta=25℃,Vin=-20dBV,RL=8Ω
BD7830NUV frequency characteristic
VCC=5V,Ta=25℃,Vin=-20dBV,RL=8Ω
10
10
5
Gain[dB]
5
Gain[dB]
4
Vcc[V]
0
-5
-10
0
-5
-10
-15
-15
10
100
1k
10k
100k
f[Hz]
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10
100
1k
10k
100k
f[Hz]
14/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Typical Characteristics (2)
0
0
-10
Power Supply Rejection Ratio[dB]
Power Supply Rejection Ratio [dB]
BD7830NUV f-PSRR
Ta=25℃, VCC=3V,Vripple=200mVpp,30kLPF
BD7830NUV f-PSRR
Ta=25℃,VCC=5V, Vripple=200mVpp,30kLPF
-20
-30
-40
-50
-60
-70
10
100
1k
10k
-10
-20
-30
-40
-50
-60
-70
100k
10
f[Hz]
100
1k
10k
f[Hz]
100k
BD7830NUV Circuit current (STBY)
Ta=25℃, RL=8Ω
BD7830NUV Circuit current (ACT)
Ta=25℃,RL=8Ω
8
0.10
Circuit current (STBY)[μA]
Circuit current (ACT)[mA]
0.09
6
4
2
0
2
3
4
5
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0.00
6
2
3
VCC[V]
4
5
6
VCC[V]
BD7830NUV RL-Po
Ta=25℃, f=1kHz, THD+N=1%
BD7830NUV Po-Pd
0.7
10.00
0.6
VCC=5.5V
VCC=5V
VCC=3V
1.00
0.4
Po
Pd[W]
0.5
VCC=3V
0.3
0.10
0.2
VCC=2.4V
0.1
0.0
0.01
0.0
0.5
1.0
1.5
1
Po[W]
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10
100
RL[Ω]
15/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Notes for use
1) The above numerical values and data are typical values for the design, which are not guaranteed.
2) The application circuit examples can be reliably recommended, but their characteristics should be checked carefully
before use. When using external component constants that have been modified, determine an ample margin that takes
into consideration variation among the external components and Rohm's LSI IC chips, including variation in static
characteristics and transient characteristics.
3) Absolute maximum ratings
This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other parameters
are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings. If it is possible
that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and determine ways to
avoid exceeding the IC's absolute maximum ratings. The above numerical values and data are typical values for the
design, which are not guaranteed.
4) GND pin's potential
Try to set the minimum voltage for GND pin's potential, regardless of the operation mode.
Check that the voltage of each pin does not go below GND pin's voltage, including transient phenomena.
5) Shorting between pins and mounting errors
When mounting the IC chip on a board, be very careful to set the chip's orientation and position precisely. When the power
is turned on, the IC may be damaged if it is not mounted correctly. The IC may also be damaged if a short occurs (due to
a foreign object, etc.) between two pins, between a pin and the power supply, or between a pin and the GND.
6) Shorting output pin
When output pin (5,8pin) is shorted to VCC or GND, the IC may be damaged by over current, so be careful in operation.
7) Thermal design
Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use
modes, because this IC is power amp.
When excessive signal inputs which the heat dissipation is insufficient condition, it is possible that TSD (thermal shutdown
circuit) is active.
TSD is protection of the heat by excessive signal inputs, it is not protection of the shorting output to VCC or GND.
8) Shorted pins and mounting errors
When the output pins (pins 5 and 8) are connected to VCC and GND, the thermal shutdown function repeatedly switches
between shutdown (OFF) and cancel (ON). Note with caution that chip damage may occur if these connections remain
for a long time.
9) Operating range
The rated operating power supply voltage range(VCC=+2.4 ~ +5.5V) and the rated operation temperature range
(Ta=-40~+85℃) are the range by which basic circuit functions is operated.
It is not guaranteed a specification and a rated output power about all operating power supply voltage range or operation
temperature range.
10) Operation in strong magnetic fields
Note with caution that operation faults may occur when this IC operates in a strong magnetic field.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
16/17
2010.06 - Rev.A
Technical Note
BD7830NUV
●Ordering part number
B
D
7
Part No.
8
3
0
Part No.
N
U
V
-
Package
NUV:VSON008V2030
T
R
Packaging and forming specification
TR: Embossed tape and reel
VSON008V2030
<Tape and Reel information>
3.0±0.1
2.0±0.1
1.0MAX
0.25
3000pcs
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(0.22)
+0.03
0.02 -0.02
S
1.5±0.1
0.5
1
4
8
5
1.4±0.1
0.3±0.1
C0.25
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
+0.05
0.25 -0.04
1pin
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.06 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Similar pages